Sampling circuit board, cell module, battery pack, energy storage device and power utilization device

Abstract

The application belongs to the technical field of batteries, and provides a sampling circuit board, a battery cell module, a battery pack, an energy storage device and a power utilization device. The sampling circuit board comprises a signal layer and a ground layer, the signal layer is used for being connected with a to-be-sampled component, the ground layer is connected with the signal layer, the ground layer is provided with at least one hollow part, and at least part of the circumferential side of the hollow part is provided with a connecting part. The safety of the sampling circuit board provided in the application is relatively high in the sampling process.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a sampling circuit board, a cell module, a battery pack, an energy storage device, and an electrical device. Background Technology

[0002] The status information of electrical equipment such as vehicles, aircraft, ferries, computers, or energy storage cabinets needs to be monitored in real time.

[0003] The sampling circuit board can be connected to the component to be sampled in the electrical equipment. The sampling circuit board is used to collect information such as voltage, current and temperature of the component to be sampled and transmit it to the management controller so that the pipeline controller can monitor and control the working status of the component to be sampled.

[0004] In related technologies, the safety of sampling circuit boards during the sampling process needs to be improved. Utility Model Content

[0005] This application provides a sampling circuit board, a cell module, a battery pack, an energy storage device, and an electrical device. The sampling circuit board provides high security during the sampling process.

[0006] This application provides a sampling circuit board, including a signal layer and a ground layer. The signal layer is connected to the device to be sampled. The ground layer is connected to the signal layer and has at least one cutout. At least a portion of the cutout has a connecting portion on its periphery.

[0007] In one possible implementation, the sampling circuit board provided in this application has one or more cutouts, and the total area of ​​the one or more cutouts is 40%-70% of the total area of ​​the ground layer.

[0008] In one possible implementation, the sampling circuit board provided in this application has a cutout portion whose projection shape on the plane where the ground layer is located is one or more of a rectangle, a polygon, or an ellipse.

[0009] In one possible implementation, the sampling circuit board provided in this application has at least two cutouts, and along the line connecting the centers of two adjacent cutouts, the size of at least a portion of the connecting portion is less than or equal to 2 / 3 of the size of the cutout adjacent to the connecting portion.

[0010] In one possible implementation, the sampling circuit board provided in this application further includes a first via, one end of which is connected to the signal layer and the other end of which is connected to the connection portion.

[0011] In one possible implementation, the sampling circuit board provided in this application further includes a surface layer and a second via. The surface layer is located on opposite sides of the sampling circuit board along the thickness direction of the sampling circuit board. One end of the second via is connected to the signal layer, and the other end is connected to the surface layer.

[0012] In one possible implementation, the sampling circuit board provided in this application further includes a third via, one end of which is connected to the ground layer and the other end of which is connected to the surface layer.

[0013] In one possible implementation, the sampling circuit board provided in this application further includes a first protective layer that covers the surface layer.

[0014] In one possible implementation, the sampling circuit board provided in this application further includes an insulating layer, wherein an insulating layer is provided between the signal layer and the ground layer, between the signal layer and its adjacent surface layer, and between the ground layer and its adjacent surface layer.

[0015] In one possible implementation, the sampling circuit board provided in this application further includes sampling terminals, and the signal layer is connected to the sampling terminals to connect to the device to be sampled through the sampling terminals.

[0016] In one possible implementation, the sampling circuit board provided in this application uses a battery cell as the sampled component.

[0017] This application also provides a battery cell module, including a battery cell and the above-mentioned sampling circuit board, wherein the sampling circuit board is connected to the battery cell to sample the battery cell.

[0018] In one possible implementation, the battery cell comprises multiple battery cells arranged along a first direction, and a sampling circuit board extends along the first direction such that each battery cell is connected to the sampling circuit board.

[0019] In one possible implementation, the battery cell module provided in this application further includes a connecting piece for electrically connecting two adjacent battery cells; the battery cell module also includes a second protective layer located between the connecting piece and the sampling circuit board.

[0020] In one possible implementation, the battery cell module provided in this application includes a sampling circuit board with sampling terminals, the sampling terminals including a first sampling terminal and a second sampling terminal, the battery cell including a housing, at least a portion of the first sampling terminal being connected to a connecting piece, and at least a portion of the second sampling terminal being electrically connected to the housing.

