A temperature control device for semiconductor production capable of rapid cooling

Abstract

The utility model discloses a temperature control equipment for semiconductor production of quick cooling, including work cavity and refrigeration plant, the work cavity upper wall fixedly connected with the baffle. The utility model discloses, when needing to carry out quick cooling, second air cylinder starts to open the apron, and simultaneously first air cylinder drives the heat exchange coil pipe to enter the inside of work cavity, and the refrigerant of refrigeration plant flows through the heat exchange coil pipe, and the heat of the inside of work cavity is taken away quickly, and the heat exchange area is increased significantly in combination with the original heat exchange structure in the inside of work cavity, thereby realizes the purpose of quick cooling.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a temperature control device for semiconductor manufacturing that can rapidly cool down the temperature. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. During the semiconductor equipment manufacturing process, temperature control equipment is required to regulate the equipment's temperature and ensure the quality of semiconductor production.

[0003] Existing technology discloses a temperature control device for semiconductor manufacturing, including a temperature control chamber and a cold water tank. The temperature control chamber has an opening at the top and lifting components on both sides, with a lid connecting the two lifting components. The advantage of this disclosed technology compared to existing technologies is that it solves the problem that current temperature control devices for semiconductor production rely solely on refrigeration systems to cool the load equipment, failing to achieve ideal temperature control. However, this type of temperature control device directly uses circulating water and airflow for cooling. The use of circulating water can cause the temperature to rise, thus reducing the cooling effect on the production equipment. Furthermore, the ventilation inside the device is poor, hindering rapid heating and cooling, thus reducing the practicality of the temperature control device.

[0004] To address this, a publicly available technology proposes a temperature control device for semiconductor manufacturing to prevent high-temperature damage. This device includes a housing, a cooling water tank located on one side of the top of the housing, and air inlets located in the middle of both sides of the housing. The housing includes mounting ports at the middle of both ends, with sealed doors on both sides inside each mounting port. A semiconductor cooler is located in the middle of the top of the cooling water tank, and a rotating motor is installed in the middle of the bottom. This improved technology cools the cooling water inside the cooling water tank using a semiconductor cooler and thermally conductive copper sheets. Simultaneously, the rotating motor drives a stirring frame via a shaft, thereby improving the cooling efficiency of the cooling water inside the tank. A water pump delivers the cooling water to the water supply pipe, enabling its recycling. Continuous cooling of the cooling water further enhances the cooling effect of the temperature control device.

[0005] However, for cooling operations within the working chamber of semiconductor manufacturing equipment, simply improving the cooling efficiency of the refrigerant is insufficient to achieve rapid cooling. Therefore, to further improve cooling efficiency, it is necessary to upgrade existing temperature control equipment used in semiconductor manufacturing. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a temperature control device for semiconductor manufacturing that can rapidly cool down the material.

[0007] To achieve the above objectives, this utility model adopts the following technical solution: a temperature control device for semiconductor production capable of rapid cooling, comprising a working chamber and a cooling device. A partition is fixedly connected to the upper wall of the working chamber, and an equipment box is fixedly connected to the upper wall of the partition. A connecting box is fixedly connected to the front wall of the partition. Three sets of recesses are provided on the lower wall of the partition. Each set of recesses has a mating hole on its inner upper wall that communicates with the upper wall of the partition. A cover plate is rotatably connected between the inner front wall and inner rear wall of the recesses via a rotating shaft, the front end of which penetrates the partition. The front wall extends into the connection box, which is equipped with a second drive structure for driving the rotating shaft to rotate and thus driving the cover plate to rotate. The inner side wall of the equipment box is slidably connected to a lifting plate. The upper wall of the equipment box is equipped with a first drive structure for driving the lifting plate to move up and down. The lower wall of the lifting plate is arranged in a left-right distribution and is fixedly connected with three sets of mounting frames. The three sets of mounting frames correspond vertically to a set of mating holes. A heat exchange coil for improving the cooling rate inside the working chamber is fixedly connected between the front wall and the rear wall of the inner side wall of the mounting frame.

