A BGA solder joint welding forming auxiliary device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU AUTOMATION RESEARCH INSTITUTE
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-09
AI Technical Summary
Traditional BGA soldering and forming auxiliary devices have a simple design structure and cannot limit movement in all directions, causing the soldering position to deviate from the design requirements, affecting the quality and reliability of the solder joints. They are also inconvenient to disassemble, increasing the risk of rework and scrap.
Design a BGA soldering and forming auxiliary device that includes a main component and a limiting component. Through the combination of multiple sets of limiting blocks, sliders, connectors and fixing components, it can achieve all-round limiting of the chip and can be flexibly disassembled. It is suitable for BGA chips of different sizes and types.
It improves the stability and applicability of welding, reduces rework and scrap, saves time and material resources, and increases production efficiency.
Smart Images

Figure CN224333780U_ABST