A sunken base island structure for an optical coupler

Abstract

The utility model relates to the technical field of optical coupler, concretely to a sunken base island structure of optical coupler, set up between PT chip and IR chip for the light guide piece that will IR chip emit light is oriented PT chip photosurface, can more efficient part of light that IR chip emits is imported to the photosurface of PT chip high efficiency, greatly improve this part of light propagation to the efficiency of PT chip photosurface, to improve the efficiency that IR chip light whole is transmitted to the photosurface of PT chip, guarantee the stability of optical signal transmission between PT chip and IR chip, through setting up the sunken structure of PT support pin upper support foot simultaneously, to cancel the gasket, thereby can reduce the gold wire length on IR chip, reduce the cost while improving the stability of gold wire, reduce the fracture probability, solved the current plane formula light coupling light performance is poor, gold wire cost is higher and the problem that longer gold wire is more likely to break in the processing.

Description

Technical Field

[0001] This utility model relates to the field of optical coupler technology, specifically to a sunken base island structure for an optical coupler. Background Technology

[0002] In the current technological field, planar optocouplers have two main drawbacks. First, their light guiding process relies primarily on light emitted by an infrared emitting chip (IR chip). When the photosensitive part of the infrared receiving chip (PT chip) is illuminated by light, a current change is generated within the PT chip, thereby converting the electrical signal. The transmission of the optical signal within the optocoupler mainly occurs in two ways: one is that the photosensitive surface of the PT chip directly receives the light emitted from the IR chip; the other is that the light emitted by the IR chip is reflected to the photosensitive surface of the PT chip after passing through the internal reflection structure of the planar optocoupler. However, in both of these methods of transmitting optical signals, the amount of light illuminating the photosensitive surface of the PT chip is usually relatively small, leading to a reduction in optical signal transmission efficiency. Second, in existing planar optocouplers, the IR chip is typically mounted on a spacer to ensure that the light emitted by the IR chip can illuminate the photosensitive surface of the PT chip. This results in a longer gold wire connecting the IR chip to the pins, making it more susceptible to breakage during manufacturing and increasing costs. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a sunken base island structure for an optical coupler, which solves the problems of poor light guiding performance, high cost of gold wires, and increased likelihood of breakage during processing of long gold wires in existing planar optical couplers.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a recessed base island structure for an optical coupler, comprising a package body, on which a PT support pin and an IR support pin are disposed, one end of which is located inside the package body. An IR chip for emitting light is mounted on the base island of the IR support pin, and a PT chip is disposed on the base island of the PT support pin. The base island of the PT support pin is recessed to the side away from the PT chip. A light guide is disposed between the PT chip and the IR chip for guiding the light emitted by the IR chip to the photosensitive surface of the PT chip.

[0005] Preferably, the light guide is a rigid transparent body with both ends fixed, and a first reflective layer is provided on the rigid transparent body to reflect the light inside back into its interior.

[0006] Preferably, the package is used to reflect the light emitted by the IR chip back into its interior while blocking external light.

[0007] Preferably, the encapsulation body is a titanium dioxide epoxy resin layer.

[0008] Preferably, the second reflective layer has an isolation layer on the side away from the light guide for blocking external light.

[0009] Preferably, the light guide is an optical fiber.

[0010] Preferably, the light guide further includes a fixing member for rigidly connecting the PT chip and the IR chip.

[0011] Preferably, the base island of the PT bracket pin is provided with a Z-shaped bend.

[0012] Compared with the prior art, this utility model provides a sunken base island structure for an optical coupler, which has the following advantages:

[0013] 1. By setting a light guide between the PT chip and the IR chip to direct the light emitted by the IR chip to the photosensitive surface of the PT chip, a portion of the light emitted by the IR chip can be more efficiently guided to the photosensitive surface of the PT chip. This greatly improves the efficiency of this portion of light propagating to the photosensitive surface of the PT chip, thereby improving the overall efficiency of the light from the IR chip being transmitted to the photosensitive surface of the PT chip. This ensures the stability of the optical signal transmission between the PT chip and the IR chip. At the same time, by setting a recessed structure on the pins of the PT support to eliminate the need for a spacer, the length of the gold wire on the IR chip can be reduced, thereby reducing costs while improving the stability of the gold wire and reducing the probability of breakage.

[0014] 2. By setting the light guide as a rigid transparent body with both ends fixed, and coating its surface with a layer of titanium dioxide as the first reflective layer, it is possible to both guide the propagation of light and fix the PT chip and IR chip relatively, thereby improving the yield of the product in the production process.

[0015] 3. By setting the light guide to an optical fiber and using a fixing component for rigidly connecting the PT chip and IR chip, it is possible to both guide the propagation of light and fix the PT chip and IR chip relatively, and the propagation efficiency of light is relatively higher. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the internal structure of this utility model;

[0018] Figure 2 This is a cross-sectional schematic diagram of the present invention;

[0019] Figure 3This is a schematic diagram of the first reflective layer of this utility model;

[0020] Figure 4 This is a schematic diagram of the fastener of this utility model.