[0008] As a further description of the above technical solution:

[0009] Three sets of refrigerant inlet pipes are fixedly connected to the top of the equipment box near the front wall, arranged in a left-right pattern. Three sets of refrigerant recovery pipes are also fixedly connected to the top of the equipment box near the rear wall, arranged in a left-right pattern. The ends of the refrigerant inlet pipes and refrigerant recovery pipes facing the equipment box penetrate the upper wall of the equipment box and extend into the interior of the equipment box. The front wall of the mounting frame is provided with a first connector that communicates with the front end of the heat exchange coil, and the rear wall of the mounting frame is provided with a second connector that communicates with the rear end of the heat exchange coil. The ends of the refrigerant inlet pipes and refrigerant recovery pipes that extend into the equipment box are respectively connected to the first connector and the second connector through a set of flexible spring hoses. The ends of the refrigerant inlet pipes and refrigerant recovery pipes away from the equipment box are connected to the refrigeration equipment.

[0010] As a further description of the above technical solution:

[0011] The rotating shaft is located near the left wall of the cover plate, and when the upper wall of the cover plate abuts against the upper inner wall of the settling tank, it completely covers the lower opening of the mating hole.

[0012] As a further description of the above technical solution:

[0013] The first drive structure includes a first cylinder and two sets of guide rods. Both sets of guide rods are fixedly connected to the upper wall of the lifting plate. The ends of the two sets of guide rods away from the lifting plate pass through the upper wall of the equipment box and are slidably connected thereto. The first cylinder is fixedly connected to the upper wall of the equipment box and is located between the two sets of guide rods. The end of the first cylinder's protruding shaft passes through the upper wall of the equipment box and is fixedly connected to the upper wall of the lifting plate.

[0014] As a further description of the above technical solution:

[0015] The second drive structure includes a second cylinder, a slide bar, and a gear. The second cylinder is fixedly connected to the left wall of the connecting box. The end of the second cylinder's extension shaft passes through the left wall of the connecting box and extends into the interior of the connecting box. The slide bar is slidably connected to the upper inner wall of the connecting box via a sliding seat. One end of the second cylinder's extension shaft extending into the connecting box is fixedly connected to the left end of the slide bar. The gear is fixedly connected to the outer wall of the end of the shaft extending into the connecting box. The lower wall of the slide bar is provided with planar teeth that mesh with the outer wall of the gear.

[0016] As a further description of the above technical solution:

[0017] The equipment box has three sets of exhaust windows on its rear wall, and each set of exhaust windows has an exhaust fan on its front wall.

[0018] As a further description of the above technical solution:

[0019] An air inlet mesh is provided on the front wall of the equipment box.

[0020] This utility model has the following beneficial effects:

[0021] Compared to existing technologies, this rapid-cooling temperature control equipment for semiconductor manufacturing activates a second cylinder to open the cover when rapid cooling is required, while the first cylinder simultaneously drives the heat exchange coil into the working chamber. The refrigerant generated by the cooling equipment flows through the heat exchange coil, quickly carrying away heat from the working chamber. Combined with the existing heat exchange structure within the working chamber, this significantly increases the heat exchange area, thereby achieving rapid cooling. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a temperature control device for semiconductor manufacturing that can rapidly cool down, as proposed in this utility model.

[0023] Figure 2 This is a partial cross-sectional schematic diagram of the connection structure of the equipment box and lifting plate of a temperature control device for semiconductor production that can quickly cool down, as proposed in this utility model.

[0024] Figure 3 The side view shows the lifting plate, mounting frame, and heat exchange coil connection structure of a temperature control device for semiconductor manufacturing that can quickly cool down according to this utility model.

[0025] Figure 4 This is a partial sectional view of the side of the partition and connecting box connection structure of a temperature control device for semiconductor manufacturing that can rapidly cool down, as proposed in this utility model.

[0026] Figure 5This utility model proposes a temperature control device for semiconductor manufacturing that can rapidly cool down the material. Figure 4 A magnified view of a section at point A in the middle;

[0027] Figure 6 This is a top view of the partition of a temperature control device for semiconductor manufacturing that can rapidly cool down, as proposed in this utility model.

