A feeding device and a semiconductor processing apparatus

Abstract

This invention relates to a feeding device and a semiconductor processing equipment. The device includes a base, a feeding mechanism, a flipping mechanism, a rework mechanism, and a movement control mechanism. The base is positioned near a calibration table on the semiconductor processing equipment. The feeding mechanism is mounted on the base. The flipping mechanism is also mounted on the base and is used to clamp or release the workpiece to be processed. The flipping mechanism is also used to flip the clamped workpiece. The rework mechanism is movably mounted on the base and has a first position and a second position. When the rework mechanism is in the first position, it is located between the feeding mechanism and the flipping mechanism. When the rework mechanism is in the second position, it is located directly below the flipping mechanism. The movement control mechanism drives the rework mechanism to switch between the first and second positions. This invention solves the problem in existing feeding devices where the feeding process cannot be paralleled with the processing of defective workpieces, leading to interruptions in the feeding process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and in particular to a feeding device and semiconductor processing equipment. Background Technology

[0002] Currently, in existing semiconductor processing equipment, the loading device typically adopts a parallel layout of two loading stations and one rework station, with the flipping station located on the side away from the rework station from the two loading stations. This results in an excessively long transport path for the robotic arm when transferring defective products from the flipping station. Furthermore, because existing loading devices rely on a single robotic arm to handle both loading (transferring workpieces from the loading station to the flipping station) and rework unloading (transferring defective products from the flipping station to the rework station), when a workpiece is detected as defective, the robotic arm must prioritize processing the defective workpiece before normal loading. This can easily lead to interruptions in the loading process, severely impacting the device's loading efficiency. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To address this issue, the present invention provides a feeding device that solves the problem of interrupted feeding processes caused by the inability of existing feeding devices to process defective workpieces in parallel.

[0005] The present invention also provides a semiconductor processing apparatus including the above-described feeding device.

[0006] A feeding device according to a first aspect of the present invention, applied to semiconductor processing equipment, includes: Base; The feeding mechanism, located on the machine base, is used to place the workpiece to be processed; The flipping mechanism, located on the machine base, is used to clamp or release the workpiece to be processed; the flipping mechanism is also used to flip the clamped workpiece to be processed. The rework mechanism is movably mounted on the machine base. The rework mechanism has a first position and a second position. When the rework mechanism is in the first position, it is located between the feeding mechanism and the flipping mechanism. When the rework mechanism is in the second position, it is located directly below the flipping mechanism. The rework mechanism is used to receive the workpiece to be processed that has been released from the clamp by the flipping mechanism. A movement control mechanism, connected to the rework mechanism, is used to drive the rework mechanism to switch between a first position and a second position.

[0007] Optionally, it also includes: The vision inspection module is used to inspect the workpiece to be processed held by the flipping mechanism and determine whether the workpiece is a good product or a defective product. The first control module is used to control the moving control mechanism to drive the rework mechanism to move to the second position if the workpiece to be processed is defective, so that the rework mechanism can take over the workpiece to be processed that has been released from the clamp by the flipping mechanism.

[0008] Optionally, the first control module is also used to drive the movement control mechanism to move the rework mechanism from the second position to the first position after the rework mechanism receives the workpiece to be processed that has been released from the clamping by the flipping mechanism.

[0009] Optionally, the first control module includes a first control unit and a second control unit; The first control unit is used to control the movement control mechanism to drive the rework mechanism to move to the second position when the workpiece to be processed is a defective product. The second control unit is used to control the flipping mechanism to flip so that the surface of the workpiece to be processed held by it faces the rework mechanism after the rework mechanism moves to the second position, and to control the flipping mechanism to release the workpiece to be processed.

[0010] Optionally, it also includes: The first robotic arm is used to transfer the workpiece to be processed on the loading mechanism to the flipping mechanism; The second robotic arm is used to transfer the workpiece to be processed from the flipping mechanism to the calibration table on the semiconductor processing equipment. The first control module is also used to control the second robotic arm to transfer the workpiece to be processed from the flipping mechanism to the calibration table on the semiconductor processing equipment if the workpiece is a good product.

[0011] Optionally, the feeding mechanism and the flipping mechanism are arranged parallel to each other on the machine base along the X-axis direction; when the rework mechanism is in the first position, the rework mechanism is arranged parallel to the feeding mechanism and the flipping mechanism on the machine base; the first robotic arm includes a gantry and a robotic arm part mounted on the gantry, the gantry is movably mounted on the machine base, and the gantry can reciprocate on the machine base along the X-axis direction.

[0012] Optionally, the rework mechanism includes a carrier box, the mounting height of which on the base is lower than the mounting height of the flipping mechanism on the base; the movement control mechanism includes a connecting component and a second drive unit; The connecting assembly includes a mounting bracket and a guide bracket. The guide bracket is mounted on the base and has a guide rail. The first end of the guide rail extends below a first position, and the second end of the guide rail extends below a second position. The carrier box is mounted on the mounting bracket and has a sliding part that is slidably connected to the guide rail. The second drive unit is used to drive the sliding part to move on the guide rail, so as to drive the carrier box to switch between the first position and the second position.

[0013] Optionally, the second drive unit includes a cylinder, the length direction of which is parallel to the length direction of the guide rail, the cylinder barrel is connected to the guide frame, and the piston rod of the cylinder is connected to the sliding part.

