Middle frame assembly and electronic device

Abstract

The application relates to a middle frame assembly and an electronic device, which comprises a middle frame body and a metal frame, the metal frame is annularly arranged and connected to the outer periphery of the middle frame body, at least part of the metal frame serves as an antenna radiator, the total volume of the middle frame assembly is V1, the volume of the middle frame body is V2, and 1 / 2<=V2 / V1<1. The structure can reduce the use of metal materials in the middle frame assembly, thereby reducing the overall weight of the middle frame assembly and being beneficial to the lightweight design of the electronic device. In addition, at least part of the metal frame serves as the antenna radiator, the antenna function requirement of the electronic device can be met, the integration of the electronic device is improved, the use of metal materials is further reduced, and the metal frame is annularly arranged and connected to the outer periphery of the side wall, so that the antenna radiator can be prevented from being shielded, the radiation function of the antenna radiator is guaranteed, and the antenna performance is improved.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and more specifically to a mid-frame component and an electronic device. Background Technology

[0002] Metal materials, due to their high modulus properties, can be made thinner, making them the optimal choice for mid-frame materials. In existing electronic devices, metal materials are typically used as the main body and exterior material of the mid-frame, providing rigidity and heat dissipation; some areas of metal can also function as antenna radiators. However, since the main body of the mid-frame is metal, it is relatively heavy, which can easily increase the overall weight of the device. With the increasing diversification of electronic device forms and the increase in size in recent years, the demand for weight reduction in metal mid-frames has become increasingly strong.

[0003] In related technologies, the middle frame can be divided into an inner frame and an outer skin. The inner frame is made of die-cast metal, and the outer skin is wrapped with plastic material to reduce the weight of the middle frame. However, the main material of the middle frame is still metal, and the weight is still relatively large. In addition, part of the metal on the inner frame can serve as the antenna radiator, while the setting of the outer skin can easily affect the performance of the antenna. Utility Model Content

[0004] In view of this, this application provides a mid-frame assembly and an electronic device to reduce the overall weight of the mid-frame assembly and improve antenna performance.

[0005] The first aspect of this application provides a mid-frame assembly, including a mid-frame body and a metal frame, wherein the metal frame is circumferentially connected to the outer periphery of the mid-frame body, and at least a portion of the metal frame serves as an antenna radiator. The total volume of the mid-frame assembly is V1, and the volume of the mid-frame body is V2, where 1 / 2 ≤ V2 / V1 < 1.

[0006] In this embodiment, the main body of the middle frame can be used to support the entire device, ensuring the support effect of the middle frame assembly. At the same time, the metal frame is connected to the outer periphery of the main body of the middle frame, which can improve the overall appearance of the electronic device and reduce the use of metal materials in the middle frame assembly, thereby reducing the overall weight of the middle frame assembly and contributing to the lightweight design of the electronic device.

[0007] In addition, to achieve signal transmission and reception, the electronic device is equipped with at least one antenna assembly, which includes an antenna radiator. In this embodiment, at least a portion of the metal frame serves as the antenna radiator, which satisfies the antenna function requirements of the electronic device while improving its integration and further reducing the use of metal materials, thus facilitating lightweight design. Furthermore, the metal frame is circumferentially connected to the outer periphery of the main frame, preventing the antenna radiator from being blocked, ensuring its radiation function, and improving antenna performance.

[0008] Furthermore, when the total volume V1 of the middle frame assembly and the volume V2 of the middle frame body 1 satisfy 1 / 2≤V2 / V1<1, the proportion of metal material in the middle frame assembly is moderate, which can meet the various functional requirements of electronic devices while reducing the overall weight of the middle frame assembly, which is conducive to the lightweight design of electronic devices.

[0009] In one possible design, the metal frame includes a body and a connecting portion, the body being circumferentially connected to the outer periphery of the middle frame body, and the connecting portion protruding from the surface of the body and connected to the middle frame body.

[0010] In this solution, the structure is simple, reliable, easy to implement, and easy to manufacture. It can increase the connection strength between the metal frame and the main body of the middle frame, improve the connection stability of the metal frame on the main body of the middle frame, and thus improve the structural stability of the middle frame assembly.

[0011] In one possible design, the mid-frame assembly further includes a conductive layer disposed on at least one side surface of the mid-frame body along the thickness direction of the mid-frame assembly, the conductive layer being used for radiating electrical connection with the antenna.

[0012] In this design, the conductive layer meets the grounding requirements of the antenna radiator, ensuring the reliability of the antenna function and improving the safety of electronic equipment. Furthermore, the conductive layer is disposed on at least one surface of the mid-frame assembly along its thickness direction, facilitating electrical connections between electronic components within the electronic device. This meets the design requirements of different electronic devices and enhances the design freedom of the electronic device; the specific configuration can be tailored to actual needs and is not limited here.

[0013] In one possible design, at least a portion of the body serves as the antenna radiator, which is electrically connected to the conductive layer via the connecting portion.

[0014] In this solution, the structure is simple and easy to implement, which can further reduce the structural complexity of the middle frame component, facilitate the fabrication and molding of the middle frame component, and save on manufacturing costs.

[0015] In one possible design, the middle frame body includes a middle plate and side panels formed on the middle plate, the side panels being circumferentially connected to the outer periphery of the middle plate, and the metal frame being circumferentially connected to the outer periphery of the side panels.

