Stable semiconductor heating disc

Abstract

This utility model discloses a stable semiconductor heating plate, relating to the technical field of temperature control and thermal conductive materials. It includes a base, a placement groove, a heating plate, and heating wires. The base has a placement groove inside, and the heating plate is movably connected inside the placement groove. The diameter of the heating plate is equal to the diameter of the placement groove. Heating wires are spirally arranged inside the heating plate. Multiple connecting rods are fixedly connected to the inner walls of both sides of the base. Hydraulic rods are movably connected to the tops of the connecting rods. Rollers are located at the top of the hydraulic rods and are fitted inside the bottom of the heating plate. A mesh cover is movably hinged to the top of the base. Sponge is fixedly connected inside the placement groove. This improves airflow around the heating plate, helps distribute heat more evenly, and avoids damage to the wafer.

Description

Technical Field

[0001] This utility model belongs to the field of temperature control and thermal conductive materials technology, and particularly relates to a stable semiconductor heating plate. Background Technology

[0002] In semiconductor manufacturing, temperature control is crucial for process stability and the quality of the final product. Semiconductor heating plates typically use materials with high thermal conductivity (such as aluminum alloys and stainless steel) and ceramic materials (such as aluminum nitride and silicon carbide) to ensure rapid and uniform heat transfer. Simultaneously, the design of the heating plate needs to ensure high thermal conductivity and a low coefficient of thermal expansion to avoid deformation caused by thermal stress. Semiconductor heating plates need to operate in complex environments such as high temperatures, vacuum, plasma, and chemical gases, thus requiring high standards for the high-temperature stability, thermal conductivity, corrosion resistance, and low thermal mass of the materials. Some new heating plates integrate heating and cooling functions, typically exhibiting rapid temperature response characteristics, quickly reaching the required temperature and thus improving production efficiency.

[0003] However, because the heating plate needs to operate in high temperature and complex environment, its maintenance requirements are high. It needs to be cleaned and inspected regularly to ensure the stability and service life of the equipment. For some complex semiconductor processes, the design and optimization of the heating plate need to be customized for specific processes, which increases the difficulty of research and development and production.

[0004] Therefore, it is necessary to improve it and propose a new type of stable semiconductor heating plate. The hydraulic rod is driven to extend and retract by using the pressure of hydraulic oil. When the hydraulic system is working, the hydraulic oil is pressurized and pushes the piston of the hydraulic rod, thereby realizing the extension and retraction of the hydraulic rod. When the heating plate needs to be lowered, it will be completely retracted into the placement slot. Utility Model Content

[0005] To achieve the above objectives, this utility model proposes a stable semiconductor heating plate, including a base, a placement groove, a heating plate, and a heating wire. The placement groove is provided inside the base, and the heating plate is movably connected inside the placement groove. The diameter of the heating plate is equal to the diameter of the placement groove. The heating wire is spirally laid inside the heating plate.

[0006] In one example, multiple connecting rods are fixedly connected to the inner walls on both sides of the base, and hydraulic rods are movably connected to the top of the multiple connecting rods. The top of the hydraulic rods has rollers, and the rollers are fitted inside the bottom end of the heating plate.

[0007] In one example, a mesh cover is movably hinged to the top of the base.

[0008] In one example, a sponge is fixedly connected to the inside of the placement slot.

[0009] In one example, a support rod is fixedly installed at the top of the placement slot, and a screen is fixedly installed at the top of the support rod.

[0010] In one example, the bottom of the support rod and the screen is enclosed to form a hollow heat dissipation area.

[0011] In one example, pull rings are fixedly installed on both outer sides of the base.

[0012] In one example, the top of the heating wire is connected to multiple wires.

[0013] The stable semiconductor heating plate proposed in this utility model can bring the following beneficial effects:

[0014] 1. This utility model has a screen fixedly installed by multiple support rods. In high temperature or chemical reaction environments, the screen can prevent material from depositing on the heating element. This design helps to extend the service life of the heating element while maintaining heating efficiency.

