A new PCBA assembly soldering equipment

Abstract

This utility model discloses a novel PCBA assembly soldering equipment, comprising a PCBA board transfer device that flows through a first feeding station, a second feeding station, a spot coating station, and a reflow soldering station, for transferring PCBA boards having connector mounting holes and solder ring placement holes; an RF connector feeding device, corresponding to the PCBA board transfer device and disposed at the first feeding station, for feeding RF connectors and installing them in the connector mounting holes; a solder ring feeding device, corresponding to the PCBA board transfer device and disposed at the second feeding station, for feeding solder rings and installing them in the solder ring placement holes; a spot coating device, corresponding to the PCBA board transfer device and disposed at the spot coating station, for spot coating adhesive onto the RF connectors and solder rings to obtain PCBA assemblies; and a reflow soldering device, corresponding to the PCBA board transfer device and disposed at the reflow soldering station, for reflow soldering the PCBA assemblies.

Description

Technical Field

[0001] This utility model relates to the field of PCBA production technology, specifically to a new type of PCBA assembly soldering equipment. Background Technology

[0002] In the PCBA production process, there are often processes such as RF connector installation. The existing RF connector installation process usually uses adhesive to assemble the RF connector onto the PCBA board, and then bakes and cures it at high temperature to achieve assembly and fixation. However, this assembly method has low adhesive strength and is prone to problems such as falling off. In addition, it cannot ensure that the RF connector has good encapsulation and sealing performance, resulting in a low actual yield. Utility Model Content

[0003] To overcome the above-mentioned technical problems, this utility model discloses a new type of PCBA assembly soldering equipment.

[0004] The technical solution adopted by this utility model to achieve the above objectives is as follows:

[0005] A novel PCBA assembly soldering equipment, the equipment comprising:

[0006] PCBA board transfer device, which sequentially flows through the first feeding station, the second feeding station, the spot coating station and the reflow soldering station, is used to transfer PCBA boards, the PCBA boards having connector mounting holes and solder ring placement holes;

[0007] An RF connector feeding device is disposed at the first feeding station, corresponding to the PCBA board transfer device, for feeding RF connectors and installing them into the connector mounting holes;

[0008] A solder ring feeding device is provided at the second feeding station, corresponding to the PCBA board transfer device, for feeding solder rings and installing them in the solder ring placement hole;

[0009] A spot coating device, which is disposed at the spot coating station corresponding to the PCBA board transfer device, is used to spot coat the RF connector and the solder ring with adhesive to obtain a PCBA assembly.

[0010] A reflow soldering device is disposed at the reflow soldering station corresponding to the PCBA board transfer device, and is used to perform reflow soldering on the PCBA assembly.

[0011] The aforementioned novel PCBA assembly soldering equipment, wherein the PCBA board transfer device includes a first conveyor line and several sets of PCBA fixing mechanisms arranged at intervals on the first conveyor line;

[0012] The PCBA fixing mechanism includes a PCBA support base, and the PCBA support base is provided with a first PCBA receiving cavity for positioning the PCBA board.

[0013] The aforementioned novel PCBA assembly soldering equipment includes PCBA positioning components on both sides of the PCBA support. Each PCBA positioning component includes a first cylinder and a fixed push block. The fixed push block is mounted on the drive shaft of the first cylinder and has a PCBA board positioning groove for securing the PCBA board.

[0014] The aforementioned novel PCBA assembly soldering equipment, wherein the RF connector feeding device includes a first feeding mechanism and a first transfer mechanism, the first transfer mechanism moving back and forth between the first feeding mechanism and the PCBA board transfer device;

[0015] The first feeding mechanism includes a second conveyor line and a first loading tray disposed on the second conveyor line. The first loading tray is provided with a plurality of first connector receiving cavities for placing the radio frequency connector at intervals.