[0021] In the figure: 1. Package; 2. PT bracket pin; 3. IR bracket pin; 4. IR chip; 5. PT chip; 6. Light guide; 7. First reflective layer; 10. Fixing component; 11. Bending part. Detailed Implementation

[0022] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0023] Example 1

[0024] To address the issues of poor light guiding performance, high cost, and increased breakage rate of long gold wires in existing planar optical couplers, this application provides a recessed base island structure for the optical coupler, such as... Figure 1 As shown, the package 1 has a PT bracket pin 2 and an IR bracket pin 3 with one end located inside it. An IR chip 4 for emitting light is mounted on the base island of the IR bracket pin 3, and a PT chip 5 is mounted on the base island of the PT bracket pin 2. The base island of the PT bracket pin 2 is recessed away from the PT chip 5. The recessed height is optimally the height of the original spacer. This ensures that even without the spacer, the light emitted by the IR chip 4 can still propagate to the photosensitive surface of the PT chip 5. A light guide 6 is provided between the PT chip 5 and the IR chip 4 to guide the light emitted by the IR chip 4 to the photosensitive surface of the PT chip 5. This ensures that a portion of the optical signal can be transmitted to the photosensitive surface of the PT chip 5 with high efficiency, resulting in higher energy utilization and significantly improving the overall optical signal transmission efficiency. The light guide 6 can be positioned between the IR chip 4 and the IR bracket pin 3, or it can be positioned on the side of the IR chip 4. As long as it can receive as much light emitted by the IR chip 4 as possible, the propagation efficiency of the optical signal can be improved.

[0025] As a medium for guiding and propagating optical signals, the light guide 6 needs to reduce the loss of optical signals during propagation, such as... Figure 3As shown, the light guide 6 is a rigid transparent body with both ends fixed, such as glass. Due to its rigid structure, the rigid transparent body can achieve relative fixation of the IR chip 4 and the PT chip 5, avoiding relative displacement of the IR chip 4 and the PT chip 5 during wire bonding and filling of the package 1, thereby reducing the probability of gold wire breakage. The rigid transparent body is provided with a first reflective layer 7 for reflecting its internal light back into its interior. The first reflective layer 7 can be achieved by coating with titanium dioxide, thereby forming a path for light propagation.

[0026] In order to allow more light to be contained within the light guide 6, the package 1 is used to reflect the light emitted by the IR chip 4 back into its interior while blocking external light. The package 1 can be formed by encapsulating a mixture of titanium dioxide and epoxy resin, so that some of the reflected light can be reflected back to the light guide 6 and collected inside the light guide 6, thereby further increasing the intensity of the light propagated to the photosensitive surface of the PT chip 5, while preventing external ambient light from entering and interfering with the PT chip 5, thus improving the stability of product performance.

[0027] To further illustrate the method of sinking the base island of PT bracket pin 2, a Z-shaped bend 11 is provided at the base island of PT bracket pin 2, which can ensure the stability and consistency of the sinking distance at each point on the base island and facilitate processing.

[0028] Example 2

[0029] The following provides another structure for the light guide at 6 locations, which has the same technical effect as Embodiment 1, such as... Figure 4 As shown.

[0030] Compared with Example 1, Example 2 differs in that the light guide 6 is made of optical fiber, which can further reduce the loss of light propagation within the light guide 6. In order to achieve relative fixation between the PT chip 5 and the IR chip 4 and improve the stability of the PT chip 5 and the IR chip 4 during the processing, the light guide 6 also includes a fixing member 10 for rigidly connecting the PT chip 5 and the IR chip 4, thereby achieving relative fixation between the two and improving the yield.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A recessed base island structure for an optical coupler, comprising a package (1), wherein a PT bracket pin (2) and an IR bracket pin (3) are disposed on the package (1), wherein an IR chip (4) for emitting light is mounted on the base island of the IR bracket pin (3), and a PT chip (5) is disposed on the base island of the PT bracket pin (2), characterized in that, The base island of the PT bracket pin (2) is recessed to the side away from the PT chip (5), and a light guide (6) is provided between the PT chip (5) and the IR chip (4) to guide the light emitted by the IR chip (4) to the photosensitive surface of the PT chip (5).

2. The sunken base island structure according to claim 1, characterized in that, The light guide (6) is a rigid transparent body with both ends fixed, and a first reflective layer (7) is provided on the rigid transparent body to reflect the light inside back into its interior.

3. The sunken base island structure according to claim 1, characterized in that, The package (1) is used to reflect the light emitted by the IR chip (4) back into its interior, while blocking external light.

4. The sunken base island structure according to claim 3, characterized in that, The encapsulation body (1) is a titanium dioxide epoxy resin layer.

5. The sunken base island structure according to claim 1, characterized in that, The light guide (6) is an optical fiber.

6. The sunken base island structure according to claim 5, characterized in that, The light guide (6) also includes a fastener (10) for rigidly connecting the PT chip (5) and the IR chip (4).

7. The sunken base island structure according to claim 1, characterized in that, The PT bracket pin (2) has a Z-shaped bend (11) at its base island.

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