Substrate cleaning chamber cleaning device

Abstract

This utility model discloses a substrate cleaning chamber cleaning device, relating to the field of display technology. The substrate cleaning chamber cleaning device is used to clean substrate fragments from the bottom of a substrate cleaning chamber. It includes a support rod and an adsorption assembly. The adsorption assembly includes a negative pressure source, an adsorption tube, and a suction nozzle connected in sequence. The adsorption tube is connected to the support rod and can drive the suction nozzle to extend into the bottom of the substrate cleaning chamber. The negative pressure source provides negative pressure to the suction nozzle through the adsorption tube, causing the suction nozzle to adsorb the substrate fragments from the bottom of the substrate cleaning chamber. By using the adsorption force of the negative pressure, the substrate fragments at the bottom of the substrate cleaning chamber are sucked out, avoiding the danger of manual picking and solving the difficulty of manual picking. Simultaneously, by fixing the adsorption tube to the support rod, the length of the support rod allows the suction nozzle to extend into the bottom of the relatively high substrate cleaning chamber, eliminating the need for the cleaning personnel to enter the substrate cleaning chamber, greatly reducing the cleaning difficulty and improving cleaning efficiency.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a substrate cleaning chamber cleaning device. Background Technology

[0002] In the production process of liquid crystal displays, in order to improve product performance and yield, the substrate is usually cleaned before the film deposition process. Water is used to impact the surface of the substrate to remove particulate matter, thereby achieving the purpose of cleaning the substrate surface.

[0003] If the substrate breaks during the cleaning process, its fragments are likely to adhere to the bottom of the cleaning chamber. Because the substrate fragments are extremely thin and are adsorbed by atmospheric pressure difference, cleaning is extremely difficult. Figure 1 This is a schematic diagram of a cleaning worker cleaning substrate fragments at the bottom of a cleaning chamber in the prior art; as shown. Figure 1 As shown, currently, when cleaning personnel are cleaning, substrate fragments 200 are attached to residual water stains 300. When picking them up with one hand, the substrate fragments 200 will slide back and forth on the surface of the water stains 300 and cannot be picked up. At the same time, the substrate cleaning chamber 100 is relatively high, making it difficult for cleaning personnel 400 to operate with both hands, which makes cleaning inconvenient. Figure 2 This is a schematic diagram of the prior art of washing substrate fragments with a high-pressure water gun, such as... Figure 2 As shown, when using a high-pressure water gun 500 to rinse, the high-pressure water gun 500 pushes the substrate fragments 200 to the drain outlet 101 of the substrate cleaning chamber 100 and then removes them. However, some substrate fragments 200 cannot be pushed, resulting in incomplete cleaning. At the same time, the movement direction of the substrate fragments 200 is uncontrollable, resulting in long processing time. In addition, the substrate fragments 200 accumulate in the drain outlet 101 and cannot be discharged, so they still need to be picked up by cleaning personnel 400. The ultra-thin substrate fragments 200 are difficult to pick up, and the operation difficulty is further increased after wearing cut-resistant gloves.

[0004] Therefore, a cleaning device is urgently needed to solve the aforementioned problems. Utility Model Content

[0005] The purpose of this invention is to provide a substrate cleaning chamber cleaning device that facilitates the cleaning of substrate fragments at the bottom of the substrate cleaning chamber and has high cleaning efficiency.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A substrate cleaning chamber cleaning device is used to clean substrate fragments at the bottom of the substrate cleaning chamber. The substrate cleaning chamber cleaning device includes:

[0008] Support rod;

[0009] An adsorption assembly includes a negative pressure source, an adsorption tube, and a suction nozzle connected in sequence. The adsorption tube is connected to the support rod and can drive the suction nozzle to extend into the bottom of the substrate cleaning chamber. The negative pressure source provides negative pressure to the suction nozzle through the adsorption tube so that the suction nozzle adsorbs substrate fragments at the bottom of the substrate cleaning chamber.

[0010] As an optional solution for the substrate cleaning chamber cleaning device, the support rod is provided with adsorption channels extending through both ends of it;

[0011] The adsorption tube passes through one end of the adsorption channel and exits through the other end, and is connected to the suction nozzle.

