A special cooling system for producing a fully degradable bamboo shoe material

Abstract

The utility model relates to a kind of cooling system special for the production of full-degradable bamboo shoe material, including assembly line conveying table, fan mechanism and cooling mechanism, the assembly line conveying table is used for the delivery of material, fan mechanism and cooling mechanism are all arranged in the top of assembly line conveying table, the cooling mechanism is close to the feed end of assembly line conveying table;The cooling mechanism includes mounting bracket, heat preservation frame, semiconductor refrigeration piece group and gas sending part semiconductor refrigeration piece group generates Peltier effect after being electrified, cold end temperature can be quickly reduced to, cold end is directly contacted with the inner chamber of heat preservation frame, form low-temperature environment, with dustproof filter's air inlet fan inhales ambient air, air stays in serpentine rotary air pipe for second, jet head sprays cold air flow, air is blown on the material surface of assembly line conveying table, and with the delivery of material of assembly line conveying table, subsequent use multiple fan ware to air-cooled cooling of material surface.

Description

Technical Field

[0001] This utility model relates to the field of bamboo shoe material production technology, specifically a cooling system for the production of fully degradable bamboo shoe materials. Background Technology

[0002] Traditional shoe materials often use non-environmentally friendly materials in their production process, and the cooling process relies heavily on energy-intensive compressor refrigeration or water cooling systems, resulting in low efficiency, high energy consumption, and environmental pollution. With increasing environmental protection requirements, fully biodegradable bamboo shoe materials have become an emerging option. In existing technologies, traditional shoe manufacturing equipment cooling systems generally use water cooling or air cooling. Air cooling is too costly and energy-intensive, while water cooling causes the materials to absorb water, affecting subsequent processing and causing pollution, which does not meet environmental protection or energy-saving objectives. The cooling system is also too simple, consumes too much energy, and does not meet my country's carbon neutrality requirements. The cooling process in the production process cannot simultaneously achieve rapid cooling and environmental protection, and cannot efficiently cool bamboo materials according to their characteristics. Therefore, we need to provide a dedicated cooling system for the production of fully biodegradable bamboo shoe materials. Utility Model Content

[0003] The purpose of this invention is to provide a dedicated cooling system for the production of fully degradable bamboo shoe materials. It pre-cools the air using a semiconductor refrigeration fin assembly and extends the path of the cold air by using a serpentine rotating air pipe to improve cooling efficiency. The semiconductor refrigeration fin assembly provides precise temperature control, which significantly reduces energy consumption compared to a compressor. The hot end dissipates heat quickly through a metal heat dissipation fin, improving the efficiency of the TEC (thermal energy dissipation system) and solving the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a special cooling system for the production of fully degradable bamboo shoe materials, comprising:

[0005] The assembly line includes a conveyor table, a fan mechanism, and a cooling mechanism. The conveyor table is used for conveying materials. The fan mechanism and the cooling mechanism are both located on the top of the conveyor table, with the cooling mechanism located near the feed end of the conveyor table.

[0006] The cooling mechanism includes a mounting frame, an insulation frame, a semiconductor refrigeration chip assembly, and an air supply component. The mounting frame is located on the top of the conveyor belt. The insulation frame is located in a groove inside the mounting frame. The top of the insulation frame is equipped with a semiconductor refrigeration chip assembly consisting of multiple TECs. The interior of the insulation frame is equipped with an air supply component for supplying air to the materials on the conveyor belt.

[0007] Preferably, the air supply component includes a rotary air pipe, an inlet pipe, and an outlet pipe. The interior of the insulation frame is provided with rotary air pipes arranged in a serpentine pattern. The cold end of the semiconductor cooling chip assembly is located inside the insulation frame. The outlet end at the bottom of the rotary air pipe is connected to the outlet pipe, and the inlet end on one side of the rotary air pipe is connected to an inlet component.

[0008] Preferably, the lower end of the exhaust pipe is connected to a pipe, the bottom of the pipe is connected to a plurality of jet heads, and an exhaust hood is fixedly installed on the surface of the exhaust pipe.

[0009] Preferably, the air intake component includes a collection hood, an air intake fan, and a dust cover, wherein the bottom of the collection hood is connected to the air intake fan, and the bottom of the air intake fan is provided with a dust cover.

[0010] Preferably, an installation frame is fixedly installed on the surface of the insulation frame, and the interior of the installation frame has four evenly distributed slots. Each of the four slots has a movably fitted block inside. The bottom of each of the four blocks is fixedly installed on the top of the installation frame, and the top of each of the four blocks is set as an inclined surface. Handles are fixedly installed on both sides of the insulation frame.