[0014] Optionally, the machine base is provided with two feeding areas, and each feeding area is provided with a workpiece limiting groove; the feeding mechanism includes two feeding components corresponding to the two workpiece limiting grooves, and the feeding components include: The material box placement platform is movably mounted on the machine base. The material box placement platform is used to place material boxes that load and stack workpieces to be processed. The lifting assembly is located inside the machine base and directly below the workpiece limiting groove. It is used to lift the workpieces to be processed in the material box one by one to the top of the corresponding workpiece limiting groove after the material box moves with the material box placement table to the bottom of the workpiece limiting groove.

[0015] Optionally, the flipping mechanism includes: The flip frame has a clamping part on its inner side wall. When the workpiece to be processed is located inside the flip frame, the clamping part is used to clamp the side of the workpiece to be processed, so as to fix the workpiece to be processed inside the flip frame. The flip frame is rotatably mounted on the flip frame. The rotation drive assembly, connected to the flip frame drive, is used to drive the flip frame to rotate relative to the flipping frame, so as to flip the workpiece to be processed held in the flip frame.

[0016] Optionally, it may also include transit agencies, which include: The transfer platform is located below the flipping frame; the transfer platform is used to carry the workpieces to be processed that are transported from the loading mechanism. The lifting drive assembly is connected to the transfer platform and is used to drive the transfer platform to lift. The second control module is used to control the lifting drive assembly to drive the transfer platform to rise when the workpiece to be processed on the loading mechanism is transferred to the flipping mechanism, until the transfer platform moves into the flipping frame so that the position of the clamping part on the inner side wall of the flipping frame corresponds to the side position of the workpiece to be processed; the second control module is also used to control the lifting drive assembly to drive the transfer platform to fall before the rotation drive assembly drives the flipping frame to rotate relative to the flipping frame, until the transfer platform moves away from the flipping frame.

[0017] A semiconductor processing apparatus according to a second aspect of the present invention includes a feeding device as described in the first aspect or various embodiments.

[0018] One of the above technical solutions has at least the following advantages or beneficial effects: In a feeding device according to an embodiment of the present invention, by optimizing the station settings of the feeding mechanism, the rework mechanism, and the flipping mechanism on the machine base, and by controlling the switching movement of the rework mechanism between the first position and the second position, the efficiency of the rework mechanism in receiving the workpiece to be processed located on the flipping mechanism can be improved. At the same time, when a workpiece to be processed that needs to be reworked is defective, the feeding process of other workpieces to be processed in the feeding mechanism can be carried out continuously without waiting for the robotic arm to move the workpiece to be processed. This improves the overall feeding efficiency of the feeding device and solves the problem in the prior art where the feeding process is interrupted because the feeding device cannot be paralleled with the processing of defective workpieces.

[0019] The semiconductor processing equipment provided in this embodiment of the invention is equipped with the feeding device described above. Since the feeding device has the above-mentioned technical effects, the semiconductor processing equipment equipped with the feeding device should also have the corresponding technical effects. Attached Figure Description

[0020] Figure 1 A schematic diagram of the structure of a feeding device according to an embodiment of the present invention is shown; Figure 2 A top view of a feeding device according to an embodiment of the present invention is shown; Figure 3 A schematic diagram of the rework mechanism according to an embodiment of the present invention is shown; Figure 4 A schematic diagram of a rework mechanism receiving a workpiece located on a flipping mechanism, according to an embodiment of the present invention, is shown.

[0021] Explanation of reference numerals in the attached figures: 1. Machine base; 101. Workpiece limiting groove; 2. Feeding mechanism, 201. Material box placement platform, 202. Base plate; 3. Flipping mechanism, 301. Flipping frame, 302. Flipping bracket, 303. Clamping part, 304. Connecting shaft, 305. First drive part; 4. Repair mechanism, 401, carrier box; 5. Motion control mechanism; 501. Mounting bracket; 502. Guide bracket; 503. Guide rail; 504. Second drive unit; 6. First robotic arm; 7. Transfer mechanism; 701. Transfer platform; 702. Lifting drive assembly. Detailed Implementation

[0022] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Currently, in existing semiconductor processing equipment used for cutting semiconductor workpieces, the loading device typically employs a parallel layout of two loading stations and one rework station, with the flipping station located on the side away from the rework station from the two loading stations. Therefore, the stations in existing loading devices are scattered and disorganized, occupying a large amount of space and resulting in excessively long paths for transferring defective products, thus affecting the loading efficiency of the semiconductor processing equipment. Furthermore, existing loading devices rely on a single robotic arm to handle both loading and rework unloading, leading to low robotic arm efficiency. When a defective workpiece is detected, the robotic arm must prioritize processing the defective workpiece before normal loading, which can easily cause interruptions in the loading process and severely impact the equipment's loading cycle time.

[0024] To at least address one of the technical problems existing in the prior art or related technologies, the present invention provides a feeding device, which includes a base, a feeding mechanism, a flipping mechanism, a rework mechanism, and a movement control mechanism. The base is positioned near a calibration table on a semiconductor processing equipment. The feeding mechanism is mounted on the base and is used to place the workpiece to be processed. The flipping mechanism is mounted on the base and is used to clamp or release the workpiece to be processed. The flipping mechanism is also used to flip the clamped workpiece. The rework mechanism is movably mounted on the base and has a first position and a second position. When the rework mechanism is in the first position, it is located between the feeding mechanism and the flipping mechanism. When the rework mechanism is in the second position, it is located directly below the flipping mechanism and is used to receive the workpiece to be processed that has been released from clamping by the flipping mechanism. The movement control mechanism is connected to the rework mechanism and is used to drive the rework mechanism to switch between the first position and the second position. This application enables the continuous feeding process of other workpieces to be processed in the feeding mechanism without waiting for the robotic arm to move the workpiece to be processed, thereby improving the overall feeding efficiency of the feeding device and solving the problem that the feeding process is affected by the need for the robotic arm to prioritize the handling of defective workpieces in the feeding process of the existing feeding device.