[0016] In this solution, the structure can ensure the support effect of the main body of the middle frame on the whole device, improve the overall appearance of the electronic device, ensure the antenna function of the electronic device, and make the metal frame design thinner, further reducing the use of metal materials in the middle frame assembly, thereby further reducing the overall weight of the middle frame assembly, which is more conducive to the lightweight design of the electronic device.

[0017] In one possible design, along the thickness direction of the middle frame assembly, the side panel protrudes from one side surface of the middle plate, and the side panel and the middle plate enclose to form a first mounting groove.

[0018] In this design, the first mounting slot provides ample space for installing other components within the electronic device, and its simple structure allows the mid-frame assembly to serve directly as the back cover, eliminating the need for a separate back cover and facilitating overall assembly. Furthermore, the mid-frame assembly, with its non-metallic surface exposed on the side facing away from the first mounting slot, allows for decorative effects through processes such as spraying and printing, enhancing design freedom and meeting diverse customer needs while improving the user experience.

[0019] In one possible design, along the thickness direction of the middle frame assembly, the side panels protrude from opposite sides of the middle plate, and the side panels and the middle plate enclose a first mounting groove and a second mounting groove arranged sequentially along the thickness direction.

[0020] In this solution, the middle frame assembly of the structure has a first mounting groove and a second mounting groove arranged sequentially on opposite sides along the thickness direction. This ensures that the electronic device has sufficient installation space while allowing some electronic components to be isolated from each other through the middle plate. This facilitates the partitioned assembly of electronic components within the electronic device, reduces interference between some electronic components, and increases the contact area between the electronic components and the middle frame assembly, thereby improving the connection stability between the electronic components and the middle frame assembly and further enhancing the structural stability of the electronic device.

[0021] In one possible design, the mid-frame body further includes a cover layer that covers the outside of the metal frame and is connected to the side panel.

[0022] In this solution, the cover layer is relatively thin, which has a low impact on antenna performance. Moreover, the cover layer can cover the antenna gaps on the metal frame, achieving a continuous and seamless integrated appearance of the mid-frame assembly, improving the appearance consistency of the mid-frame assembly and enhancing the user experience.

[0023] In one possible design, the middle plate, the side panels, and the cover layer are integrally formed to improve the structural stability of the middle frame assembly and facilitate the overall assembly of the middle frame assembly.

[0024] In one possible design, the mid-frame assembly further includes a metal backplate that covers the side surface of the mid-frame body facing away from the first mounting groove and is connected to the metal frame, wherein the metal backplate and the metal frame are integrally formed.

[0025] In this solution, when the mid-frame assembly directly serves as the rear shell of the electronic device, the metal frame and metal backplate are exposed on the outside of the mid-frame assembly. This ensures the antenna function of the electronic device while improving its overall appearance. Furthermore, the integrated molding of the metal frame and metal backplate facilitates the manufacturing of the mid-frame assembly, improving production efficiency. It also enhances the overall strength and reliability of the mid-frame assembly, improves the consistency of the overall appearance of the electronic device, and ultimately enhances the user experience.

[0026] In one possible design, the mid-frame assembly further includes a functional material layer, which is embedded inside the mid-frame body or disposed on the surface of the mid-frame body, in order to enable the mid-frame assembly to have corresponding functional characteristics, meet the design requirements of electronic devices, and improve the design freedom of electronic devices.

[0027] In one possible design, the functional material layer includes one or more combinations of a thermally conductive layer, a thermally insulating layer, a phase change material layer, a metal sheet layer, and a dielectric material layer, to meet the design requirements of electronic devices and enhance the design freedom of electronic devices.

[0028] In one possible design, the middle frame body includes multiple layers of panels, which are hot-pressed together to form the middle frame body. At least some of the panels are provided with windows, and the functional material layer is disposed within the windows.

[0029] In this design, the functional material layer is placed inside the window, allowing it to be embedded within the main body of the middle frame. This structure is simple, easy to manufacture, and can reduce the thickness of the middle frame assembly, which is beneficial for the lightweight design of electronic devices.

[0030] In one possible design, the middle frame body further includes an edge banding portion that wraps around the outer periphery of the multilayer panels.

[0031] In this design, when the shelves are under pressure, the edge banding can pull the edges of the multiple shelves, thereby reducing the risk of deformation of the main frame, improving the overall structural strength of the main frame, and achieving a better appearance.

[0032] In one possible design, the material of the main body of the middle frame is a continuous fiber reinforced composite material.

[0033] In this solution, continuous fiber reinforced composite materials have high strength and high modulus, and relatively low density and light weight. Therefore, when the main body of the middle frame is made of continuous fiber reinforced composite materials, it can ensure that the middle frame assembly has high support strength while reducing the overall weight of the middle frame assembly, which is beneficial to the lightweight design of electronic devices.

[0034] In one possible design, the reinforcing fibers of the continuous fiber reinforced composite material include one of glass fiber, quartz fiber, ceramic fiber, carbon fiber, aramid, silicon carbide fiber, Kevlar fiber, liquid crystal polymer, polyimide, and poly(p-phenylenebenzodioxazole) fiber, and the resin material of the continuous fiber reinforced composite material is one of epoxy resin, unsaturated resin, and acrylic resin, so as to form a continuous fiber reinforced composite material that meets the design requirements of the mid-frame assembly.