[0012] Alternatively, one end of the adsorption channel is connected to the adsorption tube, and the other end of the adsorption channel is connected to the suction nozzle.

[0013] As an optional embodiment of the substrate cleaning chamber cleaning device, the suction nozzle includes a flexible suction nozzle and a rigid suction nozzle, which can be selectively connected to the adsorption channel.

[0014] As an optional embodiment of the substrate cleaning chamber cleaning device, the substrate cleaning chamber cleaning device further includes an air blowing assembly, which includes an air blowing nozzle disposed on the periphery of the suction nozzle to blow up the substrate fragments while the suction nozzle picks them up.

[0015] As an optional solution for the substrate cleaning chamber cleaning device, the air blowing assembly further includes an adjustment component, which is connected to the air blowing nozzle and can drive the air blowing nozzle to move, so as to adjust the air blowing angle and / or air blowing distance of the air blowing nozzle.

[0016] As an optional solution for the substrate cleaning chamber cleaning device, the air blowing assembly further includes an air source and an air supply pipeline connected thereto. The air supply pipeline includes a flexible section and a rigid section connected thereto. The air blowing nozzle is located at the end of the rigid section. The adjustment component adjusts the angle of the air blowing nozzle and / or the air blowing distance by driving the rigid section to rotate.

[0017] As an optional embodiment of the substrate cleaning chamber cleaning device, the substrate cleaning chamber cleaning device further includes a support frame connected to the side of the support rod, and the flexible section is disposed through the support frame.

[0018] As an optional embodiment of the substrate cleaning chamber cleaning device, the adjusting component includes:

[0019] A connector, one end of which is rotatably connected to the support frame, and the other end of which is connected to the rigid section;

[0020] A locking element that can lock the connector to the support frame.

[0021] As an optional embodiment of the substrate cleaning chamber cleaning device, the flexible section is connected to the rigid section via an air pipe connector;

[0022] A switching valve is installed on the flexible section.

[0023] As an alternative to the substrate cleaning chamber cleaning device, the air nozzle extends downward at an angle from the rigid section toward the suction nozzle, and the air blowing channel of the air nozzle gradually narrows toward the suction nozzle.

[0024] The beneficial effects of this utility model are:

[0025] The substrate cleaning chamber cleaning device provided by this utility model, when it is necessary to clean substrate fragments at the bottom of the substrate cleaning chamber, uses a support rod and an adsorption tube to drive the suction nozzle into the interior of the substrate cleaning chamber and close to the bottom. A negative pressure source provides negative pressure to the suction nozzle through the adsorption tube, so that the suction nozzle adsorbs the substrate fragments at the bottom of the substrate cleaning chamber. Thus, the substrate fragments at the bottom of the substrate cleaning chamber are sucked out by the adsorption force of the negative pressure, avoiding the danger of manual picking and solving the difficulty of picking them up by hand. At the same time, the adsorption tube is fixed to the support rod, and the length of the support rod is used to extend the suction nozzle into the bottom of the substrate cleaning chamber, which is at a higher height, to adsorb the substrate fragments or other impurities located at the bottom of the substrate cleaning chamber. The cleaning personnel do not need to put their bodies into the substrate cleaning chamber, which greatly reduces the cleaning difficulty and improves the cleaning efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a cleaning worker cleaning substrate fragments at the bottom of a cleaning chamber in the prior art;

[0027] Figure 2 This is a schematic diagram of the prior art of washing substrate fragments with a high-pressure water gun;

[0028] Figure 3 This is a schematic diagram of the substrate cleaning chamber cleaning device provided in a specific embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the air blowing assembly provided in a specific embodiment of the present invention;

[0030] Figure 5 This is a structural schematic diagram of the connector provided in a specific embodiment of this utility model;

[0031] Figure 6 This is a schematic diagram of the rigid section and the air nozzle provided in a specific embodiment of the present invention.

