An electronic device

Abstract

The application relates to the technical field of electronic equipment, in particular to a sub-device, which comprises a display module, an injection molding part, a bonding part and a middle frame, the middle frame comprises a middle plate and a first side wall, one end of the middle plate along a first direction is connected with the first side wall; the display module and the middle plate are sequentially stacked along a second direction, one end of the display module along the first direction is provided with a bending area, and an opening of the bending area faces away from the first side wall; the bending area comprises an inner surface and an outer surface which are oppositely arranged along the thickness direction of the bending area, the inner surface is located on the side of the bending area facing the opening, and the outer surface is located on the side of the bending area facing away from the opening; the injection molding part is located between the first side wall and the bending area and surrounds the outer surface of the bending area, and the inner surface of the bending area encloses a hollow area; the bonding part is located between the injection molding part and the middle plate, and the surface of the injection molding part facing the middle plate is bonded with the middle plate through the bonding part. In this way, the structural stability of the display module can be enhanced, and damage caused by external force can be prevented.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] Today, mobile phones, tablets, and other electronic devices enrich people's lives, providing users with a variety of services. With the rapid development of electronic device technology, these devices are constantly being upgraded and iterated, and users' functional needs are becoming increasingly diversified. From communication to entertainment, electronic devices have become indispensable tools in people's lives. Against this backdrop, users are placing higher demands on the performance and stability of electronic device screens.

[0003] However, the screen display module of electronic devices is easily affected by external forces, which can cause problems such as bright lines, bright spots, and screen flickering, thus affecting the display effect of the screen. Utility Model Content

[0004] This application provides an electronic device to prevent the display screen from malfunctioning when subjected to external impact.

[0005] In a first aspect, this application provides an electronic device, including a display module, an injection molded part, an adhesive component, and a mid-frame, wherein: the mid-frame includes a mid-plate and a first sidewall, one end of the mid-plate is connected to the first sidewall along a first direction, the first direction being the length or width direction of the mid-plate; the display module and the mid-plate are stacked sequentially along a second direction, the second direction being the thickness direction of the mid-plate, one end of the display module along the first direction has a bending region, the opening of the bending region facing away from the first sidewall; the bending region includes an inner surface and an outer surface disposed opposite to each other along its thickness direction, the inner surface being located on the side of the bending region facing the opening, and the outer surface being located on the side of the bending region facing away from the opening; the injection molded part is located between the first sidewall and the bending region, and surrounds the outer surface of the bending region, the inner surface of the bending region forming a hollow area; the adhesive component is located between the injection molded part and the mid-plate, the surface of the injection molded part facing the mid-plate is bonded to the mid-plate by the adhesive component.

[0006] In this embodiment, the outer side of the bending area is filled while the inner side is not, thereby avoiding stress concentration and damage to the display module when subjected to external forces. This allows the bending area to maintain a certain strength while possessing better flexibility and impact resistance, effectively reducing the risk of damage to the bending area due to external forces, improving the reliability and stability of the display module, and thus ensuring the continued excellent display effect of the electronic device.

[0007] In one possible implementation of the first aspect described above, the injection molded part has a first gap along the first direction and the first sidewall, and the adhesive part has a second gap along the first direction and the first sidewall.

[0008] In one possible implementation of the first aspect described above, the first sidewall is perpendicular to the middle plate, and the first gap is less than or equal to the second gap.

[0009] In one possible implementation of the first aspect described above, the dimension of the adhesive in the second direction is less than or equal to 0.15 mm, the dimension in the first direction is less than or equal to 1.6 mm, and the difference between the first gap and the second gap is less than or equal to 0.2 mm.

[0010] In one possible implementation of the first aspect described above, a polarizer is further included, the polarizer being located on the side of the display module away from the adhesive, the polarizer and the display module being stacked along the second direction, and the polarizer having a third gap along the first direction and the first sidewall, the third gap being larger than the second gap.

[0011] In one possible implementation of the first aspect described above, a cover plate and an optically transparent adhesive layer are also included, wherein the cover plate, the optically transparent adhesive layer, the polarizer, and the display module are stacked sequentially along the second direction.

[0012] In one possible implementation of the first aspect described above, two sealing members are respectively provided at opposite ends of the bending area along the width direction of the electronic device, and the hollow area is located between the two sealing members. The material of the sealing members is different from that of the injection molded part, and the width direction of the electronic device is perpendicular to the first direction and the second direction.