[0025] The following description, with reference to the accompanying drawings, describes a feeding device and semiconductor processing equipment according to some embodiments of the present invention.

[0026] See Figures 1 to 4This invention provides a feeding device applied to semiconductor processing equipment. The feeding device includes a base 1, a feeding mechanism 2, a flipping mechanism 3, a rework mechanism 4, and a movement control mechanism 5. The base 1 is positioned near a calibration table on the semiconductor processing equipment. The feeding mechanism 2 is mounted on the base 1 and is used to place the workpiece to be processed. The flipping mechanism 3 is mounted on the base 1 and is used to clamp or release the workpiece to be processed. The flipping mechanism 3 is also used to flip the clamped workpiece. The rework mechanism 4 is movably mounted on the base 1 and has a first position and a second position. When the rework mechanism 4 is in the first position, it is located between the feeding mechanism 2 and the flipping mechanism 3. Figure 4 As shown, when the rework mechanism 4 is in the second position, the rework mechanism 4 is located directly below the flipping mechanism 3. The rework mechanism 4 is used to receive the workpiece to be processed that has been released from the clamp by the flipping mechanism 3. The movement control mechanism 5 is connected to the rework mechanism 4 and is used to drive the rework mechanism 4 to switch between the first position and the second position.

[0027] It should be noted that the workpiece to be processed can be a semiconductor package, which is composed of multiple semiconductor package substructures arranged in rows and columns, and the semiconductor package is a rectangular sheet structure.

[0028] When loading semiconductor processing equipment, the rework mechanism 4 is moved to the first position, and the workpiece to be processed in the loading mechanism 2 is transferred to the flipping mechanism 3. After the flipping mechanism 3 clamps the workpiece to be processed, the movement control mechanism 5 drives the rework mechanism 4 to move from the first position to the second position. Then, the flipping mechanism 3 flips the workpiece to be processed, and after the upper surface of the workpiece to be processed faces the rework mechanism 4, the workpiece to be processed clamped on the flipping mechanism 3 is inspected. If the inspection result of the workpiece to be processed is a defective product, the flipping mechanism 3 is controlled to release the clamping of the workpiece to be processed, so that the workpiece to be processed falls onto the rework mechanism 4. Then, the rework mechanism 4 carrying the workpiece to be processed is controlled to move from the second position to the first position. If the inspection result of the workpiece to be processed is a good product, the workpiece to be processed is transferred to the calibration table on the semiconductor processing equipment.

[0029] Here, the first position is the rework waiting station of the rework mechanism 4. After the workpiece to be processed is transferred to the rework mechanism 4, the staff will take the workpiece to be processed from the rework mechanism 4 located in the first position and then perform rework.

[0030] In this embodiment, by placing the rework mechanism 4 between the loading mechanism 2 and the flipping mechanism 3, the original layout of the rework mechanism 4, loading mechanism 2, and flipping mechanism 3 in the loading device of existing semiconductor processing equipment can be optimized. This allows defective products on the flipping mechanism 3 to be moved from the first position to the second position via the movement control mechanism 5, without the need for robotic arm handling or long-distance transport. This moves the rework mechanism 4, positioned near the flipping mechanism 3, directly below it, allowing it to receive the workpiece released from the flipping mechanism 3. The movement control mechanism 5 then drives the rework mechanism 4 from the second position to the first position, enabling rapid transfer of the workpiece from the flipping mechanism 3 without the use of a robotic arm. Between the feeding mechanism 2 and the flipping mechanism 3, it can be seen that this application optimizes the workstation settings of the feeding mechanism 2, the rework mechanism 4, and the flipping mechanism 3 on the machine base 1, and controls the switching movement of the rework mechanism 4 between the first position and the second position. This improves the efficiency of the rework mechanism 4 in receiving the workpiece to be processed located on the flipping mechanism 3. At the same time, when a workpiece to be processed that needs to be reworked is defective, the rework mechanism 4 can be moved directly under the flipping mechanism 3 to receive the workpiece. This allows the feeding process of other workpieces to be processed in the feeding mechanism 2 to be carried out continuously without waiting for the robotic arm to handle the workpiece. This improves the overall feeding efficiency of the feeding device and solves the problem in the prior art where the feeding process is affected by the robotic arm prioritizing the handling of defective workpieces.

[0031] In some possible embodiments, the feeding device further includes a vision inspection module and a first control module. The vision inspection module is used to inspect the workpiece to be processed held by the flipping mechanism 3 and determine whether the workpiece to be processed is a good product or a defective product. The first control module is used to control the movement control mechanism 5 to drive the rework mechanism 4 to move to the second position if the workpiece to be processed is a defective product, so that the rework mechanism 4 can receive the workpiece to be processed that has been released from the flipping mechanism 3.

[0032] It should be noted that the visual inspection module inspects the workpiece to be processed by recognizing images acquired through the module to determine whether the workpiece is a good or defective product. For example, if the workpiece contains a label indicating it is defective, the module can identify whether the corresponding label is present in the image. If the label is present, the workpiece is determined to be defective. Furthermore, the module can also identify scratches in the images acquired by the visual inspection module. If scratches are detected, the workpiece is determined to be defective.

