Buffer assembly and display module

Abstract

Embodiments of the present application provide a kind of buffer assembly and display module, it is related to display technical field, it is to solve the problem that display module is prone to produce mark when being pulled in related technology.The buffer assembly is used in display module, display module includes display panel and flexible circuit board, flexible circuit board is suitable for being fixed to buffer assembly and being electrically connected display panel;Wherein, buffer assembly includes buffer layer, buffer layer includes first buffer part and second buffer part being connected with each other, second buffer part is suitable for being fixed with flexible circuit board.The Young's modulus of first buffer part is less than the Young's modulus of second buffer part.Therefore when flexible circuit board is pulled by acting force, the acting force will be transmitted to second buffer part, second buffer part is not prone to deformation, so it can avoid the deformation of other film layers in display module to the part of second buffer part, to alleviate the problem that display module is pulled and leads to mark.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a buffer component and a display module. Background Technology

[0002] A display module typically includes a display panel, a buffer component, and a flexible circuit board, with the flexible circuit board fixed to one side of the buffer component. In related technologies, the buffer component usually consists of a single layer of foam to provide cushioning for the display panel.

[0003] When the "neck" of the flexible circuit board is short, it is easily stretched during the assembly of the display module, causing stress concentration between the flexible circuit board and the buffer component at the stretched area. Because the foam layer of the buffer component has a low modulus, it is prone to deformation under stress, leading to deformation of the various film layers in the display module. This deformation alters the light reflection path, ultimately forming visible macroscopic marks on the display panel surface, severely affecting the display effect and appearance quality of the display module. Utility Model Content

[0004] This application provides a buffer component and a display module to at least solve the problem in the related art that display modules are prone to leaving marks when the flexible circuit board is stretched.

[0005] On one hand, embodiments of this application provide a buffer assembly for a display module, the display module including a display panel and a flexible circuit board, the flexible circuit board being adapted to be fixed to the buffer assembly and electrically connected to the display panel; wherein, the buffer assembly includes a buffer layer, the buffer layer including a first buffer portion and a second buffer portion interconnected, the second buffer portion being adapted to be fixed to the flexible circuit board. Wherein, the Young's modulus of the first buffer portion is smaller than the Young's modulus of the second buffer portion.

[0006] In some embodiments, the first buffer portion includes a foam portion, and the second buffer portion includes a polyimide portion.

[0007] In some embodiments, the first buffer portion has an opening, and the second buffer portion is located within the opening.

[0008] In some embodiments, the buffer assembly further includes a heat dissipation layer located on one side of the buffer layer, and the flexible circuit board is adapted to be fixed to the second buffer portion through the heat dissipation layer.

[0009] In some embodiments, the buffer assembly further includes a textured adhesive layer located on one side of the buffer layer, and the display panel is adapted to be fixed to the textured adhesive layer.

[0010] On the other hand, this application also provides a display module, which includes a display panel, a flexible circuit board, and a buffer component as described in any of the above embodiments.

[0011] In some embodiments, the flexible circuit board includes a circuit board fixing part, a circuit board bending part, and a circuit board connecting part connected in sequence; wherein, the circuit board fixing part is fixed to the second buffer part, and the circuit board connecting part is electrically connected to the display panel.

[0012] In some embodiments, the circuit board fixing portion has a first edge connected to the second buffer portion and close to the side of the circuit board bending portion, wherein the second buffer portion covers the first edge in the thickness direction of the display module.

[0013] In some embodiments, the second buffer portion covers the circuit board fixing portion in the thickness direction of the display module.

[0014] In some embodiments, the buffer assembly further includes a heat dissipation layer located on one side of the buffer layer, and the circuit board fixing portion is fixed to the second buffer portion through the heat dissipation layer; wherein, the circuit board bending portion and the heat dissipation layer are spaced apart in the thickness direction of the display module so as to be suspended relative to the heat dissipation layer.

[0015] In some embodiments, the display panel includes a first panel body portion, a panel bending portion, and a second panel body portion connected in sequence, the first panel body portion and the second panel body portion being disposed opposite to each other in the thickness direction of the display module; the flexible circuit board is electrically connected to the second panel body portion; wherein, the buffer assembly is fixedly connected between the first panel body portion and the second panel body portion, and is also fixedly connected to the flexible circuit board.

