A heat dissipation structure for an LCD display module and an LCD display module
By constructing a continuous heat conduction path in the LCD module, the problem of poor heat dissipation was solved, effective heat dissipation was achieved, the temperature was reduced, and the film material deformation was avoided, thus improving the heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG HONGQIN COMM TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-09
AI Technical Summary
The heat dissipation of LCD modules in the current technology is not good, especially in high refresh rate and high brightness application scenarios, where heat is easily accumulated in concentrated areas, resulting in problems such as hot hands and deformation of backlight film.
A continuous heat conduction path is formed by using a first heat-conducting component and a second heat-conducting component. The first heat-conducting component is connected to the iron frame and folded to the driver chip. The second heat-conducting component is located in the vertical projection area of the LED bead. A path for heat conduction from the driver chip and the LED bead to the outside is formed by direct or indirect connection. Combined with the edge-wrapping component, a surrounding heat conduction path is constructed.
It effectively reduces module temperature, prevents membrane warping and overall machine overheating, and improves heat dissipation efficiency.
Smart Images
Figure CN224343625U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display module technology, and in particular to a heat dissipation structure for an LCD display module and an LCD display module. Background Technology
[0002] With the widespread use of LCD modules in mobile devices, especially in high refresh rate and high brightness applications, the overlapping area of the Driver IC and the backlight is the main heat concentration area, which is prone to problems such as burning the hands due to excessive heat. In addition, the problem of backlight film deformation is becoming increasingly prominent.
[0003] As shown in the figure, the LCD module includes a liquid crystal display panel 11, a light guide plate 12, a metal frame 13, LED beads 14, and a driver chip 15 arranged sequentially. In the prior art, a graphite heat dissipation layer 16 is typically attached to the back of the metal frame 13 to dissipate the heat generated by the LED beads 14 and the driver chip 15. However, since the graphite heat dissipation layer 16 is not directly connected to the heat source, heat still accumulates, resulting in poor heat dissipation and failing to meet the heat dissipation requirements of electronic devices. Therefore, improvements to the existing technology are needed.
[0004] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content
[0005] This invention provides a heat dissipation structure for an LCD display module and an LCD display module to solve the problems existing in the prior art.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A heat dissipation structure for an LCD display module, the LCD display module comprising a liquid crystal display panel, a light guide plate and an iron frame arranged in sequence, wherein an LED bead for providing backlight and a driver chip electrically connected to the LED bead are disposed within the iron frame;
[0008] The heat dissipation structure includes:
[0009] A first heat-conducting component, the first end of which is connected to the iron frame, and the second end of which is folded over to connect to the driving chip;
[0010] The second heat-conducting component is disposed on the iron frame and located in the area where the LED beads are vertically projected onto the iron frame;
[0011] The first heat-conducting component and the second heat-conducting component are directly or indirectly connected to form a continuous heat conduction path from the driving chip and the LED beads to the outside.
[0012] In some possible implementations, the first heat-conducting element comprises a single layer of graphite sheet.
[0013] In some possible implementations, the second heat-conducting element comprises a double-layer graphite sheet.
[0014] In some possible implementations, the edges of the heat dissipation structure are covered with edging members;
[0015] The edge-wrapping component is located on the same side of the LED bead and the driver chip, and wraps around the side of the heat dissipation structure to form a surrounding heat conduction path.
[0016] In some possible implementations, the edging member includes at least one layer of copper foil tape on the outer layer.
[0017] In some possible implementations, the edging member includes at least one thermally conductive sheet located in the inner layer.
[0018] In some possible implementations, the second end of the first heat-conducting element covers the top of the driver chip.
[0019] In some possible implementations, the LED display module further includes a flexible circuit board for connecting the LED beads and the driver chip;
[0020] The flexible circuit board is located between the first thermal conductive element and the second thermal conductive element, so that the first thermal conductive element and the second thermal conductive element are indirectly connected.
[0021] In some possible implementations, the second heat-conducting element is connected to the iron frame by thermally conductive adhesive.
[0022] This utility model also provides an LCD display module, including a heat dissipation structure for an LCD display module as described in any of the preceding claims.
[0023] Compared with the prior art, the present invention has the following beneficial effects:
[0024] This utility model provides a heat dissipation structure for an LCD display module and an LCD display module. By constructing a targeted and continuous heat conduction path, the heat generated by the driver chip and LED beads is effectively dissipated, reducing the temperature of the module's lamp port and preventing film warping and overall overheating.
[0025] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of the structure of an LCD display module in the prior art;
[0028] Figure 2 This is a schematic diagram of a heat dissipation structure for an LCD display module and an LCD display module structure provided by an embodiment of this utility model.
[0029] Reference numerals: 11. Liquid crystal display panel; 12. Light guide plate; 13. Iron frame; 14. LED lamp bead; 15. Driver chip; 16. Graphite heat dissipation layer; 21. First heat conduction component; 22. Second heat conduction component; 23. Flexible circuit board; 24. Edge-binding component. Detailed Implementation
[0030] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.
[0031] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.
[0032] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.
[0033] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.
[0034] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.
[0035] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.
[0036] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.
[0037] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0038] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0039] Please refer to Figure 2 This utility model embodiment provides a heat dissipation structure for an LCD display module. The LCD display module includes a liquid crystal display panel 11, a light guide plate 12 and an iron frame 13 arranged in sequence. The iron frame 13 is provided with LED beads 14 for providing backlight and a driver chip 15 electrically connected to the LED beads 14.
[0040] In this embodiment, the heat dissipation structure includes:
[0041] The first heat-conducting component 21 has a first end connected to the iron frame 13 and a second end folded over to connect to the driving chip 15.