[0033] Here, when the vision inspection module determines that the workpiece held by the flipping mechanism 3 is defective, it can be determined that the workpiece needs to be reworked to prevent the defective product from being transferred to other processing mechanisms in the semiconductor processing equipment, resulting in defects in the final cut sub-workpiece. Therefore, when it is determined that the workpiece needs to be reworked, the first control module controls the movement control mechanism 5 to drive the rework mechanism 4 to move to the second position, so that the rework mechanism 4 is located directly below the flipping mechanism 3. Then, the flipping mechanism 3 is controlled to release the gripping of the workpiece, so that the workpiece falls onto the rework mechanism 4. Thus, by setting the rework mechanism 4 between the feeding mechanism 2 and the flipping mechanism 3, and making the rework mechanism 4 movable below the flipping mechanism 3, when the workpiece held by the flipping mechanism 3 is detected to be defective, the workpiece can be transferred to the rework mechanism 4 without using a robotic arm to transfer the workpiece.

[0034] In this embodiment, by setting a vision inspection module and a first control module on the feeding device, the vision inspection module can automatically inspect the workpiece to be processed, eliminating the need for manual visual inspection to determine whether the workpiece is good or defective. When the workpiece to be processed is detected as defective, the first control module controls the rework process to automatically trigger and move to the second position, so that the rework mechanism 4 can receive the workpiece to be processed that has been released from the clamp by the flipping mechanism 3. This realizes full automation of defective product detection, station switching and workpiece acceptance at the flipping station, ensuring smooth connection of the feeding, inspection and rework acceptance processes of the feeding device without waiting for robotic arms or manual instructions, and further improving the overall feeding efficiency of the feeding device.

[0035] Furthermore, the first control module is also used to drive the movement control mechanism 5 to move the rework mechanism 4 from the second position to the first position after the rework mechanism 4 receives the workpiece to be processed that has been released from the clamping by the flipping mechanism 3.

[0036] Here, the rework mechanism 4 is equipped with a detection sensor, which is used to detect whether the rework mechanism 4 is carrying a workpiece to be processed. After the detection sensor detects that the rework mechanism 4 is carrying a workpiece to be processed, the detection sensor is also used to send a detection signal to the first control module, so that the first control module determines that the rework mechanism 4 is carrying the workpiece to be processed that has been released from the clamp by the flipping mechanism 3. Then, the first control module drives the movement control mechanism 5 to drive the rework mechanism 4 to move from the second position to the first position, so that the rework mechanism 4 is away from the underside of the flipping mechanism 3, which makes it easier for the staff to take the workpiece to be processed off the rework mechanism 4.

[0037] In this embodiment, after the rework mechanism 4 receives the workpiece to be processed that has been released from the flipping mechanism 3, the first control module drives the movement control mechanism 5 to move the rework mechanism 4 from the second position to the first position, thereby achieving automatic reset of the rework mechanism 4. This prevents the rework mechanism 4 from continuing to occupy the space below the flipping mechanism 3 and ensures the smooth progress of subsequent processes.

[0038] Furthermore, the first control module includes a first control unit and a second control unit.

[0039] The first control unit is connected to the movement control mechanism 5, and the second control unit is connected to the flipping mechanism 3.

[0040] The first control unit is used to control the movement control mechanism 5 to drive the rework mechanism 4 to move to the second position when the workpiece to be processed is defective.

[0041] When it is determined that the workpiece to be processed is defective, the first control unit controls the movement control mechanism 5 to drive the rework mechanism 4 to move to the second position, which can quickly transfer the rework mechanism 4 to the underside of the flipping mechanism 3.

[0042] The second control unit is used to control the flipping mechanism 3 to flip so that the surface of the workpiece to be processed held by the flipping mechanism 4 faces the rework mechanism 4 after the rework mechanism 4 moves to the second position, and to control the flipping mechanism 3 to release the workpiece to be processed.

[0043] After the rework mechanism 4 moves to the second position, it is determined that the rework mechanism 4 is located below the flipping mechanism 3. The rework mechanism 4 is ready to carry the workpiece to be processed held on the flipping mechanism 3. At this time, the second control unit controls the flipping mechanism 3 to flip so that the surface of the workpiece to be processed held faces the rework mechanism 4, so that after the flipping mechanism 3 releases the workpiece to be processed, the workpiece to be processed can fall smoothly onto the rework mechanism 4.

[0044] In this embodiment, by selecting the first control module as a module including a first control unit and a second control unit, the control of "driving the rework mechanism 4 to move when there are defective products" and "controlling the flipping mechanism 3 to move after the rework mechanism 4 is in place" can be realized through the two units respectively. This improves the overall control accuracy and reliability of the first control module, further avoids the interference between the movement of the rework mechanism 4 and the flipping mechanism 3, makes the control of each action more precise, reduces the probability of the entire device's operation failure, and improves the stability of the overall control system of the device.

[0045] In some possible embodiments, the feeding device further includes a first robotic arm 6 and a second robotic arm. The first robotic arm 6 is used to transfer the workpiece to be processed on the feeding mechanism 2 to the flipping mechanism 3, and the second robotic arm is used to transfer the workpiece to be processed on the flipping mechanism 3 to the calibration table on the semiconductor processing equipment. The first control module is also used to control the second robotic arm to transfer the workpiece to be processed on the flipping mechanism 3 to the calibration table on the semiconductor processing equipment if the workpiece to be processed is a good product.