[0028] Figure 7 This is a schematic diagram of the cover plate and connecting shaft connection structure of a temperature control device for semiconductor manufacturing that can rapidly cool down, as proposed in this utility model.

[0029] Legend:

[0030] 1. Working chamber; 2. Equipment box; 3. Partition; 301. Mating hole; 302. Settling tank; 4. Connecting box; 5. First cylinder; 6. Guide rod; 7. Second cylinder; 8. Air inlet screen; 9. Refrigerant inlet pipe; 10. Refrigerant recovery pipe; 11. Lifting plate; 12. Mounting frame; 13. First connector; 14. Second connector; 15. Heat exchange coil; 16. Exhaust window; 17. Exhaust fan; 18. Cover plate; 19. Rotating shaft; 20. Gear; 21. Sliding seat; 22. Sliding bar. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1 to 7 The present invention provides a temperature control device for semiconductor production that can quickly cool down: including a working chamber 1 and a cooling device, a partition 3 is fixedly connected to the upper wall of the working chamber 1, an equipment box 2 is fixedly connected to the upper wall of the partition 3, and a connection box 4 is fixedly connected to the front wall of the partition 3.

[0033] To separate the working chamber 1 and the equipment box 2 when rapid cooling is not required, the lower wall of the partition 3 is provided with three sets of recesses 302. Each set of recesses 302 has a mating hole 301 on its inner upper wall that communicates with the upper wall of the partition 3. A cover plate 18 is rotatably connected between the inner front wall and inner rear wall of the recesses 302 via a rotating shaft 19. The front end of the rotating shaft 19 passes through the front wall of the partition 3 and extends into the connecting box 4. The connecting box 4 is provided with a second driving structure for driving the rotating shaft 19 to rotate and thus rotating the cover plate 18. The second driving structure includes a second cylinder 7, a slide bar 22, and a gear 20. The second cylinder 7 is fixedly connected to the left wall of the connecting box 4. The end of the extended shaft of the second cylinder 7 passes through the left wall of the connecting box 4 and extends into the connecting box 4. The slide bar 22 is slidably connected to the inner upper wall of the connecting box 4 via a sliding seat 21. One end of the extension shaft extends into the connection box 4 and is fixedly connected to the left end of the slide bar 22. The gear 20 is fixedly connected to the outer wall of the end of the rotating shaft 19 that extends into the connection box 4. The lower wall of the slide bar 22 is provided with planar teeth that mesh with the outer wall of the gear 20. The rotating shaft 19 is located near the left wall of the cover plate 18. When the upper wall of the cover plate 18 abuts against the inner upper wall of the sink 302, it completely covers the lower opening of the mating hole 301. The extension and retraction of the extension shaft of the second cylinder 7 can drive the slide bar 22 to move left and right. Then, through the meshing of the planar teeth with the gear 20, the rotating shaft 19 is driven to rotate. When the rotating shaft 19 rotates, it drives the cover plate 18 to flip. When the cover plate 18 flips to be perpendicular to the partition plate 3, the mounting frame 12 can enter the working chamber 1 from the mating hole 301. After the cover plate 18 covers the mating hole 301, it can separate the working chamber 1 and the equipment box 2.

[0034] To drive the installation frame 12 and heat exchange coil 15 to rise and fall, a lifting plate 11 is slidably connected to the inner wall of the equipment box 2. The upper wall of the equipment box 2 is provided with a first driving structure for driving the lifting plate 11 to rise and fall. The first driving structure includes a first cylinder 5 and two sets of guide rods 6. Both sets of guide rods 6 are fixedly connected to the upper wall of the lifting plate 11. The ends of the two sets of guide rods 6 away from the lifting plate 11 pass through the upper wall of the equipment box 2 and are slidably connected to it. The first cylinder 5 is fixedly connected to the upper wall of the equipment box 2 and is located between the two sets of guide rods 6. The end of the extension shaft of the first cylinder 5 passes through the upper wall of the equipment box 2 and is fixedly connected to the upper wall of the lifting plate 11. The extension and retraction of the extension shaft of the first cylinder 5 can drive the lifting plate 11 to fall and rise, thereby driving the lifting plate 11 and the installation frame 12 to move. When the installation frame 12 retracts into the equipment box 2, it does not affect the processing and production operations inside the working chamber 1.

