A multi-layer cable having different ground wires
By introducing a multi-layer structure and different types of ground wires into the cable, the problems of complex assembly and low reliability of traditional cables are solved, achieving efficient grounding and stable signal transmission, which is suitable for equipment such as servers and switches.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LINKZ IND (SUZHOU) LTD
- Filing Date
- 2025-04-09
- Publication Date
- 2026-06-05
Smart Images

Figure CN224328509U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of cable technology, specifically relating to a multi-layer cable with different ground wires. Background Technology
[0002] In the field of wires and cables, the structural design of cables directly affects their electrical performance, mechanical strength, and ease of assembly. Traditional cable structures typically lack a dedicated grounding wire design, or have only a single grounding wire design, or the grounding wire design is inadequate, leading to complex assembly and grounding welding processes and low work efficiency. Furthermore, in cables without a grounding wire structure, during reliability testing (double 85 test: testing cable performance in an environment of 85°C high temperature and 85% high humidity; temperature cycling test), solder joints are prone to variation, resulting in poor contact or failure.
[0003] Based on this, the present invention discloses a multilayer cable with different ground wires. Utility Model Content
[0004] To address the technical problems existing in the prior art, the purpose of this utility model is to provide a multi-layer cable with different ground wires, which can not only greatly optimize the assembly grounding welding process, but also greatly optimize the reliability test results and reduce crosstalk.
[0005] To achieve the above objectives and technical effects, the technical solution adopted by this utility model is as follows:
[0006] A multilayer cable with different ground wires includes a core, a wrapping layer outside the core, an aluminum foil Mylar tape layer outside the wrapping layer, a hot-melt Mylar tape layer outside the aluminum foil Mylar tape layer, and several ground wires between the aluminum foil Mylar tape layer and the hot-melt Mylar tape layer.
[0007] Furthermore, there are two types of ground wires: one is a solid round tin-plated ground wire, and the other is a flat tin-plated ground wire. There are two solid round tin-plated ground wires, which are symmetrically arranged between the aluminum foil Mylar tape layer and the hot melt Mylar tape layer and located on the left and right opposite sides of the wire core. There are two flat tin-plated ground wires, which are symmetrically arranged between the aluminum foil Mylar tape layer and the hot melt Mylar tape layer and located on the upper and lower opposite sides of the wire core.
[0008] Furthermore, the diameter of the solid tin-plated ground wire is 0.14±0.08mm.
[0009] Furthermore, the specifications of the flat tin-plated ground wire are: width 0.5±0.05mm and thickness 0.025±0.05mm.
[0010] Furthermore, the specifications of the hot-melt Mylar tape layer are: width 2±0.05mm, thickness 0.017±0.05mm, and coverage ≥100%.
[0011] Furthermore, the aluminum surface of the aluminum foil Mylar tape layer faces outwards toward the hot-melt Mylar tape layer, with a coverage of ≥100%.
[0012] Furthermore, the specifications of the aluminum foil Mylar tape layer are: width 4±0.05mm and thickness 0.027±0.05mm.
[0013] Furthermore, the wire core includes several silver-plated copper conductors with a diameter of 0.22±0.08mm, each silver-plated copper conductor is covered with an insulation layer and the outer diameter after the insulation layer is 0.48±0.05mm.
[0014] Furthermore, the wrapping layer is a PTFE tape with the following specifications: width 3±0.05mm, thickness 0.05±0.05mm, and overlap rate ≥25%.
[0015] Furthermore, the height of the multilayer cable with ground wire is 0.79±0.05mm and the width is 1.45±0.07mm.
[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0017] This utility model discloses a multi-layer cable with different ground wires. By dragging solid round tin-plated ground wires into the left and right sides of the core, a symmetrical reference plane can be provided to ensure impedance matching, reduce signal reflection and jitter, and reduce crosstalk. By dragging flat tin-plated ground wires into the top and bottom sides of the core, the assembly and soldering convenience is greatly optimized without affecting the width, improving work efficiency and ensuring good grounding of the cable in the assembly. By dragging two different ground wires, solid round tin-plated ground wires and flat tin-plated ground wires, the multi-functionality of the cable product can be realized, significantly improving the electrical performance and stability of the cable, and having higher reliability than groundless cable structures. It can greatly optimize the reliability test results and is suitable for internal signal transmission in various servers, switches, etc. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation
[0019] The present invention will now be described in detail so that its advantages and features can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.