[0046] The vision inspection module can be installed on the second robotic arm or on the semiconductor processing equipment; preferably, the vision inspection module can be a vision device that, within its shooting range, can capture images of the workpiece to be processed held by the flipping mechanism 3 below it.

[0047] It should be noted that the second robotic arm may include a linear robotic arm positioned near the calibration table on the semiconductor processing equipment. This linear robotic arm can move along the Y-axis and has a first suction cup portion that can vacuum-adsorb the workpiece to be processed. After the first suction cup portion vacuum-adsorbs the workpiece to be processed, the flipping mechanism 3 is controlled to release the clamping of the workpiece to be processed, and then the second robotic arm is controlled to drive the first suction cup portion to move so that the workpiece to be processed moves to the calibration table along with the first suction cup portion.

[0048] In this embodiment, by setting a first robotic arm 6 and a second robotic arm on the feeding device, and controlling the second robotic arm to transfer the workpiece to be processed from the flipping mechanism 3 to the calibration table when it is determined that the workpiece to be processed is a good product, it is possible to avoid interference between the second robotic arm and the flipping mechanism 3 without any movement. This allows for precise transfer of the workpiece to be processed from the flipping mechanism 3 to the calibration table when it is determined that the workpiece to be processed is a good product. This makes the control of each movement of the second robotic arm and the flipping mechanism 3 more precise, reduces the probability of malfunction of the feeding device, and improves the stability of the overall control system of the device.

[0049] Furthermore, the feeding mechanism 2 and the flipping mechanism 3 are arranged parallel to each other on the base 1 along the X-axis direction; when the rework mechanism 4 is in the first position, the rework mechanism 4 is arranged parallel to the feeding mechanism 2 and the flipping mechanism 3 on the base 1; the first robotic arm 6 includes a gantry frame and a robotic arm part mounted on the gantry frame, the gantry frame is movably mounted on the base 1, and the gantry frame can reciprocate on the base 1 along the X-axis direction.

[0050] Here, the robotic arm is equipped with a second suction cup. When the robotic arm moves with the gantry frame to above the workpiece to be processed on the loading mechanism 2, the robotic arm can move downward so that the second suction cup contacts the workpiece to be processed. Then, the second suction cup is controlled to perform vacuum adsorption on the workpiece to be processed, and the robotic arm is controlled to move upward so that the robotic arm can grasp the workpiece to be processed on the loading mechanism 2. Then, the robotic arm moves with the gantry frame on the base 1 along the X-axis until the workpiece to be processed is clamped by the flipping mechanism 3. Then, the second suction cup is controlled to release the vacuum adsorption on the workpiece to be processed.

[0051] It should be noted that, in this embodiment, the first robotic arm 6, by adopting the structure of a gantry frame and a robotic arm, can improve its structural rigidity under the bidirectional support of the robotic arm on the gantry frame, so as to ensure the stability of the continuous horizontality of the movement of the robotic arm on the base 1.

[0052] In this embodiment, by arranging the feeding mechanism 2, the flipping mechanism 3, and the rework mechanism 4 at the first position parallel to each other along the X-axis, the core workstations can be arranged in a straight and regular manner on the machine base 1. This changes the problem of the dispersed and messy layout of the workstations of the aforementioned mechanisms on the machine base 1 in the prior art, significantly reducing the overall space occupied by the machine base 1 and improving the space utilization rate of the equipment. At the same time, the straight and parallel layout minimizes the distance between each workstation, providing convenient conditions for the subsequent transfer of workpieces to be processed, and reducing the transfer time of workpieces to be processed from the layout level. Meanwhile, the first robotic arm 6 is selected here as a structure including a gantry and a robotic arm mounted on the gantry. The gantry is movably mounted on the base 1, and the gantry can reciprocate along the X-axis on the base 1. This allows the design of the first robotic arm 6 being arranged parallel to each workstation along the X-axis to perfectly match the design. That is, the robotic arm is driven by the gantry to move in a straight line synchronously. Without the need for complex multi-directional turning actions, the robotic arm can accurately dock with the loading mechanism 2 and the flipping mechanism 3 to complete the transfer of the workpiece between the two workstations. At the same time, the straight-line movement trajectory can effectively avoid jamming and deviation caused by excessive movement of the robotic arm, ensuring that the transfer action of the robotic arm is accurate and smooth, and further improving the smooth operation of the equipment.

[0053] In some possible embodiments, the rework mechanism 4 includes a carrier box 401, which is mounted at a lower height on the base 1 than the flipping mechanism 3 is mounted on the base 1.

[0054] It should be noted that when the rework mechanism 4 is in the first position, the upper surface of the base 1 does not obstruct the carrier box 401, so that the carrier box 401 is exposed outside the base 1, which makes it easier for the staff to take out the workpiece to be processed from the carrier box 401.

[0055] Accordingly, the motion control mechanism 5 includes a connecting component and a second drive unit 504.

[0056] The connecting assembly includes a mounting bracket 501 and a guide bracket 502. The guide bracket 502 is mounted on the base 1 and has a guide rail 503. The first end of the guide rail 503 extends below the first position, and the second end of the guide rail 503 extends below the second position. The carrier box 401 is mounted on the mounting bracket 501 and has a sliding part that is slidably connected to the guide rail 503. The second drive part 504 is used to drive the sliding part to move on the guide rail 503, thereby driving the carrier box 401 to switch between the first and second positions.