[0021] This application also provides a battery pack, including the above-mentioned sampling circuit board or including the above-mentioned cell module.

[0022] This application also provides an energy storage device, including the above-mentioned sampling circuit board, or including the above-mentioned cell module, or including the above-mentioned battery pack.

[0023] This application also provides an electrical device, including the above-mentioned sampling circuit board, or including the above-mentioned battery cell module, or including the above-mentioned battery pack.

[0024] The sampling circuit board provided in this application, by providing at least one hollow portion in the ground layer, with at least a portion of the hollow portion having a connecting portion on its periphery, can reduce the probability of thermal runaway of a sampled component being transmitted to other components, thereby increasing the safety of the sampling process. By providing at least one hollow portion and a connecting portion, the ground layer of the sampling circuit board is more likely to melt in extreme cases, and the area of ​​short-circuit arcing can be reduced. The smaller the area of ​​short-circuit arcing, the less destructive the arcing, further improving the safety of the sampling process. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the battery pack structure provided in an embodiment of this application;

[0027] Figure 2 This is an exploded view of the battery pack provided in an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of the battery cell module provided in the embodiments of this application;

[0029] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0030] Figure 5 This is an exploded view of the battery cell module provided in an embodiment of this application;

[0031] Figure 6 for Figure 5 Enlarged view of point B in the middle;

[0032] Figure 7 This is a schematic diagram illustrating the connection method of each component in the battery cell module provided in the embodiments of this application;

[0033] Figure 8 This is a schematic diagram of the sampling circuit board provided in an embodiment of this application;

[0034] Figure 9 For along Figure 8 A sectional view of the C-plane;

[0035] Figure 10 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 1 ;

[0036] Figure 11 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 2 ;

[0037] Figure 12 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 3 ;

[0038] Figure 13 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 4 .

[0039] Explanation of reference numerals in the attached figures:

[0040] 10-Battery cell module;

[0041] 100 - Sampling circuit board; 100a - Insulating layer; 100b - Conductive layer;

[0042] 110 - Signal Layer;

[0043] 120 - Grounding layer; 121 - Hollowed-out section; 122 - Connecting section;

[0044] 130 - Surface layer;

[0045] 140 - First via;

[0046] 150 - Second via;

[0047] 160 - Components;

[0048] 170 - Sampling terminal; 171 - First sampling terminal; 172 - Second sampling terminal;

[0049] 180 - First protective layer;

[0050] 190 - Third via;

[0051] 200 - Cell; 200a - First cell; 200b - Second cell; 200c - Third cell; 200d - Fourth cell; 200e - Fifth cell;

[0052] 210 - Positive terminal;

[0053] 220 - Negative terminal;

[0054] 230 - Housing; 231 - Contact;

[0055] 300 - Connecting piece; 300a - First connecting piece; 300b - Second connecting piece; 300c - Third connecting piece; 300d - Fourth connecting piece;

[0056] 20 - Box body; 21 - Receiving cavity;

[0057] 1000-battery pack;

[0058] H - Thickness direction;

[0059] L - Direction of connection; L1 - First dimension; L2 - Second dimension;

[0060] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0062] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0064] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0065] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such as a process, method, system, product, or maintenance tool that includes a series of steps or units, not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or maintenance tools.

[0066] The status information of electrical equipment such as vehicles, aircraft, ferries, computers, or energy storage cabinets needs to be monitored in real time.

[0067] Taking a battery pack as an example, the battery pack includes cell modules and a management controller. Each cell module contains multiple cells, which can be connected in series or parallel via connectors. The cells can be blade-shaped, with a larger length and smaller width and height. The positive and negative terminals of each cell are located at their respective ends along its length. The management controller is electrically connected to the cells to monitor their voltage, current, and temperature. While cables could be used to connect the cells and management controller, their large length necessitates long cables, and multiple cables occupy too much space. Furthermore, exposed cables can cause short circuits. Therefore, a sampling circuit board can be placed on one side of the cell module. This sampling circuit board is electrically connected to multiple cells and the management controller, allowing it to collect voltage, current, and temperature information from the cells and transmit it to the management controller. This enables the controller to monitor and control the cells' operating status.