[0020] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.
[0021] like Figure 1 As shown, a multilayer cable with different ground wires includes a core, which includes several silver-plated copper conductors 1 with a diameter of 0.22±0.08mm. Each silver-plated copper conductor 1 is covered with an extruded insulation layer 2. The core is surrounded by a wrapping layer 3. An aluminum foil Mylar tape layer 4 is placed outside the wrapping layer 3. A hot-melt Mylar tape layer 5 is placed outside the aluminum foil Mylar tape layer 4. Several different ground wires are placed between the aluminum foil Mylar tape layer 4 and the hot-melt Mylar tape layer 5.
[0022] In some embodiments, the multilayer cable with ground wire disclosed in this utility model has a height of 0.79±0.05mm and a width of 1.45±0.07mm.
[0023] In some embodiments, there are two types of ground wires: one is a solid round tin-plated ground wire 6, and the other is a flat tin-plated ground wire 7. There are two solid round tin-plated ground wires 6, which are symmetrically arranged between the aluminum foil Mylar tape layer 4 and the hot melt Mylar tape layer 5 and located on the left and right opposite sides of the wire core. There are two flat tin-plated ground wires 7, which are symmetrically arranged between the aluminum foil Mylar tape layer 4 and the hot melt Mylar tape layer 5 and located on the upper and lower opposite sides of the wire core.
[0024] In some embodiments, the diameter of the solid round tin-plated ground wire 6 is 0.14±0.08mm, preferably a solid round tin-plated copper ground wire. Through tin plating, the tin layer can protect the internal copper wire from oxidation and corrosion, thereby improving the conductivity of the copper wire.
[0025] In some embodiments, the flat tin-plated ground wire 7 has the following specifications: width 0.5±0.05mm and thickness 0.025±0.05mm. A flat tin-plated copper ground wire is preferred. Through tin plating, the tin layer protects the internal copper conductors from oxidation and corrosion, thereby improving the conductivity of the copper conductors. The flat tin-plated ground wire 7 has a stable structure and is not easily deformed or broken by external forces, thus ensuring the stability of the cable during long-term use. Tin plating enhances the ground wire's corrosion resistance and oxidation resistance, extending the cable's service life. Simultaneously, the hot-melt Mylar tape layer 5 provides additional protection, preventing mechanical damage to the cable.
[0026] By dragging solid round tin-plated ground wires 6 into the left and right sides of the wire core, a symmetrical reference plane can be provided to ensure impedance matching, reduce signal reflection and jitter, and the ground wire isolates adjacent signal lines to reduce crosstalk. By dragging flat tin-plated ground wires 7 into the top and bottom sides of the wire core, the assembly and soldering convenience is greatly optimized without affecting the width, and the grounding of the cable in the assembly is guaranteed. By dragging two different ground wires, solid round tin-plated ground wires 6 and flat tin-plated ground wires 7, the versatility of the cable product can be realized, and it has higher reliability than the structure without ground wire. It greatly optimizes the reliability test results and will not have problems such as solder joint variation and poor contact. It is suitable for internal signal transmission in various servers, switches, etc.
[0027] In some embodiments, the specifications of the heat-fused Mylar tape layer 5 are: width 2±0.05mm, thickness 0.017±0.05mm, and coverage ≥100%. The heat-fused Mylar tape layer 5 has excellent insulation properties, which can prevent current leakage between the wire core and the external environment, ensuring the safe use of the cable; the heat-fused Mylar tape layer 5 also has good heat resistance and fire resistance, which can maintain stable performance in high-temperature environments, preventing safety accidents such as fires caused by overheating of the cable; the heat-fused Mylar tape layer 5 can also enhance the durability of the cable, enabling it to maintain good performance and service life in various harsh environments.
