Semiconductor seal ring processing device

Abstract

This utility model relates to the field of sealing ring processing technology, and proposes a semiconductor sealing ring processing device, including a worktable. A motor is fixedly installed on the top of the worktable, and a threaded rod is fixedly connected to the motor through its output shaft. A guide rail and a support frame are fixedly connected to the top of the worktable. A mold plate is connected to the top surface of the guide rail, and a molding groove is opened on the top of the mold plate. A material cylinder is fixedly connected to the inner side of the support frame, and a heating device is provided on the surface of the material cylinder. A discharge pipe is fixedly connected through the bottom of the material cylinder. In this utility model, by setting up an accelerated forming mechanism, when the motor drives the threaded rod to rotate, causing the mold plate to move to the right for injection molding, the mechanism also drives the fan blades to swing back and forth through the cooperation of components such as rack, drive gear, and drive rod. The back and forth swing of the fan blades increases the airflow above the mold plate, thereby accelerating the cooling and forming of the sealing ring.

Description

Technical Field

[0001] This utility model relates to the field of sealing ring processing technology, specifically to a semiconductor sealing ring processing device. Background Technology

[0002] Semiconductor sealing rings are sealing devices used to enclose semiconductor devices from the external environment, and are an important component of semiconductor device support and packaging. Depending on the material, they can be classified as rubber sealing rings, silicon sealing rings, metal sealing rings, etc. The manufacturing processes for semiconductor sealing rings include extrusion molding, compression molding, injection molding, and thermoforming, among others.

[0003] The utility model disclosed in CN215434652U is a sealing ring processing device for hydraulic cylinders, including a table, a support leg fixedly connected to the lower end face of the table, a shaping and conveying device provided on the upper end face of the table, the shaping and conveying device including a slide rail, a fixing block fixedly connected to the upper end face of the table, a first gear rotatably connected to the front end face of the fixing block, a second gear rotatably connected to the rear end face of the fixing block, the first gear and the second gear being fixedly connected, and an extension plate fixedly connected to the lower end face of the table.

[0004] The aforementioned application document describes a method where the meshing gear rail moves to the left, causing the entire molding plate to move to the left on the slide rail. The raw material falls into the molding groove through the feeding port and is shaped. A fan is turned on to blow air into the molding groove, which can quickly cool and shape the sealing ring in the molding groove. However, the large airflow and fixed direction of the fan during cooling may cause deformation of the sealing ring, affecting its quality. Therefore, this method needs improvement. Utility Model Content

[0005] This invention proposes a semiconductor sealing ring processing device, which solves the problems in related technologies.

[0006] The technical solution of this utility model is as follows: A semiconductor sealing ring processing device includes a worktable, a motor fixedly mounted on the top of the worktable, a threaded rod fixedly connected to the motor through its output shaft, a guide rail and a support frame fixedly connected to the top of the worktable, a mold plate connected to the top surface of the guide rail, a molding groove formed on the top of the mold plate, a material cylinder fixedly connected to the inner side of the support frame, a heating device provided on the surface of the material cylinder, a discharge pipe penetrating and fixedly connected to the bottom of the material cylinder, and a material distribution device penetrating and fixedly connected to the bottom of the discharge pipe. The box has an injection head at its bottom and an accelerated shaping mechanism and a scraping mechanism at its top. The accelerated shaping mechanism includes a rack, a drive rod, and a driven rod. The rack is fixedly connected to the mold plate. The drive rod and the driven rod are rotatably connected to the top of the worktable. A drive gear is fixedly connected to the surface of the drive rod, a rotating gear is fixedly connected to the top of the drive rod, a driven gear is fixedly connected to the top of the driven rod, a fan blade and a rotating plate are fixedly connected to the surface of the driven rod, and a torsion spring is fixedly connected to the bottom of the rotating plate.

[0007] Optionally, the guide rails are configured in two sets. The threaded rod is rotatably connected to the top of the workbench via a bracket. The mold plate is threadedly connected to the threaded rod via an internal thread. When the threaded rod rotates, it will drive the mold plate to move laterally along the two sets of guide rails through the engagement of the threads.

[0008] Optionally, the surface of the discharge pipe is provided with a solenoid valve, and the number of injection heads is set to four. The solenoid valve can control the opening and closing of the discharge pipe, and the raw material is injected into the molding tank through the four sets of injection heads.

[0009] Optionally, the teeth on the rack are adapted to the teeth on the driving gear, and the teeth on the rotating gear are initially engaged with the teeth on the driven gear. When the rack moves and engages with the driving gear, it will drive the driving gear to rotate. When the rotating gear rotates and its teeth engage with the teeth on the driven gear, it will drive the driven gear to rotate.