[0068] When the electrolyte in one of the battery cells leaks, the highly corrosive electrolyte will corrode the insulation layer. The internal circuitry of the circuit board may short-circuit and arc with the connecting pieces, potentially triggering thermal runaway in the corresponding battery cell. This thermal runaway can then be transmitted to other cells, ultimately causing thermal runaway across the entire battery pack. In summary, the safety of the sampling circuit board in related technologies needs improvement during the sampling process to prevent sampling accidents under extreme conditions.

[0069] Based on this, embodiments of this application provide a sampling circuit board, a cell module, a battery pack, an energy storage device, and an electrical device, with the sampling circuit board providing high security during the sampling process.

[0070] The energy storage device can be a battery pack, a battery compartment, or an energy storage cabinet. When the energy storage device is a battery compartment or an energy storage cabinet, it can include multiple battery packs. The energy storage device can also include a cell module 10, in which a sampling circuit board 100 is provided. The sampling circuit board 100 is used to collect information from each cell 200 in the cell module 10. The sampling circuit board 100 can also be located in other positions within the energy storage device or battery pack to collect information from other components in the energy storage device or battery pack.

[0071] The following explanation will take the example of the sampling circuit board 100 being located in the battery pack 10. First, the structure of the battery pack 10 will be explained.

[0072] Figure 1 This is a schematic diagram of the battery pack structure provided in an embodiment of this application; Figure 2 This is an exploded view of a battery pack provided in an embodiment of this application. Figure 2 The top cover of the box is not shown.

[0073] See Figure 1 and Figure 2 As shown, the battery pack 1000 includes a cell module 10 and a housing 20. The housing 20 has a receiving cavity 21, and the cell module 10 can be disposed in the receiving cavity 21. Figure 2 In the middle, the housing 20 has four receiving cavities 21, and the battery pack 1000 includes four battery cell modules 10, with one battery cell module 10 being received in each receiving cavity 21.

[0074] Figure 3 This is a schematic diagram of the structure of the battery cell module provided in the embodiments of this application; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is an exploded view of the battery cell module provided in an embodiment of this application; Figure 6 for Figure 5 Enlarged view of point B in the middle.

[0075] See Figures 3 to 6 As shown, the battery cell module 10 includes a plurality of battery cells 200 and a sampling circuit board 100. The plurality of battery cells 200 are arranged along a first direction X, and the sampling circuit board 100 extends along the first direction X so that the plurality of battery cells 200 are all connected to the sampling circuit board 100.

[0076] Multiple battery cells 200 are stacked to form a battery cell module 10. The battery cell module 10 includes a first direction X, a second direction Y and a third direction Z, wherein the stacking direction of the battery cells 200 is the first direction X.

[0077] Figure 7 This is a schematic diagram illustrating the connection method of various components in the battery cell module provided in the embodiments of this application.

[0078] See Figures 3 to 5 as well as Figure 7 As shown, the battery cell module 10 also includes a connecting piece 300, which is used to connect two adjacent battery cells 200.

[0079] Please continue reading Figure 7 As shown, the battery cell 200 includes terminals, including a positive terminal 210 and a negative terminal 220, which are disposed on both sides of the battery cell 200 along a second direction Y. A connecting piece 300 is used to connect the terminals of adjacent battery cells 200 to allow adjacent battery cells 200 to be connected in series or in parallel. The battery cell module 10 also includes a bracket (not shown in the figure), which can be located between the battery cell 200 and the sampling circuit board 100. The connecting piece 300 can be fixed to the battery cell 200 via the bracket.

[0080] Figure 7 The image shows five battery cells 200, namely, first battery cell 200a, second battery cell 200b, third battery cell 200c, fourth battery cell 200d and fifth battery cell 200e. The positive terminal 210 and negative terminal 220 of the five battery cells 200 are arranged alternately. The staggered arrangement refers to the following: the positive terminal 210 of the first cell 200a, the negative terminal 220 of the second cell 200b, the positive terminal 210 of the third cell 200c, the negative terminal 220 of the fourth cell 200d, and the positive terminal 210 of the fifth cell 200e are all oriented towards the same end along the second direction Y; the negative terminal 220 of the first cell 200a, the positive terminal 210 of the second cell 200b, the negative terminal 220 of the third cell 200c, the positive terminal 210 of the fourth cell 200d, and the negative terminal 220 of the fifth cell 200e are all oriented towards the other end along the second direction Y.