[0013] In one possible implementation of the first aspect above, the sealing element is made of one of the following materials: cationic adhesive, UV adhesive, or thermosetting adhesive.

[0014] In one possible implementation of the first aspect above, the injection molded part is made of one of the following materials: UV adhesive or thermosetting adhesive.

[0015] In one possible implementation of the first aspect described above, the adhesive includes dispensing or backing adhesive. Attached Figure Description

[0016] Figure 1A A front view of a mobile phone 100 is shown;

[0017] Figure 1B A side view of a mobile phone 100 is shown;

[0018] Figure 2 A first structural schematic diagram of a mobile phone 100 is shown;

[0019] Figure 3 A schematic diagram of the structure of the casing 30 of a mobile phone 100 is shown;

[0020] Figure 4A A schematic diagram of a second structure of a mobile phone 100 is shown;

[0021] Figure 4B A schematic diagram of a third structure of a mobile phone 100 is shown;

[0022] Figure 5 A schematic diagram of a first cross-section of a mobile phone 100 along the ZY plane is shown;

[0023] Figure 6A A schematic diagram of a second cross-section of a mobile phone 100 along the ZY plane is shown;

[0024] Figure 6B A schematic diagram of the bottom structure of a mobile phone 100 is shown;

[0025] Figure 6C A schematic diagram of a third cross-section of a mobile phone 100 along the ZY plane is shown;

[0026] Figure 6D A schematic diagram of a fourth cross-section of a mobile phone 100 along the ZY plane is shown;

[0027] Figure 7 A fifth cross-sectional view of a mobile phone 100 along the ZY plane is shown;

[0028] Figure 8 A sixth cross-sectional view of a mobile phone 100 along the ZY plane is shown;

[0029] Figure 9 A schematic diagram of the seventh section of a mobile phone 100 along the ZY plane is shown;

[0030] Figure 10 The diagram shows an eighth cross-section of a mobile phone 100 along the ZY plane. Detailed Implementation

[0031] The illustrative embodiments of this application include, but are not limited to, a display screen and an electronic device.

[0032] It is understood that the electronic device provided in this application includes a housing and a display screen as described in any embodiment of this application, with the display screen disposed on the housing. The electronic device provided in this application may include, but is not limited to, any of the following electronic devices with microphones: mobile phones, tablets, laptops, cameras, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, smart vehicles, smart robots, industrial equipment, etc. This application does not impose any limitations on this. For ease of description, the following explanation uses a mobile phone 100 as an example.

[0033] Figure 1A A front view of mobile phone 100 is shown. Figure 1B A side view of the mobile phone 100 is shown. Before introducing the electronic device, the directions indicated in the figures of this application will be explained. In the figures of this application, the X-axis direction represents the width direction of the mobile phone 100, the Y-axis direction represents the length direction of the mobile phone 100, and the Z-axis direction represents the thickness direction of the mobile phone 100. The X-axis, Y-axis, and Z-axis directions are perpendicular to each other. The negative Y-axis direction can be, for example, a first direction, and the positive Z-axis direction can be, for example, a second direction.

[0034] According to some embodiments, the mobile phone 100 includes a display screen 10, a circuit board 20, and a housing 30 (or structural component).

[0035] refer to Figure 2 The display screen 10 includes a cover plate 11 and a display module 12, which are stacked along the negative Z-axis. The cover plate 11 is made of glass, for example, and is bonded to the display module 12 by an optically transparent adhesive (OCA) layer.

[0036] According to one embodiment, the display screen 10 is a flat screen, and the cover plate 11 and the display module 12 are planar structures.

[0037] According to some embodiments, the display screen 10 is a curved screen and a 2.5D screen, the display module 12 has a planar structure, and the edge of the cover plate 11 is chamfered.

[0038] According to some embodiments, the display screen 10 is a curved screen and a 3D screen, and the edges of the display module 12 and the cover plate 11 are both curved and deformed.

[0039] It is understood that the display 10 described herein is applicable to all of the above screen types.