[0016] In the buffer assembly provided in this application embodiment, when the flexible circuit board is subjected to a tensile force, the force is transmitted to the second buffer portion. Since the second buffer portion has a relatively large Young's modulus, it is less prone to deformation. This prevents deformation of other film layers in the display module at the locations directly opposite the second buffer portion, effectively mitigating the problem of marks on the display module caused by the flexible circuit board being stretched, thereby improving the display effect and appearance quality of the display module. Furthermore, since the buffer layer also includes a first buffer portion with a relatively small modulus, this effectively ensures the buffering function of the buffer layer while avoiding the problems of poor cutting and difficulty in edge gripping of the display module caused by the larger modulus of the first buffer portion. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a buffer component provided in some embodiments of this application;

[0019] Figure 2 This is a schematic diagram of the structure of a display module provided in some embodiments of this application;

[0020] Figure 3 This is a schematic diagram of the structure of a display module provided in some other embodiments of this application;

[0021] Figure 4 This is a schematic diagram of the structure of a buffer layer provided in some embodiments of this application. Detailed Implementation

[0022] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. The described technical solutions are for illustrative purposes only and should not be construed as limiting the scope of protection of this application.

[0023] In the description of this application, it should be understood that the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms "multiple" and similar words mean two or more, unless otherwise expressly defined.

[0024] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0025] The use of "applies to" or "configured to" in this application implies open and inclusive language, which does not exclude the applicability to or configuration to devices performing additional tasks or steps. Additionally, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0026] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application.

[0027] The various embodiments of this application are similar, and features from different embodiments and / or different examples can be combined with each other.

[0028] Some embodiments of this application provide a buffer component, such as Figure 1 and Figure 2 As shown, the buffer assembly 30 is used for the display module 100, which includes a display panel 10 and a flexible circuit board 40. The flexible circuit board 40 is adapted to be fixed to the buffer assembly 30 and electrically connected to the display panel 10.

[0029] The buffer assembly 30 includes a buffer layer 31, which comprises a first buffer portion 311 and a second buffer portion 312 connected to each other. The second buffer portion 312 is adapted to be fixed to the flexible circuit board 40. Furthermore, the Young's modulus of the first buffer portion 311 is smaller than that of the second buffer portion 312. That is, when the same force is applied to both the second buffer portion 312 and the first buffer portion 311, the second buffer portion 312, due to its relatively higher Young's modulus, is less prone to deformation than the first buffer portion 311.

[0030] It is worth noting that in this application, the connection between A and B can be a direct connection or an indirect connection via an intermediary. Similarly, the fixing between C and D can be a direct fixing or an indirect fixing via an intermediary.

[0031] For example, the second buffer part 312 can be fixed to the flexible circuit board 40 directly, or it can be fixed indirectly through an intermediate component.

[0032] In the buffer component 30 provided in this embodiment, when the flexible circuit board 40 is subjected to a tensile force, the force is transmitted to the second buffer portion 312. Since the second buffer portion 312 has a relatively large Young's modulus, it is less prone to deformation. This prevents deformation of other film layers in the display module 100 at the locations directly opposite the second buffer portion 312, effectively mitigating the problem of marks on the display module caused by the flexible circuit board 40 being stretched, thereby improving the display effect and appearance quality of the display module 100. Furthermore, since the buffer layer 31 also includes a first buffer portion 311 with a relatively small modulus, this effectively ensures the buffering function of the buffer layer 31, while also avoiding the problems of poor cutting and difficulty in edge gripping of the display module caused by the large modulus of the first buffer portion 311.

[0033] In some examples, the first buffer portion 311 includes a foam portion. For example, the first buffer portion 311 is made of foam material (such as acrylic foam or polypropylene foam). In this case, the first buffer portion 311 can provide good cushioning for the display panel 10 to avoid damage to the display panel 10 due to large forces during assembly or use. On the other hand, it can also ensure the smooth cutting of the first buffer portion 311 and the smooth progress of subsequent edge-gripping steps.

[0034] In some examples, the second buffer portion 312 includes a polyimide portion. For example, the second buffer portion 312 is made of polyimide material. This ensures that the second buffer portion 312 is not easily deformed under external force, thereby effectively preventing deformation of other film layers in the display module 100 at the locations facing the second buffer portion 312, and thus improving the display effect and appearance quality of the display module 100.

[0035] It is worth noting that the Young's modulus of the polyimide portion is typically between 2 GPa and 4 GPa, while the Young's modulus of the foam portion is typically between 10 MPa and 100 MPa. This ensures a relatively large difference in the Young's modulus between the two, thereby ensuring that the buffer layer 31 provides effective cushioning while also protecting the portions of other film layers in the display module 100 that are directly opposite the second buffer portion 312 from deformation.

[0036] In some embodiments, such as Figure 2 and Figure 3 As shown, the first buffer part 311 has an opening K, and the second buffer part 312 is located inside the opening K.