[0081] The connecting pieces 300 are respectively a first connecting piece 300a, a second connecting piece 300b, a third connecting piece 300c, and a fourth connecting piece 300d. The negative terminal 220 of the first cell 200a is connected to the positive terminal 210 of the second cell 200b through the first connecting piece 300a. The negative terminal 220 of the second cell 200b is electrically connected to the positive terminal 210 of the third cell 200c through the second connecting piece 300b. The negative terminal 220 of the third cell 200c is electrically connected to the positive terminal 210 of the fourth cell 200d through the third connecting piece 300c. The negative terminal 220 of the fourth cell 200d is electrically connected to the positive terminal 210 of the fifth cell 200e through the fourth connecting piece 300d. Thus, the first cell 200a, the second cell 200b, the third cell 200c, the fourth cell 200d, and the fifth cell 200e are connected in series. The first connecting piece 300a and the third connecting piece 300c are located at the same end along the second direction Y, while the second connecting piece 300b and the fourth connecting piece 300d are located at the other end along the second direction Y.

[0082] The sampling circuit board 100 can be disposed on one side of the cell module 10 along the second direction Y, and the sampling circuit board 100 extends along the first direction X, so that the sampling circuit board 100 is electrically connected to each cell 200 in the cell module 10, so as to collect information such as voltage, current and temperature of each cell 200.

[0083] Figure 8 This is a schematic diagram of the sampling circuit board provided in an embodiment of this application; Figure 9 For along Figure 8 A sectional view of the C-plane; Figure 10 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 1 ; Figure 11 This is a schematic diagram showing the relative positions of the ground layer and the battery cell in the sampling circuit board provided in the embodiments of this application.

[0084] See Figures 8 to 11 As shown, the sampling circuit board 100 provided in this embodiment includes a signal layer 110 and a ground layer 120. The signal layer 110 is used to connect to the battery cell 200. The ground layer 120 is connected to the signal layer 110. The ground layer 120 has at least one cutout portion 121, and at least a portion of the cutout portion 121 has a connecting portion 122 on its periphery.

[0085] Please continue reading Figure 9 As shown, the sampling circuit board 100 includes an insulating layer 100a and a conductive layer 100b stacked along the thickness direction H of the sampling circuit board 100, wherein the thickness direction H is consistent with the second direction Y.

[0086] Insulating layer 100a is used to separate adjacent conductive layers 100b. The substrate of insulating layer 100a can be resin filled with glass fiber. The number of conductive layers 100b is the same as the number of layers in sampling circuit board 100. Figure 9 The image shows a four-layer sampling circuit board 100. These four conductive layers 100b are a signal layer 110, a ground layer 120, and a surface layer 130 located on two surfaces of the sampling circuit board 100 along the thickness direction H.

[0087] Please continue reading Figure 9 As shown, the sampling circuit board 100 also includes a first via 140, which extends along the thickness direction H. One end of the first via 140 is connected to the signal layer 110, and the other end is connected to the ground layer 120, so that the signal layer 110 is connected to the ground layer 120.

[0088] Please continue reading Figure 9As shown, the sampling circuit board 100 also includes a second via 150. One end of the second via 150 is connected to the signal layer 110, and the other end is connected to the surface layer 130, so that the surface layer 130 is connected to the signal layer 110. Some components 160 can also be disposed on the surface layer 130, and the components 160 are connected to the surface layer 130, so that the components 160 can be connected to the signal layer 110 through the second via 150.

[0089] Please continue reading Figure 9 As shown, the sampling circuit board 100 also includes a third via 190, one end of which is connected to the ground layer 120 and the other end is connected to the surface layer 130, so that the surface layer 130 can be grounded.

[0090] Please continue reading Figure 4 and Figure 8 As shown, the sampling circuit board 100 also includes a sampling terminal 170, one end of which is connected to the surface layer 130 and the other end is connected to the battery cell 200. The voltage, current, and temperature information of the battery cell 200 collected by the sampling terminal 170 can be transmitted to the signal layer 110 through the surface layer 130 and the second via 150 in sequence.