[0032] In the picture:

[0033] 100. Substrate cleaning chamber; 101. Drain outlet;

[0034] 200. Substrate fragments; 300. Residual water stains; 400. Cleaning personnel; 500. High-pressure water gun;

[0035] 11. Support rod; 111. Adsorption channel; 12. Support frame; 121. Nut;

[0036] 2. Adsorption assembly; 21. Negative pressure source; 22. Adsorption tube; 23. Suction nozzle;

[0037] 3. Air blowing assembly; 31. Air blowing nozzle; 32. Adjustment component; 321. Connector; 3211. Through hole; 322. Locking component; 33. Air supply pipeline; 331. Flexible section; 3311. Flexible main pipe; 3312. Flexible branch pipe; 332. Rigid section; 34. Switch valve; 35. Air source; 36. Air pipe connector. Detailed Implementation

[0038] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] This embodiment provides a substrate cleaning chamber cleaning device for cleaning substrate fragments at the bottom of the substrate cleaning chamber. This substrate cleaning chamber cleaning device is a simple tool for cleaning substrate fragments, small in size and easy to store. While the substrate is being cleaned, the substrate cleaning chamber cleaning device can be stored in a cleaning tool storage box near the substrate cleaning device; after the substrate cleaning operation is completed, the substrate cleaning chamber cleaning device can be removed from the cleaning tool storage box to clean substrate fragments or other impurities at the bottom of the cleaning chamber.

[0041] Figure 3 This is a schematic diagram of the substrate cleaning chamber cleaning device provided in a specific embodiment of this utility model, as shown below. Figure 3As shown, the substrate cleaning chamber cleaning device provided in this embodiment includes a support rod 11 and an adsorption component 2. The support rod 11 supports the adsorption component 2, making it easier for the cleaning personnel 400 to handle and operate it. It also makes it easier for the adsorption component 2 to extend into the substrate cleaning chamber 100, which is at a higher height, to accurately adsorb substrate fragments 200 or other impurities, thereby improving the convenience of the cleaning operation and reducing the labor intensity of the cleaning personnel 400.

[0042] In one embodiment, the adsorption assembly 2 includes a negative pressure source 21, an adsorption tube 22, and a suction nozzle 23 connected in sequence. The adsorption tube 22 is connected to the support rod 11 and can drive the suction nozzle 23 to extend into the bottom of the substrate cleaning chamber 100. The negative pressure source 21 provides negative pressure to the suction nozzle 23 through the adsorption tube 22 so that the suction nozzle 23 adsorbs substrate fragments 200 at the bottom of the substrate cleaning chamber 100.

[0043] When it is necessary to clean the substrate fragments 200 at the bottom of the substrate cleaning chamber 100, the support rod 11 and the suction tube 22 are used to drive the suction nozzle 23 into the interior of the substrate cleaning chamber 100 and close to the bottom. The negative pressure source 21 provides negative pressure to the suction nozzle 23 through the suction tube 22, so that the suction nozzle 23 adsorbs the substrate fragments 200 at the bottom of the substrate cleaning chamber 100. Thus, the substrate fragments 200 at the bottom of the substrate cleaning chamber 100 are sucked out by the suction force of the negative pressure, avoiding the danger of manual picking and solving the difficulty of manual picking. At the same time, the suction tube 22 is fixed to the support rod 11, and the length of the support rod 11 is used to extend the suction nozzle 23 into the bottom of the substrate cleaning chamber 100 at a higher height to adsorb the substrate fragments 200 or other impurities located at the bottom of the substrate cleaning chamber 100. The cleaning personnel 400 do not need to put their bodies into the substrate cleaning chamber 100, which greatly reduces the cleaning difficulty and improves the cleaning efficiency.

[0044] The support rod 11 provides support and guidance for the adsorption tube 22. The adsorption tube 22 is usually a flexible tube. The flexible tube is fixed to the support rod 11. The rigidity of the support rod 11 supports the flexible tube, preventing it from swaying left and right when entering the substrate cleaning chamber 100. This avoids the suction nozzle 23 from shaking for a long time and failing to accurately adsorb onto the substrate fragments 200.

