Contact heating water cooling heat dissipation double control repair device

Abstract

This utility model discloses a contact-type heating and water-cooling dual-control rework device, including a base. Board adsorption blocks are provided at both ends of the top of the base, and pressure buckles are provided at both ends of the top of the board adsorption blocks. A board limiting block is provided at the left rear end of the top of the base, and a module fixing plate is provided above the board limiting block. This utility model is used for the disassembly and soldering repair of closely spaced dispensing PCBA assembly boards, signal shielding frames, or shielding covers. It rapidly heats the soldering parts of the shielding frame through a shaped copper block, reaching a melting point of 217-230℃ to melt the solder. This allows for the disassembly and soldering of the shielding frame. Simultaneously, contact cooling is applied to the dispensing components in the middle or periphery to keep the solder joint temperature below the melting point of 217℃. This ensures that the disassembly and soldering heating process of the shielding frame does not cause defects such as adhesive or solder bursting to the active components in the middle or periphery, reducing waste and emissions.

Description

Technical Field

[0001] This utility model relates to the field of repair device technology, specifically a contact heating and water cooling dual-control repair device. Background Technology

[0002] Due to process requirements, poor contact is prone to occur in the production of close-pitch dispensing PCBA assembly boards, signal shielding frames, or shielding covers, which require disassembly and resoldering. However, existing repair methods all rely on manual operation, which not only increases the workload but also reduces repair efficiency. To address this, we propose a contact-type heating and water-cooling dual-control rework device. Utility Model Content

[0003] The purpose of this invention is to provide a contact-type heating and water-cooling dual-control repair device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a contact heating and water cooling dual-control rework device, comprising a base, with plate adsorption blocks provided at both the left and right ends of the top of the base, with buckles provided at both the left and right ends of the top of the plate adsorption blocks, and a plate limiting block provided at the left rear end of the top of the base, a module fixing plate provided above the plate limiting block, and a cylinder connecting block provided above the left side of the module fixing plate, a cylinder fixing block provided at the rear end of the module fixing plate, and a suction nozzle plate provided at the lower left end of the module fixing plate.

[0005] Preferably, a base fixing plate is fixedly connected to both the left and right sides of the bottom of the base. The base fixing plate on the left side has a lower heating pressure block at its bottom, and a lower air-cooling block is provided at the bottom of the lower heating pressure block.

[0006] Preferably, a lower vacuum pad is provided at both the front and rear ends of the left side of the bottom of the base, and a connecting and fixing block is provided at the bottom of the lower vacuum pad.

[0007] Preferably, the plate adsorption block located at the left end has heat insulation blocks on both its left and right sides, and the top of the heat insulation blocks is provided with heat dissipation pipes.

[0008] Preferably, a vacuum suction cup bracket is provided at the rear end of the inner surface of the suction nozzle plate, a vacuum suction block is provided on the inner surface of the suction nozzle plate, a desoldering fixing plate is provided on the right side of the vacuum suction block, and an upper heating plate is provided at the front end of the desoldering fixing plate.

[0009] Preferably, an upper water-cooling plate is provided below the suction plate, an ejector pin fixing block is provided below the upper water-cooling plate, and a single-head mold heating tube is provided on the outside of the ejector pin fixing block.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0011] This invention is used for the disassembly, soldering, and repair of closely spaced dispensing PCBA assembly boards, signal shielding frames, or shielding covers. It rapidly heats the soldering parts of the shielding frame by using a shaped copper block to melt the solder at a melting point of 217-230°C, allowing for the disassembly and soldering of the shielding frame. Simultaneously, it provides contact cooling to the dispensing components in the middle or periphery, keeping the solder joint temperature below the melting point of 217°C. This ensures that the disassembly and soldering heating process does not cause defects such as adhesive or solder bursting to the active components in the middle or periphery, thus reducing waste and emissions. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention from a first-person perspective.

[0013] Figure 2 This is a three-dimensional structural diagram of the present invention from a second perspective.

[0014] Figure 3 This is a three-dimensional structural diagram of the present invention from a third-view perspective.

[0015] In the diagram: 1. Base; 2. Single-head mold heating tube; 3. Upper water-cooling plate; 4. Press buckle; 5. Ejector pin fixing block; 6. Vacuum suction block; 7. Vacuum suction cup bracket; 8. Cylinder fixing block; 9. Cylinder connecting block; 10. Module fixing plate; 11. Suction nozzle plate; 12. Upper heating plate; 13. Plate adsorption block; 14. Heat dissipation pipe; 15. Plate limiting block; 16. Desoldering fixing plate; 17. Base fixing plate; 18. Connecting fixing block; 19. Lower air-cooling block; 20. Lower vacuum pad block; 21. Lower heating pressure block; 22. Heat insulation block. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] The components of this application, including the base 1, single-head mold heating tube 2, upper water-cooling plate 3, snap fastener 4, ejector pin fixing block 5, vacuum suction block 6, vacuum suction cup bracket 7, cylinder fixing block 8, cylinder connecting block 9, module fixing plate 10, suction nozzle plate 11, upper heating plate 12, plate adsorption block 13, heat dissipation pipe 14, plate limiting block 15, desoldering fixing plate 16, base fixing plate 17, connecting fixing block 18, lower air-cooling block 19, lower vacuum pad 20, lower heating pressure block 21, and heat insulation block 22, are all general standard parts or parts known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0018] Please see Figures 1-3 A contact-type heating and water-cooling dual-control repair device includes a base 1. Plate adsorption blocks 13 are provided at both the left and right ends of the top of the base 1. Buckles 4 are provided at both the left and right ends of the top of the plate adsorption blocks 13. A plate limiting block 15 is provided at the left rear end of the top of the base 1. A module fixing plate 10 is provided above the plate limiting block 15. A cylinder connecting block 9 is provided on the upper left side of the module fixing plate 10. A cylinder fixing block 8 is provided at the rear end of the module fixing plate 10. The end is equipped with a suction plate 11 for disassembling, soldering, and repairing closely spaced dispensing PCBA assembly boards, signal shielding frames, or shielding covers. It uses a shaped copper block to quickly contact and heat the soldering parts of the shielding frame to reach the melting point of 217-230℃, thus disassembling and soldering the shielding frame. At the same time, it provides contact cooling to the dispensing components in the middle or around the edges, keeping the solder joint temperature below the melting point of 217℃. This ensures that the disassembly and soldering heating process of the shielding frame will not cause defects such as glue or solder bursting to the active components in the middle or around the edges, thus reducing waste and emissions.

