LED display screen capable of effectively improving IC security and reliability

Abstract

This invention provides an LED display screen and its manufacturing method that can effectively improve the safety and reliability of ICs. The display screen includes a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer. The light-emitting layer is connected to the printed circuit of the conductive layer by soldering, and the light-emitting layer is an LED light-emitting unit. It also includes several IC modules linearly soldered to the outer edge of the conductive layer for controlling the light-emitting state of the LED light-emitting units. Furthermore, it includes a main control circuit board disposed at one end of the substrate layer. The main control circuit board includes a main control chip, a communication module, and a power supply module. A UV adhesive layer is also coated on the IC modules for reinforcement and protection. In practical applications, the UV adhesive layer on the outside of the IC modules can provide good fixation and protection, especially when the flexible screen is bent, preventing damage to the IC modules.

Description

[Technical Field]

[0001] This utility model relates to the technical field of LED flexible display products, and in particular to an LED display with a reasonable structural design and outstanding application effect that can effectively improve the safety and reliability of ICs, as well as a manufacturing method. [Background Technology]

[0002] With the continuous development and progress of technology, flexible displays, LED soft screens and other products are gradually entering people's daily lives. Combined with communication and interconnection with smart terminals such as mobile phones, they can efficiently display and adjust the content displayed on the screen, bringing great enjoyment to actual use.

[0003] However, existing LED flexible screens still have many problems in terms of structure, especially for flexible display products with relatively large length dimensions. During the rolling and folding process, the rigid reinforcing steel sheet is prone to cutting the circuit board, causing short circuits and affecting the normal use and display of the product.

[0004] For example, the utility model patent with application number CN201910253372.8 and patent title "A Flexible Display Module and Flexible Display Terminal" specifically discloses a flexible display module and a flexible display terminal. Addressing the problem in existing foldable screen solutions where creases easily form during folding, leading to screen damage, this utility model provides a flexible display module comprising: a flexible display screen and connecting hinges; when the flexible display screen begins to fold, the connecting hinges fold together, and the inner arc length of the hinges remains unchanged; when the flexible display screen is fully unfolded, the connecting hinges interlock to keep the folded screen in the unfolded state. By maintaining the inner arc length of the connecting hinges during the folding process of the flexible display screen, the flexible display screen forms an arc shape during folding, without compressing the length of the flexible display screen and avoiding damage. Simultaneously, the connecting hinges interlock to keep the screen in the unfolded state when fully unfolded, thus limiting and fixing the flexible display screen.

[0005] For example, utility model patent application number CN202211238302.3, entitled "A Dedicated Hardware Circuit Board for LED Flexible Screens and Its Design Method," specifically discloses a dedicated hardware circuit board for LED flexible screens and its design method. This relates to the field of flexible circuit board technology, and includes a top circuit layer, an intermediate substrate layer, and a bottom circuit layer. The top circuit layer, intermediate substrate layer, and bottom circuit layer are soldered sequentially from top to bottom. The design method includes the following specific steps: S1, trace design; S2, pad design; S3, via design; S4, device layout; S5, reinforcement hole drilling; S6, device orientation. This dedicated hardware circuit board for LED flexible screens and its design method improve the quality of flexible screens by optimizing pads, vias, trace orientation, device layout, and adding reinforcement, thereby improving the quality of the circuit board, making defective products controllable, increasing production efficiency, and streamlining the production process. By improving the quality of the circuit board from the source, defective products during the production process can be reduced, as can after-sales costs after shipment.

[0006] The specific implementation method

[0052] mentions that "the steel sheet reinforcement 34 is made by applying glue and pressing at high temperature, and several ventilation holes 33 are added. Due to the presence of the steel sheet reinforcement 34, the degree of bending will be greatly reduced, thereby reducing the probability of circuit breakage." However, as can be seen from the attached drawings, due to the presence of the steel sheet reinforcement 34, the two ends of the reinforcement sheet are also prone to damage to the circuit board when actually bent, resulting in poor safety.

[0007] The technical contents disclosed in the above-mentioned prior art have problems such as "easy to produce creases, easy to cause damage to the display screen, and damage to the IC". Based on this, it is necessary to improve and refine the display screen structure and manufacturing method to solve the corresponding technical problems. [Utility Model Content]

[0008] The problem with the prior art that this application addresses is:

[0009] Existing LED flexible screens still have many structural problems, especially for flexible display products with relatively large lengths. During the rolling and folding process, the rigid reinforcing sheet is prone to cutting the circuit board, causing short circuits and affecting the normal use and display of the product.