[0040] The housing 30 of the mobile phone 100 is used to support other components such as the display screen 10 and the circuit board 20. For example, the housing 30 can be a single piece. For another example, see reference... Figure 3 The housing 30 can be disassembled into two mechanical parts: a middle frame 31 and a back cover 32 (or battery cover). The middle frame 31 includes sidewalls extending circumferentially along the electronic device (e.g., including a first sidewall), and a middle plate for supporting various components. Figure 3 (Not shown in the image). According to some embodiments, the middle plate can be processed to have features such as holes and steps.

[0041] refer to Figure 4AThe display module 12 includes a polarizer (POL) 121, a display panel 122, a back film 123, a mesh adhesive 124, foam 125, and copper foil 126 arranged sequentially along the negative Z-axis. At the lower edge of the display screen 10, the panel 122 has a pad bending (PB) area. (Reference) Figure 4B After being bent in the PB area, Panel 122 is electrically connected to the flexible printed circuit board (FPC) 13. The FPC is connected to the motherboard via a board-to-board connector (BTB) 14, thereby realizing the electrical connection between Panel 122 and the motherboard.

[0042] It is understood that this application does not restrict the location of the PB area. In some other embodiments, the PB area may also be arranged circumferentially along the edge of the display module 12.

[0043] The copper foil 126 can protect and support the display module 12, prevent film marks from forming on the screen, and can dissipate heat evenly, thus achieving electrostatic discharge (ESD) protection.

[0044] Foam 125 provides impact resistance, and mesh adhesive 124 is used to bond the module materials. According to some embodiments, foam 125 and mesh adhesive 124 can be replaced with silicone encapsulation pad adhesive (SEPA), and their impact resistance and adhesive properties remain unchanged after the replacement.

[0045] POL 121 can eliminate the influence of ambient light. According to some embodiments, POL 121 can be replaced with a color filter on encapsulation (COE), that is, a color filter, which can also achieve the effect of eliminating the influence of ambient light.

[0046] The following describes an embodiment of a mobile phone 100.

[0047] refer to Figure 5 The middle frame 31 has an adhesive dispensing step 311, which is a stepped structure located on the side of the middle frame 31 facing the positive X-axis direction. There is a gap between the adhesive dispensing step 311, the display module 12, and the adhesive backing M2. The adhesive dispensing step 311 can seal, fix, and protect the internal components of the display module, while ensuring structural stability. The cover plate 11 is bonded to the adhesive dispensing step 311 of the middle frame 31 by sealant M1, and the display module 12 is bonded to the middle frame 31 by adhesive backing M2. Thus, the distance from the outer edge of the screen display area to the inner wall of the middle frame 31 is 0.8mm to 1mm, forming a relatively wide black border.

[0048] The following describes another embodiment of the mobile phone 100.

[0049] refer to Figure 6A , Figure 6B and Figure 6C The lower part of the display module 12 is filled with an injection molded part M3. The middle frame 31 does not have a glue dispensing step, and the bottom surface of the injection molded part M3 facing the negative Z-axis direction is connected to the middle frame 31 through a backing adhesive M2.

[0050] Further reference Figure 6D The mobile phone 100 includes a protective layer, a display module 12, and a mid-frame 31. The protective layer includes a cover plate 11 and an optically transparent adhesive layer 15 arranged sequentially along the negative Z-axis. The cover plate 11 is bonded to the display module 12 via the optically transparent adhesive layer. The display module 12 includes a planar area and a PB area. The planar area includes a POL 121, a Panel 122, a back film 123, and a support member 127 stacked in a square along the negative Z-axis. For example, the support member 127 may include the aforementioned foam 125 and mesh adhesive 124, or it may be SEPA. The PB area includes a shielding layer 128 and a Panel 122 stacked in a square along the Y-axis. The inner and outer sides of the PB area are filled with an injection molded part M3. The bottom surface of the injection molded part M3 facing the negative Z-axis square is connected to the mid-frame 31 via a back adhesive M2.

[0051] Thus, the distance from the outer edge of the screen display area to the inner wall of the middle frame 31 is 0.4mm to 0.5mm, which is 0.4mm to 0.6mm narrower than the aforementioned embodiment.