[0019] Base fixing plates 17 are fixedly connected to both the left and right sides of the bottom of base 1. The bottom of the base fixing plate 17 on the left side is provided with a lower heating pressure block 21, and the bottom of the lower heating pressure block 21 is provided with a lower air cooling block 19. The front and rear ends of the left side of the bottom of base 1 are provided with lower vacuum pads 20, and the bottom of the lower vacuum pads 20 is provided with connecting fixing blocks 18. The plate adsorption block 13 on the left end is provided with heat insulation blocks 22 on both the left and right sides, and the top of the heat insulation block 22 is provided with a heat dissipation pipe 14. The rear end of the inner surface of the suction plate 11 is provided with a vacuum suction cup bracket 7. The inner surface of the suction plate 11 is provided with a vacuum suction block 6. The right side of the vacuum suction block 6 is provided with a desoldering fixing plate 16. The front end of the desoldering fixing plate 16 is provided with an upper heating plate 12. The bottom of the suction plate 11 is provided with an upper water cooling plate 3. The bottom of the upper water cooling plate 3 is provided with an ejector pin fixing block 5. The outside of the ejector pin fixing block 5 is provided with a single-head mold heating tube 2.

[0020] The working principle of this application is as follows: it is used for the disassembly, soldering, and repair of close-pitch dispensing PCBA assembly boards, signal shielding frames, or shielding covers. By using a shaped copper block to quickly contact and heat the soldering parts of the shielding frame to reach the melting point of 217-230℃, the shielding frame is disassembled and soldered. At the same time, the dispensing components in the middle or around the frame are cooled and dissipated through contact, so that the solder joint temperature is lower than the melting point of 217℃. This ensures that the disassembly and soldering heating process of the shielding frame will not cause defects such as glue bursting or solder bursting to the active components in the middle or around the frame, thus reducing waste and saving emissions.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A contact-type heating and water-cooling dual-control repair device, comprising a base (1), characterized in that: The base (1) has plate adsorption blocks (13) on both the left and right sides of the top, and pressure buckles (4) on both the left and right sides of the top of the plate adsorption blocks (13). The base (1) has a plate limiting block (15) on the left rear end. The plate limiting block (15) has a module fixing plate (10) above it. The module fixing plate (10) has a cylinder connecting block (9) on the upper left side. The module fixing plate (10) has a cylinder fixing block (8) at the rear end. The module fixing plate (10) has a suction nozzle plate (11) at the lower left end.

2. The contact-type heating and water-cooling dual-control repair device according to claim 1, characterized in that: The base (1) has a base fixing plate (17) fixedly connected to both the left and right sides of the bottom. The base fixing plate (17) on the left side has a lower heating pressure block (21) at its bottom, and a lower air cooling block (19) is provided at the bottom of the lower heating pressure block (21).

3. The contact-type heating and water-cooling dual-control repair device according to claim 1, characterized in that: The base (1) has a lower vacuum pad (20) at both the front and rear ends on the left side of the bottom, and a connecting fixing block (18) is provided at the bottom of the lower vacuum pad (20).

4. The contact-type heating and water-cooling dual-control repair device according to claim 1, characterized in that: The plate adsorption block (13) located on the left end has heat insulation blocks (22) on both its left and right sides, and heat dissipation pipes (14) are provided on the top of the heat insulation blocks (22).

5. The contact-type heating and water-cooling dual-control repair device according to claim 1, characterized in that: A vacuum suction cup bracket (7) is provided at the rear end of the inner surface of the suction plate (11), a vacuum suction block (6) is provided on the inner surface of the suction plate (11), a desoldering fixing plate (16) is provided on the right side of the vacuum suction block (6), and an upper heating plate (12) is provided at the front end of the desoldering fixing plate (16).

6. The contact-type heating and water-cooling heat dissipation dual-control repair device according to claim 1, characterized in that: An upper water-cooling plate (3) is provided below the suction plate (11), and an ejector pin fixing block (5) is provided below the upper water-cooling plate (3). A single-head mold heating tube (2) is provided on the outside of the ejector pin fixing block (5).

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