A wall-embedded network device

Abstract

The specification provides a wall-embedded network device, and relates to the technical field of communication.A wall-embedded network device comprises a bottom shell, a cavity is formed in the bottom shell; a plurality of circuit boards are arranged in the cavity; and a shell is matched with the bottom shell to shield the cavity; wherein the plurality of circuit boards comprise a first circuit board and a second circuit board, the first circuit board and the second circuit board are electrically connected, the first circuit board is horizontally arranged at the bottom of the cavity, and the second circuit board is vertically arranged between the shell and the first circuit board. Through the above structure, the safety of the wall-embedded network device can be improved.

Description

Technical Field

[0001] This specification relates to the field of communication technology, and in particular to a wall-mounted network device. Background Technology

[0002] With the development of network technology, network devices have taken on various forms, and wall-mounted network devices, as a deployment method, have gradually been applied to the required scenarios.

[0003] Wall-mounted network devices have several circuit boards stacked between the outer casing and the bottom casing. The heat generated on the circuit boards is primarily released to the outer casing. During continuous use, the exposed outer casing can overheat due to high temperatures, posing a risk of burns. Therefore, reducing the temperature of the outer casing in embedded network devices is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this specification provides a wall-embedded network device.

[0005] According to a first aspect of the embodiments of this specification, a wall-mounted network device is provided, comprising:

[0006] The bottom shell has a cavity formed within it;

[0007] Several circuit boards are disposed in the receiving cavity;

[0008] The outer shell, which mates with the bottom shell, shields the receiving cavity;

[0009] The plurality of circuit boards include a first circuit board and a second circuit board, which are electrically connected. The first circuit board is horizontally disposed at the bottom of the receiving cavity, and the second circuit board is vertically disposed between the outer shell and the first circuit board.

[0010] Optionally, the bottom shell includes a metal heat-conducting part;

[0011] The wall-embedded network device also includes:

[0012] The heat-conducting bracket is fixed to the second circuit board and abuts against the metal heat-conducting part.

[0013] Optionally, the heat-conducting bracket includes:

[0014] The contact portion abuts against the second circuit board;

[0015] The positioning portion extends from the contact portion toward the second circuit board and passes through a positioning hole formed on the second circuit board;

[0016] The fixing part secures the second circuit board by engaging with the fixing holes on the second circuit board.

[0017] Optionally, the heat-conducting bracket further includes:

[0018] The heat transfer section is the contact section that connects different second circuit boards.

[0019] Optionally, the height of the heat transfer portion is smaller than the height of the contact portion;

[0020] In the vertical direction, the heat transfer part is connected to the middle of the opposite side of the contact part.

[0021] Optionally, in the length direction, the heat transfer part is connected to the middle of the opposite side of the contact part.

[0022] Optionally, the metal heat-conducting part is a heat-conducting boss disposed on the bottom wall of the bottom shell, and a through hole is formed on the first circuit board, the heat-conducting boss passing through the through hole and abutting against the heat transfer part;

[0023] Alternatively, a heat-conducting protrusion is formed on the bottom wall side of the heat transfer part facing the bottom shell, and a through hole is formed on the first circuit board, through which the heat-conducting protrusion abuts against the metal heat-conducting part;

[0024] Alternatively, a first heat-conducting boss is formed on the metal heat-conducting part, and a second heat-conducting boss is formed on the bottom wall side of the heat transfer part facing the bottom shell. A through hole is formed on the first circuit board, and one of the first heat-conducting boss and / or the second heat-conducting boss passes through the through hole and abuts against the other.

[0025] Optionally, the metal heat-conducting part is the heat-conducting sidewall of the bottom shell, and each heat-conducting bracket is connected to a second circuit board. The heat-conducting bracket extends toward the heat-conducting sidewall and abuts against the heat-conducting sidewall.

[0026] Optionally, one of the second circuit boards is electrically connected to the first circuit board via a flexible circuit board; and / or,

[0027] One of the second circuit boards is electrically connected to the first circuit board via the mating of gold fingers and a connector.

[0028] Optionally, one of the second circuit boards is a wireless network board, the other of the second circuit boards is a power supply board, and the first circuit board is a motherboard.