[0015] 2. This utility model has a sponge fixedly connected inside the placement groove. The sponge is usually used for heat insulation and cushioning to protect the heating plate and the surrounding equipment. In the semiconductor heating plate, the sponge can prevent excessive heat transfer to the surrounding environment, reduce heat loss, and at the same time avoid the impact of high temperature on other sensitive components. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of a stable semiconductor heating plate according to the present invention.

[0018] Figure 2 This is a side view of the heating plate and heating wire of a stable semiconductor heating plate according to the present invention.

[0019] Figure 3 This is a schematic diagram of the internal screen structure of the placement slot of the color printing chamber of a stable semiconductor heating plate according to the present invention.

[0020] Figure 4 This is a cross-sectional schematic diagram of the screen and hollow heat dissipation area inside the placement groove of a stable semiconductor heating plate according to the present invention.

[0021] The attached figures are labeled as follows:

[0022] 1. Base; 2. Placement slot; 3. Heating plate; 4. Heating wire; 5. Connecting rod; 6. Hydraulic rod; 7. Mesh cover; 8. Sponge; 9. Support rod; 10. Screen; 11. Hollow heat dissipation area; 12. Pull ring; 13. Production line. Detailed Implementation

[0023] To more clearly illustrate the overall concept of this utility model, a detailed description is provided below with reference to the accompanying drawings.

[0024] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "a solution," "some solutions," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that solution or example is included in at least one solution or example of this invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same solution or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more solutions or examples.

[0028] like Figures 1-4 As shown, this utility model provides a stable semiconductor heating plate, which includes a base 1, a placement groove 2, a heating plate 3, and a heating wire 4. The placement groove 2 is provided inside the base 1, and the heating plate 3 is movably connected inside the placement groove 2. The diameter of the heating plate 3 is equal to the diameter of the placement groove 2. The heating wire 4 is spirally laid inside the heating plate 3. The heating plate 3 and the heating wire 4 are usually made of high-temperature corrosion-resistant materials, such as high-purity aluminum, high-silicon, metal, ceramic, quartz, glass, etc., to ensure the purity and reliability of the wafer heat treatment process. The heating wire 4 is usually used as the heating element, and heat is transferred through the bottom of the heating plate 3. Multiple connecting rods 5 are fixedly connected to the inner walls on both sides of the base 1. A hydraulic rod 6 is movably connected to the top of the connecting rod 5. The top of the hydraulic rod 6 has a roller. The roller can rotate flexibly and is embedded in the bottom end of the heating plate 3. The roller allows the heating plate 3 to rotate flexibly during the lifting process, reducing friction and ensuring the smoothness of the lifting process.

[0029] The base 1 is the supporting structure of the entire device. It has a placement slot 2 inside to store the heating plate 3 and the heating wire 4. The hydraulic rod 6 is powered by the hydraulic system. The hydraulic system uses the pressure of hydraulic oil to drive the extension and retraction of the hydraulic rod 6. When the hydraulic system is working, the hydraulic oil is pressurized and pushes the piston of the hydraulic rod 6, thereby realizing the extension and retraction of the hydraulic rod 6. When the heating plate 3 needs to be lowered, it will be completely stored in the placement slot 2.

[0030] During the ascent, when it is necessary to raise the heating plate 3, the hydraulic system starts to work, and the piston of the hydraulic rod 6 moves upward. Since the top of the hydraulic rod 6 is engaged with the bottom of the heating plate 3 through the roller, the rise of the hydraulic rod 6 will drive the heating plate 3 and the heating wire 4 to move upward together.

[0031] During the descent process, when the heating plate 3 needs to be lowered, the hydraulic system works in reverse, the piston of the hydraulic rod 6 moves downward, and the descent of the hydraulic rod 6 will drive the heating plate 3 and the heating wire 4 to move downward together, and finally put the heating plate 3 into the placement slot 2 inside the base 1.

