A jaw mechanism

Abstract

This utility model relates to the field of semiconductor processing equipment technology, and in particular to a gripper mechanism, including a gripper frame, a lifting unit for moving the gripper frame up and down, a centering component slidably connected to the gripper frame, and a gripping assembly for gripping a wafer cassette. The centering component is provided with a centering portion adapted to a cavity at the top of the wafer cassette. When the wafer cassette needs to be gripped, the lifting unit moves the gripper frame downward, the centering portion adapts to the cavity, and the centering portion is pushed upward by the wafer cassette to the required position. The lifting unit stops, and the gripping assembly grips the wafer cassette so that the center of gravity of the wafer cassette corresponds longitudinally to the center of the centering portion. This utility model achieves centered positioning of the wafer cassette through the centering component, which facilitates smooth gripping of the wafer cassette, reduces positioning deviation of the wafer cassette, and ensures alignment accuracy in wafer processing.

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