[0029] The technical solutions provided in the embodiments of this specification may include the following beneficial effects:

[0030] In the embodiments described in this specification, in the wall-mounted network device, a first circuit board arranged horizontally is located near the bottom of the bottom shell, and a second circuit board electrically connected to it is arranged vertically. The heat generated by the first circuit board is away from the top shell, and the heat generated by the second circuit board is transferred into the cavity and dissipated. This avoids the heat generated by the stacked circuit boards directly baking the outer shell, reduces the outer shell temperature of the wall-mounted network device, and improves the safety of the wall-mounted network device.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0033] Figure 1 This is a structural schematic diagram of a wall-mounted network device involved in this application;

[0034] Figure 2 This is a cross-sectional schematic diagram of a wall-embedded network device according to an embodiment of this application;

[0035] Figure 3 This is a cross-sectional schematic diagram of a wall-embedded network device according to another embodiment of this application;

[0036] Figure 4 This is a schematic diagram of the structure of a heat-conducting bracket in a wall-mounted network device according to an embodiment of this application, wherein the metal heat-conducting part is a heat-conducting boss;

[0037] Figure 5 This is a cross-sectional schematic diagram of a wall-mounted network device according to another embodiment of this application, wherein the heat-conducting boss extends from the heat transfer part to the bottom wall of the bottom shell;

[0038] Figure 6 This is a cross-sectional schematic diagram of a wall-embedded network device according to another embodiment of this application, wherein the heat-conducting boss is divided into a first heat-conducting boss and a second heat-conducting boss.

[0039] Figure 7 This is a cross-sectional schematic diagram of a wall-mounted network device according to another embodiment of this application, wherein different second circuit boards are provided with different heat-conducting supports. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.

[0041] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0042] It should be understood that although the terms first, second, third, etc., may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this specification, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0043] This application provides a wall-mounted network device 100, such as... Figure 1-2 As shown, it includes:

[0044] The bottom shell 1 has a receiving cavity 10 formed therein, and the bottom shell 1 is a structure embedded in the wall;

[0045] Several circuit boards 2 are disposed in the receiving cavity 10;

[0046] The outer shell 3 cooperates with the bottom shell 1 to shield the receiving cavity 10. The outer shell 3 may include a front shell 30 and a middle shell 31. The middle shell 31 directly cooperates with the bottom shell 1 to shield the receiving cavity 10. The front shell 30 covers the middle shell 31 to improve the overall integrity of the wall-mounted network device 100.

[0047] The plurality of circuit boards 2 include a first circuit board 20 and a second circuit board 21, which are electrically connected. The first circuit board 20 is horizontally disposed at the bottom of the receiving cavity 10, and the second circuit board 21 is vertically disposed between the outer shell 3 and the first circuit board 20.

[0048] The aforementioned horizontal arrangement refers to the direction extending along the bottom wall 12 of the bottom shell 1, while the vertical arrangement refers to the direction that is nearly perpendicular to the bottom wall 12 of the bottom shell 1.

[0049] The number of second circuit boards 21 can be set according to actual needs. That is, multiple second circuit boards 21 can be vertically arranged on a horizontally arranged first circuit board 20. For example, one, two, three or more vertically arranged second circuit boards 21 can be arranged on a first circuit board 20, depending on actual needs and the capacity of the receiving cavity 10.

[0050] Optional, such as Figure 2 As shown, one of the second circuit boards 21 is electrically connected to the first circuit board 20 via a flexible circuit board. That is, connectors for inserting flexible circuit boards can be formed on a second circuit board 21 and a first circuit board 20, respectively, and the electrical connection between the first circuit board 20 and the second circuit board 21 is achieved by inserting the flexible circuit boards into the connectors of the second circuit board 21 and the first circuit board 20, respectively.

[0051] Optionally, one of the second circuit boards 21 is electrically connected to the first circuit board 20 via a gold finger and a connector. That is, a gold finger is formed on the second circuit board 21, and a connector that mates with the gold finger is formed on the first circuit board 20. The electrical connection between the first circuit board 20 and the second circuit board 21 is achieved by the interlocking of the gold finger and the connector.

[0052] The specific electrical connection method between the first circuit board 20 and the second circuit board 21 is not limited to the two methods mentioned above, and can be set according to actual needs. For example, Figure 2 As shown, the second circuit board 21 on one side is electrically connected to the first circuit board 20 via a flexible circuit board, and the second circuit board 21 on the other side is electrically connected to the connector on the first circuit board 20 via gold fingers on it.

[0053] Since the wall-mounted network device 100 can be a network device such as an AP (Access Point), router, and switch, the functions of the first circuit board 20 and the second circuit board 21 can be set according to actual needs.

[0054] Optionally, one of the second circuit boards 21 is a wireless network board, and the other is a power supply board, while the first circuit board 20 is the motherboard. A network interface, etc., can also be configured on the first circuit board 20, which serves as the motherboard.