[0052] However, in the embodiment where the middle frame 31 does not have a dispensing step, since the inner and outer sides of the display module 12 are filled with injection molded parts M3, the display panel 122 in the PB area may be affected by external forces when using low-pressure injection molding (LIPO) or when the user uses the electronic device. At this time, both the inner and outer sides of the PB area are squeezed, which may cause partial breakage of the circuits (such as power lines) in the PB area, resulting in faults such as bright lines, bright spots, and screen flickering, thereby affecting the display effect of the screen.

[0053] To address the aforementioned technical problems, this application proposes an electronic device comprising a display screen, wherein the display module of the display screen undergoes single-sided potting in the PB area. Specifically, the outer side of the PB area is filled with injection-molded material, while the inner side has a hollow structure. This prevents the PB area from being subjected to pressure on both sides when affected by external forces, thereby reducing the failure rate of the display screen.

[0054] refer to Figure 7According to one embodiment, a mobile phone 100 includes a protective layer, a display module 12, and a mid-frame 31. The protective layer includes a cover plate 11 and an optically transparent adhesive layer 15 arranged sequentially along the negative Z-axis. The cover plate 11 is bonded to the display module 12 via the optically transparent adhesive layer 15. The display module 12 includes a planar (Pad) area and a PB area. The planar area includes a POL 121, a Panel 122, a back film 123, and a support member 127 stacked along the negative Z-axis. The POL 121 is located on the side of the display module 12 opposite to the adhesive member M2. The POL 121 and the display module 12 are stacked along the Z-axis, and the cover plate 11 is bonded to the POL 121 via the optically transparent adhesive layer 15. For example, the support member 127 may include the aforementioned foam 125 and mesh adhesive 124, or it may be SEPA. The PB area includes a shielding layer 128 and a Panel 122 stacked in a square along the Y-axis. Compared to Figure 6C In the embodiment shown, the outer side of the PB area of ​​the display module 12 is filled with injection molded part M3, while the inner side of the PB is a hollow structure and is not filled.

[0055] like Figure 7 As shown, the middle frame 31 includes a first sidewall and a middle plate that are perpendicular to each other. The first sidewall is parallel to the Z-axis, the middle plate is parallel to the X-axis, and one end of the middle plate along the negative Y-axis is connected to the first sidewall. The first direction is the length or width direction of the middle plate. The display module 12 and the middle plate are stacked sequentially along the Z-axis.

[0056] The PB area is located at one end of the display module 12 along the negative Y-axis. The PB area includes an opening away from the first sidewall, and an inner surface and an outer surface disposed opposite to each other along its thickness direction, wherein the inner surface is located on the side of the PB area facing the opening, and the outer surface is located on the side of the PB area away from the opening.

[0057] The injection molded part M3 is located between the first sidewall and the PB area, and surrounds the outer surface of the PB area, while the inner surface of the PB area forms a hollow region.

[0058] The injection molded part M3 and the adhesive part M2 are bonded together, and the adhesive part M2 is bonded to the middle plate of the middle frame 31. The adhesive part M2 can be applied with dots or adhesive backing; this application does not limit this. It is understood that... Figure 7 A gap (hereinafter referred to as the first gap) exists between the first sidewall of the shown middle frame 31 and the injection molded part M3, and a gap (hereinafter referred to as the second gap) also exists between the first sidewall and the adhesive part M2. Figure 7 In the embodiment shown, the first gap is equal to the second gap.

[0059] According to some embodiments, the injection molded part M3 is made of one of the following materials: UV adhesive or thermosetting adhesive.

[0060] According to some embodiments, the PB region of Panel 122 is provided with two sealing members at both ends along the X-axis, and the space between the two sealing members is a hollow area within the opening of the PB region.

[0061] The material of the sealing component can be different from that of the injection-molded part M3. For example, the sealing component may be made of one of the following materials: cationic adhesive, UV adhesive, or thermosetting adhesive. This application does not limit the material of the sealing component; any material that does not react with the injection-molded adhesive is within the scope of protection of this application. The adhesive modulus of the sealing component can be 1–20 MPa, for example, 1 MPa or 20 MPa.

[0062] refer to Figure 8 The thickness A of the cover plate 11 is 0.5–0.55 mm, for example, 0.5 mm or 0.55 mm. The thickness B of the optically transparent adhesive layer 15 is 75–100 μm, for example, 75 μm or 100 μm. The thickness C of the adhesive M2 is 0–0.15 mm, for example, 0.01 mm or 0.15 mm. The width D of the adhesive M2 is 0–1.6 mm, for example, 0.01 mm or 1.6 mm. It is understood that the above values ​​are for illustrative purposes only and are not intended to limit the application.

