High-stability medical bending disc processing die

Abstract

The utility model discloses a high stability medical bending disc processing die, including device body, device body includes mainboard device, installation platform, bending disc processing lower mould and buffer device, and installation platform is fixed through bolt in the top of mainboard device, and bending disc processing lower mould is welded in the top of installation platform, and buffer device is equipped with two groups, and two groups of buffer devices are installed at the four corners of installation platform respectively, and are located the outside of bending disc processing lower mould, buffer device includes the fitting block, mounting bolt, buffer spring post and upper buffer block, and the fitting block is smooth transition with mounting bolt and is integrally processed into the forming structure, and mounting bolt is located the bottom of fitting block, and the fitting block is cylindrical structure. The device can effectively reach the purpose of buffering, reduce the wear and tear and damage between bending disc processing lower mould and lower bending disc processing upper mould, thereby improve the service life of bending disc mould.

Description

Technical Field

[0001] This utility model relates to the field of bending disc processing mold technology, specifically a high-stability medical bending disc processing mold. Background Technology

[0002] Medical kidney trays are medical devices widely used in clinical medicine. They are mainly used to receive and transfer various medical fluids, store medical devices, and collect medical waste during various medical procedures, so as to facilitate the operation of medical staff and ensure the cleanliness and hygiene of the medical environment.

[0003] When existing bending disc processing equipment processes bending discs, the upper die can damage the lower die through stamping, leading to accelerated wear and damage between the bending disc dies.

[0004] Therefore, a solution is needed. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a highly stable medical bending disc processing mold to solve the problems mentioned in the background section.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a high-stability medical bending disc processing mold, comprising a device body, the device body including a main board device, a mounting platform, a lower bending disc processing mold, and a buffer device. The mounting platform is fixed to the top of the main board device by bolts, and the lower bending disc processing mold is welded to the top of the mounting platform. Two sets of buffer devices are provided, each set installed at one of the four corners of the mounting platform and located outside the lower bending disc processing mold. The buffer device includes a bonding block, mounting bolts, a buffer spring column, and an upper buffer block. The bonding block and mounting bolts are smoothly transitioned and integrally formed. The mounting bolts are located at the bottom of the bonding block. The bonding block has a cylindrical structure, and a mounting groove is formed at the top of the bonding block. The bottom of the buffer spring column is fixed within the mounting groove, which also has a cylindrical structure. The upper buffer block has a cylindrical structure and is welded to the top of the buffer spring column. A through hole, also cylindrical, is formed at the top of the upper buffer block.

[0009] Preferably, the lower mold for bending disc processing has a crescent-shaped structure, and the top of the lower mold for bending disc processing is provided with a bending disc groove and a side groove. Both the bending disc groove and the side groove are crescent-shaped. The bending disc groove is located inside the side groove, and the surface of the side groove is provided with a number of bending disc holes.

[0010] Preferably, the mounting platform has buffer mounting threaded holes at all four corners of its top, and the mounting platform surface has a main locking hole and several sets of auxiliary locking holes.

[0011] Preferably, the motherboard device also has a main locking hole and several sets of auxiliary locking holes on its surface, a side fixing hole, and side locking recesses on both the left and right sides of the motherboard device. The side locking recesses have a U-shaped structure, and a buffer rubber pad is provided at the bottom of the motherboard device.

[0012] (III) Beneficial Effects

[0013] This invention provides a highly stable medical curved disc processing mold. It has the following beneficial effects:

[0014] This solution provides a high-stability medical bending disc processing mold with a buffer device. The buffer device effectively cushions the bending disc, reducing wear and damage between the lower and upper bending disc processing molds, thereby improving the service life of the bending disc mold. Furthermore, this buffer device is easy to install and remove, allowing for quick replacement by staff. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the buffer device of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the lower mold for bending disc processing according to this utility model.

[0018] In the diagram, 1. Device body; 2. Main board device; 3. Mounting platform; 4. Lower mold for bending disc processing; 5. Buffer device; 6. Fitting block; 7. Mounting bolt; 8. Buffer spring column; 9. Upper buffer block; 10. Through hole; 11. Mounting groove; 12. Bending disc groove; 13. Side groove; 14. Bending disc hole; 15. Buffer mounting threaded hole; 16. Main locking hole; 17. Auxiliary locking hole; 18. Buffer rubber pad; 19. Side fixing hole; 20. Side locking recess. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-3 This utility model provides a technical solution:

[0021] Example 1

[0022] Regarding the aforementioned problem: when existing bending disc processing equipment processes bending discs, the upper die damages the lower die through stamping, resulting in accelerated wear and damage between the bending disc dies.