[0045] In this embodiment, the negative pressure source 21 can be a vacuum generator or a vacuum cleaner. Vacuum generators are commonly used components in display panel processing workshops, and vacuum cleaners are also commonly used cleaning tools in production workshops, thus realizing the use of local materials, making the most of resources, and reducing costs.

[0046] After the substrate cleaning device has finished its work, the cleaning personnel 400 removes the substrate cleaning chamber cleaning device from the cleaning toolbox and connects the suction tube 22 to a nearby vacuum generator or vacuum cleaner. The vacuum generator or vacuum cleaner provides negative pressure to the suction tube 22. The support rod 11 is then inserted into the bottom of the substrate cleaning chamber 100, and the suction nozzle 23 is aligned with the substrate fragment 200 or other impurities. The suction nozzle 23 adsorbs the upper surface of the substrate fragment 200 or other impurities. Once the suction nozzle 23 has firmly adhered to the substrate fragment 200 or other impurities, the support rod 11 is pulled upwards to remove the substrate fragment 200 or other impurities from the bottom of the substrate cleaning chamber 100. The removed substrate fragment 200 or other impurities are aligned with the trash can, and then the vacuum generator or vacuum cleaner is controlled to stop providing negative pressure to the suction tube 22. The suction nozzle 23 automatically releases the substrate fragment 200 or other impurities, which then fall into the trash can.

[0047] In one embodiment, the support rod 11 has an adsorption channel 111 extending through both ends. The adsorption tube 22 passes through one end of the adsorption channel 111 and exits through the other end, connecting to the suction nozzle 23; or one end of the adsorption channel 111 connects to the adsorption tube 22, and the other end of the adsorption channel 111 connects to the suction nozzle 23. The support rod 11 simultaneously serves as both structural support and negative pressure conduction, eliminating the need for an additional fixed structure for the independent adsorption tube 22, significantly simplifying the overall mechanism and reducing the space occupied. Moreover, the adsorption channel 111 forms the shortest and most direct negative pressure transmission path inside the support rod 11, reducing gas flow resistance and potential leakage points, which helps maintain the stability of the negative pressure and adsorption strength at the suction nozzle 23, thereby improving the adsorption efficiency of substrate fragments 200 or other impurities. Utilizing the rigid support rod 11 itself as a negative pressure channel significantly improves the rigidity and positioning stability of the suction nozzle 23 compared to an external flexible tube, preventing the adsorption efficiency from being affected by the shaking or deformation of the adsorption tube 22. When the vacuum generator and the vacuum cleaner have fixed positions in the production workshop and are heavy and difficult to move, the flexible nature of the adsorption tube 22 allows for flexible adjustment of its position and direction in the equipment layout, reducing the difficulty of installation.

[0048] Of course, in other embodiments, it can also be configured such that one end of the adsorption tube 22 is connected to the negative pressure source 21, and the other end extends from one end of the support rod 11 to the other end. The adsorption tube 22 is fixed to the support rod 11 by a cable tie, and the suction nozzle 23 is connected to the adsorption tube 22.

[0049] The bottom of the substrate cleaning chamber 100 has two typical contaminant states: one is substrate fragments 200 attached to the residual water stains 300, which are difficult to separate due to the large pressure difference generated by the water film; the other is debris or tiny impurities scattered at the bottom of the drying chamber.

[0050] For the two typical contaminant states at the bottom of the substrate cleaning chamber 100, the suction nozzle 23 provides replaceable flexible and rigid suction nozzles, which the operator can selectively connect to the adsorption channel 111 according to the actual condition of the bottom of the chamber.

[0051] Because water stains create an adsorption force between the substrate fragment 200 and the cavity bottom, the flexible nozzle can adapt and deform when it contacts the substrate fragment 200, increasing the contact area and more effectively conforming to the edge or surface of the substrate fragment 200. This overcomes the water film barrier, establishes a more reliable negative pressure seal, and thus overcomes the adsorption resistance caused by water stains, effectively lifting the substrate fragment 200. The flexible nozzle can be made of rubber or silicone.