[0016] The novel PCBA assembly soldering equipment described above, wherein the first transfer mechanism includes a first pick-up component, a first lateral movement drive component for driving the first pick-up component to move laterally, and a first longitudinal movement drive component for driving the first pick-up component to move longitudinally, wherein the driving direction of the first lateral movement drive component is perpendicular to the driving direction of the first longitudinal movement drive component.

[0017] The first pickup component includes grippers and a second cylinder for driving the grippers to open and close. The grippers are provided with connector positioning grooves for securing the RF connector. The grippers are all provided corresponding to the first connector receiving cavity and the first PCBA receiving cavity.

[0018] The novel PCBA assembly soldering equipment described above, wherein the RF connector feeding device further includes a flux pre-feeding mechanism, the flux pre-feeding mechanism being disposed between the first feeding mechanism and the PCBA board transfer device along the transfer direction of the first transfer mechanism, the first transfer mechanism traveling back and forth between the first feeding mechanism, the flux pre-feeding mechanism and the PCBA board transfer device.

[0019] The aforementioned novel PCBA assembly soldering equipment, wherein the flux pre-dispensing mechanism includes a first rotating component and a pre-dispensing component;

[0020] The first rotating assembly includes a first rotating seat and a first rotating drive assembly for driving the first rotating seat to rotate. The first rotating seat is provided with a second connector receiving cavity for placing the radio frequency connector, and the second connector receiving cavity is provided corresponding to the gripper.

[0021] The pre-positioning component includes a first nozzle for dispensing flux, the first nozzle being disposed corresponding to the second connector receiving cavity, so as to pre-position flux on the surface of the RF connector to be soldered.

[0022] The aforementioned novel PCBA assembly soldering equipment, wherein the solder ring feeding device includes a second feeding mechanism and a second transfer mechanism, the second transfer mechanism moving back and forth between the second feeding mechanism and the PCBA board transfer device;

[0023] The second feeding mechanism includes a third conveyor line and a second loading tray disposed on the third conveyor line. The second loading tray is provided with a plurality of sets of solder ring receiving cavities for placing the stacked solder rings at intervals.

[0024] The second transfer mechanism includes a second pickup component, a second lateral drive component for driving the second pickup component to move laterally, and a second longitudinal drive component for driving the second pickup component to move longitudinally, wherein the driving direction of the second lateral drive component is perpendicular to the driving direction of the second longitudinal drive component.

[0025] The second pickup component includes a pickup post for picking up stacked solder rings, the pickup post being configured corresponding to the solder ring receiving cavity and the first PCBA receiving cavity.

[0026] The novel PCBA assembly soldering equipment described above, wherein the dotting device includes a second rotating component, a lifting component, and a dotting component, wherein the second rotating component is disposed below the PCBA board transfer device and is disposed on the lifting component, and the dotting component is disposed corresponding to the second rotating component;

[0027] The dotting assembly includes a second nozzle for dispensing adhesive. The second nozzle is configured to correspond to the second rotating assembly so that the adhesive is uniformly applied to the RF connector and the solder ring under centrifugal force after dotting.

[0028] The aforementioned novel PCBA assembly soldering equipment includes a second rotating component comprising a second rotating seat and a second rotating drive component for driving the second rotating seat to rotate. The second rotating seat is movably inserted into the PCBA support seat, and a second PCBA receiving cavity for positioning the PCBA board is provided in the second rotating seat. The second PCBA receiving cavity is provided corresponding to the second feed head.

[0029] The beneficial effects of this utility model are as follows: The novel PCBA assembly soldering equipment of this utility model is based on the PCBA board transfer device, which transfers the PCBA board sequentially through the first feeding station, the second feeding station, the spot coating station, and the reflow soldering station. It is equipped with an RF connector feeding device and a solder ring feeding device to assemble and place the RF connector and solder ring in the connector mounting holes and solder ring placement holes of the PCBA board, respectively. The spot coating device applies adhesive, which, under centrifugal force, evenly coats the RF connector and solder ring, ensuring hermetic sealing of the RF connector, improving product yield, and making it suitable for mass production. Attached Figure Description

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] Figure 1 This is a top view of the structure of this utility model. Detailed Implementation

[0032] The present invention will be further described below through specific embodiments, so as to make the technical solution of the present invention easier to understand and master, rather than to limit the present invention.