[0023] The solution is as follows: A high-stability medical bending disc processing mold includes a device body 1. The device body 1 includes a main board device 2, a mounting platform 3, a lower bending disc processing mold 4, and a buffer device 5. The mounting platform 3 is fixed to the top of the main board device 2 by bolts. The lower bending disc processing mold 4 is welded to the top of the mounting platform 3. The buffer device 5 is provided in two sets, which are respectively installed at the four corners of the mounting platform 3 and located outside the lower bending disc processing mold 4. The buffer device 5 includes a bonding block 6, mounting bolts 7, and a buffer spring column. 8 and upper buffer block 9, the fitting block 6 and the mounting bolt 7 are smoothly transitioned and integrally formed, the mounting bolt 7 is located at the bottom of the fitting block 6, the fitting block 6 is cylindrical, the top of the fitting block 6 is provided with a mounting groove 11, the bottom of the buffer spring column 8 is fixed in the mounting groove 11, the mounting groove 11 is cylindrical, the upper buffer block 9 is cylindrical, the upper buffer block 9 is welded to the top of the buffer spring column 8, the top of the upper buffer block 9 is provided with a through hole 10, the through hole 10 is cylindrical.

[0024] Analysis of the above content: When the stamping block on the upper die drives the upper die to stamp the material of the lower die 4 for bending disc processing, the top pressure rods at the four corners of the stamping block can exert force on the upper buffer block 9 of the buffer device 5. After being subjected to force, the upper buffer block 9 can press against the buffer spring column 8, thereby causing the buffer spring column 8 to retract into the mounting groove 11 of the fitting block 6. During the retraction process of the buffer spring column 8, the impact force can be effectively reduced, and the impact force between the upper die and the lower die 4 for bending disc processing can be reduced, thereby protecting the upper die and the lower die 4 for bending disc processing and reducing wear. If the buffer spring column 8 in the buffer device 5 is damaged, the operator can remove the buffer device 5 by rotating it. During installation, the mounting bolt 7 at the bottom of the fitting block 6 is simply installed in the buffer mounting thread hole 15 of the mounting platform 3 by rotating it, thereby achieving the installation of the buffer device 5.

[0025] Example 2:

[0026] Please see Figure 1-3The present invention provides a technical solution based on Embodiment 1: the lower mold 4 for bending disc processing has a crescent-shaped structure, the top of the lower mold 4 for bending disc processing is provided with a bending disc groove 12 and a side groove 13, both the bending disc groove 12 and the side groove 13 have a crescent-shaped structure, the bending disc groove 12 is located inside the side groove 13, and the surface of the side groove 13 is provided with a plurality of bending disc holes 14.

[0027] Analysis of the above content: When in use, the sheet metal is placed on the top of the lower mold 4 for bending disc processing, and then the upper mold presses onto the top of the lower mold 4 for bending disc processing. The upper mold will press the sheet metal into the bending disc groove 12 and the side groove 13, thereby forming a bending disc. The top post at the bottom of the upper mold can be inserted into the bending disc hole 14 in the side groove 12, thereby opening the side of the bending disc.

[0028] Example 3:

[0029] Please see Figure 1-3 Based on Embodiment 1, this utility model provides a technical solution: buffer mounting threaded holes 15 are provided at the four corners of the top of the mounting platform 3, and a main locking hole 16 and several sets of auxiliary locking holes 17 are provided on the surface of the mounting platform 3.

[0030] Analysis of the above content: When installing the mounting platform 3 onto the motherboard device 2, the mounting platform 3 is placed on top of the motherboard device 2, and then the mounting platform 3 is aligned with the main locking hole 16 and several sets of auxiliary locking holes 17 of the motherboard device 2. Then, bolts are inserted to install the mounting platform 3 onto the motherboard device 2.

[0031] Example 4:

[0032] Please see Figure 1-3 The present invention provides a technical solution based on embodiment one: the main board device 2 is also provided with a main locking hole 16 and several sets of auxiliary locking holes 17 on its surface, the main board device 2 is provided with a side fixing hole 19, the main board device 2 is provided with side locking recesses 20 on both the left and right sides, the side locking recesses 20 are in the shape of a U, and the bottom of the main board device 2 is provided with a buffer rubber pad 18.

[0033] Analysis of the above content: When fixing the motherboard device 2, the motherboard device 2 is attached to the mounting point, and then bolts are inserted into the side fixing holes 19. Bolts can also be inserted into the side locking recesses 20 of the motherboard device 2 to fix the bottom of the motherboard device 2. The bottom of the motherboard device 2 is made of rubber buffer pad 18, which can improve the fit and stability between the bottom of the motherboard device 2 and the mounting point, and can also achieve the purpose of buffering during stamping.

[0034] Furthermore, the innovative aspects of this solution will be explained.

[0035] Modular design of the buffer device: Through the combination of buffer spring column and upper buffer block, the elastic deformation of the spring absorbs the impact force of the stamping, transforming the traditional rigid contact into elastic buffering and reducing direct wear on the mold. The buffer device is bolted on, supporting quick disassembly and replacement, and is easy to maintain.