[0010] The solution to the technical problem of this utility model is:

[0011] An LED display screen that can effectively improve the safety and reliability of ICs is provided, including a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer; the light-emitting layer is connected to the printed circuit of the conductive layer by soldering, and the light-emitting layer is an LED light-emitting unit; the substrate layer is a PI material layer;

[0012] It also includes several IC modules linearly soldered to the outer edge of the conductive layer, used to control the light emission state of the LED light-emitting unit;

[0013] It also includes a main control circuit board disposed at one end of the base layer; the main control circuit board includes a main control chip, a communication module and a power module;

[0014] The IC module is also coated with a UV adhesive layer for reinforcement and protection.

[0015] Preferably, the LED display screen that can effectively improve the safety and reliability of IC further includes a positive electrode copper strip and a negative electrode copper strip for supplementing power;

[0016] The positive electrode charging copper strip and the negative electrode charging copper strip are arranged in a whole strip structure on the substrate layer, and their length matches the size of the substrate layer. Alternatively, the positive electrode charging copper strip and the negative electrode charging copper strip are arranged in several independent strip structures with uniform spacing, and are electrically connected to the main control circuit board through a circuit.

[0017] The positive electrode charging copper strip and the negative electrode charging copper strip are located at the outer edge of the front or back of the substrate layer;

[0018] It also includes a power supply connector that is connected to the main control circuit board.

[0019] Preferably, the base layer includes a first substrate layer, a second substrate layer, and a PP material layer for connecting the first substrate layer and the second substrate layer, to meet the requirements for large-angle bending;

[0020] The first substrate layer and the second substrate layer are a polyimide material layer and a copper foil layer, respectively.

[0021] Preferably, welding trays for welding are provided around the LED display screen; multiple LED display screens are welded together through the welding trays.

[0022] The positive electrode copper strip and the negative electrode copper strip are arranged in a strip-shaped structure that matches the overall length of the multiple LED displays, or the positive electrode copper strip and the negative electrode copper strip are arranged in several independent strip-shaped structures with uniform spacing. Through electrical conduction, the conductive connection between adjacent positive electrode copper strips and negative electrode copper strips is achieved.

[0023] Preferably, the positive electrode charging copper strip and the negative electrode charging copper strip are connected to the substrate layer by welding or adhesive layer; the substrate layer is provided with a plurality of first welding points, and the positive electrode charging copper strip and the negative electrode charging copper strip are provided with second welding points corresponding to each of the first welding points.

[0024] Preferably, the positive electrode charging copper strip and the negative electrode charging copper strip are located at the upper and lower edges of the front side of the substrate layer; and an ink layer with a shielding and covering function is provided on the upper part of the positive electrode charging copper strip and the negative electrode charging copper strip.

[0025] Preferably, the conductive layer includes a first circuit layer and a second circuit layer; the LED light-emitting unit includes red LED flip-chip, green LED flip-chip, and blue LED flip-chip; the first circuit layer and the second circuit layer are flexible high-precision circuit boards, and both the first circuit layer and the second circuit layer are provided with multiple lines; the first circuit layer and the second circuit layer are connected by a via structure.

[0026] Preferably, the LED display screen that can effectively improve the security and reliability of IC further includes a substrate support strip attached to the substrate layer; the substrate support strip is a long strip-shaped PI material structure or a steel sheet structure, and matches the length of the substrate layer; the substrate support strip is located near the outer edge of the substrate layer and is located on the front or back of the substrate layer; the substrate support strip is connected to the substrate layer through an adhesive layer, and the substrate support strip is symmetrically arranged on both sides of the substrate layer.

[0027] Preferably, the base support strip has a support through hole for avoiding the IC module portion; the diameter of the support through hole is larger than the size of the IC module;

[0028] The base support strip is located outside the positive electrode charging copper strip and the negative electrode charging copper strip, covering the positive electrode charging copper strip and the negative electrode charging copper strip; an insulating layer is provided between the base support strip and the positive electrode charging copper strip and the negative electrode charging copper strip.

[0029] A method for manufacturing an LED display screen that can effectively improve the security and reliability of ICs includes the following steps:

[0030] S1: FPC is used as the basic material for the main body of the display screen, and the LED beads, display screen MCU and IC module are mounted on the FPC circuit board using the surface mount technology.