[0063] refer to Figure 9 In this embodiment of the application, the outer side of the PB area of ​​the display module 12 is filled with injection molded part M3, while the inner side is not filled.

[0064] The following is combined with Figure 10 Another embodiment of the mobile phone 100 is described. In this embodiment, the first gap is smaller than the second gap.

[0065] refer to Figure 10 According to one embodiment, the mobile phone 100 includes a protective layer, a display module 12, and a mid-frame 31. The protective layer includes a cover plate 11 and an optically transparent adhesive layer 15 arranged sequentially along the negative Z-axis. The cover plate 11 is bonded to the display module 12 via the optically transparent adhesive layer 15. The display module 12 includes a planar area and a PB area. The planar area includes a POL 121, a Panel 122, a back film 123, and a support member 127 stacked along the negative Z-axis. The POL 121 is located on the side of the display module 12 opposite to the adhesive member M2. The POL 121 and the display module 12 are stacked along the Z-axis, and the cover plate 11 is bonded to the POL 121 via the optically transparent adhesive layer 15. For example, the support member 127 may include the aforementioned foam 125 and mesh adhesive 124, or it may be SEPA. The PB area includes a shielding layer 128 and a Panel 122 stacked in a square along the Y-axis. Compared to Figure 7In the illustrated embodiment, the adhesive component M2 is recessed inward along the X-axis relative to the injection molded component M3, meaning there is a distance E between the edge of the adhesive component M2 along the negative X-axis and the edge of the injection molded component M3 along the negative X-axis; that is, the difference between the first gap and the second gap is E. By setting the aforementioned distance E, a gap is formed between the injection molded component M3, the adhesive component M2, and the middle frame 31, thereby reducing the impact of external forces on the injection molded component M3 when the middle frame 31 is subjected to external forces, thus preventing damage to the display module 12. This not only improves the ball-launching capability of the electronic device, reduces the impact of drops and movement on the structure of the electronic device, and improves the stability of the display module, but also reduces costs.

[0066] The middle frame 31 includes a first sidewall and a middle plate that are perpendicular to each other. The first sidewall is parallel to the Z-axis, and the middle plate is parallel to the X-axis. One end of the middle plate along the negative Y-axis is connected to the first sidewall. The first direction is either the length direction or the width direction of the middle plate. The display module 12 and the middle plate are stacked sequentially along the Z-axis.

[0067] The PB area is located at one end of the display module 12 along the negative Y-axis. The PB area includes an opening away from the first sidewall, and an inner surface and an outer surface disposed opposite to each other along its thickness direction, wherein the inner surface is located on the side of the PB area facing the opening, and the outer surface is located on the side of the PB area facing the opening to the north.

[0068] The injection molded part M3 is located between the first sidewall and the PB area, and surrounds the outer surface of the PB area, while the inner surface of the PB area forms a hollow region.

[0069] POL 121 has a gap (hereinafter referred to as the third gap) with the first sidewall along the negative Y-axis direction. According to one embodiment, the third gap is larger than the second gap.

[0070] The injection molded part M3 and the adhesive part M2 are bonded together, and the adhesive part M2 is bonded to the middle plate of the middle frame 31. The adhesive part M2 can be applied with dots or adhesive backing; this application does not limit this. It is understood that... Figure 10 There is a gap between the first sidewall of the middle frame 31 and the injection molded part M3 shown. In some other embodiments, there may be no gap between the first sidewall of the middle frame 31 and the injection molded part M3, that is, the injection molded part M3 and the first sidewall of the middle frame 31 are bonded together. This application does not limit this.

[0071] According to some embodiments, the injection molded part M3 is made of one of the following materials: UV adhesive or thermosetting adhesive.

[0072] According to some embodiments, the PB region of Panel 122 is provided with sealing elements at both ends along the X-axis, and the space between the two sealing elements is a hollow area within the opening of the PB region.

[0073] The material of the sealing component can be different from that of the injection-molded part M3. For example, the sealing component may be made of one of the following materials: cationic adhesive, UV adhesive, or thermosetting adhesive. This application does not limit the material of the sealing component; any material that does not react with the injection-molded adhesive is within the scope of protection of this application. The adhesive modulus of the sealing component can be 1–20 MPa, for example, 1 MPa or 20 MPa.