[0037] This design allows for the creation of the buffer layer 31 by cutting a portion of the buffer layer 31 to form a first buffer portion 311 with an opening K. Then, a second buffer portion 312 is filled into the opening K to complete the fabrication of the buffer layer 31. This effectively improves the fabrication efficiency of the buffer layer 31 while also reducing its manufacturing cost.

[0038] In some embodiments, please refer to Figure 2 The opening K is a through hole. In this case, along the thickness direction of the buffer layer 31, the two opposite surfaces of the second buffer portion 312 are flush with the two opposite surfaces of the first buffer portion 311.

[0039] Since the opening K is a through hole, the second buffer portion 312 does not come into contact with the first buffer portion 311 in the thickness direction of the buffer layer 31. This ensures that the buffer layer 31 can effectively resist the force transmitted by the flexible circuit board 40 in the area where the second buffer portion 312 is located, thereby effectively alleviating the problem of the display module having marks caused by the flexible circuit board 40 being stretched, so as to improve the display effect and appearance quality of the display module 100.

[0040] In other embodiments, please refer to Figure 3 The opening K is a blind hole, and the opening direction of the blind hole is towards the flexible circuit board 40.

[0041] In some examples, the surface of the second buffer portion 312 near the flexible circuit board 40 is flush with the surface of the first buffer portion 311 near the flexible circuit board 40.

[0042] Since the second buffer portion 312 and the first buffer portion 311 are flush with each other on the side near the flexible circuit board 40, this is beneficial for the fabrication of other film layers (such as heat dissipation layer 32) in the buffer assembly 30, while ensuring the surface flatness of the display module 100.

[0043] In some embodiments, please continue reading Figures 1 to 3 The buffer assembly 30 also includes a heat dissipation layer 32 located on one side of the buffer layer 31, and the flexible circuit board 40 is adapted to be fixed to the second buffer portion 312 through the heat dissipation layer 32. For example, the flexible circuit board 40 and the second buffer portion 312 are respectively fixed on both sides of the heat dissipation layer 32, thereby realizing the fixation between the flexible circuit board 40 and the second buffer portion 312.

[0044] The heat dissipation layer 32 can provide good heat dissipation conditions for the buffer component 30, thereby improving the heat dissipation performance of the display module 100.

[0045] In some examples, the material of the heat dissipation layer 32 may include at least one of aluminum, silver, nickel, and copper. For example, the heat dissipation layer 32 may be a copper layer.

[0046] In some embodiments, please continue reading Figures 1 to 3 The buffer assembly 30 also includes a textured adhesive layer 33 located on one side of the buffer layer 31, and the display panel 10 is adapted to be fixed to the textured adhesive layer 33. When the buffer assembly 30 includes a heat dissipation layer 32, the heat dissipation layer 32 and the textured adhesive layer 33 are disposed on opposite sides of the buffer layer 31.

[0047] In this embodiment, the textured adhesive layer 33 has an adhesive function to ensure that the display panel 10 and the buffer layer 31 can be firmly bonded together. In addition, the textured adhesive layer 33 can expel air during the bonding process between the display panel 10 and the buffer layer 31, avoiding air bubbles generated during the bonding process and ensuring bonding quality.

[0048] Based on the same inventive concept, some embodiments of this application provide a display module, such as... Figure 2 and Figure 3As shown, the display module 100 includes a display panel 10, a flexible circuit board 40, and a buffer assembly 30 as described in any of the above embodiments. The flexible circuit board 40 is fixed to the buffer assembly 30 and electrically connected to the display panel 10, allowing the display panel 10 to transmit signals via the flexible circuit board 40. The buffer assembly 30 includes a buffer layer 31, which comprises a first buffer portion 311 and a second buffer portion 312 connected to each other. The Young's modulus of the first buffer portion 311 is smaller than that of the second buffer portion 312, and the second buffer portion 312 is fixed to the flexible circuit board 40.

[0049] Since it includes the buffer component 30, the display module 100 has the technical effects of the buffer component 30 described above, which will not be repeated here.

[0050] In some embodiments, please continue reading Figure 2 and Figure 3 The flexible circuit board 40 includes a circuit board fixing part 41, a circuit board bending part 42 and a circuit board connecting part 43 connected in sequence; wherein, the circuit board fixing part 41 is fixed to the second buffer part 312, and the circuit board connecting part 43 is electrically connected to the display panel 10.