[0052] The debris at the bottom of the drying chamber is typically small and lightweight, requiring precise and rapid adsorption. Rigid nozzles offer higher structural rigidity and positioning accuracy. Their stable, non-deformable nozzles can more accurately align with the target debris, achieving efficient pickup in conjunction with negative pressure, making them particularly suitable for fine, dispersed dry impurities. Rigid nozzles can be made of metal or PVC (Polyvinyl Chloride).

[0053] The substrate cleaning chamber cleaning device provided in this embodiment can flexibly handle complex working conditions such as switching between dry and wet states at the bottom of the chamber or mixed contamination (containing both wet and dry debris) by quickly changing the suction nozzle 23, without changing tools or interrupting the cleaning process. Targeted selection of the most suitable suction nozzle 23 significantly reduces operational difficulty and improves cleaning success rate and efficiency.

[0054] For the substrate fragments 200 attached to the residual water stains 300, the pressure difference between the upper and lower surfaces of the substrate fragments 200 is large. Under the action of atmospheric pressure, the substrate fragments 200 are tightly pressed into the bottom of the substrate cleaning chamber 100, and may be difficult to remove even when using a flexible suction nozzle.

[0055] To address the difficulty in cleaning the substrate fragments 200 adhering to the residual water stains 300 Figure 4 This is a structural schematic diagram of the air blowing assembly provided in a specific embodiment of this utility model, as shown below. Figure 3 and Figure 4 As shown, the substrate cleaning chamber cleaning device provided in this embodiment also includes an air blowing component 3. The air blowing component 3 blows air to remove the water film and breaks the pressure difference adsorption between the substrate fragments 200 and the water film, thereby making it easier for the suction nozzle 23 to pick up the substrate fragments 200 attached to the residual water stains 300.

[0056] The blowing assembly 3 includes a blowing nozzle 31, which is disposed around the suction nozzle 23 to blow up the substrate fragment 200 while the suction nozzle 23 picks it up. By blowing air through the blowing nozzle 31 between the edge of the substrate fragment 200 and the water film, the adhesion between the substrate fragment 200 and the water film is broken, making it easier for the suction nozzle 23 to pick up the substrate fragment 200.

[0057] In one embodiment, the air blowing assembly 3 further includes an adjustment component 32, which is connected to the air blowing nozzle 31 and can move the air blowing nozzle 31 to adjust the blowing angle and / or blowing distance of the air blowing nozzle 31. By setting the adjustment component 32, the blowing angle and / or blowing distance of the air blowing nozzle 31 can be adjusted, thereby achieving precise removal of water film and breaking of pressure difference adsorption, effectively improving the debris pickup efficiency.

[0058] The airflow ejected from the nozzle 31 acts directionally on the bottom edge of the substrate fragment 200. The airflow impacts and peels off the water film between the substrate fragment 200 and the bottom of the cavity, cutting off the water film tension and breaking the local seal, thereby significantly weakening or eliminating the additional adsorption force generated by the water film, so that the nozzle 23 can effectively adsorb the fragment.

[0059] Different sized substrate fragments 200 require different effective airflow coverage areas. The angle and / or distance between the air nozzle 31 and the suction nozzle 23 is adjusted by the regulating component 32. This changes the airflow direction, ensuring precise coverage of the substrate fragment 200's edge area. Smaller fragments require more focused airflow, while larger fragments require wider or more oblique airflow. This allows the airflow from the nozzle 31 to blow away the water film around the substrate fragment 200, thus eliminating pressure differential adhesion. By adjusting the blowing distance, the impact force and coverage area of ​​the airflow reaching the edge of the substrate fragment 200 are optimized. The closer the nozzle 31 is to the edge of the substrate fragment 200, the stronger the airflow impact but the smaller the coverage area; conversely, the farther the nozzle 31 is from the edge, the larger the coverage area but the weaker the impact force. By adjusting the angle and / or distance between the nozzle 31 and the suction nozzle 23, the most effective airflow assistance is ensured regardless of the size of the substrate fragment 200, effectively removing the water film.

[0060] After the air blowing component 3 breaks the water film's adsorption force, the suction nozzle 23 can pick up the substrate fragments 200 more reliably and quickly under lower negative pressure requirements, reducing the number of attempts and improving overall cleaning efficiency.