[0035] To increase the heat exchange area inside the working chamber 1, three sets of mounting frames 12 are fixedly connected to the lower wall of the lifting plate 11 in a left-right arrangement. The three sets of mounting frames 12 correspond vertically to the positions of a set of mating holes 301. A heat exchange coil 15 for improving the cooling rate inside the working chamber 1 is fixedly connected between the inner front wall and the inner rear wall of the mounting frame 12. Three sets of refrigerant inlet pipes 9 are fixedly connected to the top of the equipment box 2 in a left-right arrangement near the front wall. Three sets of refrigerant recovery pipes 10 are fixedly connected to the top of the equipment box 2 in a left-right arrangement near the rear wall. The ends of the refrigerant inlet pipes 9 and the refrigerant recovery pipes 10 facing the equipment box 2 both penetrate the top of the equipment box 2. The walls extend into the equipment box 2. The front wall of the mounting frame 12 is provided with a first connector 13 that communicates with the front end of the heat exchange coil 15, and the rear wall of the mounting frame 12 is provided with a second connector 14 that communicates with the rear end of the heat exchange coil 15. The ends of the refrigerant inlet pipe 9 and the refrigerant recovery pipe 10 that extend into the equipment box 2 are respectively connected to the first connector 13 and the second connector 14 through a set of spring hoses. The ends of the refrigerant inlet pipe 9 and the refrigerant recovery pipe 10 that are away from the equipment box 2 are connected to the refrigeration equipment. When the original heat exchange structure cannot be used to lay new pipes, the heat exchange area can be increased by adding a new heat exchange coil 15 externally. When rapid cooling is required, the cooling speed can be effectively improved.

[0036] In order to cool down the heat exchange coil 15 after heat exchange and reduce the pressure on the refrigeration equipment, three sets of exhaust windows 16 are provided on the rear wall of the equipment box 2. Each set of exhaust windows 16 is equipped with an exhaust fan 17 on the front wall. An air inlet screen 8 is provided on the front wall of the equipment box 2. After the heat exchange coil 15 participates in heat exchange, it can be cooled by air through the exhaust fan 17.

[0037] Working principle: The extension and retraction of the second cylinder 7's extension shaft can drive the slide bar 22 to move left and right, thereby driving the rotating shaft 19 to rotate through the meshing of the planar teeth and gear 20. When the rotating shaft 19 rotates, it drives the cover plate 18 to flip. When the cover plate 18 flips to be perpendicular to the partition plate 3, the mounting frame 12 can enter the working chamber 1 through the mating hole 301. After the cover plate 18 covers the mating hole 301, it can separate the working chamber 1 and the equipment box 2. The extension and retraction of the first cylinder 5's extension shaft can drive the lifting plate 11 to descend and rise, thereby driving the lifting plate 11 and the mounting frame 12 to move. When the mounting frame 12 retracts into the equipment box 2, it does not affect the processing and production operations inside the working chamber 1. When the original heat exchange structure cannot be used to lay new pipes, the heat exchange area can be increased by adding a new heat exchange coil 15 externally. When rapid cooling is required, it can effectively improve the cooling speed. After the heat exchange coil 15 participates in heat exchange, it can be cooled by air cooling through the exhaust fan 17.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature control device for semiconductor manufacturing capable of rapid cooling, characterized in that: The device includes a working chamber (1) and a refrigeration device. A partition (3) is fixedly connected to the upper wall of the working chamber (1). An equipment box (2) is fixedly connected to the upper wall of the partition (3). A connecting box (4) is fixedly connected to the front wall of the partition (3). Three sets of sinks (302) are provided on the lower wall of the partition (3). Each set of sinks (302) has a mating hole (301) on the inner upper wall that communicates with the upper wall of the partition (3). A cover plate (18) is rotatably connected between the inner front wall and the inner rear wall of the sink (302) through a rotating shaft (19). The front end of the rotating shaft (19) passes through the front wall of the partition (3) and extends into the connecting box (4). The receiving box (4) is provided with a second driving structure for driving the rotating shaft (19) to rotate and drive the cover plate (18) to rotate. The inner wall of the equipment box (2) is slidably connected with a lifting plate (11). The upper wall of the equipment box (2) is provided with a first driving structure for driving the lifting plate (11) to rise and fall. The lower wall of the lifting plate (11) is arranged in a left-right distribution and is fixedly connected with three sets of mounting frames (12). The three sets of mounting frames (12) are respectively vertically corresponding to a set of mating holes (301). The front wall and the rear wall of the inner side of the mounting frame (12) are fixedly connected with a heat exchange coil (15) for improving the cooling rate inside the working chamber (1).