[0033] In this embodiment, unless otherwise specified, all reagents are commercially available.

[0034] In this embodiment, unless otherwise specified, all methods used are conventional methods.

[0035] Example: See Figure 1 This embodiment provides a novel PCBA assembly soldering equipment, the equipment comprising:

[0036] PCBA board transfer device 1, which flows sequentially through the first feeding station, the second feeding station, the spot coating station and the reflow soldering station, is used to transfer PCBA boards, the PCBA boards having connector mounting holes and solder ring placement holes;

[0037] An RF connector feeding device is provided at the first feeding station, corresponding to the PCBA board transfer device 1, for feeding RF connectors and installing them into the connector mounting holes;

[0038] A solder ring feeding device is provided at the second feeding station, corresponding to the PCBA board transfer device 1, for feeding solder rings and installing them in the solder ring placement hole;

[0039] The spot coating device 4, which is disposed at the spot coating station corresponding to the PCBA board transfer device 1, is used to spot coat the RF connector and the solder ring with adhesive to obtain a PCBA assembly.

[0040] The reflow soldering device 5 is disposed at the reflow soldering station corresponding to the PCBA board transfer device 1, and is used to perform reflow soldering on the PCBA assembly.

[0041] Specifically, the PCBA board transfer device 1 transfers the PCBA board sequentially through the first feeding station, the second feeding station, the spot coating station, and the reflow soldering station. The RF connector feeding device and the solder ring feeding device are also provided to assemble and place the RF connector and solder ring in the connector mounting holes and solder ring placement holes of the PCBA board, respectively. The spot coating device 4 applies adhesive, which, under centrifugal force, evenly coats the RF connector and solder ring after spot coating, ensuring hermetic sealing of the RF connector, improving product yield, and making it suitable for mass production.

[0042] Preferably, the PCBA board transfer device 1 includes a first conveyor line and a plurality of PCBA fixing mechanisms arranged at intervals on the first conveyor line;

[0043] The PCBA fixing mechanism includes a PCBA support base, and the PCBA support base is provided with a first PCBA receiving cavity for positioning the PCBA board.

[0044] PCBA positioning components are provided on both sides of the PCBA support. Each PCBA positioning component includes a first cylinder and a fixed push block. The fixed push block is disposed on the drive shaft of the first cylinder and has a PCBA board positioning groove for securing the PCBA board. When the PCBA board is placed in the first PCBA receiving cavity, the first cylinder drives the fixed push block to press against the PCBA board, at which time the edge of the PCBA board is engaged in the PCBA board positioning groove.

[0045] Preferably, the RF connector feeding device includes a first feeding mechanism 21 and a first transfer mechanism 22, wherein the first transfer mechanism 22 travels back and forth between the first feeding mechanism 21 and the PCBA board transfer device 1;

[0046] The first feeding mechanism 21 includes a second conveyor line and a first loading tray disposed on the second conveyor line. The first loading tray is provided with a plurality of first connector receiving cavities for placing the RF connectors at intervals. Specifically, the first loading tray is fully loaded with the RF connectors to be assembled, and the first transfer mechanism 22 picks up the RF connectors and moves them to the PCBA board transfer device 1.

[0047] Preferably, the first transfer mechanism 22 includes a first pickup component, a first lateral movement drive component for driving the first pickup component to move laterally, and a first longitudinal movement drive component for driving the first pickup component to move longitudinally, wherein the driving direction of the first lateral movement drive component is perpendicular to the driving direction of the first longitudinal movement drive component.

