A heat dissipation assembly for an electronic device and an electronic device

Abstract

This utility model discloses a heat dissipation component and an electronic device, which solves the technical problem that the air inlet of existing electronic devices cannot be adjusted, thus allowing external dust to easily enter the internal parts of the electronic device through the air inlet. The heat dissipation component of this utility model includes a device base, a cooling fan, and a baffle plate. The device base has multiple air inlet holes. The cooling fan has a housing with an air inlet on the side of the housing facing the device base. The air inlet corresponds to the air inlet holes. The baffle plate is located between the air inlet and the air inlet holes and is slidably connected to the housing. The baffle plate has multiple ventilation holes, each corresponding to one of the multiple air inlet holes. A driving component is connected to the housing and is connected to the baffle plate. The driving component drives the baffle plate to slide on the housing, causing the position of the ventilation holes relative to the air inlet holes to change, thereby adjusting the opening of the air inlet holes.

Description

Technical Field

[0001] This utility model relates to the field of electronic device design technology, and in particular to a heat dissipation component and electronic device for electronic devices. Background Technology

[0002] Existing electronic devices generate heat during operation. To keep these devices at their normal operating temperature, they are typically equipped with cooling fans to dissipate heat.

[0003] Taking laptops as an example, laptops typically use cooling fans for heat dissipation. Circular or rectangular vents are cut into the bottom of the laptop casing as air intakes. However, since the air intake area of ​​current laptop cooling fans is designed to meet maximum load, the opening of these vents is fixed and cannot be adjusted. This means that when the laptop is powered off, external dust can easily enter the laptop through these vents. As dust accumulates inside, it affects heat dissipation performance, leading to overheating, reduced lifespan, and decreased performance, causing the laptop to lag or stutter.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0005] This utility model discloses a heat dissipation component and an electronic device for electronic devices, which solves the technical problem that the air inlet of existing electronic devices cannot be adjusted, thus causing external dust to easily enter the inside of the electronic device through the air inlet.

[0006] This utility model provides a heat dissipation component for electronic devices, including a device bottom shell, a cooling fan, and a shielding plate;

[0007] The bottom shell of the device is provided with multiple air inlet holes. The cooling fan has a housing. An air inlet is opened on the side of the housing facing the bottom shell of the device. The air inlet is corresponding to the air inlet holes. The baffle is located between the air inlet and the air inlet holes and is slidably connected to the housing. The baffle is provided with multiple ventilation holes. The multiple ventilation holes are corresponding to the multiple air inlet holes one by one.

[0008] A driving component is connected to the housing and is connected to the baffle plate. The driving component is used to drive the baffle plate to slide on the housing so that the position of the ventilation hole relative to the position of the air inlet hole changes, thereby adjusting the opening of the air inlet hole.

[0009] Optionally, the number and arrangement of the ventilation holes on the baffle plate are the same as the number and arrangement of the air inlet holes on the bottom shell of the equipment.

[0010] Optionally, the plurality of ventilation holes are arranged in a matrix on the shield plate;

[0011] Multiple air inlets are arranged in a matrix on the bottom shell of the device.

[0012] Optionally, the housing is provided with at least one sliding portion;

[0013] The shield plate has a groove that is slidably connected to the sliding part, and the sliding part is slidably connected in the groove.

[0014] Optionally, the chute extends along the length or width of the bottom shell of the equipment.

[0015] Optionally, the driving component is a motor;

[0016] The motor has a drive gear on its output shaft and a rack structure on the side of the baffle plate.

[0017] The drive gear meshes with the rack structure;

[0018] When the motor drives the drive gear to rotate, the drive gear drives the baffle to slide on the housing through the rack structure.

[0019] Optionally, it also includes a control unit and a temperature sensor;

[0020] The control unit is electrically connected to the temperature sensor, and the drive unit is electrically connected to the control unit. The temperature sensor is used to detect the internal temperature of the electronic device, and the control unit is used to control the drive unit to move the baffle plate according to the temperature data detected by the temperature sensor, so as to adjust the opening of the air inlet.

[0021] Optionally, a limit strip is provided on the housing;

[0022] The limiting strip is provided on the side of the baffle plate, and the limiting strip has a limiting part for limiting the displacement of the baffle plate toward the bottom shell of the equipment.

[0023] Optionally, the cooling fan further includes a fan body;

[0024] The fan body is installed inside the housing, and an air guide channel is formed inside the housing. An air outlet is provided on the housing. One end of the air guide channel is connected to the air inlet, and the other end of the air guide channel is connected to the air outlet.