[0061] In one embodiment, the blowing assembly 3 further includes an air source 35 and an air supply pipe 33 connected thereto. The air supply pipe 33 includes a flexible section 331 and a rigid section 332 connected thereto. The blowing nozzle 31 is located at the end of the rigid section 332. The adjusting component 32 adjusts the angle and / or blowing distance of the blowing nozzle 31 by driving the rigid section 332 to rotate. The air supply pipe 33 is connected to the air source 35, which is a CDA (Compressed Dry Air) source in the production workshop. The CDA source supplies gas to the blowing nozzle 31 through the air supply pipe 33. The air supply pipe 33 uses the flexible section 331 for the front end connection and the rigid section 332 for the end positioning. Combined with the CDA air source in the production workshop, it achieves a dual optimization of precise and adjustable blowing angle and convenient and reliable system connection. Effective removal of the water film requires the airflow direction to act precisely and stably on the bottom edge of the substrate fragment 200. The rigidity of the rigid section 332 itself ensures precise angle adjustment and high execution stability. When the adjusting component 32 drives the rigid section 332 to rotate, the angle change of the end air nozzle 31 is direct and without lag, accurately positioning it to the desired spray direction. Once the air nozzle 31 is properly adjusted, the rigid section 332 is less prone to deformation or vibration, maintaining long-term stability of the airflow spray direction and ensuring reliable water film removal. The air supply line 33 needs to be easily connected to the air source 35 at a fixed location in the production workshop, avoiding external interference with the end-point accuracy. The flexibility of the flexible section 331 allows the air supply line 33 to be easily connected to the fixed CDA air source interface, unrestricted by equipment layout, simplifying installation and wiring; moreover, it effectively absorbs vibration and displacement stress from the air supply line 33 or the production workshop, preventing it from being transmitted to the rigid section 332 and the air nozzle 31, ensuring the angle stability and adjustment accuracy of the end air nozzle 31.

[0062] CDA gas sources are typically used as a clean, water-free, and oil-free gas source to ensure the accuracy, reliability, and safety of systems or experiments. Directly utilizing CDA gas sources widely available in production facilities eliminates the need for dedicated gas sources or complex processing equipment, reducing system complexity and cost.

[0063] The flexible section 331 can be a flexible hose, and the rigid section 332 can be a metal pipe such as a steel pipe or an aluminum pipe.

[0064] Specifically, the flexible segment 331 is connected to the rigid segment 332 via an air pipe connector 36. The air pipe connector 36 is threaded to both the flexible segment 331 and the rigid segment 332, ensuring the stability and reliability of the connection between the flexible segment 331 and the rigid segment 332, and ensuring a continuous and stable supply of airflow. The threaded connection forms a strong mechanical connection between the flexible segment 331 and the rigid segment 332, which can effectively resist the separation force caused by the large-scale or repeated bending of the rigid segment 332, and greatly reduce the risk of the connection between the rigid segment 332 and the flexible segment 331 being pulled out or loosened.

[0065] A switching valve 34 is provided on the flexible section 331. By providing the switching valve 34 on the flexible section 331, the air blowing nozzle 31 is controlled to blow air. This allows the air blowing assembly 3 to be turned off when cleaning debris or small impurities scattered at the bottom of the drying chamber, and the adsorption assembly 2 can be used alone to clean them. When adsorbing substrate fragments 200 attached to residual water stains 300, the air blowing assembly 3 is turned on, and air is blown onto the edges of the substrate fragments 200 through the air blowing nozzle 31. This achieves precise removal of the water film and breaks the pressure difference adsorption force, effectively improving the picking efficiency of substrate fragments 200.

[0066] In one embodiment, the substrate cleaning chamber cleaning device further includes a support frame 12 connected to the side of the support rod 11, through which the flexible segment 331 passes. The support frame 12 is fixed to the support rod 11 by welding or other means, providing a stable mounting base for the adjustment component 32. The support frame 12 effectively constrains the flexible segment 331, ensuring a stable starting point for the adjustment action and controllable inlet state of the airflow supply; during the adjustment process, it isolates the uncontrollable shaking or torsion that may be caused by the flexibility of the flexible segment 331 itself, preventing it from interfering with the precise positioning of the rigid segment 332.