[0091] Please continue reading Figure 4 and Figure 7 As shown, sampling terminal 170 can be electrically connected to connecting piece 300. Since connecting piece 300 connects two adjacent cells 200, the connection between sampling terminal 170 and connecting piece 300 allows for simultaneous acquisition of information from two cells 200, resulting in a smaller number of sampling terminals 170 in the sampling circuit board 100. Figure 7 In the middle, the second connecting piece 300b and the fourth connecting piece 300d are electrically connected to the surface layer 130 of the sampling circuit board 100 through the sampling terminal 170.

[0092] When electrolyte leakage or thermal runaway occurs in the second cell 200b or the third cell 200c, the electrolyte will corrode the insulating layer 100a. Since the potential of the ground layer 120 is low, the signal layer 110 may short-circuit with the ground layer 120.

[0093] For example, when the third cell 200c experiences thermal runaway or leakage, the electrolyte flows into the sampling circuit board 100, causing a short circuit between the signal layer 110 and the ground layer 120 of the sampling circuit board 100. Since the fourth connecting piece 300d is also electrically connected to the sampling circuit board 100, the current flows along the ground layer 120 to the position connected to the fourth connecting piece 300d, causing the fourth cell 200d connected to the fourth connecting piece 300d to also short circuit with the third cell 200c. The short circuit causes the fourth cell 200d to arc with the ground layer 120 of the sampling circuit board 100, which has a lower potential, causing the fourth cell 200d to also experience thermal runaway.

[0094] Please continue reading Figure 10 and Figure 11 As shown in this embodiment, a connecting portion 122 is provided around each cutout portion 121 in the ground layer 120. The connecting portion 122 ensures that each area of ​​the ground layer 120 remains conductive, without affecting the function of the ground layer 120. Because of the cutout portion 121 and the connecting portion 122, when the sampling circuit board 100 experiences a short circuit due to thermal runaway or leakage of the second cell 200b, the current in the ground layer 120 increases instantaneously. Since the cutout portion 121 cannot carry current, all the current flows into the connecting portion 122, resulting in a large current and increased temperature in the connecting portion 122. The connecting portion 122 melts due to the increased temperature, making it difficult for the current to flow along the ground layer 120 to the fourth cell 200d. In other words, by providing the cutout portion 121 and the connecting portion 122, the probability of thermal runaway from one cell 200 being transmitted to other cells 200 can be reduced, resulting in higher safety during the sampling process of the sampling circuit board 100, thereby improving the overall safety of the cell module 10. By setting the cutout portion 121, the area of ​​short-circuit arcing can be reduced. The smaller the area of ​​short-circuit arcing, the less destructive the arcing will be, which can further improve the safety of the sampling circuit board 100 during the sampling process.

[0095] Table 1 shows a comparison of the safety test results for battery pack 1000.

[0096] Table 1

[0097]

[0098] Referring to Table 1, the same safety test conditions were used. When the ground layer 120 of the sampling circuit board 100 had a cutout 121 and a connection 122, the battery pack 1000 did not experience arcing or fire. Upon disassembly of the sampling circuit board 100, some of the connection 122 had melted. When the ground layer was a single copper layer, the battery pack caught fire and exploded during the safety test. Upon disassembly of the sampling circuit board, the ground layer was still a single copper layer. When the sampling circuit board was removed from the battery pack, no arcing or fire occurred during the safety test, indicating that the arcing or fire was caused by current transmission within the sampling circuit board.

[0099] In addition, by providing a cutout 121 in the ground layer 120, the amount of copper foil used in the ground layer 120 can be reduced, thereby reducing the cost of the sampling circuit board 100.

[0100] In one possible implementation, the cutout portion 121 is one or more, and the total area of ​​the one or more cutout portions 121 on the ground layer 120 is 40%-70% of the total area of ​​the ground layer 120.

[0101] If the area of ​​the cutout portion 121 is too large, it will affect the return current function and electromagnetic shielding effect of the grounding layer 120 during normal operation; if the area of ​​the cutout portion 121 is too small, the area of ​​the connecting portion 122 will increase, and the current required for the fuse of the connecting portion 122 will be larger, making the fuse of the connecting portion 122 more difficult. Therefore, in this embodiment, the total area of ​​the multiple cutout portions 121 can be set to 40%-70% of the total area of ​​the grounding layer 120.

