A projector using TEC cooling sheet for heat dissipation

Abstract

This utility model relates to the field of projector technology and discloses a projector using a TEC (Transformer Electrode Cooler) for heat dissipation. It includes a projector body with a projection lens mounted on its upper end. A first internal circulation fan and a second internal circulation fan are respectively mounted on the lower left and upper right sides of the projector body. This projector using a TEC for heat dissipation consists of two sets of internal and external circulation cooling systems that work together to not only dissipate internal heat but also create a relatively comfortable operating environment for the projector. Since the display unit has temperature limitations, generally not exceeding the material's temperature limit of 90°C, the internal and external circulation systems ensure that the internal temperature does not exceed the limit, thus guaranteeing reliability and service life. An NTC (Natural Temperature Sensor) and an adjustable fan detect the internal temperature; if the internal temperature approaches the limit, the fan speed can be increased, and vice versa, further ensuring the internal temperature is maintained.

Description

Technical Field

[0001] This utility model relates to the field of projector technology, specifically a projector that uses a TEC cooling chip for heat dissipation. Background Technology

[0002] A projector is an optical device that magnifies and displays images or videos by projecting light onto a surface (usually a screen or wall). It works by modulating light emitted from a light source (usually a bulb, LED, or laser) through a small, transparent image chip, such as an LCD, DLP, or LCoS, to generate an image, which is then projected through a lens.

[0003] However, traditional projectors have poor heat dissipation and are prone to noise problems. Therefore, there is an urgent need for a projector that uses a TEC (thermal energy dissipation device) to solve the above technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a projector that uses a TEC cooling chip for heat dissipation, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A projector using a TEC (Transformer Electrode Cooler) for heat dissipation includes a projector body. A projection lens is mounted on the upper part of the projector body. A first internal circulation fan and a second internal circulation fan are mounted on the lower left and upper right sides of the projector body, respectively. A first internal-external circulation heat sink and a second internal-external circulation heat sink are respectively disposed at the upper end of the first internal circulation fan and the lower right side of the second internal circulation fan. A first external circulation fan is mounted on the left side of the first internal circulation fan. A second external circulation fan is disposed at the upper end of the second internal circulation fan. A TEC (Transformer Electrode Cooler) is disposed on one side of the second internal-external circulation heat sink, and a TEC heat sink is mounted on the lower right side of the TEC cooling chip. A third external circulation fan is connected to the lower end of the TEC heat sink. A display unit is mounted in the middle of the projector body, and an NTC (Natural Temperature Sensor) is disposed on one side of the display unit.

[0007] Preferably, the TEC radiator is made in the form of stacked fins.

[0008] Preferably, the TEC radiator consists of multiple thermoelectric modules.

[0009] Preferably, the TEC cooling chip is a semiconductor electronic device.

[0010] Compared with existing technologies, this utility model has the following advantages: The projector using a TEC cooling chip consists of two sets of circulating cooling systems, internal and external, working together to not only dissipate internal heat but also create a relatively comfortable operating environment for the projector. Since the display unit has temperature limitations, generally not exceeding the material's temperature limit of 90°C, the internal and external circulation systems ensure that the internal temperature does not exceed the limit, thus guaranteeing reliability and lifespan. An NTC temperature sensor and an adjustable fan detect the internal temperature; if the internal temperature approaches the limit, the fan speed can be increased, and vice versa, further ensuring the internal temperature. By utilizing the cooling chip and the internal and external circulation systems, the projector's heat dissipation problem, noise problem, reliability, and lifespan can be solved. Attached Figure Description

[0011] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0012] Figure 1 This is a schematic diagram of the overall structure of the projector using a TEC cooling chip for heat dissipation according to this utility model.

[0013] Figure 2 This is a rear view of the projector that utilizes a TEC cooling chip for heat dissipation according to this utility model.

[0014] Figure 3 This is a front view of the projector using a TEC cooling chip for heat dissipation according to this utility model.

[0015] In the diagram: 1. First internal circulation fan; 2. Second internal circulation fan; 3. First internal and external circulation heat sink; 4. Second internal and external circulation heat sink; 5. First external circulation fan; 6. Second external circulation fan; 7. TEC cooling chip; 8. TEC heat sink; 9. Third external circulation fan; 10. Display unit; 11. NTC temperature sensor; 12. Projection lens; 13. Projector body. Detailed Implementation

[0016] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. In the embodiments of the present utility model, the different types of cross-sectional lines are not labeled according to national standards, nor do they specify material requirements for the components; they are used to distinguish the cross-sectional views of the components in the drawings.