[0067] In one embodiment, the adjusting component 32 includes a connector 321 and a locking member 322. One end of the connector 321 is rotatably connected to the support frame 12, and the other end is connected to the rigid segment 332. The locking member 322 can lock the connector 321 to the support frame 12. The connector 321 acts as a rigid transmission arm, rotating relative to the pivot point on the support frame 12, directly and without loss converting the adjusting force into the rotational motion of the rigid segment 332. During the adjustment process, the connector 321 is driven to rotate, and the connector 321 drives the rigid segment 332 to perform a controlled arc motion around the pivot point on the support frame 12, thereby precisely changing the angle of the end nozzle 31.

[0068] In this embodiment, the connector 321 is L-shaped. The end of the long arm of the L-shaped connector 321 is rotatably connected to the support frame 12, and the end of the short arm is welded to the outer wall of the rigid section 332.

[0069] Of course, in other embodiments, the connector 321 may also be slidably disposed on the support frame 12, and the connector 321 may move in a horizontal direction toward or away from the suction nozzle 23, thereby changing the radial distance between the blowing nozzle 31 and the suction nozzle 23.

[0070] When adjusting the angle and / or blowing distance of the nozzle 31, first disconnect the connector 321 from the support frame 12 by locking the locking member 322, then rotate the connector 321. When the connector 321 is rotated to the appropriate position, the angle of the rigid section 332 is adjusted to the appropriate position. Then, lock the connector 321 onto the support frame 12 by locking the locking member 322 to lock the angle of the rigid section 332, thereby ensuring the stability of the blowing angle of the nozzle 31.

[0071] By rigidly locking the relative position of the connecting piece 321 and the support frame 12 after the rigid section 332 is adjusted to the correct angle, the rotational freedom of the adjusting component 32 is completely eliminated, enabling it to effectively resist various disturbances during operation. This ensures that the air nozzle 31 maintains the set air blowing angle during critical cleaning operations. This fundamentally solves the problem of maintaining static operational stability of the adjusting component 32 after dynamic adjustment, and is a key mechanism to ensure the continuous, reliable, and efficient function of air blowing to assist in removing the water film.

[0072] Figure 5 This is a structural schematic diagram of the connector provided in a specific embodiment of this utility model, as shown below. Figure 4 and Figure 5 As shown, specifically, the locking element 322 is a hand-tightening screw. A nut 121 is welded to the side wall of the support frame 12, and a through hole 3211 is provided at the end of the long arm of the L-shaped connector 321. After the angle of the rigid section 332 is adjusted to the correct position, the hand-tightening screw passes through the through hole 3211 and is threadedly connected to the nut 121 to fix the connector 321 to the support frame 12.

[0073] In one embodiment, at least one air blowing assembly 3 is provided. When two or more air blowing assemblies 3 are provided, the two or more air blowing nozzles 31 are evenly distributed along the periphery of the suction nozzle 23. When the size of the substrate fragment 200 is large, air can be blown evenly to various positions around the periphery of the substrate fragment 200 through the multiple air blowing nozzles 31 around the suction nozzle 23 to quickly remove the water film, break the pressure difference adsorption between the substrate fragment 200 and the water film, and thus achieve faster pickup of the substrate fragment 200.

[0074] For example, continue to refer to Figure 3 The flexible section 331 includes a flexible main pipe 3311 and two or more flexible branch pipes 3312. Each flexible branch pipe 3312 is connected to a rigid section 332, and each rigid section 332 is connected to an air nozzle 31. The number of adjusting components 32 is the same as the number of flexible branch pipes 3312, and the adjusting components 32 are set in a one-to-one correspondence with the flexible branch pipes 3312.