[0031] S2: Apply UV adhesive to the outside of the IC module area and use light curing or heat curing to make the adhesive cure quickly;

[0032] S3: Apply a blackening treatment to the periphery or sides of the IC module and other components to form an ink layer;

[0033] S4: Weld multiple LED display units together using welding trays around the perimeter;

[0034] S5: Connect the positive electrode copper strip and the negative electrode copper strip to the LED display screen by welding or adhesive layer;

[0035] S6: Apply an AB adhesive layer to the front of the LED display screen and allow it to cure.

[0036] The technical effects achieved by this application in solving the technical problem are as follows:

[0037] Compared with existing technologies, this utility model provides an LED display screen that can effectively improve the safety and reliability of ICs. It simultaneously comprises a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer. The light-emitting layer is connected to the printed circuit of the conductive layer by soldering, and the light-emitting layer is an LED light-emitting unit. The substrate layer is a PI material layer. It also includes several IC modules linearly soldered to the outer edge of the conductive layer for controlling the light-emitting state of the LED light-emitting units. Furthermore, it includes a main control circuit board disposed at one end of the substrate layer. The main control circuit board includes a main control chip, a communication module, and a power module. A UV adhesive layer is also coated on the IC modules for reinforcement and protection. In practical applications, the UV adhesive layer on the outside of the IC modules provides good fixation and protection, especially when the flexible screen is bent, preventing damage to the IC modules. [Image Description]

[0038] Figure 1 This is a flowchart illustrating the manufacturing method of an LED display screen that can effectively improve the security and reliability of ICs, according to this utility model.

[0039] Figure 2 This is a schematic diagram of the layered structure of an LED display screen that can effectively improve the security and reliability of ICs according to this utility model. [Detailed Implementation]

[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0041] It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0042] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0043] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0046] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0047] Please see Figure 1 and Figure 2 This utility model discloses an LED display screen 1 that can effectively improve the security and reliability of ICs. It includes a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer. The light-emitting layer is connected to the printed circuit of the conductive layer by soldering. The light-emitting layer is an LED light-emitting unit. The substrate layer is a PI material layer.

[0048] It also includes several IC modules linearly soldered to the outer edge of the conductive layer, used to control the light emission state of the LED light-emitting unit;

[0049] It also includes a main control circuit board disposed at one end of the base layer; the main control circuit board includes a main control chip, a communication module and a power module; the communication module is a WiFi module, a Bluetooth module or a 2.4G communication module;

[0050] The IC module is also coated with a UV adhesive layer for reinforcement and protection.

[0051] This application simultaneously comprises a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer; the light-emitting layer is an LED light-emitting unit, which is soldered to the printed circuit of the conductive layer; the substrate layer is a PI material layer; it also includes several IC modules linearly soldered to the outer edge of the conductive layer for controlling the light-emitting state of the LED light-emitting units; it also includes a main control circuit board disposed at one end of the substrate layer; the main control circuit board includes a main control chip, a communication module, and a power module; the IC modules are also coated with a UV adhesive layer for reinforcement and protection. In practical applications, the UV adhesive layer on the outside of the IC module can provide good fixation and protection for the IC module, especially when the flexible screen is bent, to avoid damage to the IC module.

[0052] In some other embodiments, the LED display screen that can effectively improve the security and reliability of ICs also includes positive electrode copper strips and negative electrode copper strips for supplementing power.

[0053] The positive electrode charging copper strip and the negative electrode charging copper strip are arranged in a whole strip structure on the substrate layer, and their length matches the size of the substrate layer. Alternatively, the positive electrode charging copper strip and the negative electrode charging copper strip are arranged in several independent strip structures with uniform spacing, and are electrically connected to the main control circuit board through a circuit.

[0054] The positive electrode charging copper strip and the negative electrode charging copper strip are located at the outer edge of the front or back of the substrate layer;

[0055] It also includes a power supply connector that is connected to the main control circuit board.

[0056] Thanks to the addition of a copper power strip, the problem of insufficient power supply to the LED beads, which is caused by the excessive length of the flexible display screen, can be effectively solved, thus improving the stability of the product's operation.

[0057] If it is an independent strip structure, the circuit section needs to be electrically connected to the main control circuit board, and a thicker power supply line is used;

[0058] The base layer includes a first substrate layer, a second substrate layer, and a PP material layer for connecting the first substrate layer and the second substrate layer, which meets the requirements for large-angle bending.

[0059] The first substrate layer and the second substrate layer are a polyimide material layer and a copper foil layer, respectively.

[0060] The LED display screen is surrounded by welding trays for welding; multiple LED display screens are welded together through the welding trays.