[0102] Figure 12 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 3 ; Figure 13 A schematic diagram of the ground plane structure in the sampling circuit board provided in this application embodiment. Figure 4 .

[0103] See Figures 10 to 13 As shown, the projection shape of the hollow part 121 on the plane where the ground layer 120 is located is one or more of a rectangle, a polygon, or an ellipse.

[0104] exist Figure 10 and Figure 11 In the middle, the hollowed-out part 121 is rectangular, in Figure 12 In the middle, the hollowed-out part 121 is a polygon. Figure 13 In the original embodiment, the cutout portion 121 is elliptical. In another embodiment, the cutout portion 121 can be either rectangular or elliptical. In yet another embodiment, the cutout portion 121 can also be other irregular shapes. The first via 140 is connected to the connecting portion 122 in the ground layer 120, and the shape of the projection of the cutout portion 121 onto the ground layer 120 needs to avoid the first via 140. The position of the cutout portion 121 on the ground layer 120 is relatively flexible, as long as it avoids the first via 140.

[0105] Please continue reading Figure 10 As shown, the example is a rectangle with a hollowed-out portion 121. In one possible embodiment, there are at least two hollowed-out portions, and along the line L connecting the centers of two adjacent hollowed-out portions 121, the size of at least part of the connecting portion 122 is less than or equal to 2 / 3 of the size of the hollowed-out portion 121 adjacent to the connecting portion 122.

[0106] The direction L of the line connecting two adjacent hollowed-out portions 121 can be changed according to the specific position of the hollowed-out portion 121, for example, Figure 10 The diagram shows two directions L of three lines, two of which are parallel to two sides of the rectangle, and the third direction L forms an angle with a side of the rectangle. It should be noted that the direction L lies on the plane containing the grounding layer 120, and the plane containing the grounding layer 120 is perpendicular to the thickness direction H.

[0107] Along the connecting line direction L, the size of the connecting part 122 is the first size L1, and the size of the two hollow parts 121 adjacent to the connecting part 122 is the second size L2. The first size L1 is less than or equal to 2 / 3 of the second size L2. As a result, the cross-sectional area of ​​the connecting part 122 is smaller. In the event of a short circuit, the current in the connecting part 122 is larger, and the connecting part 122 is more likely to melt.

[0108] Please continue reading Figure 9 As shown, in one possible implementation, the sampling circuit board 100 further includes a first protective layer 180, which covers the surface layer 130.

[0109] A first protective layer 180 can be disposed on both surface layers 130 along the thickness direction H, and the first protective layer 180 can protect the surface of the sampling circuit board 100. In the embodiments of this application, the first protective layer 180 can also slow down the rate at which the electrode liquid corrodes the insulating layer 100a.

[0110] In one possible implementation, the battery module 10 further includes a second protective layer (not shown in the figure), which is located between the connecting piece 300 and the sampling circuit board 100.

[0111] The second protective layer can be a potting compound filled between the connecting piece 300 and the sampling circuit board 100. The second protective layer can also slow down the rate at which the electrode liquid corrodes the insulating layer 100a.

[0112] The specific connection method between sampling terminal 170 and battery cell 200 is described below.

[0113] Please continue reading Figure 6 and Figure 8 As shown, the sampling terminal 170 includes a first sampling terminal 171 and a second sampling terminal 172, and the battery cell 200 includes a housing 230. Part of the first sampling terminal 171 is connected to the connecting piece 300, and the second sampling terminal 172 is connected to the housing 230.

[0114] The first sampling terminal 171 and the second sampling terminal 172 are disposed at both ends of the sampling circuit board 100 along the third direction Z. The sampling terminal 170 connected to the connecting piece 300 is the first sampling terminal 171. The housing 230 of the battery cell 200 has a contact 231, and the second sampling terminal 172 is connected to the contact 231 on the housing 230. For example, when collecting voltage information, the housing 230 is a voltage reference point, and the voltage difference between the first sampling terminal 171 and the second sampling terminal 172 is the voltage information of the battery cell 200.

[0115] This application also provides an electrical device, including the battery pack 1000 provided in the above embodiments.