[0010] Optionally, the rotating gear is an incomplete gear, the end of the torsion spring away from the rotating plate is fixedly connected to the top of the workbench, the bottom of the fan blade is higher than the top of the mold plate, the rotating plate will deform the torsion spring when it rotates, and the fan blade will not collide with the mold plate when it swings.

[0011] Optionally, the scraping mechanism includes a pneumatic chamber fixedly connected to the top of the worktable. A piston rod A is slidably connected to a piston inside one end of the pneumatic chamber. A pressure plate is fixedly connected to the end of the piston rod A away from the pneumatic chamber. A return spring is sleeved on the surface of the piston rod A. A piston rod B is slidably connected to a piston inside the other end of the pneumatic chamber. A scraper is fixedly connected to the end of the piston rod B away from the pneumatic chamber.

[0012] Optionally, the pressure plate is located on the movement trajectory of the mold plate, and the two ends of the return spring abut against the pressure plate and the air chamber respectively. When the mold plate moves to the right, it will contact the pressure plate and drive the pressure plate to move to the right. The movement of the pressure plate to the right will compress the return spring.

[0013] Optionally, the length of the scraper is greater than the length of the mold plate, and the bottom of the scraper is flush with the top of the mold plate. When the scraper moves left and right, it scrapes off the excess material on the top of the mold plate.

[0014] The working principle and beneficial effects of this utility model are as follows:

[0015] 1. In this utility model, by setting up an accelerated forming mechanism, when the motor is turned on to drive the threaded rod to rotate and the mold plate moves to the right for injection molding, the fan blades will also swing back and forth through the cooperation of components such as rack, drive gear, and drive rod. The back and forth swing of the fan blades increases the air flow above the mold plate, thereby accelerating the cooling and forming of the sealing ring.

[0016] 2. In this utility model, a scraping mechanism is provided, which enables the motor to drive the threaded rod to rotate and move the mold plate to the right for injection molding. At the same time, the pressure plate, piston rod A, air chamber and other components will work together to drive the scraper to move to the left to contact the top of the mold plate and scrape off the excess material, thereby improving the efficiency of the overall sealing ring processing. Attached Figure Description

[0017] The preferred embodiments will be described below in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages and implementation methods of this utility model.

[0018] Figure 1 This is a three-dimensional front view of the overall structure of this utility model;

[0019] Figure 2 This is a three-dimensional side view of the overall structure of this utility model;

[0020] Figure 3 This is a three-dimensional schematic diagram of the overall structure of the accelerated shaping mechanism of this utility model;

[0021] Figure 4 This is a three-dimensional schematic diagram of a portion of the accelerated shaping mechanism of this utility model;

[0022] Figure 5 This is a three-dimensional schematic diagram of the overall structure of the scraping mechanism of this utility model.

[0023] In the diagram: 1. Workbench; 2. Motor; 3. Threaded rod; 4. Guide rail; 5. Mold plate; 6. Shaping groove; 7. Support frame; 8. Material cylinder; 9. Heating device; 10. Discharge pipe; 11. Solenoid valve; 12. Material distribution box; 13. Injection head; 14. Accelerating shaping mechanism; 141. Rack; 142. Driving rod; 143. Driving gear; 144. Rotating gear; 145. Driven rod; 146. Driven gear; 147. Fan blade; 148. Rotating plate; 149. Torsion spring; 15. Scraping mechanism; 151. Air chamber; 152. Piston rod A; 153. Pressure plate; 154. Return spring; 155. Piston rod B; 156. Scraper. Detailed Implementation

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0025] To keep the drawings concise, only the parts relevant to the utility model are shown schematically in each drawing; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "a" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0026] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Example 1