[0042] The second heat-conducting component 22 is disposed on the iron frame 13 and is located in the area where the LED bead 14 is vertically projected onto the iron frame 13.
[0043] The first heat-conducting component 21 and the second heat-conducting component 22 are directly or indirectly connected to form a continuous heat conduction path H from the driver chip 15 and the LED beads 14 to the outside.
[0044] The second heat-conducting component 22 enables point-to-surface contact heat conduction to the LED beads 14, and the first heat-conducting component 21 connects the heat conduction path to the driver chip 15, thereby forming a continuous heat path. This effectively dissipates the heat generated by the driver chip 15 and the LED beads 14, reduces the temperature rise of the module lamp port, and prevents film warping and overheating of the entire machine.
[0045] In some possible implementations, the first heat-conducting element 21 comprises a single layer of graphite sheet.
[0046] The first heat-conducting component 21 is specifically made of a single-layer graphite sheet, which has excellent surface contact heat conduction performance. The single-layer graphite sheet has high structural flexibility and can be closely attached to the surface of the driver chip 15, thereby quickly conducting its heat to the iron frame 13.
[0047] In some possible implementations, the second heat-conducting element 22 comprises a double-layer graphite sheet.
[0048] The second heat-conducting component 22 adopts a double-layer graphite sheet structure, which has excellent vertical heat conduction performance and lateral diffusion capability. When it covers the concentrated heat-generating area of the LED bead 14, it can significantly improve the heat conduction area and efficiency, which is conducive to the outward diffusion of heat from the LED bead 14.
[0049] In some possible implementations, the edges of the heat dissipation structure are covered with edging members 24;
[0050] Among them, the edge-wrapping component 24 is located on the same side of the LED bead 14 and the driver chip 15, and forms a surrounding heat conduction path by wrapping around the side of the heat dissipation structure.
[0051] Furthermore, the edge-wrapping component 24 is connected to the first heat-conducting component 21 in a side-encircling manner to form a closed heat conduction path, which is beneficial for guiding heat to diffuse to the entire casing.
[0052] In some possible implementations, the edging member 24 includes at least one layer of copper foil tape on the outer layer.
[0053] It is understandable that copper foil tape is used to wrap the edges of the heat dissipation structure. Because copper foil has high thermal conductivity, it is conducive to the rapid conduction and release of heat.
[0054] In some possible implementations, the edging member 24 includes at least one heat-conducting sheet located in the inner layer.
[0055] The inner layer structure of the edge-binding component 24 uses a thermally conductive pressure plate, which can serve as a thermal interface material to further reduce contact thermal resistance and improve the coupling efficiency between different thermal conduction paths.
[0056] In some possible implementations, the second end of the first heat-conducting element 21 covers the top of the driving chip 15 to achieve direct surface contact between the heating surface of the driving chip 15 and the heat-conducting material, thereby further enhancing the heat conduction efficiency.
[0057] In some possible implementations, the LED display module also includes a flexible circuit board 23 for connecting the LED beads 14 and the driver chip 15; the flexible circuit board 23 is located between the first heat-conducting element 21 and the second heat-conducting element 22, and while providing electrical connection, it also serves as a physical spacer between the heat-conducting elements, so that the two are indirectly connected.
[0058] In some possible implementations, the second thermally conductive element 22 is connected to the iron frame 13 by thermally conductive adhesive. The thermally conductive adhesive provides good gap-filling ability and enhances contact adhesion, thereby helping to reduce interfacial thermal resistance.
[0059] This utility model also provides an LCD display module, including a heat dissipation structure for the LCD display module as described in any of the above claims.
[0060] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of protection of this utility model. Any technical solutions resulting from equivalent structural or procedural substitutions or modifications made based on the essential concept of this application and utilizing the content described in the text and drawings of this application, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of protection of this utility model.
Claims
1. A heat dissipation structure for an LCD display module, the LCD display module comprising a liquid crystal display panel, a light guide plate and an iron frame arranged sequentially, wherein an LED bead for providing backlight and a driver chip electrically connected to the LED bead are disposed within the iron frame; Its features are, The heat dissipation structure includes: A first heat-conducting component, the first end of which is connected to the iron frame, and the second end of which is folded over to connect to the driving chip; The second heat-conducting component is disposed on the iron frame and located in the area where the LED beads are vertically projected onto the iron frame; The first heat-conducting component and the second heat-conducting component are directly or indirectly connected to form a continuous heat conduction path from the driving chip and the LED beads to the outside.
2. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The first heat-conducting element comprises a single layer of graphite sheet.
3. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The second heat-conducting element includes a double-layer graphite sheet.
4. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The edges of the heat dissipation structure are covered with edge-sealing components; The edge-wrapping component is located on the same side of the LED bead and the driver chip, and wraps around the side of the heat dissipation structure to form a surrounding heat conduction path.
5. The heat dissipation structure for an LCD display module according to claim 4, characterized in that, The edge-sealing component includes at least one layer of copper foil tape on the outer layer.
6. The heat dissipation structure for an LCD display module according to claim 4, characterized in that, The edge-binding component includes at least one heat-conducting pressure plate located in the inner layer.
7. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The second end of the first heat-conducting element covers the top of the driving chip.
8. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The LCD display module also includes a flexible circuit board for connecting the LED beads and the driver chip; The flexible circuit board is located between the first thermal conductive element and the second thermal conductive element, so that the first thermal conductive element and the second thermal conductive element are indirectly connected.
9. The heat dissipation structure for an LCD display module according to claim 1, characterized in that, The second heat-conducting component is connected to the iron frame by thermally conductive adhesive.
10. An LCD display module, characterized in that, Includes the heat dissipation structure for an LCD display module as described in any one of claims 1 to 9.