[0035] In one possible design, the mid-frame assembly further includes a protrusion, which is injection molded onto the mid-frame body, or the protrusion is fixedly connected to the mid-frame body, in order to reduce the manufacturing difficulty of the mid-frame assembly, improve the manufacturing efficiency of the mid-frame assembly, and save manufacturing costs.

[0036] A second aspect of this application provides an electronic device, which includes a display module and a mid-frame assembly as described in any of the above embodiments, wherein the display module is connected to the mid-frame assembly. Since the mid-frame assembly has the aforementioned technical effects, the electronic device including the mid-frame assembly should also possess the aforementioned technical effects, and will not be elaborated further here.

[0037] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0040] Figure 2 A cross-sectional schematic diagram of the mid-frame component provided in this application in a specific embodiment;

[0041] Figure 3 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0042] Figure 4 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0043] Figure 5 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0044] Figure 6 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0045] Figure 7 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0046] Figure 8 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment;

[0047] Figure 9 A top view of the main frame body provided in this application in a specific embodiment;

[0048] Figure 10 A partially exploded view of the mid-frame component provided in this application in one specific embodiment;

[0049] Figure 11 A top view of the main frame body provided in this application in another specific embodiment;

[0050] Figure 12 A cross-sectional schematic diagram of the mid-frame component provided in the application in another specific embodiment;

[0051] Figure 13 This is a schematic diagram of the assembly structure during the fabrication of the mid-frame component.

[0052] Figure 14 This is a schematic diagram showing the fit between the assembly and the mold during the fabrication of the mid-frame component.

[0053] Figure label:

[0054] 100 - Electronic devices;

[0055] 10 - Mid-frame assembly; 20 - Display module; 30 - Back cover;

[0056] 1-Middle frame main body;

[0057] 11-Middle panel; 12-Side panel; 13-Covering layer; 14-Shelf; 15-Window; 16-Edge binding; 1a-First area; 1b-Second area; 1c-Third area; 1d-Fourth area;

[0058] 2-Metal frame;

[0059] 21-Body; 22-Connecting part;

[0060] 3-Conductive layer;

[0061] 4-Functional material layer;

[0062] 5-Metal backplate;

[0063] 6-Protrusion;

[0064] 7-First mounting slot;

[0065] 8-Second mounting slot;

[0066] 200-Assembly;

[0067] 300-Mold;

[0068] Z - Thickness direction.

[0069] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0070] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0071] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0072] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0073] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0074] Metal materials, due to their high modulus properties, can be made thinner, making them the optimal choice for mid-frame materials. In existing electronic devices, metal materials are typically used as the main body and exterior material of the mid-frame, providing rigidity and heat dissipation; some areas of metal can also function as antenna radiators. However, since the main body of the mid-frame is metal, it is relatively heavy, which can easily increase the overall weight of the device. With the increasing diversification of electronic device forms and the increase in size in recent years, the demand for weight reduction in metal mid-frames has become increasingly strong.

[0075] In related technologies, the middle frame can be divided into an inner frame and an outer skin. The inner frame is made of die-cast metal, and the outer skin is wrapped in plastic to reduce the weight of the middle frame. However, the main material of the middle frame is still metal, so the weight is still relatively large. Furthermore, part of the metal on the inner frame can function as the antenna radiator, while the outer skin can easily affect the antenna's performance. Additionally, while the outer skin uses a non-metallic coating to achieve a metallic-like texture, its appearance is not refined enough.

[0076] In view of this, embodiments of this application provide a mid-frame assembly and an electronic device to reduce the overall weight of the mid-frame assembly and improve antenna performance. The electronic device can be any device with a mid-frame assembly, including, for example, a mobile phone, tablet computer, personal digital assistant (PDA), laptop computer, in-vehicle computer, foldable display device, foldable display screen, wearable device, etc. Embodiments of this application do not impose special limitations on the specific form of the aforementioned electronic device. For ease of explanation, the following description uses a mobile phone as an example. Specific embodiments of the electronic device of this application will be used to describe the electronic device of this application.

[0077] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 1 As shown, the electronic device 100 may include a mid-frame assembly 10 and a display module 20, with the display module 20 mounted on the mid-frame assembly 10. The display module 20 may include a liquid crystal display (LCD), an organic light-emitting diode (OLED) display panel, or other display panels for displaying images, while the mid-frame assembly 10 provides support for the entire device.

[0078] For example, the mid-frame assembly 10 can serve as the housing of the electronic device 100, allowing the screen assembly 20 and the mid-frame assembly 10 to jointly enclose an installation space for mounting the motherboard, battery, camera module, and other electronic devices. For example, the electronic device also includes a rear cover 30, which is connected to the display module 20 on opposite sides of the mid-frame assembly 10, and the display module 20, mid-frame assembly 10, and rear cover 30 can jointly enclose an installation space for mounting the motherboard, battery, camera module, and other electronic devices. The rear cover 30 can be made of materials such as metal, ceramic, glass, or plastic. The mid-frame assembly 10 and the rear cover 30 can be molded separately and fixed by welding, snap-fitting, or bonding.