[0048] The first pickup component includes grippers and a second cylinder for driving the grippers to open and close. The grippers are provided with connector positioning grooves for securing the RF connector. The grippers are all provided corresponding to the first connector receiving cavity and the first PCBA receiving cavity. Specifically, the second cylinder drives the grippers to open and close to release or clamp the RF connector.

[0049] Preferably, the RF connector feeding device further includes a flux pre-dispensing mechanism 23, which is disposed between the first feeding mechanism 21 and the PCBA board transfer device 1 along the transfer direction of the first transfer mechanism 22. The first transfer mechanism 22 travels back and forth between the first feeding mechanism 21, the flux pre-dispensing mechanism 23 and the PCBA board transfer device 1.

[0050] The flux pre-dispensing mechanism 23 includes a first rotating component and a pre-dispensing component;

[0051] The first rotating assembly includes a first rotating base and a first rotating drive assembly for driving the first rotating base to rotate. The first rotating base is provided with a second connector receiving cavity for placing the radio frequency connector, and the second connector receiving cavity is provided corresponding to the gripper. The first rotating drive assembly is preferably, but not limited to, driven by a motor or cylinder assembly.

[0052] The pre-positioning component includes a first nozzle for dispensing flux. The first nozzle is disposed in relation to the second connector receiving cavity to pre-position flux on the surface of the RF connector to be soldered. Specifically, when the RF connector is placed in the second connector receiving cavity, the first rotation drive component drives the first rotating seat to rotate, and the first nozzle applies flux to the surface of the RF connector to be soldered.

[0053] Preferably, the solder ring feeding device includes a second feeding mechanism 31 and a second transfer mechanism 32, the second transfer mechanism 32 moving back and forth between the second feeding mechanism 31 and the PCBA board transfer device 1;

[0054] The second feeding mechanism 31 includes a third conveyor line and a second loading tray disposed on the third conveyor line. The second loading tray is provided with a plurality of solder ring receiving cavities for placing the stacked solder rings at intervals. Specifically, the second loading tray is fully loaded with the stacked solder rings, and the second transfer mechanism 32 picks up the stacked solder rings and moves them to the PCBA board transfer device 1.

[0055] The second transfer mechanism 32 includes a second pickup component, a second lateral movement drive component for driving the second pickup component to move laterally, and a second longitudinal movement drive component for driving the second pickup component to move longitudinally, wherein the driving direction of the second lateral movement drive component is perpendicular to the driving direction of the second longitudinal movement drive component.

[0056] The second pickup component includes a pickup post for picking up stacked solder rings. The pickup post is configured corresponding to the solder ring receiving cavity and the first PCBA receiving cavity. Specifically, the pickup post passes through the stacked solder rings. For each solder ring fed, the remaining solder rings descend along the pickup post by one solder ring height, where the solder ring height is the height of the solder ring.

[0057] Preferably, the dotting device 4 includes a second rotating component, a lifting component, and a dotting component. The second rotating component is disposed below the PCBA board transfer device 1 and is disposed on the lifting component. The dotting component is disposed corresponding to the second rotating component.

[0058] The dotting assembly includes a second nozzle for dispensing adhesive. The second nozzle is configured to correspond to the second rotating assembly so that the adhesive is evenly applied to the RF connector and the solder ring under centrifugal force after dotting.

[0059] The second rotating assembly includes a second rotating seat and a second rotating drive assembly for driving the second rotating seat to rotate. The second rotating seat is movably inserted into the PCBA support seat, and a second PCBA receiving cavity for positioning the PCBA board is provided in the second rotating seat. The second PCBA receiving cavity is provided corresponding to the second material head. The second rotating drive assembly is preferably, but not limited to, driven by a motor or cylinder assembly.