[0074] refer to Figure 10 The thickness A of the cover plate 11 is 0.5–0.55 mm, for example, 0.5 mm or 0.55 mm. The thickness B of the optically transparent adhesive layer 15 is 75–100 μm, for example, 75 μm or 100 μm. The thickness C of the adhesive component M2 is 0–0.15 mm, for example, 0.01 mm or 0.15 mm. The width D of the adhesive component M2 is 0–1.6 mm, for example, 0.01 mm or 1.6 mm. The distance E between the edge of the adhesive component M2 along the negative X-axis and the edge of the injection molded part M3 along the negative X-axis is 0–0.2 mm, that is, the difference between the first gap and the second gap is less than or equal to 0.2 mm, for example, 0.01 mm or 0.2 mm. It is understood that the above values ​​are only illustrative and are not intended to limit the scope of this application.

[0075] According to some embodiments, the edge of the adhesive M2 facing the negative X-axis is closer to the first sidewall of the middle frame 31 than the edge of the POL 121 facing the negative X-axis, so that the adhesive line of the adhesive M2 avoids the edge of the POL 121, preventing the POL 121 from being suspended, achieving sufficient support for the POL 121, and ensuring that the weak points of the edge of the POL 121 are not affected by external forces.

[0076] It should be noted that in the examples and description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, including an element by a statement does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0077] Although this application has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made thereto without departing from the scope of this application.

Claims

1. An electronic device, characterized in that, Includes display module, injection molded parts, adhesive parts, and mid-frame, among which: The middle frame includes a middle plate and a first side wall. One end of the middle plate is connected to the first side wall along a first direction, where the first direction is the length direction or the width direction of the middle plate. The display module and the middle plate are stacked sequentially along a second direction, which is the thickness direction of the middle plate. The display module has a bending area at one end along the first direction, and the opening of the bending area faces away from the first sidewall. The bending area includes an inner surface and an outer surface disposed opposite to each other along its thickness direction. The inner surface is located on the side of the bending area facing the opening, and the outer surface is located on the side of the bending area away from the opening. The injection molded part is located between the first sidewall and the bending area, and surrounds the outer surface of the bending area, while the inner surface of the bending area forms a hollow region. The adhesive is located between the injection molded part and the middle plate, and the surface of the injection molded part facing the middle plate is bonded to the middle plate by the adhesive.

2. The electronic device according to claim 1, characterized in that, The injection molded part has a first gap along the first direction and the first sidewall, and the adhesive part has a second gap along the first direction and the first sidewall.

3. The electronic device according to claim 2, characterized in that, The first sidewall is perpendicular to the middle plate, and the first gap is less than or equal to the second gap.

4. The electronic device according to claim 3, characterized in that, The dimension of the adhesive component along the second direction is less than or equal to 0.15 mm, the dimension along the first direction is less than or equal to 1.6 mm, and the difference between the first gap and the second gap is less than or equal to 0.2 mm.

5. The electronic device according to claim 4, characterized in that, Also includes polarizers, The polarizer is located on the side of the display module away from the adhesive. The polarizer and the display module are stacked along the second direction. The polarizer has a third gap along the first direction and the first sidewall. The third gap is larger than the second gap.

6. The electronic device according to claim 5, characterized in that, It also includes a cover plate and an optically clear adhesive layer. The cover plate, the optically transparent adhesive layer, the polarizer, and the display module are stacked sequentially along the second direction.

7. The electronic device according to claim 6, characterized in that, Two sealing members are respectively provided at opposite ends of the bending area along the width direction of the electronic device. The hollow area is located between the two sealing members. The material of the sealing members is different from that of the injection molded part. The width direction of the electronic device is perpendicular to the first direction and the second direction.

8. The electronic device according to claim 7, characterized in that, The sealing component is made of one of the following materials: cationic adhesive, UV adhesive, or thermosetting adhesive.

9. The electronic device according to any one of claims 1-8, characterized in that, The injection molded part is made of one of the following materials: UV adhesive or thermosetting adhesive.

10. The electronic device according to any one of claims 1-9, characterized in that, The adhesive includes dispensing or backing adhesive.

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