[0029] Reference Figures 1-5This is the first embodiment of the present invention, which proposes a semiconductor sealing ring processing device, including a worktable 1. A motor 2 is fixedly mounted on the top of the worktable 1. A threaded rod 3 is fixedly connected to the motor 2 through its output shaft. A guide rail 4 and a support frame 7 are fixedly connected to the top of the worktable 1. A mold plate 5 is connected to the top surface of the guide rail 4. The guide rail 4 is configured with two sets. The threaded rod 3 is rotatably connected to the top of the worktable 1 through a bracket. The mold plate 5 is threadedly connected to the threaded rod 3 through an internal thread. When the threaded rod 3 rotates, it will drive the mold plate 5 to move laterally along the two sets of guide rails 4 through the engagement of the threads. The top of the mold plate 5 is open. The worktable 1 is equipped with a molding tank 6, and a material cylinder 8 is fixedly connected to the inner side of a support frame 7. A heating device 9 is installed on the surface of the material cylinder 8. A discharge pipe 10 is fixedly connected through the bottom of the material cylinder 8. A distribution box 12 is fixedly connected through the bottom of the discharge pipe 10. An injection head 13 is installed at the bottom of the distribution box 12. A solenoid valve 11 is installed on the surface of the discharge pipe 10. The number of injection heads 13 is set to four. The solenoid valve 11 can control the opening and closing of the discharge pipe 10. The raw material is injected into the molding tank 6 through the four injection heads 13. An accelerated shaping mechanism 14 and a scraping mechanism 15 are installed on the top of the worktable 1. The accelerated shaping mechanism 14 The assembly includes a rack 141, a drive rod 142, and a driven rod 145. The rack 141 is fixedly connected to the mold plate 5. The drive rod 142 and the driven rod 145 are both rotatably connected to the top of the worktable 1. A drive gear 143 is fixedly connected to the surface of the drive rod 142, and a rotating gear 144 is fixedly connected to the top of the drive rod 142. A driven gear 146 is fixedly connected to the top of the driven rod 145. The teeth on the rack 141 are matched with the teeth on the drive gear 143. Initially, the teeth on the rotating gear 144 mesh with the teeth on the driven gear 146. The rack 141 moves to mesh with the drive gear 143. When the gear is engaged, it will drive the drive gear 143 to rotate. When the rotating gear 144 rotates and its upper teeth mesh with the upper teeth of the driven gear 146, it will drive the driven gear 146 to rotate. The driven rod 145 has a fan blade 147 and a rotating plate 148 fixedly connected to its surface. The bottom of the rotating plate 148 has a torsion spring 149 fixedly connected to its bottom. The rotating gear 144 is an incomplete gear. The end of the torsion spring 149 away from the rotating plate 148 is fixedly connected to the top of the workbench 1. The bottom of the fan blade 147 is higher than the top of the mold plate 5. When the rotating plate 148 rotates, it will cause the torsion spring 149 to deform. When the fan blade 147 swings, it will not collide with the mold plate 5.

[0030] In this embodiment, the injection molding material is fed into the barrel 8, the heating device 9 is turned on to prevent the material from solidifying, and the solenoid valve 11 is controlled to open the discharge pipe 10, so that the material enters the distribution box 12 through the discharge pipe 10 and is discharged from the injection head 13 into the molding groove 6 at the top of the mold plate 5. The motor 2 is turned on to drive the threaded rod 3 to rotate. The rotation of the threaded rod 3 will drive the mold plate 5 to move to the right along the two sets of guide rails 4 through the engagement of the threads, so as to carry out the injection molding work. During the rightward movement of the mold plate 5, the rack 141 will mesh with the drive gear 143, causing the drive gear 143 to rotate. The rotation of the drive gear 143 drives the drive gear to rotate. When rod 142 rotates, the active rod 142 drives the rotating gear 144 to rotate. Initially, the rotation of the rotating gear 144 drives the driven gear 146 to rotate. The rotation of the driven gear 146 drives the driven rod 145 and the rotating plate 148 to rotate. The torsion spring 149 deforms. When the rotating gear 144 rotates to the toothless part and disengages from the driven gear 146, the torsion spring 149 rebounds and drives the rotating plate 148 and the driven rod 145 to flip back to their original positions, thus forming a cycle. The back-and-forth rotation of the driven rod 145 drives the fan blade 147 to swing back and forth, increasing the airflow above the mold plate 5, thereby accelerating the cooling and forming of the sealing ring.

[0031] Example 2

[0032] Reference Figures 1-5 This is the second embodiment of the present invention. This embodiment differs from the first embodiment in that the scraping mechanism 15 includes a pneumatic chamber 151, which is fixedly connected to the top of the workbench 1. A piston rod A152 is slidably connected to one end of the pneumatic chamber 151. A pressure plate 153 is fixedly connected to the end of the piston rod A152 away from the pneumatic chamber 151. A return spring 154 is sleeved on the surface of the piston rod A152. The pressure plate 153 is located on the movement trajectory of the mold plate 5. The two ends of the return spring 154 are respectively connected to the pressure plate 153. When the mold plate 5 moves to the right, it will contact the pressure plate 153 and cause the pressure plate 153 to move to the right. The pressure plate 153 will compress the return spring 154 when it moves to the right. The piston inside the other end of the air pressure chamber 151 is slidably connected to the piston rod B155. The end of the piston rod B155 away from the air pressure chamber 151 is fixedly connected to the scraper 156. The length of the scraper 156 is greater than the length of the mold plate 5, and the bottom of the scraper 156 is flush with the top of the mold plate 5. When the scraper 156 moves left and right, it will scrape off the excess material on the top of the mold plate 5.