[0057] It should be noted that the length direction of guide rail 503 is parallel to the X-axis direction.

[0058] The installation height of the motion control mechanism 5 on the base 1 is also lower than the installation height of the flipping mechanism 3 on the base 1.

[0059] Here, by installing the rework mechanism 4 at a lower height on the base 1 than the tilting mechanism 3 on the base 1, the rework mechanism 4 can move inside the base 1 under the drive of the movement control mechanism 5 and always remain below the tilting mechanism 3.

[0060] In this embodiment, by installing the carrier box 401 of the rework mechanism 4 at a lower height than the flipping mechanism 3, when the flipping mechanism 3 releases a defective workpiece, the workpiece can fall smoothly into the carrier box 401 by its own weight, avoiding the workpiece being bumped or damaged by manual or mechanical pushing. At the same time, the guide rail 503 on the guide frame 502 and the sliding part on the mounting frame 501 provide precise guidance for the movement of the carrier box 401, avoiding problems such as deviation or jamming of the rework mechanism 4 during movement, and ensuring that the carrier box 401 can accurately switch to the first position and the second position.

[0061] Furthermore, the second drive unit 504 includes a cylinder, the length direction of which is parallel to the length direction of the guide rail 503, the cylinder barrel is connected to the guide frame 502, and the piston rod of the cylinder is connected to the sliding part.

[0062] In this embodiment, by selecting a cylinder as the second drive unit 504, the second drive unit 504 can be adapted to the guiding direction of the guide rail 503, thereby improving the driving stability and accuracy of the second drive unit 504. Specifically, the length direction of the cylinder is parallel to the length direction of the guide rail 503, the cylinder barrel is fixed to the guide frame 502, and the piston rod is connected to the sliding part. This ensures that the driving force direction of the cylinder is completely consistent with the moving direction of the carrier box 401, guaranteeing smooth and precise driving action of the second drive unit 504, and further ensuring the accuracy of the rework mechanism 4 switching between the first and second positions.

[0063] In some possible embodiments, the base 1 is provided with two feeding areas, and each feeding area is provided with a workpiece limiting groove 101.

[0064] Among them, the two workpiece limiting grooves 101 are arranged side by side along the X-axis.

[0065] Correspondingly, the feeding mechanism 2 includes two feeding components corresponding to the two workpiece limiting grooves 101. The feeding components include a material box placement platform 201 and a lifting component. The material box placement platform 201 is movably disposed on the machine base 1 and is used to place the material box containing the stacked workpieces to be processed. The lifting component is disposed inside the machine base 1 and is located directly below the workpiece limiting groove 101. It is used to lift the workpieces to be processed in the material box one by one to the top of the corresponding workpiece limiting groove 101 after the material box moves with the material box placement platform 201 to the bottom of the workpiece limiting groove 101.

[0066] It should be noted that the feeding mechanism 2 also includes a base plate 202. One end of the base plate 202 extends into the machine base 1, and at least a portion of the base plate 202 is located directly below the workpiece limiting groove 101. At least a portion of the base plate 202 is located outside the machine base 1, and the lifting component is set on the corresponding portion of the base plate 202 located directly below the workpiece limiting groove 101. The material box placement platform 201 can slide on the base plate 202 to move the material box from the outside of the machine base 1 into the machine base 1 along with the material box placement platform 201 and to be located directly below the workpiece limiting groove 101.

[0067] Here, by movably mounting the material box placement platform 201 on the machine base 1, it is convenient to replenish the workpieces to be processed and maintain the material boxes, thereby improving the convenience of loading the material boxes located on the material box placement platform 201. At the same time, by positioning the lifting component directly below the workpiece limiting groove 101, after the material box is in place with the material box placement platform 201, the stacked workpieces to be processed can be lifted one by one to the position of the top of the workpiece limiting groove 101, ensuring that the workpieces to be processed are always at a height that the robotic arm of the first robotic arm 6 can accurately grasp, avoiding the situation where the robotic arm grasps the workpieces due to height deviation.

[0068] In this setup, multiple workpieces are stacked along the height of the material box. After the lifting assembly lifts all the workpieces in the material box, the topmost workpiece can be lifted to a position at the same or similar height as its corresponding workpiece limiting groove 101, so that the first robotic arm 6 can grasp the topmost workpiece. Here, the lifting assembly can be a motor, with its axis parallel to the height direction of the base 1, so that the workpieces in the material box can be lifted one by one to a position at the same or similar height as their corresponding workpiece limiting groove 101 under the lifting action of the motor.

[0069] In this embodiment, by setting two feeding areas on the machine base 1, and each feeding area is provided with a workpiece limiting groove 101, and the feeding mechanism 2 is configured to include two feeding components corresponding to the two workpiece limiting grooves 101, a design of dual feeding areas and dual feeding components is achieved on the machine base 1. This enables the alternating feeding of workpieces to be processed in the two feeding areas on the machine base 1, thereby avoiding equipment downtime caused by a single feeding component interrupting the feeding process, ensuring continuous feeding, and effectively improving the overall efficiency of the equipment.

[0070] In some possible embodiments, the flipping mechanism 3 includes a flipping frame 301, a flipping frame 302, and a rotation drive assembly. The inner sidewall of the flipping frame 301 is provided with a clamping part 303. When the workpiece to be processed is located inside the flipping frame 301, the clamping part 303 is used to clamp the side of the workpiece to be processed, so as to fix the workpiece to be processed inside the flipping frame 301. The flipping frame 301 is rotatably mounted on the flipping frame 302. The rotation drive assembly is drivenly connected to the flipping frame 301 and is used to drive the flipping frame 301 to rotate relative to the flipping frame 302, so as to flip the workpiece to be processed clamped in the flipping frame 301.