[0051] In this embodiment, the circuit board bending portion 42 is equivalent to the neck of a flexible circuit board in related technologies. It is easily stretched during the assembly of the display module 100, causing stress concentration between the flexible circuit board 40 and the buffer assembly 30 at the stretched portion. By fixing the circuit board fixing portion 41 to the second buffer portion 312 with a larger Young's modulus, deformation of other film layers in the display module 100 directly opposite the second buffer portion 312 can be avoided. This effectively alleviates the problem of marks on the display module caused by stretching of the flexible circuit board 40, thereby improving the display effect and appearance quality of the display module 100.

[0052] In some examples, the circuit board mounting portion 41 can be secured to the buffer assembly 30 with adhesive.

[0053] It is worth noting that the name "bent section 42" is only to distinguish it from other parts of the flexible circuit board 40, and does not indicate that the bent section 42 will ultimately be bent. Due to the inherent bendability of the flexible circuit board 40, the bent section 42 can be bent or straightened depending on the specific location of the circuit board fixing part 41 and the circuit board connecting part 43.

[0054] In some embodiments, please continue reading Figure 2 and Figure 3 The circuit board fixing part 41 has a first edge 411 connected to the second buffer part 312 and close to the circuit board bending part 42, wherein the second buffer part 312 covers the first edge 411 in the thickness direction of the display module 100.

[0055] Because the bent portion 42 of the circuit board is easily stretched during the assembly of the display module 100, and this stretching force tends to concentrate at the first edge 411 and affect other film layers in the display module 100 that are directly opposite the first edge 411, the second buffer portion 312 can cover the first edge 411 to alleviate the stress concentration at the first edge 411, thereby effectively preventing the flexible circuit board 40 from being stretched and causing marks on the display module.

[0056] In some examples, the second buffer portion 312 covers the circuit board fixing portion 41 in the thickness direction of the display module 100. In this case, the second buffer portion 312 covers the surface of the circuit board fixing portion 41 that contacts the buffer assembly 30.

[0057] Since the circuit board bending portion 42 is easily stretched during the assembly of the display module 100, causing stress concentration on the surface where the circuit board fixing portion 41 contacts the buffer component 30, this embodiment of the application covers the surface where the circuit board fixing portion 41 contacts the buffer component 30 with the second buffer portion 312. This ensures that the flexible circuit board 40 will not directly cause marks on the display module 100 when it is stretched.

[0058] In one implementation, the second buffer portion 312 overlaps with the orthographic projection of the circuit board fixing portion 41 onto the buffer layer 31. In this case, the shape and size of the horizontal cross-section of the second buffer portion 312 (the direction of which is perpendicular to the thickness direction of the display module 100) are the same as the shape and size of the horizontal cross-section of the circuit board fixing portion 41. This allows the second buffer portion 312 to provide good protection for the portions of other film layers in the display module 100 that face the circuit board fixing portion 41, thereby effectively preventing the flexible circuit board 40 from being stretched and causing marks on the display module 100.

[0059] As another implementation, the edge of the second buffer portion 312 surrounds the orthographic projection of the circuit board fixing portion 41 onto the buffer layer 31. In this case, the area of ​​the horizontal cross-section of the second buffer portion 312 is larger than the area of ​​the horizontal cross-section of the circuit board fixing portion 41. This allows the second buffer portion 312 to have a relatively large coverage area, providing good protection for the portions of other film layers in the display module 100 that are directly opposite the second buffer portion 312, thereby effectively preventing the flexible circuit board 40 from being stretched and causing marks on the display module 100.

[0060] It is worth noting that when the edge of the second buffer portion 312 surrounds the orthographic projection of the circuit board fixing portion 41 on the buffer layer 31, the edge of the second buffer portion 312 may or may not overlap with the edge of the orthographic projection of the circuit board fixing portion 41 on the buffer layer 31.

[0061] Furthermore, the shape and size of the horizontal cross-section of the second buffer portion 312 can be adjusted according to the shape and size of the horizontal cross-section of the circuit board fixing portion 41.

[0062] In some examples, such as Figure 4 As shown, the shape of the horizontal cross-section of the second buffer portion 312 can be rectangular, rounded rectangle, or other regular shapes. In this case, the opening of the first buffer portion corresponding to the second buffer portion 312 is also a regular shape, which is beneficial for making openings in the buffer layer 31 and for manufacturing the second buffer portion 312.

[0063] In some embodiments, please continue reading Figure 2 and Figure 3 The buffer assembly 30 also includes a heat dissipation layer 32 located on one side of the buffer layer 31, and the circuit board fixing part 41 is fixed to the second buffer part 312 through the heat dissipation layer 32. The circuit board bending part 42 and the heat dissipation layer 32 are spaced apart in the thickness direction of the display module 100 so as to be suspended relative to the heat dissipation layer 32.