[0017] Please see Figure 1-3A projector using a TEC (Thermal Design Circuit) cooling chip for heat dissipation includes a projector body 13. A projection lens 12 is mounted on the upper end of the projector body 13. A first internal circulation fan 1 and a second internal circulation fan 2 are mounted on the lower left and upper right sides of the projector body 13, respectively. A first internal and external circulation heat sink 3 and a second internal and external circulation heat sink 4 are respectively disposed at the upper end of the first internal circulation fan 1 and the lower right side of the second internal circulation fan 2. A first external circulation fan 5 is mounted on the left side of the first internal circulation fan 1. A second external circulation fan 6 is disposed at the upper end of the second internal circulation fan 2. A TEC cooling chip 7 is disposed on one side of the second internal and external circulation heat sink 4. A TEC heat sink 8 is mounted on the lower right side of the TEC cooling chip 7. A third external circulation fan 9 is connected to the lower end of the TEC heat sink 8. A display unit 10 is mounted in the middle of the projector body 13. An NTC (Natural Temperature) sensor 11 is disposed on one side of the display unit 10.

[0018] The TEC radiator 8 is designed with stacked fins.

[0019] The TEC radiator 8 consists of multiple thermoelectric modules.

[0020] Among them, the resistance value of the NTC temperature sensor 11 decreases rapidly as the temperature rises. It is composed of two or three metal oxides, mixed in a fluid-like clay, and calcined into a dense sintered ceramic in a high-temperature furnace.

[0021] Among them, the TEC cooling chip 7 is a semiconductor electronic device.

[0022] The working principle and usage process of this utility model: This design mainly consists of a heat dissipation system composed of 2 internal circulation fans, 3 external circulation fans, 2 internal circulation fan radiators, 2 internal and external circulation radiators, 1 TEC external circulation radiator, TEC cooling chip, and 1 NTC temperature sensor.

[0023] Internal circulation principle: Utilizing the low-temperature characteristics of the TEC cooling chip 7, the low temperature is conducted to the first internal and external circulation radiator 3 and the second internal and external circulation radiator 4. The first internal and external circulation radiator 3 and the second internal and external circulation radiator 4 dissipate heat in the internal space. The low temperature is carried into the air duct by two internal circulation fans, and the circulation is repeated continuously, thus forming an internal circulation system.

[0024] External circulation principle: The TEC external circulation heatsink removes the high temperature from the TEC heatsink surface. The TEC external circulation heatsink is designed with stacked fins and placed in the external circulation airflow channel. Three external circulation fans are used; two continuously draw air from outside the projector to cool the two internal circulation fans, while the third external circulation fan expels air from inside the projector outwards, creating a continuous circulation system. These two internal and external circulation cooling systems work together to not only expel internal heat from the projector, creating a relatively comfortable operating environment, but also ensure that the display unit, which has temperature limitations (generally not exceeding the material's temperature limit of 90°C), remains within its operating range, thus guaranteeing reliability and lifespan.

[0025] The NTC temperature sensor 11 and the adjustable fan detect the internal temperature. If the internal temperature is close to the limit value, the fan speed can be increased; otherwise, the speed can be decreased to further ensure the internal temperature.

[0026] By utilizing the TEC cooling chip 7 and the internal and external circulation system, problems such as heat dissipation, high noise, reliability, and lifespan of projectors can be solved.

[0027] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0028] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the utility model involved in this application is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A projector using a TEC cooling chip for heat dissipation, comprising a projector body (13), characterized in that: The projector body (13) is equipped with a projection lens (12) at the upper end, and a first internal circulation fan (1) and a second internal circulation fan (2) are respectively installed on the lower left and upper right sides of the projector body (13). A first internal circulation radiator (3) and a second internal circulation radiator (4) are respectively installed at the upper end of the first internal circulation fan (1) and the lower right side of the second internal circulation fan (2). A first external circulation fan (5) is installed on the left side of the first internal circulation fan (1). A second external circulation fan (6) is installed at the upper end of the second internal circulation fan (2). A TEC cooling chip (7) is installed on one side of the second internal circulation radiator (4), and a TEC radiator (8) is installed on the lower right side of the TEC cooling chip (7). A third external circulation fan (9) is connected to the lower end of the TEC radiator (8). A display unit (10) is installed in the middle of the projector body (13), and an NTC temperature sensor (11) is installed on one side of the display unit (10).

2. A projector using a TEC cooling chip for heat dissipation according to claim 1, characterized in that: The TEC radiator (8) is made of stacked fins.

3. A projector using a TEC cooling chip for heat dissipation according to claim 1, characterized in that: The TEC radiator (8) consists of multiple thermoelectric modules.

4. A projector using a TEC cooling chip for heat dissipation according to claim 1, characterized in that: The TEC cooling chip (7) is a semiconductor electronic device.

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