[0071] Here, the two sides of the flip frame 301 are rotatably connected to the flip frame 302 via the connecting shaft 304. When the frame surface of the flip frame 301 is parallel to the upper surface of the base 1, the distance between the left and right sides of the frame surface of the flip frame 301 and the upper surface of the base 1 is the same or similar.

[0072] The rotation drive assembly can be connected to the connecting shaft 304. By controlling the axial rotation of the connecting shaft 304 through the rotation drive assembly, the rotation drive assembly can drive the flipping frame 301 to flip. Specifically, the rotation drive assembly can be a motor mounted on the base 1, that is, a motor driving a pulley to make the connecting shaft 304 rotate axially, thereby realizing the flipping of the flipping frame 301.

[0073] It should be noted that the flip frame 301 has a first driving part 305 on one side where the clamping part 303 is provided. The first driving part 305 can drive the clamping part 303 to move along the X-axis direction to control the clamping part 303 to clamp or release the workpiece to be processed.

[0074] In this embodiment, by selecting the flipping mechanism 3 as a structure including a flipping frame 301, a flipping frame 302 and a rotation drive assembly, and providing a clamping part 303 for clamping the workpiece to be processed on the inner side wall of the flipping frame 301, the flipping frame 301 can be stably fixed to the workpiece to be processed, thereby enabling the workpiece to be processed clamped on the flipping frame 301 to be smoothly flipped under the flipping action of the flipping frame 301.

[0075] In some possible embodiments, the loading device further includes a transfer mechanism 7, which includes a transfer platform 701, a lifting drive assembly 702, and a second control module. The transfer platform 701 is located below the flipping frame 301. The transfer platform 701 is used to carry the workpiece to be processed transported from the loading mechanism 2. The lifting drive assembly 702 is connected to the transfer platform 701 and is used to drive the transfer platform 701 to lift. The second control module is used to control the lifting drive assembly 702 to drive the transfer platform 701 to rise when the workpiece to be processed on the loading mechanism 2 is transported to the flipping mechanism 3, until the transfer platform 701 moves into the flipping frame 301, so that the position of the clamping part 303 on the inner side wall of the flipping frame 301 corresponds to the side position of the workpiece to be processed. The second control module is also used to control the lifting drive assembly 702 to drive the transfer platform 701 to fall before the rotation drive assembly drives the flipping frame 301 to rotate relative to the flipping frame 302, until the transfer platform 701 moves away from the flipping frame 301.

[0076] Here, by adding a transfer mechanism 7 to the feeding device, the workpiece to be processed can be transferred from the feeding mechanism 2 to the flipping mechanism 3, thereby improving the clamping accuracy of the flipping mechanism 3. Specifically, by using the transfer platform 701 as a transition carrier for the workpiece from the conveying mechanism to the flipping frame 301, the workpiece to be processed can be received and accurately positioned first, and then the workpiece can be sent into the flipping frame 301 by the lifting drive component 702. This ensures that the clamping part 303 on the inner side wall of the flipping frame 301 is precisely aligned with the side of the workpiece, avoiding the positional deviation that occurs when the first robotic arm 6 directly puts the workpiece into the flipping frame 301. This ensures that the clamping part 303 can clamp the workpiece smoothly and accurately, reducing the probability of clamping error of the clamping part 303 in the flipping frame 301.

[0077] The transfer platform 701 is designed to be height-adjustable, which can be adapted to the action of the flipping mechanism 3 so that the workpiece to be processed can be raised during transportation, ensuring that the workpiece can smoothly enter the flipping frame 301 and be clamped. At the same time, it can be lowered before the flipping action of the flipping mechanism 3, so that the transfer platform 701 is away from the flipping frame 301, avoiding collision or interference between the transfer platform 701 and the flipping frame 301 when they rotate, ensuring the smooth flipping action of the flipping mechanism 3, and preventing the workpiece from being damaged due to obstruction by the transfer platform 701 during the flipping process.

[0078] One embodiment of the present invention provides a semiconductor processing apparatus, including the feeding device described in any of the above embodiments.

[0079] Among them, semiconductor processing equipment can be a cutting machine or a cutting and sorting integrated machine.

[0080] Since the semiconductor processing equipment of this embodiment includes any of the feeding devices in the first aspect described above, it has the beneficial effects of any of the above embodiments, which will not be repeated here.

[0081] Furthermore, semiconductor processing equipment also includes calibration tables, cutting mechanisms, and cleaning mechanisms.

[0082] Here, the calibration table is used to calibrate the position of the workpiece to be processed, which has been determined to be of good quality; the cutting mechanism is used to cut the workpiece to be processed, which is transported from the calibration table to its corresponding work plate; and the cleaning mechanism is used to clean the cut workpiece, which is transported from the cutting mechanism to its corresponding work plate.