[0061] The positive electrode copper strip and the negative electrode copper strip are arranged in a strip-shaped structure that matches the overall length of the multiple LED displays, or the positive electrode copper strip and the negative electrode copper strip are arranged in several independent strip-shaped structures with uniform spacing. Through electrical conduction, the conductive connection between adjacent positive electrode copper strips and negative electrode copper strips is achieved.

[0062] The positive electrode copper strip and the negative electrode copper strip are connected to the substrate layer by welding or adhesive layer; the substrate layer is provided with a plurality of first welding points, and the positive electrode copper strip and the negative electrode copper strip are provided with second welding points corresponding to each of the first welding points. In actual design, when the positions correspond, each welding point can simultaneously serve as a conductive connection with the conductive layer;

[0063] The positive electrode charging copper strip and the negative electrode charging copper strip are located at the upper and lower edges of the front side of the substrate layer; and an ink layer with a shielding and covering function is provided on the upper part of the positive electrode charging copper strip and the negative electrode charging copper strip.

[0064] The conductive layer includes a first circuit layer and a second circuit layer; the LED light-emitting unit includes red LED flip-chip, green LED flip-chip, and blue LED flip-chip; the first circuit layer and the second circuit layer are flexible high-precision circuit boards, and both the first circuit layer and the second circuit layer are provided with multiple lines; the first circuit layer and the second circuit layer are connected by a via structure.

[0065] The LED display screen that can effectively improve the security and reliability of ICs further includes a substrate support strip attached to the substrate layer; the substrate support strip is a long strip-shaped PI material structure or a steel sheet structure, and its length matches that of the substrate layer; the substrate support strip is located near the outer edge of the substrate layer and is located on the front or back of the substrate layer; the substrate support strip is connected to the substrate layer through an adhesive layer, and the substrate support strip is symmetrically arranged on both sides of the substrate layer.

[0066] It should be noted that this application does not involve improvements to the control program or control circuit of LED beads, which are conventional technical means in the field and well known to those skilled in the art.

[0067] Existing IC reinforcement structures typically involve attaching rigid copper sheets or similar structures directly to the back of the substrate. These rigid copper sheets correspond to the IC's position, preventing bending of the IC during flexible screen winding. However, the attached rigid steel sheet structure can easily cause damage to the substrate during flexible screen winding, directly affecting circuit conductivity.

[0068] The base support strip has a support through hole for avoiding the IC module portion; the diameter of the support through hole is larger than the size of the IC module;

[0069] The base support strip is located outside the positive electrode charging copper strip and the negative electrode charging copper strip, covering the positive electrode charging copper strip and the negative electrode charging copper strip; an insulating layer is provided between the base support strip and the positive electrode charging copper strip and the negative electrode charging copper strip.

[0070] A method for manufacturing an LED display screen that can effectively improve the security and reliability of ICs includes the following steps:

[0071] S1: FPC is used as the basic material for the main body of the display screen, and the LED beads, display screen MCU and IC module are mounted on the FPC circuit board using the surface mount technology.

[0072] S2: Apply UV adhesive to the outside of the IC module area and use light curing or heat curing to make the adhesive cure quickly;

[0073] S3: Apply a blackening treatment to the periphery or sides of the IC module and other components to form an ink layer;

[0074] S4: Weld multiple LED display units together using welding trays around the perimeter;

[0075] S5: Connect the positive electrode copper strip and the negative electrode copper strip to the LED display screen by welding or adhesive layer;

[0076] S6: Apply an AB adhesive layer to the front of the LED display screen and allow it to cure.

[0077] The technical effects achieved by this application in solving the technical problem are as follows:

[0078] Compared with existing technologies, this utility model provides an LED display screen 1 that can effectively improve the safety and reliability of ICs. This is achieved by simultaneously setting a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer. The light-emitting layer is connected to the printed circuit of the conductive layer by soldering, and the light-emitting layer is an LED light-emitting unit. The substrate layer is a PI material layer. It also includes several IC modules linearly soldered to the outer edge of the conductive layer for controlling the light-emitting state of the LED light-emitting units. Furthermore, it includes a main control circuit board located at one end of the substrate layer. The main control circuit board includes a main control chip, a communication module, and a power module. A UV adhesive layer is also coated on the IC modules for reinforcement and protection. In practical applications, the UV adhesive layer on the outside of the IC modules provides good fixation and protection, especially when the flexible screen is bent, preventing damage to the IC modules.