[0011] Preferably, the hot end of the top of the semiconductor cooling chip assembly is provided with a metal heat dissipation fin, which is fixedly installed on the top of the insulation frame by several bolts, and the interior of the insulation frame is provided with several support plates for fixing the rotating air pipe.

[0012] Preferably, the fan mechanism includes a fan motor and support columns. A plurality of fans are provided on the top of the assembly line conveyor, and two support columns are fixedly installed on the surface of each of the plurality of fans. The bottom of the support columns is fixedly installed on the top of the assembly line conveyor.

[0013] Preferably, the top and bottom of some of the fans are provided with protective nets.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention pre-cools air using a semiconductor refrigeration unit and extends the path of the cold air by using a serpentine rotating air pipe to improve cooling efficiency. The semiconductor refrigeration unit provides precise temperature control, significantly reducing energy consumption compared to a compressor. The hot end dissipates heat quickly through metal heat dissipation fins, improving TEC working efficiency. It also utilizes the biodegradability of bamboo to avoid pollution from oil cooling or chemical coolants. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0017] Figure 2 This is a partial three-dimensional structural view of the present invention;

[0018] Figure 3 This is a separate diagram of the mounting bracket and insulation frame of this utility model;

[0019] Figure 4 This is a perspective view of the air delivery component of this utility model;

[0020] Figure 5 This is a perspective view of the air intake component of this utility model;

[0021] Figure 6 This is a perspective view of the fan mechanism of this utility model.

[0022] In the diagram: 1. Assembly line conveyor; 2. Fan mechanism; 3. Cooling mechanism; 31. Mounting frame; 32. Insulation frame; 33. Semiconductor cooling chip assembly; 30. Air supply component; 301. Rotary air pipe; 302. Air inlet pipe; 303. Exhaust pipe; 4. Pipeline; 5. Jet nozzle; 6. Exhaust hood; 7. Air inlet component; 71. Collection hood; 72. Air inlet fan; 73. Dust cover; 8. Mounting frame; 9. Slot; 10. Locking block; 11. Handle; 12. Metal heat dissipation fins; 13. Support plate; 21. Fan; 22. Support column; 23. Protective net. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6 This utility model provides a technical solution: a special cooling system for the production of fully degradable bamboo shoe materials, comprising:

[0025] The assembly line conveyor 1, fan mechanism 2, and cooling mechanism 3 are used for conveying materials. The fan mechanism 2 and cooling mechanism 3 are both located on the top of the assembly line conveyor 1, with the cooling mechanism 3 located near the feed end of the assembly line conveyor 1.

[0026] The cooling mechanism 3 includes a mounting frame 31, an insulation frame 32, a semiconductor refrigeration chip assembly 33, and an air supply component 30. The mounting frame 31 is set on the top of the assembly line conveyor table 1. The insulation frame 32 is provided in the groove inside the mounting frame 31. The semiconductor refrigeration chip assembly 33, composed of multiple TECs, is installed on the top of the insulation frame 32. The insulation frame 32 is provided with an air supply component 30 for supplying air to the materials on the assembly line conveyor table 1.

[0027] Specifically, the air is pre-cooled by the semiconductor cooling chip group 33, and the cold air path is extended by the serpentine rotating air pipe 301 to improve the cooling efficiency. The semiconductor cooling chip group 33 accurately controls the temperature, which greatly reduces energy consumption compared with the compressor. The hot end dissipates heat quickly through the metal heat dissipation fin plate 12, which improves the working efficiency of TEC. By utilizing the degradation characteristics of bamboo, the pollution of oil cooling or chemical coolants is avoided. The cooling mechanism 3 first cools down quickly, and then the fan mechanism 2 dissipates heat evenly, realizing staged cooling that is adapted to the characteristics of bamboo.

[0028] The air supply component 30 includes a rotary air pipe 301, an air inlet pipe 302 and an exhaust pipe 303. The interior of the insulation frame 32 is provided with a serpentine distribution of the rotary air pipe 301. The cold end of the semiconductor cooling chip group 33 is located inside the insulation frame 32. The air outlet at the bottom of the rotary air pipe 301 is connected to the exhaust pipe 303, and the air inlet on one side of the rotary air pipe 301 is connected to the air inlet component 7.