[0055] With the wall-mounted network device 100 described above, the first circuit board 20, which is horizontally arranged, is close to the bottom of the bottom shell 1 and far away from the outer shell 3. The heat generated by it can be dissipated from the side closer to the bottom shell 1. Furthermore, the second circuit board 21 is vertically arranged on the first circuit board 20, and the heat generated by it will not directly bake the outer shell 3. These measures reduce the heat impact of the circuit boards on the outer shell 3, thereby improving the safety of the wall-mounted network device.

[0056] To further improve the heat dissipation efficiency of the wall-mounted network device 100, optional features include... Figure 3-7 As shown, the bottom shell 1 includes a metal heat-conducting part 11;

[0057] The wall-embedded network device 100 also includes:

[0058] The heat-conducting bracket 4 is fixed to the second circuit board 21 and abuts against the metal heat-conducting part 11.

[0059] The metal heat-conducting part 11 can be configured in various forms. For example, it can be configured as a heat-conducting protrusion located on the bottom wall of the bottom shell 1, or as a heat-conducting sidewall of the bottom shell 1. The bottom shell 1 can also be formed of metal material and can include the aforementioned heat-conducting protrusion. Correspondingly, the heat-conducting bracket 4 can also be made of metal material and extend to the metal heat-conducting part 11 through its structure or make full contact with the metal bottom shell 1 through its structure. The metal heat-conducting part 11 and the heat-conducting bracket 4 can be configured according to actual needs and are not limited.

[0060] By contacting the heat-conducting bracket 4 with the heat-generating device on the second circuit board 21, the heat generated on the second circuit board 21 can be efficiently absorbed by the heat-conducting bracket 4 made of metal material and transferred along the heat-conducting bracket 4 to the metal heat-conducting part 11 on the base shell 1, so as to dissipate heat to the outside of the wall-embedded network device 100, thereby improving the heat dissipation efficiency of the network device.

[0061] In addition, thermal grease can be applied between the thermally conductive bracket 4 and the metal thermally conductive part 11, or a clamping thermally conductive pad can be provided to further improve the thermal conductivity.

[0062] Optional, such as Figure 3 As shown, the heat-conducting bracket 4 includes:

[0063] The contact portion 40 abuts against the second circuit board 21. The size of the contact portion 40 can be similar to the size of the second circuit board 21. The heating device on the second circuit board 21 is in close contact with the contact portion 40.

[0064] The positioning part 41 extends from the contact part 40 toward the second circuit board 21 and passes through the positioning hole 21A formed on the second circuit board 21;

[0065] The fixing part 42 fixes the second circuit board 21 by cooperating with the fixing hole 21B on the second circuit board 21.

[0066] The positioning part 41 and the fixing part 42 can be columnar structures protruding towards the second circuit board 21. The size of the positioning part 41 is slightly smaller than the diameter of the positioning hole 21A so that the positioning part 41 can be inserted into the positioning hole 21A to perform the initial positioning of the second circuit board 21 and the heat conduction bracket 4.

[0067] The size of the fixing part 42 can be slightly larger than that of the fixing hole 21B, and a screw hole can be formed in the middle of the fixing part 42. When fixing the second circuit board 21 and the heat conduction bracket 4, the fixing part 42 presses against the second circuit board 21 and aligns with its fixing hole 21B and screw hole, and is fixed by screws passing through the fixing hole 21B and engaging with the screw hole.

[0068] Optionally, the heat-conducting bracket 4, as... Figure 3 As shown, it also includes:

[0069] The heat transfer part 43 connects to the contact part 40 that abuts against different second circuit boards 21.

[0070] When multiple second circuit boards 21 are provided in the wall-mounted network device 100, multiple contact portions 40 are provided to contact different second circuit boards 21. A heat-conducting bracket 4 can connect multiple second circuit boards 21, that is, the heat transfer portion 43 provided on the heat-conducting bracket 4 connects to the contact portions 40 of different second circuit boards 21, from which... Figure 4 From the frontal view shown, it has a near-I-shaped structure, and from such a perspective... Figure 3 The structure can also be seen as nearly I-shaped when viewed from above or below.

[0071] Specifically, such as Figure 3 As shown, the height of the heat transfer part 43 is smaller than the height of the contact part 40;

[0072] In the height direction H, the heat transfer part 43 is connected to the middle of the opposite side of the contact part 40.