[0079] Please refer to Figure 2 , Figure 2 A cross-sectional schematic diagram of the mid-frame component provided in this application in one specific embodiment.

[0080] like Figure 2 As shown, the mid-frame assembly 10 includes a mid-frame body 1 and a metal frame 2. The metal frame 2 is circumferentially connected to the outer periphery of the mid-frame body 1, and at least a portion of the metal frame 2 serves as an antenna radiator.

[0081] like Figure 2 As shown, the main body 1 of the middle frame can be used to support the entire device, ensuring the support effect of the middle frame assembly 10. At the same time, the metal frame 2 is connected to the outer periphery of the main body 1 of the middle frame, which can improve the overall appearance of the electronic device and reduce the use of metal materials in the middle frame assembly 10, thereby reducing the overall weight of the middle frame assembly 10 and contributing to the lightweight design of the electronic device.

[0082] In addition, to achieve signal transmission and reception, at least one antenna assembly is provided within the electronic device, and the antenna assembly includes an antenna radiator. In this embodiment, at least a portion of the metal frame 2 serves as the antenna radiator, which satisfies the antenna function requirements of the electronic device while improving its integration, further reducing the use of metal materials, and facilitating lightweight design. Furthermore, the metal frame 2 is circumferentially connected to the outer periphery of the main frame 1, which prevents the antenna radiator from being blocked, ensuring its radiation function and improving antenna performance.

[0083] Specifically, the total volume of the middle frame component is V1, and the volume of the middle frame body is V2, where 1 / 2 ≤ V2 / V1 < 1. For example, V2 / V1 can be 1 / 2, 3 / 5, 7 / 10, 4 / 5, 9 / 10, etc., meaning that the volume of the middle frame body 1 accounts for 50%, 60%, 70%, 80%, 90%, etc. of the total volume of the entire middle frame component 10. Of course, V2 / V1 can also be other values ​​within the above range, and can be set according to actual needs without restriction.

[0084] When V2 / V1 < 1 / 2, the mid-frame assembly is still primarily made of metal, resulting in a relatively heavy weight, which is detrimental to the lightweight design of electronic devices. When V2 / V1 = 1, the proportion of metal material is low, failing to meet the functional requirements of electronic devices such as rigidity, antenna, and / or heat dissipation.

[0085] In this embodiment, when the total volume V1 of the middle frame assembly 10 and the volume V2 of the middle frame body 1 satisfy 1 / 2≤V2 / V1<1, the proportion of metal material in the middle frame assembly 10 is moderate, which can meet the multiple functional requirements of electronic devices while reducing the overall weight of the middle frame assembly 10, which is beneficial to the lightweight design of electronic devices.

[0086] The material of the main body 1 of the middle frame is non-metallic, specifically, the material of the main body 1 of the middle frame is a continuous fiber reinforced composite material. Continuous fiber reinforced composite materials have high strength and high modulus, and relatively low density and light weight. Therefore, when the material of the main body 1 of the middle frame is a continuous fiber reinforced composite material, it can ensure that the middle frame assembly 10 has high support strength while reducing the overall weight of the middle frame assembly 10, which is beneficial to the lightweight design of electronic devices.

[0087] Specifically, the reinforcing fibers in the continuous fiber reinforced composite material may include one or more of the following fiber materials: glass fiber, quartz fiber, ceramic fiber, carbon fiber, aramid fiber, silicon carbide fiber, Kevlar fiber, liquid crystal polymer (LCO), polyimide (PI), and poly-p-phenylenebenzobisoxazole fiber (PBO). The resin material in the continuous fiber reinforced composite material may be one or more of the following resin materials: epoxy resin, unsaturated resin, and acrylic resin, to form a continuous fiber reinforced composite material that meets the design requirements of the middle frame component 10. The specific settings can be configured according to actual needs and are not limited here.

[0088] For example, continuous fiber reinforced composite material is continuous carbon fiber reinforced composite material. Continuous carbon fiber reinforced composite material is a high-performance composite material with continuous carbon fiber as the reinforcement and resin as the matrix. It has high comprehensive indicators such as specific strength and specific stiffness, thus having advantages such as low specific gravity, good rigidity and high strength. Please refer to Table 1, which compares the performance of continuous carbon fiber reinforced composite material with that of aluminum alloy (AL-6063) and 20% glass fiber (GF) reinforced polycarbonate (PC) plastic materials.

[0089] Table 1. Performance comparison of continuous carbon fiber reinforced composites with other materials

[0090] Material AL-6063 PC+GF20% Continuous carbon fiber composites Density g / cm3 2.7 1.33 1.5 Strength MPa 370 56-93 900 Specific strength 137 ～70 600 Modulus GPa 70 4.8 70 Specific modulus 25.9 3.6 46.7

[0091] In Table 1, AL-6063 is an aluminum alloy, and PC+GF20% is a 20% glass fiber (GF) reinforced polycarbonate (PC) plastic material. As shown in Table 1, continuous carbon fiber composite materials have a lower density and lighter weight than aluminum alloy materials, but their strength and specific strength are much higher than those of aluminum alloy and 20% glass fiber (GF) reinforced polycarbonate (PC) plastic materials. This is beneficial for forming a high-strength and lightweight mechanical structure. Furthermore, continuous carbon fiber composite materials have a higher specific modulus than aluminum alloy and 20% glass fiber (GF) reinforced polycarbonate (PC) plastic materials, making them less prone to deformation. Therefore, continuous carbon fiber composite materials are suitable as a substitute for metal materials in the preparation of the middle frame body 1, ensuring that the middle frame body 1 has high supporting stiffness while facilitating the lightweighting of electronic devices.

