Semiconductor cold laser physiotherapy instrument

Abstract

The utility model discloses a semiconductor cold laser physiotherapy instrument, including upper cover and lower cover, the bottom fixedly connected with lower cover of upper cover, the bottom inboard fixedly connected with lower cover PC nameplate of lower cover, the top inboard fixedly connected with upper cover PC nameplate of upper cover, the inboard fixedly connected with hardware of lower cover, the bottom inboard of hardware is inlayed with the lamp holder, the top fixedly connected with the lamp holder PCBA of lamp holder, and the lamp holder PCBA is fixedly connected with hardware, the top fixedly connected with the auxiliary heat dissipation mechanism of hardware, the inboard fixedly connected with mainboard PCBA of lower cover, the top fixedly connected with the key frame of mainboard PCBA, the inboard of key frame is provided with the key, through the setting of the fin, place a fin in the top of hardware, through the fin increase the heat dissipation effect of hardware, avoid only single through a component and carry out heat conduction, heat dissipation, lead to the heat dissipation effect decline, influence the problem of the normal work of physiotherapy instrument to appear.

Description

Technical Field

[0001] This utility model relates to the field of physiotherapy equipment technology, and in particular to a semiconductor cold laser physiotherapy equipment. Background Technology

[0002] Laser therapy is a method that uses a weak laser to directly irradiate the patient's tissues to treat diseases. It has the effects of reducing inflammation and swelling, promoting blood circulation, and improving bodily functions, and has been widely used in the treatment of various inflammations.

[0003] When using a semiconductor cold laser therapy device, the lamp head will generate heat. Currently, the main way to dissipate heat from the lamp head is through the metal parts around the lamp head. However, for such products, especially as the power increases, relying on only one component for heat conduction and dissipation will lead to a decrease in heat dissipation efficiency and affect the normal operation of the therapy device. Therefore, a semiconductor cold laser therapy device is proposed to address the above problems. Utility Model Content

[0004] The technical problem to be solved by this utility model overcomes the existing defects and can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A semiconductor cold laser therapy device includes an upper cover and a lower cover. The lower cover is fixedly connected to the bottom end of the upper cover. A lower cover PC nameplate is fixedly connected to the inner side of the bottom end of the lower cover. An upper cover PC nameplate is fixedly connected to the inner side of the top end of the upper cover. A hardware component is fixedly connected to the inner side of the lower cover. A lamp head is embedded in the inner side of the bottom end of the hardware component. A lamp head PCBA is fixedly connected to the top end of the lamp head, and the lamp head PCBA is fixedly connected to the hardware component. An auxiliary heat dissipation mechanism is fixedly connected to the top end of the hardware component. A main board PCBA is fixedly connected to the inner side of the lower cover. A button frame is fixedly connected to the top end of the main board PCBA. A button is provided on the inner side of the button frame and is slidably connected to the upper cover. A battery is fixedly connected to the inner side of the lower cover. One end of the battery is connected to a charging PCBA, and the charging PCBA is fixedly connected to the lower cover.

[0007] Preferably, the auxiliary heat dissipation mechanism includes heat sinks that are fixedly connected to the hardware.

[0008] Preferably, the heat sink and hardware components may be provided with thermally conductive silicone sheets or thermal paste.

[0009] Preferably, the heat sink is made of copper or aluminum.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] A semiconductor cold laser physiotherapy device uses a heat sink placed on top of a metal component to increase heat dissipation. This avoids the problem of reduced heat dissipation efficiency and impaired normal operation of the physiotherapy device caused by relying on only one component for heat conduction and dissipation. Attached Figure Description

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] Figure 1 This is a schematic diagram of the overall structure of a semiconductor cold laser physiotherapy device according to the present invention.

[0014] Figure 2 This is an exploded structural diagram of a semiconductor cold laser physiotherapy device according to the present invention.

[0015] Figure 3 This is a schematic diagram of the installation structure used when the heat sink and hardware parts of a semiconductor cold laser physiotherapy device of this utility model are attached together.

[0016] In the diagram: 1. Top cover; 2. Bottom cover; 3. Button; 4. Button frame; 5. Top cover PC nameplate; 6. Bottom cover PC nameplate; 7. Motherboard PCBA; 8. Battery; 9. Charging PCBA; 10. Heat sink; 11. Lamp holder PCBA; 12. Hardware. Detailed Implementation

[0017] The present invention will be further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the present invention. In order to better illustrate the specific embodiments of the present invention, some parts in the drawings may be omitted, enlarged or reduced, and do not represent the actual product size. It is understandable for those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] To make the technical means, creative features, and achieved objectives and effects of this utility model easy to understand, it should be noted in the description of this utility model that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described below in conjunction with specific embodiments.