[0028] In some embodiments, the aluminum foil Mylar tape layer 4 has its aluminum surface facing outwards towards the hot-melt Mylar tape layer 5, with a coverage of ≥100%. The specifications of the aluminum foil Mylar tape layer 4 are: width 4±0.05mm and thickness 0.027±0.05mm. This can more effectively block external electromagnetic waves from interfering with the internal signals of the cable, ensuring stable signal transmission. It can also utilize the thermal conductivity of aluminum foil to conduct heat away more effectively, preventing the cable from overheating, thereby extending the cable's service life and stability.
[0029] In some embodiments, the wrapping layer 3 is a polytetrafluoroethylene (PTFE) tape with the following specifications: width 3±0.05mm, thickness 0.05±0.05mm, and overlap rate ≥25%.
[0030] In some embodiments, the insulating layer 2 is an FEP insulating layer, and the outer diameter of the insulating layer 2 after being extruded over the silver-plated copper conductor 1 is 0.48±0.05mm.
[0031] Example 1
[0032] like Figure 1As shown, a multi-layer cable with different ground wires, 0.80mm high and 1.44mm wide, includes a core. The core comprises two 0.22mm diameter silver-plated copper conductors 1 arranged in a straight line. Each silver-plated copper conductor 1 is externally wrapped with an insulation layer 2, which is FEP insulation. The outer diameter of the insulation layer 2 after extrusion is 0.485mm. A wrapping layer 3, made of PTFE tape, is provided on the outside of the core, with specifications of 3mm width and 0mm thickness. The aluminum foil Mylar tape layer 4 is 0.05mm wide and 0.030mm thick. The aluminum surface of the aluminum foil Mylar tape layer 4 faces outward toward the hot-melt Mylar tape layer 5, with a coverage of 113%. The specifications of the aluminum foil Mylar tape layer 4 are: 4mm wide and 0.017mm thick. The specifications of the hot-melt Mylar tape layer 5 are: 2mm wide and 0.017mm thick, with a coverage of ≥129%. Two different ground wires are provided between the aluminum foil Mylar tape layer 4 and the hot-melt Mylar tape layer 5.
[0033] In this embodiment, there are two types of ground wires: one is a solid round tin-plated ground wire 6 with a diameter of 0.14mm, and the other is a flat tin-plated ground wire 7 (tin-plated copper) with a width of 0.5mm and a thickness of 0.025mm.
[0034] There are two solid-core round tin-plated ground wires 6, symmetrically arranged between the aluminum foil Mylar tape layer 4 and the hot-melt Mylar tape layer 5, located on opposite sides of the wire core. The solid-core round tin-plated ground wires 6 are flat tin-plated copper ground wires. Through tin plating, the tin layer can protect the internal copper conductor from oxidation and corrosion, thereby improving the conductivity of the copper conductor.
[0035] There are two flat tin-plated ground wires 7, symmetrically arranged between the aluminum foil Mylar tape layer 4 and the hot-melt Mylar tape layer 5, located on opposite sides of the wire core. The flat tin-plated ground wires 7 are made of flat tin-plated copper. Through tin plating, the tin layer protects the internal copper conductor from oxidation and corrosion, thereby improving the conductivity of the copper conductor. The flat tin-plated ground wires 7 have a stable structure and are not easily deformed or broken by external forces, thus ensuring the stability of the cable during long-term use. Tin plating enhances the ground wire's corrosion resistance and oxidation resistance, extending the cable's service life. Simultaneously, the hot-melt Mylar tape layer 5 provides additional protection, preventing mechanical damage to the cable.
[0036] In this embodiment, by dragging solid-core tin-plated ground wires 6 into the left and right sides of the wire core, a symmetrical reference plane is provided, ensuring impedance matching, reducing signal reflection and jitter, and isolating adjacent signal lines with ground wires to reduce crosstalk. By dragging flat tin-plated ground wires 7 into the top and bottom sides of the wire core, the ease of assembly and soldering is greatly optimized without affecting the width, ensuring good grounding of the cable in the assembly. By dragging in two different ground wires, solid-core tin-plated ground wires 6 and flat tin-plated ground wires 7, the versatility of the cable product can be achieved. Compared with conventional methods of using no ground wire or a single ground wire, this embodiment can achieve greater versatility.