[0033] Compared to Embodiment 1, further, when the motor 2 is turned on, the threaded rod 3 rotates. As the threaded rod 3 rotates, it drives the mold plate 5 to move to the right along the two sets of guide rails 4 through the engagement of the threads. During this process, the mold plate 5 will contact the pressure plate 153, causing the pressure plate 153 to move to the right. The rightward movement of the pressure plate 153 will cause the piston rod A152 to move to the right, and the return spring 154 will be compressed. The rightward movement of the piston rod A152 will cause the piston rod B155 to move to the left through the air pressure in the air chamber 151. The leftward movement of the piston rod B155 will cause the scraper 156 to move to the left to scrape off the excess material on the top of the mold plate 5, thereby improving the efficiency of the overall sealing ring processing.

[0034] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A semiconductor sealing ring processing apparatus, characterized in that, The system includes a workbench (1), a motor (2) fixedly mounted on the top of the workbench (1), a threaded rod (3) fixedly connected to the motor (2) through its output shaft, a guide rail (4) and a support frame (7) fixedly connected to the top of the workbench (1), a mold plate (5) connected to the top surface of the guide rail (4), a molding groove (6) opened on the top of the mold plate (5), a material cylinder (8) fixedly connected to the inner side of the support frame (7), a heating device (9) provided on the surface of the material cylinder (8), a discharge pipe (10) passing through and fixedly connected to the bottom of the material cylinder (8), a material distribution box (12) passing through and fixedly connected to the bottom of the discharge pipe (10), an injection head (13) provided at the bottom of the material distribution box (12), and an accelerated shaping mechanism (14) and a scraping mechanism (15) provided on the top of the workbench (1). The accelerated shaping mechanism (14) includes a rack (141), a drive rod (142), and a driven rod (145). The rack (141) is fixedly connected to the mold plate (5). The drive rod (142) and the driven rod (145) are both rotatably connected to the top of the worktable (1). A drive gear (143) is fixedly connected to the surface of the drive rod (142). A rotating gear (144) is fixedly connected to the top of the drive rod (142). A driven gear (146) is fixedly connected to the top of the driven rod (145). A fan blade (147) and a rotating plate (148) are fixedly connected to the surface of the driven rod (145). A torsion spring (149) is fixedly connected to the bottom of the rotating plate (148).

2. The semiconductor sealing ring processing apparatus according to claim 1, characterized in that, The guide rail (4) is set in two sets. The threaded rod (3) is rotatably connected to the top of the workbench (1) through the bracket. The mold plate (5) is threadedly connected to the threaded rod (3) through the built-in thread.

3. The semiconductor sealing ring processing apparatus according to claim 2, characterized in that, The surface of the discharge pipe (10) is provided with a solenoid valve (11), and the number of injection heads (13) is set to four.

4. The semiconductor sealing ring processing apparatus according to claim 3, characterized in that, The teeth on the rack (141) are adapted to the teeth on the driving gear (143), and the teeth on the rotating gear (144) are initially engaged with the teeth on the driven gear (146).

5. The semiconductor sealing ring processing apparatus according to claim 4, characterized in that, The rotating gear (144) is an incomplete gear, the end of the torsion spring (149) away from the rotating plate (148) is fixedly connected to the top of the workbench (1), and the bottom of the fan blade (147) is higher than the top of the mold plate (5).

6. The semiconductor sealing ring processing apparatus according to claim 5, characterized in that, The scraping mechanism (15) includes a pressure chamber (151), which is fixedly connected to the top of the workbench (1). A piston rod A (152) is slidably connected to the piston inside one end of the pressure chamber (151). A pressure plate (153) is fixedly connected to the end of the piston rod A (152) away from the pressure chamber (151). A return spring (154) is sleeved on the surface of the piston rod A (152). A piston rod B (155) is slidably connected to the piston inside the other end of the pressure chamber (151). A scraper (156) is fixedly connected to the end of the piston rod B (155) away from the pressure chamber (151).

7. The semiconductor sealing ring processing apparatus according to claim 6, characterized in that, The pressure plate (153) is located on the movement trajectory of the mold plate (5), and the two ends of the return spring (154) are in contact with the pressure plate (153) and the air pressure chamber (151) respectively.

8. The semiconductor sealing ring processing apparatus according to claim 7, characterized in that, The length of the scraper (156) is greater than the length of the mold plate (5), and the bottom of the scraper (156) is flush with the top of the mold plate (5).

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