[0029] In this embodiment, the semiconductor cooling chip 33 generates a Peltier effect after being powered on, and the cold end temperature can be rapidly reduced to -10℃~5℃. The cold end directly contacts the inner cavity of the insulation frame 32, forming a low-temperature environment. The intake fan 72 with dust filter draws in ambient air at a flow rate of 15-20m³ / min. The air stays in the serpentine rotating air pipe 301 for a few seconds, and the jet nozzle sprays cold air to blow cold air onto the surface of the material on the assembly line conveyor 1. As the assembly line conveyor 1 conveys the material, multiple fans are subsequently used to cool the surface of the material.

[0030] Among them, the semiconductor cooling chip group 33 hot end heat dissipation: adopts 6063 aluminum alloy heat dissipation fins, and through temperature control and optimized airflow organization, ensures that the bamboo fiber material maintains ideal crystallinity and mechanical properties during the cooling process, while meeting various requirements for environmentally friendly production.

[0031] By using semiconductor cooling and airflow optimization design, the cooling problem in the production of fully degradable bamboo shoe materials has been solved, which has the advantages of high efficiency, low energy consumption and environmental protection, and promotes the development of green shoe manufacturing technology.

[0032] The lower end of the exhaust pipe 303 is connected to a pipe 4, and the bottom of the pipe 4 is connected to several jet heads 5. An exhaust hood 6 is fixedly installed on the surface of the exhaust pipe 303.

[0033] Specifically, the lower end pipe 4 of the exhaust pipe 303 is connected, and cold air enters the pipe 4 through the exhaust pipe 303. The cold air is then ejected from several evenly distributed jet heads 5 at the bottom of the pipe 4, and an exhaust hood 6 is installed to protect the pipe 4.

[0034] The air intake component 7 includes a collection cover 71, an air intake fan 72, and a dust cover 73. The bottom of the collection cover 71 is connected to the air intake fan 72, and the bottom of the air intake fan 72 is provided with a dust cover 73. The exhaust cover 6 restricts the airflow diffusion and reduces the loss of cooling capacity.

[0035] An installation frame 8 is fixedly installed on the surface of the insulation frame 32. The interior of the installation frame 8 has four evenly distributed slots 9. Each of the four slots 9 has a movable locking block 10. The bottom of each of the four locking blocks 10 is fixedly installed on the top of the installation frame 31. The top of each of the four locking blocks 10 is set as a slope. Handles 11 are fixedly installed on both sides of the insulation frame 32.

[0036] It is worth noting that the mounting frame 8 is welded and fixed to the surface of the insulation frame 32. Four evenly distributed slots 9 are machined inside the mounting frame 8. Four beveled blocks 10 are fixed at corresponding positions on the top of the mounting frame 31. The bevel angle of the blocks 10 matches the slots 9, and the top chamfer facilitates insertion. The operator holds the handles 11 on both sides of the insulation frame 32, aligns the slots 9 of the mounting frame 8 with the bevels of the blocks 10 and presses them down to complete the installation. By pulling the handles 11 upwards, the blocks 10 automatically disengage from the slots 9, allowing for removal and maintenance. Compared with traditional bolt fixing, this design significantly improves equipment maintenance efficiency and is particularly suitable for bamboo production lines that require frequent cleaning or replacement of refrigeration modules.

[0037] The hot end of the top of the semiconductor cooling chip assembly 33 is provided with a metal heat dissipation fin 12. The metal heat dissipation fin 12 is fixedly installed on the top of the insulation frame 32 by several bolts. The interior of the insulation frame 32 is provided with several support plates 13 for fixing the rotary air pipe 301.

[0038] It should be noted that thermally conductive silicone grease (thermal conductivity ≥5W / m·K) is applied to the hot end of the TEC (semiconductor cooling chip 33) to ensure tight contact with the metal heat sink fins 12. 4-6 M4 stainless steel bolts (with anti-loosening washers) are used to evenly press the heat sink fins onto the top of the insulation frame 32, with torque controlled at 1.2-1.5 N·m. The heat sink fins are made of 6063 aluminum alloy with anodized surface treatment. Several support plates 13 are welded to the inner wall of the insulation frame 32 and fixed to the surface of the rotary air pipe 301 to secure the rotary air pipe 301. This ensures the stability of the semiconductor cooling system, achieves efficient and long-lasting operation of the cooling system, and perfectly adapts to the production process requirements of fully degradable bamboo.

[0039] The fan mechanism 2 includes a fan and a support column 22. Several fans 21 are provided on the top of the assembly line conveyor 1. Two support columns 22 are fixedly installed on the surface of each fan 21. The bottom of the support column 22 is fixedly installed on the top of the assembly line conveyor 1.

[0040] Among them, by activating multiple fans 21 to blow air and cool the cooled material again, multiple cooling methods are used to achieve a high-efficiency, stable and energy-saving cooling effect.