[0092] Of course, the material of the main body 1 of the middle frame can also be other continuous fiber reinforced composite materials such as continuous Kevlar fiber reinforced composite material or continuous glass fiber reinforced composite material. The specific material can be set according to actual needs, and there are no restrictions here.

[0093] In one specific embodiment, such as Figure 2 As shown, the metal frame 2 includes a body 21 and a connecting part 22. The body 21 is circumferentially connected to the outer periphery of the middle frame body 1, and the connecting part 22 protrudes from the surface of the body 21 and is connected to the middle frame body 1.

[0094] In this embodiment, as Figure 2 As shown, the structure is simple, reliable, easy to implement and easy to manufacture. It can increase the connection strength between the metal frame 2 and the middle frame body 1, improve the connection stability of the metal frame 2 on the middle frame body 1, and thus improve the structural stability of the middle frame assembly 10.

[0095] Furthermore, such as Figure 2 As shown, at least a portion of the body 21 of the metal frame 2 serves as an antenna radiator. The antenna radiator is electrically connected to the conductive layer 3 via a connecting portion 22 to ground the antenna radiator, thereby improving the safety performance of the electronic device. This structure is simple, flexible, and easy to implement, further reducing the structural complexity of the mid-frame assembly 10, facilitating the fabrication and molding of the mid-frame assembly 10, and saving manufacturing costs.

[0096] The metal frame 2 can be combined with the main body of the middle frame 1 by hot pressing, or it can be combined with the main body of the middle frame 1 by injection molding or other methods. The specific method can be set according to actual needs, and there are no restrictions here.

[0097] In one specific embodiment, the mid-frame assembly 10 further includes a protrusion 6. The protrusion 6 may be a relatively complex structure, such as a stud, rib, snap-fit ​​structure, or support structure, for mounting the mid-frame assembly 10 or cooperating with other components within the electronic device, thereby facilitating the installation of the mid-frame assembly 10 or other components within the electronic device and improving the structural stability of the electronic device.

[0098] The protrusion 6 can be injection molded onto the main body 1 of the middle frame, or the protrusion 6 can be fixedly connected to the main body 1 of the middle frame by means of screws, welding, bonding, etc., so as to reduce the manufacturing difficulty of the middle frame assembly 10, improve the manufacturing efficiency of the middle frame assembly 10, and save manufacturing costs.

[0099] Please refer to Figure 3 , Figure 3 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment.

[0100] In one specific embodiment, the middle frame body 1 includes a middle plate 11 and a side plate 12 formed on the middle plate 11. The side plate 12 is circumferentially connected to the outer periphery of the middle plate 11, and the metal frame 2 is circumferentially connected to the outer periphery of the side plate 12.

[0101] In this embodiment, as Figure 3 As shown, this structure can ensure the support effect of the main body 1 of the middle frame on the whole device, improve the overall appearance of the electronic device, ensure the antenna function of the electronic device, and also make the metal frame 2 thinner, further reducing the use of metal materials in the middle frame assembly 10, thereby further reducing the overall weight of the middle frame assembly 10, which is more conducive to the lightweight design of the electronic device.

[0102] Among them, such as Figure 3 As shown, when the middle frame body 1 includes a middle plate 11 and a side plate 12 formed on the middle plate 11, the connecting part 22 of the metal frame 2 can pass through the side plate 12 and connect with the middle plate 11 to further enhance the connection strength between the metal frame 2 and the middle frame body 1, thereby improving the structural stability of the middle frame assembly 10.

[0103] In one specific embodiment, such as Figure 3 As shown, along the thickness direction of the middle frame assembly 10, the side panel 12 protrudes from one side surface of the middle plate 11. The side panel 12 and the middle plate 11 form a first mounting groove 7, which provides sufficient installation space for the installation of other components inside the electronic device. The structure is simple, and the middle frame assembly 10 can be directly used as the back cover of the electronic device without the need for a separate back cover component, which facilitates the overall assembly of the electronic device.

[0104] In addition, the mid-frame assembly 10 can be directly used as the back cover of the electronic device. The side surface of the mid-frame body 1 facing away from the first mounting groove 7 is exposed on the outside and is a non-metallic surface, which makes it easy to achieve decorative effects through processes such as spraying and printing. This improves the design freedom of the electronic device and can meet the usage needs of different customers, thereby enhancing the user experience.

[0105] Please refer to Figure 4 , Figure 4 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment.

[0106] In one specific embodiment, such as Figure 4 As shown, the middle frame assembly 10 also includes a metal back plate 5, which covers the side surface of the middle frame body 1 away from the first mounting groove 7 and is connected to the metal frame 2. The metal back plate 5 and the metal frame 2 are integrally formed.