[0079] The embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. An LED display screen that can effectively improve the security and reliability of ICs, characterized in that: It includes a substrate layer, a conductive layer printed on the substrate layer, a light-emitting layer attached to the conductive layer, and an AB glue encapsulation layer cured on the light-emitting layer; the light-emitting layer is connected to the printed circuit of the conductive layer by soldering, and the light-emitting layer is an LED light-emitting unit; the substrate layer is a PI material layer; It also includes several IC modules linearly soldered to the outer edge of the conductive layer, used to control the light emission state of the LED light-emitting unit; It also includes a main control circuit board disposed at one end of the base layer; the main control circuit board includes a main control chip, a communication module and a power module; The IC module is also coated with a UV adhesive layer for reinforcement and protection.

2. The LED display screen as described in claim 1, which can effectively improve the security and reliability of ICs, is characterized in that: It also includes positive electrode copper strips and negative electrode copper strips used for supplementary power generation; The positive electrode charging copper strip and the negative electrode charging copper strip are arranged in a whole strip structure on the substrate layer, and their length matches the size of the substrate layer. Alternatively, the positive electrode charging copper strip and the negative electrode charging copper strip are arranged in several independent strip structures with uniform spacing, and are electrically connected to the main control circuit board through a circuit. The positive electrode charging copper strip and the negative electrode charging copper strip are located at the outer edge of the front or back of the substrate layer; It also includes a power supply connector that is connected to the main control circuit board.

3. An LED display screen as described in claim 1 or 2 that can effectively improve the security and reliability of ICs, characterized in that: The base layer includes a first substrate layer, a second substrate layer, and a PP material layer for connecting the first substrate layer and the second substrate layer, which meets the requirements for large-angle bending. The first substrate layer and the second substrate layer are a polyimide material layer and a copper foil layer, respectively.

4. The LED display screen as described in claim 2, which can effectively improve the security and reliability of ICs, is characterized in that: The LED display screen is surrounded by welding trays for welding; multiple LED display screens are welded together through the welding trays. The positive electrode copper strip and the negative electrode copper strip are arranged in a strip-shaped structure that matches the overall length of the multiple LED displays, or the positive electrode copper strip and the negative electrode copper strip are arranged in several independent strip-shaped structures with uniform spacing. Through electrical conduction, the conductive connection between adjacent positive electrode copper strips and negative electrode copper strips is achieved.

5. An LED display screen as described in claim 2 that can effectively improve the security and reliability of ICs, characterized in that: The positive electrode copper strip and the negative electrode copper strip are connected to the substrate layer by welding or adhesive layer; the substrate layer is provided with a plurality of first welding points, and the positive electrode copper strip and the negative electrode copper strip are provided with second welding points corresponding to each of the first welding points.

6. The LED display screen as described in claim 5, which can effectively improve the security and reliability of ICs, is characterized in that: The positive electrode charging copper strip and the negative electrode charging copper strip are located at the upper and lower edges of the front side of the substrate layer; and an ink layer with a shielding and covering function is provided on the upper part of the positive electrode charging copper strip and the negative electrode charging copper strip.

7. An LED display screen as described in claim 1, 2, 4, 5, or 6, which can effectively improve the security and reliability of ICs, characterized in that: The conductive layer includes a first circuit layer and a second circuit layer; the LED light-emitting unit includes red LED flip-chip, green LED flip-chip, and blue LED flip-chip; the first circuit layer and the second circuit layer are flexible high-precision circuit boards, and both the first circuit layer and the second circuit layer are provided with multiple lines; the first circuit layer and the second circuit layer are connected by a via structure.

8. An LED display screen as described in claim 2 that can effectively improve the security and reliability of ICs, characterized in that: It also includes a base support strip attached to the base layer; the base support strip is a long strip of PI material or a steel sheet structure, and its length matches that of the base layer; the base support strip is located near the outer edge of the base layer and is located on the front or back of the base layer; the base support strip is connected to the base layer through an adhesive layer, and the base support strip is symmetrically arranged on both sides of the base layer.

9. An LED display screen as described in claim 8 that can effectively improve the security and reliability of ICs, characterized in that: The base support strip has a support through hole for avoiding the IC module portion; the diameter of the support through hole is larger than the size of the IC module; The base support strip is located outside the positive electrode charging copper strip and the negative electrode charging copper strip, covering the positive electrode charging copper strip and the negative electrode charging copper strip; an insulating layer is provided between the base support strip and the positive electrode charging copper strip and the negative electrode charging copper strip.

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