[0032] A mesh cover 7 is hinged to the top of the base 1 to prevent heat from being transferred to the surrounding environment, reduce heat loss, and protect operators from burns. It also improves airflow around the heating plate 3, making the heat distribution more uniform. A sponge 8 is fixedly connected inside the placement slot 2. The sponge 8 is usually used for heat insulation and cushioning to protect the heating plate 3 and the surrounding equipment. In the semiconductor heating plate 3, the sponge 8 can prevent excessive heat transfer to the surrounding environment, reduce heat loss, and avoid the impact of high temperature on other sensitive components. The porous structure of the sponge 8 can improve airflow around the heating plate 3 and help the heat to be distributed more evenly. This uniform heat dissipation is crucial for ensuring that the semiconductor is heated evenly during the heating process, which helps to improve the stability of the semiconductor manufacturing process and product quality.

[0033] Multiple support rods 9 are fixedly installed at the top of the placement slot 2. A screen 10 is fixedly installed at the top of the support rods 9. In high temperature or chemical reaction environments, the screen 10 can prevent material from depositing on the heating element. This design helps to extend the service life of the heating element while maintaining heating efficiency. The structure of the screen 10 can enhance the overall structural stability of the heating plate 3, especially in high temperature or high mechanical stress environments. This enhancement helps to improve the durability and reliability of the heating plate 3. It also assists in gas flow and cooling. These functions help to improve the performance and service life of the heating plate 3. The bottom of the support rods 9 and the screen 10 forms a hollow heat dissipation area 11. The hollow heat dissipation area 11 inside the base 1 can absorb excess heat from the heating wire 4, preventing the heating wire 4 from overheating and causing the heating plate 3 to overheat the wafer, thereby avoiding damage to the wafer.

[0034] Pull rings 12 are fixedly installed on both sides of the base 1 to facilitate the placement and removal of the semiconductor heating plate 3 by the operator. Multiple wires 13 are connected to the top of the heating wire 4. The connecting wires 13 at the top of the heating wire 4 connect the heating wire 4 to the external power supply or control system to ensure that the current can be smoothly transmitted to the heating wire 4, thereby making it heat up. These connecting wires 13 usually need to have good conductivity to reduce energy loss and ensure heating efficiency. Since the heating wire 4 will generate high temperature when working, the connecting wires 13 need to have high temperature resistance and good insulation performance to prevent heat from damaging the connecting wires 13, and at the same time avoid safety hazards such as leakage or short circuit. The connecting wires 13 are not only used for electrical connection, but also play a role in fixing the heating wire 4 to ensure that the heating wire 4 will not shift or loosen during operation.

[0035] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0036] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A stable semiconductor heating plate, comprising a base (1), a placement groove (2), a heating plate (3), and a heating wire (4), characterized in that, The base (1) has a placement groove (2) inside, and a heating plate (3) is movably connected inside the placement groove (2). The diameter of the heating plate (3) is equal to the diameter of the placement groove (2). A heating wire (4) is laid inside the heating plate (3), and the heating wire (4) is spiral.

2. The stable semiconductor heating plate according to claim 1, characterized in that, Multiple connecting rods (5) are fixedly connected to the inner walls on both sides of the base (1). A hydraulic rod (6) is movably connected to the top of the multiple connecting rods (5). The top of the hydraulic rod (6) has a roller, which is fitted inside the bottom of the heating plate (3).

3. A stable semiconductor heating plate according to claim 1, characterized in that, The top of the base (1) is movably hinged with a mesh cover (7).

4. A stable semiconductor heating plate according to claim 1, characterized in that, The placement slot (2) is fixedly connected to a sponge (8).

5. A stable semiconductor heating plate according to claim 1, characterized in that, A support rod (9) is fixedly installed at the top of the placement groove (2), and a screen (10) is fixedly installed at the top of the support rod (9).

6. A stable semiconductor heating plate according to claim 5, characterized in that, The bottom of the support rod (9) and the screen (10) forms a hollow heat dissipation area (11).

7. A stable semiconductor heating plate according to claim 1, characterized in that, Pull rings (12) are fixedly installed on both sides of the outer side of the base (1).

8. A stable semiconductor heating plate according to claim 1, characterized in that, The top end of the heating wire (4) is connected to multiple wires (13).

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