[0107] In this embodiment, as Figure 4 As shown, when the mid-frame assembly 10 directly serves as the rear shell of the electronic device, the metal frame 2 and the metal backplate 5 are exposed on the outside of the mid-frame assembly 10. This ensures the antenna function of the electronic device while improving its overall appearance. Furthermore, the metal frame 2 and the metal backplate 5 are integrally formed, facilitating the manufacturing of the mid-frame assembly, improving manufacturing efficiency, enhancing the overall strength and reliability of the mid-frame assembly 10, and improving the consistency of the overall appearance of the electronic device, thus enhancing the user experience.

[0108] In the above embodiments, the metal frame 2 can be made of metal materials such as aluminum alloy, stainless steel, magnesium alloy, and titanium alloy, and the metal back plate 5 can be made of metal materials such as aluminum alloy, stainless steel, magnesium alloy, and titanium alloy, so as to improve the design freedom of electronic devices and meet the design needs of different electronic devices. The specific settings can be made according to actual needs and are not limited here.

[0109] Please refer to Figure 5 , Figure 5 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment.

[0110] In one specific embodiment, such as Figure 5 As shown, along the thickness direction Z of the middle frame assembly 10, the side panels 12 protrude from the opposite two sides of the middle plate 11, and the side panels 12 and the middle plate 11 form a first mounting groove 7 and a second mounting groove 8 arranged sequentially along the thickness direction Z.

[0111] In this embodiment, as Figure 5As shown, in the middle frame assembly 10 of this structure, there are first mounting grooves 7 and second mounting grooves 8 arranged sequentially on opposite sides along the thickness direction Z. This ensures that the electronic device has sufficient installation space while allowing some electronic components to be isolated from each other through the middle plate 1. This facilitates the partitioned assembly of electronic components within the electronic device, reduces interference between some electronic components within the electronic device, and increases the contact area between the electronic components and the middle frame assembly 10, thereby improving the connection stability between the electronic components and the middle frame assembly 10 and further enhancing the structural stability of the electronic device.

[0112] Specifically, the first mounting slot 7 can be used to install components such as display modules and circuit boards, and the second mounting slot 8 can be used to install components such as cameras, batteries and back covers to improve the structural stability of electronic devices. The specific configuration can be set according to actual needs and is not limited here.

[0113] Please refer to Figure 6 and Figure 7 , Figure 6 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment; Figure 7 A cross-sectional schematic diagram of the mid-frame component provided in this application in another specific embodiment.

[0114] In one specific embodiment, such as Figure 6 and Figure 7 As shown, the main body of the middle frame 1 also includes a cover layer 13, which covers the outside of the metal frame 2 and is connected to the side panel 12 to embed the metal frame 2 into the main body of the middle frame 1 as a whole.

[0115] When at least a portion of the metal frame 2 serves as an antenna radiator, the body 21 of the metal frame 2 typically has multiple slots as antenna slots to separate the antenna radiator from adjacent antenna radiators or other parts of the metal frame 2, thus ensuring antenna performance. Therefore, when the metal frame 2 is exposed, the antenna slots can easily disrupt the overall consistency of the metal frame 2.

[0116] In this embodiment, as Figure 6 and Figure 7 As shown, the cover layer 13 is relatively thin, which has a low impact on antenna performance. Moreover, the cover layer 13 can cover the antenna gaps on the metal frame 2, achieving a continuous and seamless integrated appearance of the mid-frame assembly 10, improving the appearance consistency of the mid-frame assembly and enhancing the user experience.

[0117] For example, such as Figure 6As shown, along the thickness direction of the mid-frame assembly 10, the side panel 12 protrudes from one side surface of the mid-plate 11, and the side panel 12 and the mid-plate 11 form a first mounting groove 7. The cover layer 13 covers the outside of the metal frame 2 and is connected to the side panel 12. At this time, the mid-frame assembly 10 can directly serve as the back cover of the electronic device, and the exposed outer surfaces of the mid-frame assembly 10 are all non-metallic surfaces, which can improve the consistency of the overall appearance of the electronic device, enhance the user experience, and further reduce the use of metal materials in the mid-frame assembly 10, which is beneficial to the lightweight design of the electronic device.

[0118] For example, such as Figure 7 As shown, along the thickness direction Z of the mid-frame assembly 10, the side panels 12 protrude from the opposite side surfaces of the mid-plate 11. The side panels 12 and the mid-plate 11 form a first mounting groove 7 and a second mounting groove 8 arranged sequentially along the thickness direction Z. The cover layer 13 covers the outer side of the metal frame 2 and is connected to the side panels 12. The cover layer 13 can cover the antenna gaps on the metal frame 2, achieving a continuous and seamless integrated appearance of the mid-frame assembly 10, improving the appearance consistency of the mid-frame assembly and enhancing the user experience.

[0119] In one specific embodiment, the middle plate 11, the side panel 12 and the covering layer 13 are integrally formed to improve the structural stability of the middle frame assembly 10 and facilitate the overall assembly of the middle frame assembly 10.

[0120] In one specific embodiment, such as Figure 7 As shown, the middle frame assembly 10 also includes a conductive layer 3, which is used to electrically connect with the antenna radiator to meet the grounding requirements of the antenna radiator, ensure the reliability of the antenna function, and improve the safety of the electronic equipment.

[0121] Along the thickness direction Z of the middle frame assembly 10, the conductive layer 3 is disposed on at least one side surface of the middle frame body 1 to facilitate electrical connection between electronic devices within the electronic device. This can meet the design requirements of different electronic devices and also improve the design freedom of the electronic device. The specific configuration can be set according to actual needs and is not limited here.