[0041] A protective net 15 is provided on the top and bottom of several fans 21;

[0042] The surface of the 304 stainless steel wire mesh is electrolytically polished. The double protective mesh design completely prevents foreign objects ≥3mm from entering. While ensuring safety, the protective structure minimizes the impact on cooling performance through fluid dynamics optimization.

[0043] Semiconductor cooling chip assembly 33 model: TEC1-12706.

[0044] When the semiconductor cooling chip 33 of this device is powered on, it generates the Peltier effect, and the temperature of the cold end can be rapidly reduced. The cold end directly contacts the inner cavity of the insulation frame 32 to form a low-temperature environment. The intake fan 72 with dust filter draws in ambient air. The air stays in the serpentine rotating air pipe 301 for a few seconds, and the jet head sprays cold air to blow cold air onto the surface of the material on the conveyor belt 1. As the conveyor belt 1 transports the material, multiple fans 21 are used to cool the surface of the material.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling system specifically designed for the production of fully biodegradable bamboo shoe materials, characterized in that, include: The assembly line conveyor (1), fan mechanism (2) and cooling mechanism (3) are provided. The assembly line conveyor (1) is used for conveying materials. The fan mechanism (2) and cooling mechanism (3) are both located on the top of the assembly line conveyor (1). The cooling mechanism (3) is located near the feed end of the assembly line conveyor (1). The cooling mechanism (3) includes a mounting frame (31), a heat insulation frame (32), a semiconductor refrigeration chip group (33), and an air supply component (30). The mounting frame (31) is located on the top of the assembly line conveyor (1). The heat insulation frame (32) is located in the groove inside the mounting frame (31). The top of the heat insulation frame (32) is equipped with a semiconductor refrigeration chip group (33) composed of multiple TECs. The heat insulation frame (32) is equipped with an air supply component (30) inside for supplying air to the materials on the assembly line conveyor (1).

2. The cooling system for the production of fully degradable bamboo shoe materials according to claim 1, characterized in that: The air supply component (30) includes a rotary air pipe (301), an air inlet pipe (302) and an exhaust pipe (303). The interior of the insulation frame (32) is provided with a serpentine distribution of rotary air pipes (301). The cold end of the semiconductor cooling chip group (33) is located inside the insulation frame (32). The exhaust end of the bottom of the rotary air pipe (301) is connected to the exhaust pipe (303). The air inlet end on one side of the rotary air pipe (301) is connected to the air inlet component (7).

3. The cooling system for the production of fully degradable bamboo shoe materials according to claim 2, characterized in that: The lower end of the exhaust pipe (303) is connected to a pipe (4), the bottom of the pipe (4) is connected to a plurality of jet heads (5), and an exhaust hood (6) is fixedly installed on the surface of the exhaust pipe (303).

4. The cooling system for the production of fully degradable bamboo shoe materials according to claim 2, characterized in that: The air intake component (7) includes a collection cover (71), an air intake fan (72) and a dust cover (73). The bottom of the collection cover (71) is connected to the air intake fan (72), and the bottom of the air intake fan (72) is provided with a dust cover (73).

5. The cooling system for the production of fully degradable bamboo shoe materials according to claim 1, characterized in that: The surface of the insulation frame (32) is fixedly mounted with an installation frame (8). The interior of the installation frame (8) is provided with four evenly distributed slots (9). Each of the four slots (9) is movably fitted with a locking block (10). The bottom of each of the four locking blocks (10) is fixedly mounted on the top of the installation frame (31). The top of each of the four locking blocks (10) is set as a slope. Both sides of the insulation frame (32) are fixedly mounted with handles (11).

6. The cooling system for the production of fully degradable bamboo shoe materials according to claim 2, characterized in that: The hot end of the top of the semiconductor cooling chip assembly (33) is provided with a metal heat dissipation fin (12), which is fixedly installed on the top of the insulation frame (32) by several bolts. The interior of the insulation frame (32) is provided with several support plates (13) for fixing the rotary air pipe (301).

7. The cooling system for the production of fully degradable bamboo shoe materials according to claim 1, characterized in that: The fan mechanism (2) includes a fan and a support column (22). Several fans (21) are provided on the top of the assembly line conveyor (1). Two support columns (22) are fixedly installed on the surface of each of the fans (21). The bottom of the support column (22) is fixedly installed on the top of the assembly line conveyor (1).

8. A cooling system for the production of fully degradable bamboo shoe materials according to claim 7, characterized in that: Some of the aforementioned fans (21) are provided with protective nets (15) at the top and bottom.

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