[0025] The present invention provides an electronic device including the aforementioned heat dissipation component.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] In this embodiment, a baffle plate is slidably connected to the housing of the cooling fan. This baffle plate has multiple ventilation holes and is positioned between the air inlet of the device's bottom casing and the air inlet of the cooling fan. Since the multiple air inlet holes correspond one-to-one with the multiple ventilation holes, when the baffle plate slides relative to the housing under the drive of a driving component, the positions of the ventilation holes relative to the multiple air inlet holes change, thereby adjusting the opening of the air inlet holes. Specifically, the greater the overlap between the air inlet holes and the ventilation holes, the larger the opening of the air inlet holes; conversely, the lower the overlap, the smaller the opening. Through this design, since the opening of the air inlet holes can be adjusted, when the electronic device is powered off, the user can completely close the air inlet holes, effectively reducing dust entering the electronic device and protecting it. When the electronic device is in use, the user can adjust the air inlet holes to a suitable opening to meet the normal heat dissipation requirements of the electronic device. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of a heat dissipation assembly for electronic devices provided by this utility model;

[0030] Figure 2 An exploded view of the structure of a heat dissipation component for electronic devices provided by this utility model;

[0031] Figure 3 A diagram illustrating the fit between a shield and a housing in a heat dissipation assembly for an electronic device, provided by this utility model.

[0032] Figure 4 A schematic diagram of the air inlet vent of a heat dissipation component for electronic devices provided by this utility model when it is at its maximum opening.

[0033] Figure 5 A schematic diagram of the air inlet vent of a heat dissipation component for electronic devices provided by this utility model when it is closed;

[0034] Figure 6 A schematic diagram of the air inlet vent of a heat dissipation component for electronic devices provided by this utility model when the opening is halfway.

[0035] Illustration: Cooling fan 1; Air inlet 101; Housing 102; Sliding part 103; Limiting strip 104; Limiting part 1041; Baffle plate 2; Ventilation hole 201; Rack and pinion structure 202; Slide groove 203; Equipment bottom shell 3; Air inlet hole 301; Motor 4; Drive gear 5; Length direction X of equipment bottom shell; Width direction Y of equipment bottom shell. Detailed Implementation

[0036] This utility model discloses a heat dissipation component and an electronic device for electronic devices, which solves the technical problem that the air inlet of existing electronic devices cannot be adjusted, thus causing external dust to easily enter the interior of the electronic device through the air inlet.

[0037] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] Please see Figures 1 to 6 The present invention provides a heat dissipation component for electronic devices, including a device bottom shell 3, a cooling fan 1, and a baffle plate 2.

[0039] The bottom shell 3 of the device is provided with a plurality of air inlet holes 301. The cooling fan 1 has a housing 102. The housing 102 has an air inlet 101 on the side facing the bottom shell 3 of the device. The air inlet 101 is correspondingly arranged with the air inlet holes 301. The baffle plate 2 is located between the air inlet 101 and the air inlet holes 301 and is slidably connected to the housing 102. The baffle plate 2 has a plurality of ventilation holes 201. The plurality of ventilation holes 201 are correspondingly arranged with the plurality of air inlet holes 301.

[0040] A driving component is connected to the housing 102. The driving component is connected to the baffle plate 2. The driving component is used to drive the baffle plate 2 to slide on the housing 102, so that the position of the ventilation hole 201 relative to the position of the air inlet hole 301 changes, thereby adjusting the opening degree of the air inlet hole 301.

[0041] In this embodiment of the heat dissipation assembly, a baffle plate 2 is slidably connected to the housing 102 of the cooling fan 1. The baffle plate 2 has multiple ventilation holes 201 and is positioned between the air inlet 301 of the bottom shell 3 and the air inlet 101 of the cooling fan 1. Since the multiple air inlet holes 301 and the multiple ventilation holes 201 are arranged in a one-to-one correspondence, when the baffle plate 2 slides relative to the housing 102 under the drive of the driving component, the positions of the multiple ventilation holes 201 and the multiple air inlet holes 301 change, thereby adjusting the opening degree of the air inlet holes 301. Specifically, the higher the degree of overlap between the air inlet holes 301 and the ventilation holes 201, the larger the opening degree of the air inlet holes 301; conversely, the lower the degree of overlap between the air inlet holes 301 and the ventilation holes 201, the smaller the opening degree of the air inlet holes 301. With the above design, since the opening of the air inlet vent 301 is adjustable, when the electronic device is turned off, the user can completely close the air inlet vent 301, thereby effectively reducing dust from entering the electronic device and protecting it. When the electronic device is in use, the user can adjust the air inlet vent 301 to a suitable opening to meet the normal heat dissipation requirements of the electronic device.