[0122] For example, such as Figure 7 As shown, a conductive layer 3 is provided on one side surface of the main frame 1, which has a simple structure and is easy to manufacture; for example, please refer to Figure 8 , Figure 8 This is a cross-sectional schematic diagram of the mid-frame assembly provided in this application in another specific embodiment. The mid-frame body 1 has conductive layers 3 on both opposite sides to meet the design requirements of different electronic devices and improve the design freedom of electronic devices.

[0123] Furthermore, such as Figure 7 and Figure 8As shown, along the thickness direction Z, a conductive layer can be formed on at least one side surface of the middle plate 11 of the middle frame body 1 by means of plating a conductive film or attaching a metal foil, etc. The specific configuration can be set according to actual needs and is not limited here.

[0124] In one specific embodiment, such as Figure 8 As shown, the mid-frame assembly 10 also includes a functional material layer 4. The functional material layer includes one or more combinations of a thermally conductive layer, a thermally insulating layer, a phase change material layer, a metal sheet layer, and a dielectric material layer. Of course, the functional material layer 4 can also be other material layers with functions. In order to enable the mid-frame assembly 10 to have corresponding functional characteristics, such as thermal conductivity, thermal insulation, temperature uniformity, improved toughness, improved strength, and reduced loss, so as to meet the design requirements of electronic devices and improve the design freedom of electronic devices, the specific settings can be set according to actual needs, and no restrictions are imposed here.

[0125] Specifically, please refer to Figure 9 , Figure 9 A top view of the main body of the midframe provided in this application in one specific embodiment.

[0126] like Figure 9 As shown, the main body 1 of the middle frame can be provided with multiple functional areas according to the needs of electronic devices in different areas of the electronic device. For example, the main body 1 of the middle frame includes a first area 1a, a second area 1b, a third area 1c, and a fourth area 1d. The first area 1a can be a high thermal conductivity area, the second area 1b can be a low loss area, the third area 1c can be a high rigidity area, and the fourth area 1d is a high toughness area. According to actual needs, a thermally conductive material can be provided in the first area 1a to form a thermally conductive layer to improve the thermal conductivity. A dielectric material with low dielectric loss can be provided in the second area 1b to form a dielectric material layer to reduce the loss of the electronic device. A high rigidity material can be provided in the third area 1c to form a reinforcing layer to improve the rigidity of the middle frame assembly 10 in this area. A high toughness material can be provided in the fourth area 1d to improve the toughness of the middle frame assembly 10 in this area.

[0127] The functional material layer 4 is embedded inside the middle frame body 1. The corresponding functional material can be used to integrally form a part of the middle frame body 1. The functional material layer can be embedded inside the middle frame body 1, or it can be set on the surface of the middle frame body. That is, after the middle frame body 1 and the functional material layer 4 are formed separately, the middle frame body 1 and the functional material layer 4 are connected by means of adhesive, welding, screw fixing, etc., so as to realize the corresponding functional characteristics in the corresponding area of ​​the middle frame body, thereby improving the design freedom of the middle frame component 10. The specific settings can be set according to actual needs, and there are no restrictions here.

[0128] Preferably, the functional material layer 4 is embedded inside the middle frame body 1 so that the middle frame assembly 10 has corresponding functional characteristics while reducing the thickness of the middle frame assembly 10, which is beneficial to the thin and light design of electronic devices.

[0129] Please refer to Figure 10 , Figure 10 This is a partially exploded view of the mid-frame component provided in this application in one specific embodiment.

[0130] like Figure 10 As shown, in one specific embodiment, the mid-frame body 1 includes multiple layers of plates 14, which are formed by hot pressing. At least some of the plates 14 are provided with windows 15, and a functional material layer 4 is disposed within the windows 15, allowing the functional material layer 4 to be embedded inside the mid-frame body 1. This structure is simple, easy to manufacture, and can reduce the thickness of the mid-frame assembly 10, which is beneficial for the lightweight design of electronic devices.

[0131] Specifically, such as Figure 10 As shown, in the process of preparing the middle frame component 10, the layer plates 14 of each layer can be cut and cut according to the structural design. That is, windows 15 are cut out on the layer plates 14 according to the shape and size of the functional material layer 4. Then, the functional material layer 4 is stacked together with the layer plates 14 and the prepreg, and hot-pressed. Finally, the excess material such as the skirt is removed to form the middle frame component 10.

[0132] Please refer to Figure 11 and Figure 12 , Figure 11 A top view of the main frame body provided in this application in another specific embodiment. Figure 12 A cross-sectional schematic diagram of the mid-frame component provided in the application in another specific embodiment.

[0133] like Figure 11 and Figure 12 As shown, in one specific embodiment, the middle frame body 1 further includes an edge-wrapping portion 16, which is wrapped around the outer periphery of the multilayer plate 14. When the plate 14 is subjected to pressure, the edge-wrapping portion 16 can pull the edge of the multilayer plate 14, thereby reducing the risk of deformation of the middle frame body 1, improving the overall structural strength of the middle frame body 1, and achieving a better appearance.

[0134] Specifically, the material of the edge banding 16 is also a continuous fiber reinforced composite material. The edge banding 16 includes multiple continuous fibers, which are wound around the outer periphery of the multilayer laminate 14.