[0064] In some embodiments, the display panel 10 includes a first panel body portion 11, a panel bending portion 12, and a second panel body portion 13 connected in sequence, with the first panel body portion 11 and the second panel body portion 13 disposed opposite to each other in the thickness direction of the display module 100.

[0065] The flexible circuit board 40 is electrically connected to the second panel body 13. The buffer assembly 30 is fixedly connected between the first panel body 11 and the second panel body 13, and is also fixedly connected to the flexible circuit board 40.

[0066] In some examples, the first panel body 11 has a first back plate 21 near the buffer assembly 30, which provides effective support for the first panel body 11. Furthermore, the second panel body 13 has a second back plate 22 near the buffer assembly 30, which provides effective support for the second panel body 13. The materials of the first back plate 21 and the second back plate 22 may include polyethylene terephthalate (PET).

[0067] As an example, the second back panel 22 can be bonded to the second panel body 13 using spacer pads. This allows the second back panel 22 and the spacer pads to provide stable support for the second panel body 13.

[0068] In some embodiments, a protective adhesive layer 50 is provided on the display panel 10, and the protective adhesive layer 50 at least covers the panel bending portion 12. The protective adhesive layer 50 can buffer stress during the bending process of the panel bending portion 12, reducing problems such as material fatigue caused by stress concentration. The protective adhesive layer 50 can be made of photosensitive adhesive.

[0069] The side of the first panel body 11 facing away from the first back plate 21 serves as the light-emitting side of the display panel 10. The display module 100 may also include a polarizer 60 and a cover plate 70 located on the light-emitting side of the first panel body 11, and the polarizer 60 and the cover plate 70 may be bonded together by an optical adhesive layer 61.

[0070] Based on the same inventive concept, some embodiments of this application also provide a display device, which includes a display module 100 as described in any of the above embodiments.

[0071] Since it includes the display module 100, the display device has the technical effects of the display module 100 described above, which will not be repeated here.

[0072] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A buffer component, characterized in that, A display module is used, the display module including a display panel and a flexible circuit board, the flexible circuit board being adapted to be fixed to the buffer assembly and electrically connected to the display panel; wherein, the buffer assembly includes: The buffer layer includes a first buffer portion and a second buffer portion connected to each other, the second buffer portion being adapted to be fixed to the flexible circuit board; The Young's modulus of the first buffer section is smaller than that of the second buffer section.

2. The buffer assembly according to claim 1, characterized in that, The first buffer portion includes a foam portion, and the second buffer portion includes a polyimide portion.

3. The buffer assembly according to claim 1, characterized in that, The first buffer portion has an opening, and the second buffer portion is located inside the opening.

4. The buffer assembly according to any one of claims 1-3, characterized in that, The buffer assembly further includes a heat dissipation layer located on one side of the buffer layer, and the flexible circuit board is adapted to be fixed to the second buffer portion via the heat dissipation layer; and / or The buffer assembly further includes a textured adhesive layer located on one side of the buffer layer, and the display panel is adapted to be fixed to the textured adhesive layer.

5. A display module, characterized in that, include: The display panel, the flexible circuit board, and the buffer assembly according to any one of claims 1-4.

6. The display module according to claim 5, characterized in that, The flexible circuit board includes a circuit board fixing part, a circuit board bending part, and a circuit board connecting part connected in sequence; wherein, the circuit board fixing part is fixed to the second buffer part, and the circuit board connecting part is electrically connected to the display panel.

7. The display module according to claim 6, characterized in that, The circuit board fixing part has a first edge connected to the second buffer part and close to the circuit board bending part, wherein the second buffer part covers the first edge in the thickness direction of the display module.

8. The display module according to claim 7, characterized in that, The second buffer portion covers the circuit board fixing portion in the thickness direction of the display module.

9. The display module according to claim 6, characterized in that, The buffer assembly further includes a heat dissipation layer located on one side of the buffer layer, and the circuit board fixing part is fixed to the second buffer part through the heat dissipation layer; wherein, the circuit board bending part and the heat dissipation layer are spaced apart in the thickness direction of the display module so as to be suspended relative to the heat dissipation layer.

10. The display module according to any one of claims 5-9, characterized in that, The display panel includes a first panel body, a panel bending portion, and a second panel body connected in sequence. The first panel body and the second panel body are arranged opposite to each other in the thickness direction of the display module. The flexible circuit board is electrically connected to the second panel body. The buffer assembly is fixedly connected between the first panel body and the second panel body, and is also fixedly connected to the flexible circuit board.

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