[0060] Specifically, the lifting component drives the second rotating component to rise, thereby lifting the PCBA board through the second rotating seat to move it away from the PCBA support. The second rotating component drives the second rotating seat to rotate, and the second material head applies adhesive to the RF connector and the solder ring. Under the action of centrifugal force, the adhesive is evenly applied to the RF connector and the solder ring.

[0061] When this utility model is in operation, it includes the following steps:

[0062] Step 1: The PCBA board to be assembled is fed through the PCBA board transfer device 1, and at this time the PCBA fixing mechanism fixes the PCBA board.

[0063] Step 2: The RF connector to be assembled is fed via the first feeding mechanism 21;

[0064] The first transfer mechanism 22 moves the RF connector to the flux pre-positioning mechanism 23, and the flux pre-positioning mechanism 23 applies flux to the surface of the RF connector to be soldered.

[0065] After the flux pre-application operation is completed, the first transfer mechanism 22 then moves the RF connector to the PCBA board transfer device 1 to install the RF connector into the connector mounting hole of the PCBA board;

[0066] Step 3: The solder ring to be assembled is fed through the second feeding mechanism 31;

[0067] The second transfer mechanism 32 moves the solder ring to the PCBA board transfer device 1 to install the solder ring in the solder ring mounting hole of the PCBA board;

[0068] Step 4: The lifting component drives the second rotating component to rise, thereby lifting the PCBA board through the second rotating seat to move it away from the PCBA support. The second rotating component drives the second rotating seat to rotate. The second material head applies adhesive to the RF connector and the solder ring. Under the action of centrifugal force, the adhesive is evenly applied to the RF connector and the solder ring to obtain the PCBA assembly.

[0069] Step 5: The PCBA assembly is sent to the reflow soldering device 5 via the PCBA board transfer device 1 for reflow soldering.

[0070] This novel PCBA assembly soldering equipment is based on a PCBA board transfer device that transports PCBA boards sequentially through a first feeding station, a second feeding station, a spot coating station, and a reflow soldering station. It is equipped with an RF connector feeding device and a solder ring feeding device to assemble and place the RF connector and solder ring in the connector mounting holes and solder ring placement holes of the PCBA board, respectively. The spot coating device applies adhesive, which, under centrifugal force, evenly coats the RF connector and solder ring, ensuring hermetic sealing of the RF connector, improving product yield, and making it suitable for mass production.

[0071] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the disclosed technical means and content, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Therefore, all equivalent changes made based on the shape, structure, and principle of this utility model without departing from its technical solution should be covered within the protection scope of this utility model.

Claims

1. A novel PCBA assembly soldering equipment, characterized in that, The device includes: PCBA board transfer device, which sequentially flows through the first feeding station, the second feeding station, the spot coating station and the reflow soldering station, is used to transfer PCBA boards, the PCBA boards having connector mounting holes and solder ring placement holes; An RF connector feeding device is disposed at the first feeding station, corresponding to the PCBA board transfer device, for feeding RF connectors and installing them into the connector mounting holes; A solder ring feeding device is provided at the second feeding station, corresponding to the PCBA board transfer device, for feeding solder rings and installing them in the solder ring placement hole; A spot coating device, which is disposed at the spot coating station corresponding to the PCBA board transfer device, is used to spot coat the RF connector and the solder ring with adhesive to obtain a PCBA assembly. A reflow soldering device is disposed at the reflow soldering station corresponding to the PCBA board transfer device, and is used to perform reflow soldering on the PCBA assembly.

2. The novel PCBA assembly soldering equipment according to claim 1, characterized in that, The PCBA board transfer device includes a first conveyor line and several sets of PCBA fixing mechanisms arranged at intervals on the first conveyor line; The PCBA fixing mechanism includes a PCBA support base, and the PCBA support base is provided with a first PCBA receiving cavity for positioning the PCBA board.

3. The novel PCBA assembly soldering equipment according to claim 2, characterized in that, PCBA positioning components are provided on both sides of the PCBA support. Each PCBA positioning component includes a first cylinder and a fixed push block. The fixed push block is disposed on the drive shaft of the first cylinder and has a PCBA board positioning groove for securing the PCBA board.