[0042] Furthermore, in this embodiment, the number and arrangement of the ventilation holes 201 on the baffle plate 2 correspond to the number and arrangement of the air inlet holes 301 on the bottom shell 3 of the equipment.

[0043] It should be noted that in this embodiment, the number of ventilation holes 201 can be 9, 12, 16, etc., and the number of air inlet holes 301 can also be 9, 12, 16, etc., and this embodiment does not impose any limitations on this. Furthermore, the plurality of ventilation holes 201 are arranged in a matrix on the baffle plate 2; the plurality of air inlet holes 301 are arranged in a matrix on the equipment bottom shell 3. For example, when the number of ventilation holes 201 is 9, the ventilation holes 201 can be arranged in a 3x3 matrix on the baffle plate 2, and similarly, the air inlet holes 301 are arranged in a 3x3 matrix on the equipment bottom shell 3.

[0044] Furthermore, at least one sliding portion 103 is provided on the housing 102 in this embodiment;

[0045] The shield plate 2 is provided with a groove 203 that is slidably connected to the sliding part 103, and the sliding part 103 is slidably connected in the groove 203.

[0046] Specifically, the aforementioned chute 203 extends along the length or width of the bottom shell 3 of the equipment.

[0047] It should be noted that the above design can effectively improve the stability of the baffle plate 2 when it moves, and the cooperation between the sliding part 103 and the slide groove 203 restricts the direction of movement of the baffle plate 2, that is, restricts the baffle plate 2 to only move along the length or width direction of the bottom shell 3 of the equipment.

[0048] Furthermore, in this embodiment, the driving component is motor 4;

[0049] The output shaft of the motor 4 is provided with a drive gear 5, and the side of the baffle plate 2 is provided with a rack structure 202;

[0050] The drive gear 5 meshes with the rack structure 202.

[0051] It should be noted that, through the above design, when the motor 4 drives the drive gear 5 to rotate, the drive gear 5 drives the baffle plate 2 to slide on the housing 102 through the rack structure 202.

[0052] Furthermore, the heat dissipation component in this embodiment also includes a control unit and a temperature sensor;

[0053] The control unit is electrically connected to the temperature sensor, and the drive unit is electrically connected to the control unit. The temperature sensor is used to detect the internal temperature of the electronic device. The control unit is used to control the drive unit to move the baffle 2 according to the temperature data detected by the temperature sensor, so as to adjust the opening of the air inlet vent 301.

[0054] It should be noted that, through the above design, when the temperature sensor detects that the internal temperature of the electronic device is high, the control unit can control the drive component to start, and the drive component drives the baffle plate 2 to move relative to the housing 102, thereby increasing the opening degree of the air inlet vent 301. Similarly, when the temperature sensor detects that the internal temperature of the electronic device is close to the room temperature, the control unit can control the drive component to start, and the drive component drives the baffle plate 2 to move relative to the housing 102, thereby closing the air inlet vent 301, thus preventing external dust from entering the interior of the electronic device through the air inlet vent 301.

[0055] Additionally, it should be noted that the aforementioned control unit can specifically be the central processing unit (CPU) of the electronic device, while the temperature sensor is specifically installed inside the electronic device.

[0056] Furthermore, in this embodiment, a limiting strip 104 is provided on the housing 102;

[0057] The limiting strip 104 is provided on the side of the shield 2, and the limiting strip 104 has a limiting part 1041 for limiting the displacement of the shield 2 toward the bottom shell 3 of the equipment.

[0058] It should be noted that the above design can effectively limit the position of the baffle 2, ensuring that the baffle 2 moves in a preset direction.

[0059] Furthermore, the cooling fan 1 in this embodiment also includes a fan body;

[0060] The fan body is installed inside the housing 102, and an air guide channel is formed inside the housing 102. An air outlet is provided on the housing 102. One end of the air guide channel is connected to the air inlet 101, and the other end of the air guide channel is connected to the air outlet.

[0061] It should be noted that, through the above design, when the fan body is started, outside air enters the air guide channel through the air inlet 301 and the air inlet 101, and is blown towards the heat-generating electronic components through the air outlet to remove the heat generated by them.

[0062] Please see Figure 1 An electronic device provided in this embodiment of the present invention includes the heat dissipation component described above.

[0063] Specifically, the aforementioned electronic device can be a laptop computer. The device bottom shell 3 in the heat dissipation assembly is specifically the bottom shell of a laptop computer, and the cooling fan 1 is specifically installed inside the laptop computer to dissipate heat from the electronic components inside the laptop computer.