[0075] Figure 6 This is a structural schematic diagram of the rigid section and the air nozzle provided in a specific embodiment of this utility model, as shown below. Figure 6As shown, in one embodiment, the air nozzle 31 extends downward at an angle from the rigid section 332 toward the suction nozzle 23, and the air blowing channel of the air nozzle 31 gradually narrows toward the suction nozzle 23. The downward angled air blowing direction causes the airflow to blow from the edge of the substrate fragment 200 into the space between the substrate fragment 200 and the water film, forming a shear force that directly breaks the adsorption force of the water film tension and atmospheric pressure difference, "prying up" the fragment rather than "blowing it away," thus avoiding the vertical impact of the airflow causing the substrate fragment 200 to lose control of its displacement or splash. The gradually narrowing air blowing channel has a gradually decreasing cross-sectional area and a gradually increasing airflow velocity, concentrating the impact energy at the outlet of the air nozzle 31, which can efficiently remove the water film.

[0076] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A substrate cleaning chamber cleaning device for cleaning substrate fragments (200) at the bottom of a substrate cleaning chamber (100), characterized in that, The substrate cleaning chamber cleaning device includes: Support rod (11); The adsorption assembly (2) includes a negative pressure source (21), an adsorption tube (22), and a suction nozzle (23) connected in sequence. The adsorption tube (22) is connected to the support rod (11) and the adsorption tube (22) can drive the suction nozzle (23) to extend into the bottom of the substrate cleaning chamber (100). The negative pressure source (21) provides negative pressure to the suction nozzle (23) through the adsorption tube (22) so that the suction nozzle (23) adsorbs substrate fragments (200) at the bottom of the substrate cleaning chamber (100).

2. The substrate cleaning chamber cleaning device according to claim 1, characterized in that, The support rod (11) is provided with adsorption channels (111) running through both ends of it; The adsorption tube (22) passes through one end of the adsorption channel (111) and exits through the other end, and is connected to the suction nozzle (23); Alternatively, one end of the adsorption channel (111) is connected to the adsorption tube (22), and the other end of the adsorption channel (111) is connected to the suction nozzle (23).

3. The substrate cleaning chamber cleaning device according to claim 2, characterized in that, The suction nozzle (23) includes a flexible suction nozzle and a rigid suction nozzle, which can be selectively connected to the adsorption channel (111).

4. The substrate cleaning chamber cleaning apparatus according to any one of claims 1-3, characterized in that, The substrate cleaning chamber cleaning device further includes an air blowing assembly (3), which includes an air blowing nozzle (31) disposed on the periphery of the suction nozzle (23) to blow up the substrate fragments (200) while the suction nozzle (23) sucks up the substrate fragments (200).

5. The substrate cleaning chamber cleaning device according to claim 4, characterized in that, The blowing assembly (3) further includes an adjustment component (32), which is connected to the blowing nozzle (31) and can drive the blowing nozzle (31) to move so as to adjust the blowing angle and / or blowing distance of the blowing nozzle (31).

6. The substrate cleaning chamber cleaning device according to claim 5, characterized in that, The air blowing assembly (3) also includes an air source (35) and an air supply line (33) connected thereto. The air supply line (33) includes a flexible section (331) and a rigid section (332) connected thereto. The air blowing nozzle (31) is located at the end of the rigid section (332). The adjusting component (32) adjusts the angle and / or blowing distance of the air blowing nozzle (31) by driving the rigid section (332) to rotate.

7. The substrate cleaning chamber cleaning device according to claim 6, characterized in that, The substrate cleaning chamber cleaning device also includes a support frame (12) connected to the side of the support rod (11), and the flexible segment (331) is disposed through the support frame (12).

8. The substrate cleaning chamber cleaning device according to claim 7, characterized in that, The adjusting component (32) includes: A connector (321) is rotatably connected at one end to the support frame (12) and at the other end to the rigid section (332). A locking member (322) is provided to lock the connector (321) to the support frame (12).

9. The substrate cleaning chamber cleaning device according to claim 6, characterized in that, The flexible segment (331) is connected to the rigid segment (332) via a tracheal connector (36); A switching valve (34) is provided on the flexible section (331).

10. The substrate cleaning chamber cleaning apparatus according to claim 6, characterized in that, The air nozzle (31) extends downward at an angle from the rigid section (332) toward the suction nozzle (23), and the air blowing channel of the air nozzle (31) gradually narrows toward the suction nozzle (23).

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