[0073] The height direction H guides the thermal support 4 from near the bottom wall 12 to near the outer casing 3. Figure 3 The middle can be considered as the vertical direction. For the heat conduction bracket 4, the height dimension of the contact part 40 is increased to increase the contact area between the heat conduction bracket 4 and the second circuit board 21, so that the heat generated on the second circuit board 21 is absorbed onto the heat conduction bracket 4 more quickly, and then the absorbed heat is dissipated to the outside through the metal heat conduction part 11 via the heat transfer part 43.

[0074] In addition, to prevent the absorbed heat from being diffused too much onto the first circuit board 20 by the heat-conducting bracket 4, the heat transfer part 43 can be positioned in the middle of the opposite side of the contact part 40 in the height direction H, so that the heat transfer part 43 is spaced a certain distance from the first circuit board 20, and the heat is transferred as much as possible through the metal heat-conducting part 11 in contact with the heat transfer part 43.

[0075] Since the second circuit board 21 with different functions may store large differences, such as the wireless network board for signal transmission generating more heat than the power board, when the contact part 40 is connected through the heat transfer part 43, it may cause the contact part 40 that absorbs more heat to quickly transfer heat to the contact part 40 that absorbs less heat, thereby causing the second circuit board 21 that generates less heat to heat up.

[0076] To avoid the above problems, alternatively, such as Figure 4 As shown, along the length direction L, the heat transfer part 43 is connected to the middle of the opposite side of the contact part 40.

[0077] Along the length direction L, the heat transfer part 43 can be disposed in the middle of the opposite side of the contact part 40, and the size of the heat transfer part 43 is similar to that of the metal heat conduction part 11. This avoids the situation where the area of ​​the heat transfer part 43 is too large than that of the metal heat conduction part 11, and the heat that cannot be dissipated in time by the metal heat conduction part 11 is transferred to the contact part 40 on the other side by the heat transfer part 43, thereby affecting the second circuit board 21 on the other side.

[0078] Optional, such as Figure 3 As shown, the metal heat-conducting part 11 is a heat-conducting protrusion 5 disposed on the bottom wall 12 of the bottom shell 1. A through hole 20A is formed on the first circuit board 20. The heat-conducting protrusion 5 passes through the through hole 21C and abuts against the heat transfer part 43.

[0079] Optional, such as Figure 5 As shown, a heat-conducting protrusion 5 is formed on the side of the heat transfer part 43 facing the bottom wall 12 of the bottom shell 1. A through hole 20A is formed on the first circuit board 20, and the heat-conducting protrusion 5 passes through the through hole 20A and abuts against the metal heat-conducting part 11.

[0080] exist Figure 4 , 5 In the middle, the heat-conducting boss 5 passes through the through hole 20A and extends to the other side to contact the heat-conducting part 11 or the heat transfer part 43 of the heat-conducting bracket 4.

[0081] Optional, such as Figure 6As shown, a first heat-conducting boss 5A is formed on the metal heat-conducting part 11, and a second heat-conducting boss 5B is formed on the side of the heat transfer part 43 facing the bottom wall 12 of the bottom shell 1. A through hole 20A is formed on the first circuit board 20, and one of the first heat-conducting boss 5A and / or the second heat-conducting boss 5B passes through the through hole 20A and abuts against the other.

[0082] exist Figure 6 In the cavity 20A, heat-conducting bosses can be provided, forming a first heat-conducting boss 5A and a second heat-conducting boss 5B. One of them can pass through the through hole 20A and abut against the other. The first heat-conducting boss 5A and the second heat-conducting boss 5B can abut against the through hole 20A, or against the side near the bottom wall 12 of the bottom shell 1, or against the side near the outer shell 3, depending on the actual needs. When the first heat-conducting boss 5A and the second heat-conducting boss 5B abut against the through hole 20A, the through hole 20A can achieve the initial positioning of the heat-conducting bracket 4 and the initial positioning of the first circuit board 20 into the receiving cavity 10, thereby improving the installation efficiency of the wall-mounted network device 100.

[0083] Optional, such as Figure 7 As shown, the metal heat-conducting part 11 is the heat-conducting sidewall 13 of the bottom shell 1. Each heat-conducting bracket 4 is connected to a second circuit board 21. The heat-conducting bracket 4 extends toward the heat-conducting sidewall 13 and abuts against the heat-conducting sidewall 13.

[0084] exist Figure 7 In the wall-mounted network device 100, multiple second circuit boards 21 and multiple heat-conducting brackets 4 corresponding to each second circuit board 21 can be provided. The heat-conducting brackets 4 can be disposed between the second circuit board 21 and the heat-conducting sidewall 13. After the heat-conducting bracket 4 is fixed to the second circuit board 21, it can extend and abut against the heat-conducting sidewall 13 through the extension portion 44 on the heat-conducting bracket 4, thereby transferring the heat absorbed by the heat-conducting bracket 4 to the outside through the heat-conducting sidewall 13.