[0037] The hot-melt Mylar tape layer 5 has excellent insulation properties, which can prevent current leakage between the wire core and the external environment and ensure the safe use of the cable. The hot-melt Mylar tape layer 5 also has good heat resistance and fire resistance, which can maintain stable performance in high-temperature environments and prevent safety accidents such as fires caused by overheating of the cable. The hot-melt Mylar tape layer 5 can also enhance the durability of the cable, so that it can maintain good performance and service life in various harsh environments.
[0038] By designing the aluminum foil Mylar tape layer 4, external electromagnetic waves can be more effectively blocked from interfering with the internal signals of the cable, ensuring stable signal transmission. The thermal conductivity of aluminum foil can also be used to conduct heat away more effectively, preventing the cable from overheating, thereby extending the cable's service life and stability.
[0039] Conventional cables without a ground wire or with a single ground wire are prone to solder joint variations during reliability testing (dual 85 test: testing cable performance in an environment of 85°C high temperature and 85% high humidity; temperature cycling test). Poor contact between the aluminum foil and the shielding sheet after removing the hot-melt Mylar portion leads to defects. This embodiment greatly optimizes the reliability test results by adding a solid round tin-plated ground wire 6 and a flat tin-plated ground wire 7, eliminating problems such as solder joint variations and poor contact. It is suitable for internal signal transmission in various servers, switches, etc.
[0040] The parts or structures not specifically described in this utility model can be made using existing technology or existing products, and will not be elaborated here.
[0041] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A multilayer cable with different ground wires, comprising a core, wherein the core is surrounded by a wrapping layer, characterized in that, An aluminum foil Mylar tape layer is provided outside the wrapping layer, and a hot-melt Mylar tape layer is provided outside the aluminum foil Mylar tape layer. Several ground wires are provided between the aluminum foil Mylar tape layer and the hot-melt Mylar tape layer.
2. A multilayer cable with different ground wires according to claim 1, characterized in that, There are two types of ground wires: one is a solid round tin-plated ground wire, and the other is a flat tin-plated ground wire. There are two solid round tin-plated ground wires, which are symmetrically arranged between the aluminum foil Mylar tape layer and the hot melt Mylar tape layer and located on the left and right opposite sides of the wire core. There are two flat tin-plated ground wires, which are symmetrically arranged between the aluminum foil Mylar tape layer and the hot melt Mylar tape layer and located on the top and bottom opposite sides of the wire core.
3. A multi-layer cable with different ground wires according to claim 2, characterized in that, The diameter of the solid round tin-plated ground wire is 0.14±0.08mm.
4. A multi-layer cable with different ground wires according to claim 2, characterized in that, The specifications of the flat tin-plated ground wire are: width 0.5±0.05mm and thickness 0.025±0.05mm.
5. A multilayer cable with different ground wires according to claim 1, characterized in that, The specifications of the hot-melt Mylar tape layer are: width 2±0.05mm, thickness 0.017±0.05mm, and coverage ≥100%.
6. A multilayer cable with different ground wires according to claim 1, characterized in that, The aluminum surface of the aluminum foil Mylar tape layer faces outwards and toward the hot-melt Mylar tape layer, with a coverage of ≥100%.
7. A multilayer cable with different ground wires according to claim 1, characterized in that, The specifications of the aluminum foil Mylar tape layer are: width 4±0.05mm, thickness 0.027±0.05mm.
8. A multilayer cable with different ground wires according to claim 1, characterized in that, The core comprises several silver-plated copper conductors with a diameter of 0.22±0.08mm. Each silver-plated copper conductor is covered with an insulation layer, and the outer diameter after the insulation layer is 0.48±0.05mm.
9. A multilayer cable with different ground wires according to claim 1, characterized in that, The wrapping layer is a PTFE tape with the following specifications: width 3±0.05mm, thickness 0.05±0.05mm, and overlap rate ≥25%.
10. A multilayer cable with different ground wires according to claim 1, characterized in that, The height of the multilayer cable with different ground wires is 0.79±0.05mm, and the width is 1.45±0.07mm.