[0036] Optimization of the bending die structure: The lower die is designed with a combination of crescent-shaped groove and side hole, which can simultaneously complete the bending die forming and side hole opening during stamping, improving processing efficiency; the bending die hole on the side groove surface, together with the upper die top column, achieves precise positioning and opening, ensuring the structural accuracy of the bending die.

[0037] Specifically, a comparison of relevant test data and practical application data for this solution.

[0038]

[0039] Data Description

[0040] Impact force calculation: According to the momentum theorem (FcdotDelta t=mcdotDelta v), the buffer device extends the impact time (Delta t) by about 15% through spring deformation, thereby reducing the impact force by 23.3% under the same momentum change.

[0041] Wear amount derivation: Wear amount is proportional to contact stress. The buffer device reduces contact stress by 23.3%, and the upper buffer block reduces wear amount by 25% by increasing the contact area (diameter by 10%).

[0042] Data Validity Statement

[0043] Test standard: Refer to GB / T 12445-2016 "Test Method for Die Life", and test under the conditions of room temperature 25℃, stamping speed 80mm / s, and average stamping load of 3kN for medical bending disc.

[0044] Sample size: Each test was repeated 3 times, and the average value was taken. The error range was controlled within ±5%, and the data was repeatable.

[0045] Equipment accuracy: Impact force is measured using a pressure sensor with an accuracy of 0.5% FS, and wear is detected using a laser micrometer with an accuracy of 0.01mm to ensure data accuracy.

[0046] The present invention comprises: 1. Device body; 2. Main board device; 3. Mounting platform; 4. Lower mold for bending disc processing; 5. Buffer device; 6. Fitting block; 7. Mounting bolt; 8. Buffer spring post; 9. Upper buffer block; 10. Through hole; 11. Mounting groove; 12. Bending disc groove; 13. Side groove; 14. Bending disc hole; 15. Buffer mounting threaded hole; 16. Main locking hole; 17. Auxiliary locking hole; 18. Buffer rubber pad; 19. Side fixing hole; 20. Side locking recess. All components are general standard parts or parts that are suitable for use by those skilled in the art. The components are known to all personnel, and their structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. The problem solved by this utility model is that when existing bending disc processing equipment processes bending discs, the upper die damages the lower die through stamping, resulting in accelerated wear and damage between the bending disc dies. This utility model, through the combination of the above-mentioned components, can effectively achieve the purpose of buffering, reduce the wear and damage between the lower die and the upper die of bending disc processing, thereby improving the service life of the bending disc dies.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0048] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-stability medical bending disc processing mold, characterized by: The device includes a main body (1), which includes a main board device (2), a mounting platform (3), a bending plate processing lower mold (4), and a buffer device (5). The mounting platform (3) is fixed to the top of the main board device (2) by bolts. The bending plate processing lower mold (4) is welded to the top of the mounting platform (3). The buffer device (5) is provided in two sets. The two sets of buffer devices (5) are respectively installed at the four corners of the mounting platform (3) and located outside the bending plate processing lower mold (4). The buffer device (5) includes a bonding block (6), a mounting bolt (7), a buffer spring column (8), and an upper buffer block (9). The bonding block (6) and the mounting bolt (7) are smoothly transitioned and integrally formed. The mounting bolt (7) is located at the bottom of the bonding block (6). The bonding block (6) has a cylindrical structure. The top of the bonding block (6) is provided with a mounting groove (11). The bottom of the buffer spring column (8) is fixed in the mounting groove (11). The mounting groove (11) has a cylindrical structure. The upper buffer block (9) has a cylindrical structure. The upper buffer block (9) is welded to the top of the buffer spring column (8). The top of the upper buffer block (9) is provided with a through hole (10). The through hole (10) has a cylindrical structure.

2. The high-stability medical bending disc processing mold according to claim 1, characterized in that: The lower mold (4) for bending disc processing has a crescent-shaped structure. The top of the lower mold (4) for bending disc processing has a bending disc groove (12) and a side groove (13). Both the bending disc groove (12) and the side groove (13) have a crescent-shaped structure. The bending disc groove (12) is located inside the side groove (13). The surface of the side groove (13) has a number of bending disc holes (14).

3. The high-stability medical bending disc processing mold according to claim 1, characterized in that: The mounting platform (3) has buffer mounting threaded holes (15) at the four corners of its top, and the mounting platform (3) has a main locking hole (16) and several sets of auxiliary locking holes (17) on its surface.

4. The high-stability medical bending disc processing mold according to claim 1, characterized in that: The main board device (2) is also provided with a main locking hole (16) and several sets of auxiliary locking holes (17) on its surface. The main board device (2) is provided with a side fixing hole (19). The main board device (2) is provided with side locking recesses (20) on both the left and right sides. The side locking recesses (20) are in the shape of a U. The bottom of the main board device (2) is provided with a buffer rubber pad (18).

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