[0085] In addition, the aforementioned bottom shell 1 can be made entirely of metal material. That is to say, the metal heat-conducting part 11, the heat-conducting sidewall 13 and other structures are made of metal material, i.e., the bottom shell 1 is a metal bottom shell. In this way, the wall-mounted network device 100 can achieve heat dissipation outward through the bottom shell 1 as a whole, thereby further improving the heat dissipation effect.

[0086] The technical solutions provided in the embodiments of this specification may include the following beneficial effects:

[0087] In the embodiments described in this specification, in the wall-mounted network device, a first circuit board arranged horizontally is located near the bottom of the bottom shell, and a second circuit board electrically connected to it is arranged vertically. The heat generated by the first circuit board is away from the top shell, and the heat generated by the second circuit board is transferred into the cavity and dissipated. This avoids the heat generated by the stacked circuit boards directly baking the outer shell, reduces the outer shell temperature of the wall-mounted network device, and improves the safety of the wall-mounted network device.

[0088] Other embodiments of this specification will readily occur to those skilled in the art upon consideration of the specification and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this specification are indicated by the following claims.

[0089] It should be understood that this specification is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is limited only by the appended claims.

[0090] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A wall-mounted network device, characterized in that, include: The bottom shell has a cavity formed within it; Several circuit boards are disposed in the receiving cavity; The outer shell, which mates with the bottom shell, shields the receiving cavity; The plurality of circuit boards include a first circuit board and a second circuit board, which are electrically connected. The first circuit board is horizontally disposed at the bottom of the receiving cavity, and the second circuit board is vertically disposed between the outer shell and the first circuit board.

2. The wall-mounted network device according to claim 1, characterized in that, The bottom shell includes a metal heat-conducting part; The wall-embedded network device also includes: The heat-conducting bracket is fixed to the second circuit board and abuts against the metal heat-conducting part.

3. The wall-mounted network device according to claim 2, characterized in that, The heat-conducting support includes: The contact portion abuts against the second circuit board; The positioning portion extends from the contact portion toward the second circuit board and passes through a positioning hole formed on the second circuit board; The fixing part secures the second circuit board by engaging with the fixing holes on the second circuit board.

4. The wall-mounted network device according to claim 3, characterized in that, The heat-conducting bracket also includes: The heat transfer section is the contact section that connects different second circuit boards.

5. The wall-mounted network device according to claim 4, characterized in that, The height dimension of the heat transfer section is smaller than the height dimension of the contact section; In the vertical direction, the heat transfer part is connected to the middle of the opposite side of the contact part.

6. The wall-mounted network device according to claim 5, characterized in that, Along its length, the heat transfer portion is connected to the middle of the opposite side of the contact portion.

7. The wall-mounted network device according to claim 4, characterized in that, The metal heat-conducting part is a heat-conducting protrusion disposed on the bottom wall of the bottom shell, and a through hole is formed on the first circuit board. The heat-conducting protrusion passes through the through hole and abuts against the heat transfer part. Alternatively, a heat-conducting protrusion is formed on the bottom wall side of the heat transfer part facing the bottom shell, and a through hole is formed on the first circuit board, through which the heat-conducting protrusion abuts against the metal heat-conducting part; Alternatively, a first heat-conducting boss is formed on the metal heat-conducting part, and a second heat-conducting boss is formed on the bottom wall side of the heat transfer part facing the bottom shell. A through hole is formed on the first circuit board, and one of the first heat-conducting boss and / or the second heat-conducting boss passes through the through hole and abuts against the other.

8. The wall-mounted network device according to claim 4, characterized in that, The metal heat-conducting part is the heat-conducting sidewall of the bottom shell. Each heat-conducting bracket is connected to a second circuit board. The heat-conducting bracket extends toward the heat-conducting sidewall and abuts against the heat-conducting sidewall.

9. The wall-mounted network device according to any one of claims 1-8, characterized in that, One of the second circuit boards is electrically connected to the first circuit board via a flexible circuit board; and / or, One of the second circuit boards is electrically connected to the first circuit board via the mating of gold fingers and a connector.

10. The wall-mounted network device according to any one of claims 1-8, characterized in that, One of the second circuit boards is a wireless network board, and the other of the second circuit board is a power supply board. The first circuit board is the motherboard.

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