Needle seat structure for improving loading efficiency

CN224343753UActive Publication Date: 2026-06-09WUXI TONGZHI MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI TONGZHI MICROELECTRONICS CO LTD
Filing Date
2025-06-30
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

The existing ejector pin structure is inefficient when leveling large-sized chips, and the large adhesion area between large-sized chips and the blue film makes it difficult for the nozzle to pick them up, increasing the risk of breakage. It is also difficult to balance the adhesive force requirements during the transport and pick-up process.

Method used

The ejector pin hole design adopts an isosceles right-angled triangle layout, with the center of the ejector pin hole located at the vertex of the triangle. This simplifies the leveling operation, reduces the adhesion area between the chip and the blue film, and improves the pick-up efficiency.

Benefits of technology

It improves leveling efficiency, reduces the risk of chip breakage, decreases the probability of nozzle failure, and improves wafer loading efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to a ejector pin holder structure that improves wafer mounting efficiency. It includes a circular ejector pin holder with a first ejector pin hole, a second ejector pin hole, and a third ejector pin hole. The centers of the first, second, and third ejector pin holes are located at the three vertices of a triangle, and the center of the ejector pin holder is located inside the triangle containing these three holes. This utility model facilitates leveling operations on the ejector pins, improving leveling efficiency and thus wafer mounting efficiency. During transport and operation, the chip will not detach from the blue film, and during pick-up, the chip and blue film can be separated effectively.
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