[0116] Electrical equipment can be vehicles, aircraft, ferries, computers, or energy storage cabinets, etc., powered by battery packs. Vehicles can be electric vehicles (EVs), pure electric vehicles (PEVs / BEVs), hybrid electric vehicles (HEVs), range-extended electric vehicles (REEVs), plug-in hybrid electric vehicles (PHEVs), or new energy vehicles. The battery pack 1000 is used to power the electrical equipment, and the equipment may include one or more battery packs 1000.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A sampling circuit board, characterized in that, include: A signal layer (110) is used to connect to the sampled component; A ground layer (120) is connected to the signal layer (110). The ground layer (120) has at least one cutout (121), and at least a portion of the cutout (121) has a connecting portion (122) on its periphery. A first via (140) is connected at one end to the signal layer (110) and at the other end to the connection portion (122).

2. The sampling circuit board according to claim 1, characterized in that, The hollow portion (121) can be one or more, and the total area of ​​the one or more hollow portions (121) is 40%-70% of the total area of ​​the ground layer (120).

3. The sampling circuit board according to claim 1, characterized in that, The projection shape of the hollow part (121) on the plane where the ground layer (120) is located is a polygon and / or an ellipse.

4. The sampling circuit board according to claim 3, characterized in that, The hollow portion (121) is at least two, and along the line connecting the centers of two adjacent hollow portions (121), at least part of the size of the connecting portion (122) is less than or equal to 2 / 3 of the size of the hollow portion (121) adjacent to the connecting portion.

5. The sampling circuit board according to claim 1, characterized in that, It also includes a surface layer (130), and the sampling circuit board (100) further includes a second via (150). The surface layer (130) is located on opposite sides of the sampling circuit board (100) along the thickness direction of the sampling circuit board (100). One end of the second via (150) is connected to the signal layer (110), and the other end is connected to the surface layer (130).

6. The sampling circuit board according to claim 5, characterized in that, It also includes a third via (190), one end of which is connected to the ground layer (120) and the other end is connected to the surface layer (130).

7. The sampling circuit board according to claim 5, characterized in that, It also includes a first protective layer (180) that covers the surface layer (130).

8. The sampling circuit board according to claim 5, characterized in that, It also includes an insulating layer (100a), which is provided between the signal layer (110) and the ground layer (120), between the signal layer (110) and the adjacent surface layer (130), and between the ground layer (120) and the adjacent surface layer (130).

9. The sampling circuit board according to any one of claims 1 to 8, characterized in that, It also includes a sampling terminal (170), the signal layer (110) is connected to the sampling terminal (170) to connect to the sampled object through the sampling terminal (170).

10. The sampling circuit board according to any one of claims 1 to 8, characterized in that, The sample to be sampled is a battery cell (200).

11. A battery cell module, characterized in that, It includes a battery cell (200) and a sampling circuit board (100) as claimed in any one of claims 1 to 10, the sampling circuit board (100) being connected to the battery cell (200) to sample the battery cell (200).

12. The cell module according to claim 11, characterized in that, There are multiple battery cells (200), and the multiple battery cells (200) are arranged along a first direction. The sampling circuit board (100) extends along the first direction so that all of the multiple battery cells (200) are connected to the sampling circuit board (100).

13. The cell module according to claim 12, characterized in that, It also includes a connecting piece (300) for connecting two adjacent cells (200); The battery cell module (10) also includes a second protective layer, which is located between the connecting piece (300) and the sampling circuit board (100).

14. The cell module according to claim 13, characterized in that, The sampling circuit board (100) includes sampling terminals (170), the sampling terminals (170) include a first sampling terminal (171) and a second sampling terminal (172), the battery cell (200) includes a housing (230), at least a portion of the first sampling terminal (171) is connected to the connecting piece (300), and at least a portion of the second sampling terminal (172) is connected to the housing (230).

15. A battery pack, characterized in that, It includes a sampling circuit board (100) as described in any one of claims 1 to 10 or a cell module (10) as described in any one of claims 11 to 14.

16. An energy storage device, characterized in that, It includes a sampling circuit board (100) as described in any one of claims 1 to 10, or a cell module (10) as described in any one of claims 11 to 14, or a battery pack (1000) as described in claim 15.

17. An electrical appliance, characterized in that, It includes a sampling circuit board (100) as described in any one of claims 1 to 10, or a cell module (10) as described in any one of claims 11 to 14, or a battery pack (1000) as described in claim 15.

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