[0064] In the heat dissipation assembly of the electronic device in this embodiment, a baffle plate 2 is slidably connected to the housing 102 of the cooling fan 1. The baffle plate 2 has multiple ventilation holes 201 and is positioned between the air inlet 301 of the bottom shell 3 and the air inlet 101 of the cooling fan 1. Since the multiple air inlet holes 301 and the multiple ventilation holes 201 are arranged in a one-to-one correspondence, when the baffle plate 2 slides relative to the housing 102 under the drive of a driving component, the position of the multiple ventilation holes 201 relative to the position of the multiple air inlet holes 301 changes, thereby adjusting the opening degree of the air inlet holes 301. Specifically, the higher the degree of overlap between the air inlet holes 301 and the ventilation holes 201, the larger the opening degree of the air inlet holes 301; conversely, the lower the degree of overlap between the air inlet holes 301 and the ventilation holes 201, the smaller the opening degree of the air inlet holes 301. With the above design, since the opening of the air inlet vent 301 is adjustable, when the electronic device is turned off, the user can completely close the air inlet vent 301, thereby effectively reducing dust from entering the electronic device and protecting it. When the electronic device is in use, the user can adjust the air inlet vent 301 to a suitable opening to meet the normal heat dissipation requirements of the electronic device.

[0065] The above provides a detailed description of a heat dissipation component for electronic devices and the electronic devices themselves. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation component for electronic devices, characterized in that, Includes the equipment bottom shell (3), cooling fan (1) and shield (2); The bottom shell (3) of the equipment is provided with a plurality of air inlet holes (301). The cooling fan (1) has a housing (102). The housing (102) has an air inlet (101) on the side facing the bottom shell (3). The air inlet (101) is correspondingly provided with the air inlet holes (301). The baffle plate (2) is located between the air inlet (101) and the air inlet holes (301) and is slidably connected to the housing (102). The baffle plate (2) is provided with a plurality of ventilation holes (201). The plurality of ventilation holes (201) are correspondingly provided with the plurality of air inlet holes (301). A drive member is connected to the housing (102), and the drive member is connected to the baffle plate (2). The drive member is used to drive the baffle plate (2) to slide on the housing (102) so that the position of the ventilation hole (201) relative to the position of the air inlet hole (301) changes, thereby adjusting the opening of the air inlet hole (301).

2. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, The number and arrangement of the ventilation holes (201) on the baffle plate (2) are the same as the number and arrangement of the air inlet holes (301) on the bottom shell (3) of the equipment.

3. The heat dissipation assembly for electronic devices according to claim 2, characterized in that, The plurality of ventilation holes (201) are arranged in a matrix on the baffle plate (2); Multiple air inlet holes (301) are arranged in a matrix on the bottom shell (3) of the equipment.

4. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, At least one sliding part (103) is provided on the housing (102). The shield (2) has a groove (203) that is slidably connected to the sliding part (103), and the sliding part (103) is slidably connected in the groove (203).

5. The heat dissipation assembly for electronic devices according to claim 4, characterized in that, The chute (203) extends along the length or width of the bottom shell (3) of the equipment.

6. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, The driving component is a motor (4); The output shaft of the motor (4) is provided with a drive gear (5), and the side of the baffle plate (2) is provided with a rack structure (202). The drive gear (5) meshes with the rack structure (202); When the motor (4) drives the drive gear (5) to rotate, the drive gear (5) drives the baffle (2) to slide on the housing (102) through the rack structure (202).

7. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, It also includes a control unit and a temperature sensor; The control unit is electrically connected to the temperature sensor, and the drive unit is electrically connected to the control unit. The temperature sensor is used to detect the internal temperature of the electronic device. The control unit is used to control the drive unit to move the baffle (2) according to the temperature data detected by the temperature sensor, so as to adjust the opening of the air inlet (301).

8. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, A limiting strip (104) is provided on the housing (102). The limiting strip (104) is provided on the side of the shield (2), and the limiting strip (104) has a limiting part (1041) for limiting the displacement of the shield (2) toward the bottom shell (3) of the equipment.

9. The heat dissipation assembly for electronic devices according to claim 1, characterized in that, The cooling fan (1) also includes a fan body; The fan body is installed inside the housing (102), and an air guide channel is formed inside the housing (102). An air outlet is provided on the housing (102). One end of the air guide channel is connected to the air inlet (101), and the other end of the air guide channel is connected to the air outlet.

10. An electronic device, characterized in that, Includes the heat dissipation component as described in any one of claims 1 to 9.

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