[0135] Please refer to Figure 13 and Figure 14 , Figure 13 This is a schematic diagram of the assembly structure during the fabrication of the middle frame component 10. Figure 14This is a schematic diagram showing the fit between the assembly and the mold during the fabrication of the middle frame component 10.

[0136] In one specific embodiment, the mid-frame assembly 10 can also be fabricated using a resin transfer molding (RTM) process. Specifically, during the fabrication of the mid-frame assembly 10, as follows: Figure 13 As described above, the reinforcing material of the main frame 1, the materials of various functional material layers 4, the metal frame 2, etc., can be first stacked or woven into a composite body 200 of the target shape, and then the composite body 200 and the materials placed in it can be... Figure 14 Resin is injected into the mold 300 shown, and then heated or cured at room temperature to allow the resin to cross-link with the various materials in the assembly 200. After the mold 300 is opened for demolding, the middle frame assembly 10 can be obtained after post-processing of the demolded model.

[0137] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

[0138] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A mid-frame component, characterized in that, include: Mid-frame main body; A metal frame is circumferentially connected to the outer periphery of the middle frame body, and at least a portion of the metal frame serves as an antenna radiator. The total volume of the middle frame assembly is V1, and the volume of the middle frame body is V2, where 1 / 2 ≤ V2 / V1 < 1.

2. The mid-frame assembly according to claim 1, characterized in that, The metal frame includes a body and a connecting part; The main body is circumferentially connected to the outer periphery of the middle frame body; The connecting part protrudes from the surface of the body and is connected to the middle frame body.

3. The mid-frame assembly according to claim 2, characterized in that, The mid-frame assembly further includes a conductive layer, which is disposed on at least one side surface of the mid-frame body along the thickness direction of the mid-frame assembly. The conductive layer is used for electrical connection with the antenna radiation.

4. The mid-frame assembly according to claim 3, characterized in that, At least a portion of the body serves as the antenna radiator, and the antenna radiator is electrically connected to the conductive layer via the connecting portion.

5. The mid-frame assembly according to any one of claims 1 to 4, characterized in that, The main body of the middle frame includes a middle plate and side panels formed on the middle plate, the side panels being circumferentially connected to the outer periphery of the middle plate; The metal frame is circumferentially connected to the outer perimeter of the side panel.

6. The mid-frame assembly according to claim 5, characterized in that, Along the thickness direction of the middle frame assembly, the side panel protrudes from one side surface of the middle plate, and the side panel and the middle plate form a first mounting groove.

7. The mid-frame assembly according to claim 5, characterized in that, Along the thickness direction of the middle frame assembly, the side panels protrude from the opposite two side surfaces of the middle plate; The side panel and the middle plate surround each other to form a first mounting groove and a second mounting groove arranged sequentially along the thickness direction.

8. The mid-frame assembly according to any one of claims 5 to 7, characterized in that, The main body of the middle frame also includes a cover layer, which covers the outside of the metal frame and is connected to the side panel.

9. The mid-frame assembly according to claim 8, characterized in that, The middle plate, the side panels, and the cover layer are integrally formed.

10. The mid-frame assembly according to any one of claims 6 to 7, characterized in that, The mid-frame assembly also includes a metal back plate, which covers the side surface of the mid-frame body facing away from the first mounting groove and is connected to the metal frame. The metal back plate and the metal frame are integrally formed.

11. The mid-frame assembly according to any one of claims 1 to 10, characterized in that, The mid-frame assembly further includes a functional material layer, which is embedded inside the mid-frame body or disposed on the surface of the mid-frame body.

12. The mid-frame assembly according to claim 11, characterized in that, The functional material layer includes one or more combinations of a thermally conductive layer, a thermally insulating layer or a phase change material layer, a metal sheet layer, and a dielectric material layer.

13. The mid-frame assembly according to claim 11 or 12, characterized in that, The main body of the middle frame includes multiple layers of plates, which are hot-pressed together to form the main body of the middle frame. At least some of the shelves are provided with windows, and the functional material layer is disposed within the windows.

14. The mid-frame assembly according to claim 13, characterized in that, The main body of the middle frame also includes an edge banding portion, which is wrapped around the outer periphery of the multilayer plates.

15. The mid-frame assembly according to any one of claims 1 to 14, characterized in that, The main body of the middle frame is made of continuous fiber reinforced composite material.

16. The mid-frame assembly according to claim 15, characterized in that, The reinforcing fibers of the continuous fiber reinforced composite material include one of glass fiber, quartz fiber, ceramic fiber, carbon fiber, aramid fiber, silicon carbide fiber, Kevlar fiber, liquid crystal polymer, polyimide, and poly(p-phenylenebenzodioxazole) fiber. The resin material in the continuous fiber reinforced composite material is one of epoxy resin, unsaturated resin, and acrylic resin.

17. The mid-frame assembly according to any one of claims 1 to 16, characterized in that, The mid-frame assembly also includes a protrusion, which is injection molded onto the mid-frame body, or the protrusion is fixedly connected to the mid-frame body.

18. An electronic device, characterized in that, The electronic device includes a display module and a mid-frame assembly as described in any one of claims 1 to 17, wherein the display module is connected to the mid-frame assembly.

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