[0019] Example

[0020] like Figure 1-3 As shown, a semiconductor cold laser therapy device includes an upper cover 1 and a lower cover 2. The lower cover 2 is fixedly connected to the bottom end of the upper cover 1. A lower cover PC nameplate 6 is fixedly connected to the inner side of the bottom end of the lower cover 2. An upper cover PC nameplate 5 is fixedly connected to the inner side of the top end of the upper cover 1. A hardware component 12 is fixedly connected to the inner side of the lower cover 2. A lamp head is embedded in the inner side of the bottom end of the hardware component 12. A lamp head PCBA 11 is fixedly connected to the top end of the lamp head, and the lamp head PCBA 11 is fixedly connected to the hardware component 12. An auxiliary heat dissipation mechanism is fixedly connected to the top end of the hardware component 12. A main board PCBA 7 is fixedly connected to the inner side of the lower cover 2. A button frame 4 is fixedly connected to the top end of the main board PCBA 7. A button 3 is provided on the inner side of the button frame 4, and the button 3 is slidably connected to the upper cover 1. A battery 8 is fixedly connected to the inner side of the lower cover 2. One end of the battery 8 is connected to a charging PCBA 9, and the charging PCBA 9 is fixedly connected to the lower cover 2.

[0021] As a further improvement to this utility model, such as Figure 2 and Figure 3 As shown, the auxiliary heat dissipation mechanism includes a heat sink 10 fixedly connected to the hardware component 12. The heat sink 10 increases the heat dissipation effect of the hardware component 12, avoiding the problem of reduced heat dissipation effect and affecting the normal operation of the physiotherapy device caused by relying solely on one component for heat conduction and dissipation.

[0022] As a further improvement to this utility model, such as Figure 2 and Figure 3 As shown, the heat sink 10 and the hardware 12 may be provided with thermally conductive silicone sheets or thermal paste. The thermally conductive silicone sheets and thermal paste can improve the heat transfer effect between the heat sink 10 and the hardware 12 and improve the heat dissipation efficiency.

[0023] As a further improvement to this utility model, such as Figure 2 and Figure 3 As shown, the heat sink 10 is made of copper or aluminum, and staff can choose according to their actual needs.

[0024] Work process: When the lamp head inside the hardware component 12 heats up, the heat will first be transferred to the hardware component 12. Then the hardware component 12 will transfer the heat to the heat sink 10. The heat sink 10 will increase the heat dissipation effect of the hardware component 12, avoiding the problem of reduced heat dissipation effect and affecting the normal operation of the physiotherapy device caused by only one component conducting and dissipating heat.

[0025] The above are preferred embodiments of the present invention. The basic principles, main features, and advantages of the present invention have been shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the scope of protection of the present invention. All such changes and modifications fall within the scope of protection of the present invention as defined by the appended claims and their equivalents.

Claims

1. A semiconductor cold laser physiotherapy device, comprising an upper cover (1) and a lower cover (2), characterized in that: The bottom end of the upper cover (1) is fixedly connected to the lower cover (2), the inner side of the bottom end of the lower cover (2) is fixedly connected to the lower cover PC nameplate (6), the inner side of the top end of the upper cover (1) is fixedly connected to the upper cover PC nameplate (5), the inner side of the lower cover (2) is fixedly connected to the hardware (12), the inner side of the bottom end of the hardware (12) is inlaid with a lamp head, the top end of the lamp head is fixedly connected to a lamp head PCBA (11), and the lamp head PCBA (11) is fixedly connected to the hardware (12). 12) is fixedly connected to an auxiliary heat dissipation mechanism at the top. The motherboard PCBA (7) is fixedly connected to the inner side of the lower cover (2). The top of the motherboard PCBA (7) is fixedly connected to a button frame (4). A button (3) is provided on the inner side of the button frame (4). The button (3) is slidably connected to the upper cover (1). A battery (8) is fixedly connected to the inner side of the lower cover (2). One end of the battery (8) is connected to a charging PCBA (9). The charging PCBA (9) is fixedly connected to the lower cover (2).

2. The semiconductor cold laser physiotherapy device according to claim 1, characterized in that: The auxiliary heat dissipation mechanism includes a heat sink (10) that is fixedly connected to the hardware (12).

3. The semiconductor cold laser physiotherapy device according to claim 2, characterized in that: The heat sink (10) and the hardware (12) may be provided with thermally conductive silicone sheets or thermal paste.

4. The semiconductor cold laser physiotherapy device according to claim 2, characterized in that: The heat sink (10) is made of copper or aluminum.

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