[0083] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0084] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0085] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0086] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "exemplary embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0087] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A feeding device, applied to semiconductor processing equipment, characterized in that, include: Base; The feeding mechanism, located on the machine base, is used to place the workpiece to be processed; A flipping mechanism, mounted on the machine base, is used to clamp or release the workpiece to be processed; the flipping mechanism is also used to flip the clamped workpiece to be processed. A rework mechanism is movably mounted on the machine base. The rework mechanism has a first position and a second position. When the rework mechanism is in the first position, it is located between the feeding mechanism and the flipping mechanism. When the rework mechanism is in the second position, it is located directly below the flipping mechanism. The rework mechanism is used to receive the workpiece to be processed that has been released from its clamping position by the flipping mechanism. A movement control mechanism, connected to the rework mechanism, is used to drive the rework mechanism to switch between the first position and the second position.

2. The feeding device according to claim 1, characterized in that, Also includes: The visual inspection module is used to inspect the workpiece to be processed held by the flipping mechanism and determine whether the workpiece to be processed is a good product or a defective product. The first control module is used to control the moving control mechanism to drive the rework mechanism to move to the second position if the workpiece to be processed is defective, so that the rework mechanism can receive the workpiece to be processed that has been released from the clamping by the flipping mechanism.

3. The feeding device according to claim 2, characterized in that, The first control module is also used to drive the movement control mechanism to move the rework mechanism from the second position to the first position after the rework mechanism receives the workpiece to be processed that has been released from the clamping by the flipping mechanism.

4. The feeding device according to claim 2, characterized in that, The first control module includes a first control unit and a second control unit; The first control unit is used to control the movement control mechanism to drive the rework mechanism to move to the second position when the workpiece to be processed is a defective product; The second control unit is used to control the flipping mechanism to flip so that the surface of the workpiece to be processed held by the flipping mechanism faces the rework mechanism after the rework mechanism moves to the second position, and to control the flipping mechanism to release the workpiece to be processed.

5. The feeding device according to claim 2, characterized in that, Also includes: The first robotic arm is used to transfer the workpiece to be processed from the loading mechanism to the flipping mechanism; The second robotic arm is used to transfer the workpiece to be processed, located on the flipping mechanism, to the calibration table on the semiconductor processing equipment. The first control module is further configured to, if the workpiece to be processed is a good product, control the second robotic arm to transfer the workpiece to be processed located on the flipping mechanism to the calibration table on the semiconductor processing equipment.

6. The feeding device according to claim 5, characterized in that, The feeding mechanism and the flipping mechanism are arranged parallel to each other on the machine base along the X-axis direction; when the rework mechanism is in the first position, the rework mechanism is arranged parallel to the feeding mechanism and the flipping mechanism on the machine base; the first robotic arm includes a gantry frame and a robotic arm part mounted on the gantry frame, the gantry frame is movably mounted on the machine base, and the gantry frame can reciprocate on the machine base along the X-axis direction.

7. The feeding device according to claim 1, characterized in that, The rework mechanism includes a carrier box, the mounting height of which on the base is lower than the mounting height of the flipping mechanism on the base; the movement control mechanism includes a connecting component and a second drive unit. The connecting assembly includes a mounting bracket and a guide bracket. The guide bracket is mounted on the base and has a guide rail. A first end of the guide rail extends below the first position, and a second end of the guide rail extends below the second position. The carrier box is mounted on the mounting bracket and has a sliding part that is slidably connected to the guide rail. The second driving part is used to drive the sliding part to move on the guide rail, so as to drive the carrier box to switch between the first position and the second position.

8. The feeding device according to claim 7, characterized in that, The second drive unit includes a cylinder, the length direction of which is parallel to the length direction of the guide rail, the cylinder barrel is connected to the guide frame, and the piston rod of the cylinder is connected to the sliding part.

9. The feeding device according to claim 1, characterized in that, The machine base is provided with two feeding areas, and each feeding area is provided with a workpiece limiting groove; the feeding mechanism includes two feeding components corresponding to the two workpiece limiting grooves, and the feeding components include: A material box placement platform is movably mounted on the machine base. The material box placement platform is used to place material boxes that load and stack workpieces to be processed. The lifting assembly is located inside the machine base and directly below the workpiece limiting groove. It is used to lift the workpieces to be processed in the material box one by one to the top of the corresponding workpiece limiting groove after the material box moves with the material box placement platform to the position below the workpiece limiting groove.

10. The feeding device according to claim 1, characterized in that, The flipping mechanism includes: The flip frame has a clamping part on its inner side wall. When the workpiece to be processed is located in the flip frame, the clamping part is used to clamp the side of the workpiece to be processed so as to fix the workpiece to be processed in the flip frame. A flipping frame, wherein the flipping frame is rotatably mounted on the flipping frame; A rotation drive assembly is connected to the flip frame drive and is used to drive the flip frame to rotate relative to the flipping frame in order to flip the workpiece to be processed held in the flip frame.

11. The feeding device according to claim 10, characterized in that, It also includes transit agencies, which include: A transfer platform is located below the flipping frame; the transfer platform is used to carry the workpieces to be processed that are transported from the loading mechanism. A lifting drive assembly, connected to the transfer platform, is used to drive the transfer platform to lift. The second control module is used to control the lifting drive assembly to drive the transfer platform to rise when the workpiece to be processed on the loading mechanism is transferred to the flipping mechanism, until the transfer platform moves into the flipping frame so that the position of the clamping part on the inner side wall of the flipping frame corresponds to the side position of the workpiece to be processed; the second control module is also used to control the lifting drive assembly to drive the transfer platform to fall before the rotation drive assembly drives the flipping frame to rotate relative to the flipping frame, until the transfer platform moves away from the flipping frame.

12. A semiconductor processing apparatus, characterized in that, Includes the feeding device as described in any one of claims 1 to 11.

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