2. The temperature control equipment for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: Three sets of refrigerant inlet pipes (9) are fixedly connected to the top of the equipment box (2) and near the front wall in a left-right arrangement. Three sets of refrigerant recovery pipes (10) are fixedly connected to the top of the equipment box (2) and near the rear wall in a left-right arrangement. The ends of the refrigerant inlet pipes (9) and refrigerant recovery pipes (10) facing the equipment box (2) both penetrate the upper wall of the equipment box (2) and extend into the interior of the equipment box (2). The front wall of the mounting frame (12) is provided with a first connector (13) that communicates with the front end of the heat exchange coil (15). The rear wall of the mounting frame (12) is provided with a second connector (14) that communicates with the rear end of the heat exchange coil (15). The ends of the refrigerant inlet pipes (9) and refrigerant recovery pipes (10) that extend into the equipment box (2) are respectively connected to the first connector (13) and the second connector (14) through a set of spring hoses. The ends of the refrigerant inlet pipes (9) and refrigerant recovery pipes (10) that are away from the equipment box (2) are both connected to the refrigeration equipment.

3. The temperature control equipment for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: The rotating shaft (19) is located near the left wall of the cover plate (18). When the upper wall of the cover plate (18) abuts against the inner upper wall of the sink (302), it completely covers the lower opening of the mating hole (301).

4. The temperature control equipment for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: The first drive structure includes a first cylinder (5) and two sets of guide rods (6). Both sets of guide rods (6) are fixedly connected to the upper wall of the lifting plate (11). The ends of the two sets of guide rods (6) away from the lifting plate (11) pass through the upper wall of the equipment box (2) and are slidably connected thereto. The first cylinder (5) is fixedly connected to the upper wall of the equipment box (2) and located between the two sets of guide rods (6). The end of the first cylinder (5) extends through the upper wall of the equipment box (2) and is fixedly connected to the upper wall of the lifting plate (11).

5. A temperature control device for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: The second drive structure includes a second cylinder (7), a slide bar (22), and a gear (20). The second cylinder (7) is fixedly connected to the left wall of the connecting box (4). The end of the extension shaft of the second cylinder (7) passes through the left wall of the connecting box (4) and extends into the interior of the connecting box (4). The slide bar (22) is slidably connected to the upper inner wall of the connecting box (4) through a sliding seat (21). One end of the extension shaft of the second cylinder (7) extending into the interior of the connecting box (4) is fixedly connected to the left end of the slide bar (22). The gear (20) is fixedly connected to the outer wall of one end of the rotating shaft (19) extending into the interior of the connecting box (4). The lower wall of the slide bar (22) is provided with planar teeth that mesh with the outer wall of the gear (20).

6. The temperature control device for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: The equipment box (2) has three sets of exhaust windows (16) on the rear wall, and each set of exhaust windows (16) has an exhaust fan (17) on the front wall.

7. A temperature control device for semiconductor manufacturing capable of rapid cooling according to claim 1, characterized in that: An air inlet mesh (8) is provided on the front wall of the equipment box (2).

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