4. The novel PCBA assembly soldering equipment according to claim 3, characterized in that, The RF connector feeding device includes a first feeding mechanism and a first transfer mechanism, wherein the first transfer mechanism travels back and forth between the first feeding mechanism and the PCBA board transfer device; The first feeding mechanism includes a second conveyor line and a first loading tray disposed on the second conveyor line. The first loading tray is provided with a plurality of first connector receiving cavities for placing the radio frequency connector at intervals.

5. The novel PCBA assembly soldering equipment according to claim 4, characterized in that, The first transfer mechanism includes a first pickup component, a first lateral movement drive component for driving the first pickup component to move laterally, and a first longitudinal movement drive component for driving the first pickup component to move longitudinally, wherein the driving direction of the first lateral movement drive component is perpendicular to the driving direction of the first longitudinal movement drive component. The first pickup component includes grippers and a second cylinder for driving the grippers to open and close. The grippers are provided with connector positioning grooves for securing the RF connector. The grippers are all provided corresponding to the first connector receiving cavity and the first PCBA receiving cavity.

6. The novel PCBA assembly soldering equipment according to claim 5, characterized in that, The RF connector feeding device further includes a flux pre-positioning mechanism, which is disposed between the first feeding mechanism and the PCBA board transfer device along the transfer direction of the first transfer mechanism. The first transfer mechanism travels back and forth between the first feeding mechanism, the flux pre-positioning mechanism, and the PCBA board transfer device.

7. The novel PCBA assembly soldering equipment according to claim 6, characterized in that, The flux pre-dispensing mechanism includes a first rotating component and a pre-dispensing component; The first rotating assembly includes a first rotating seat and a first rotating drive assembly for driving the first rotating seat to rotate. The first rotating seat is provided with a second connector receiving cavity for placing the radio frequency connector, and the second connector receiving cavity is provided corresponding to the gripper. The pre-positioning component includes a first nozzle for dispensing flux, the first nozzle being disposed corresponding to the second connector receiving cavity, so as to pre-position flux on the surface of the RF connector to be soldered.

8. The novel PCBA assembly soldering equipment according to claim 3, characterized in that, The solder ring feeding device includes a second feeding mechanism and a second transfer mechanism, wherein the second transfer mechanism travels back and forth between the second feeding mechanism and the PCBA board transfer device; The second feeding mechanism includes a third conveyor line and a second loading tray disposed on the third conveyor line. The second loading tray is provided with a plurality of sets of solder ring receiving cavities for placing the stacked solder rings at intervals. The second transfer mechanism includes a second pickup component, a second lateral drive component for driving the second pickup component to move laterally, and a second longitudinal drive component for driving the second pickup component to move longitudinally, wherein the driving direction of the second lateral drive component is perpendicular to the driving direction of the second longitudinal drive component. The second pickup component includes a pickup post for picking up stacked solder rings, the pickup post being configured corresponding to the solder ring receiving cavity and the first PCBA receiving cavity.

9. The novel PCBA assembly soldering equipment according to claim 3, characterized in that, The dotting device includes a second rotating component, a lifting component, and a dotting component. The second rotating component is disposed below the PCBA board transfer device and is disposed on the lifting component. The dotting component is disposed corresponding to the second rotating component. The dotting assembly includes a second nozzle for dispensing adhesive. The second nozzle is configured to correspond to the second rotating assembly so that the adhesive is uniformly applied to the RF connector and the solder ring under centrifugal force after dotting.

10. The novel PCBA assembly soldering equipment according to claim 9, characterized in that, The second rotating assembly includes a second rotating seat and a second rotating drive assembly for driving the second rotating seat to rotate. The second rotating seat is movably inserted into the PCBA support seat. A second PCBA receiving cavity for positioning the PCBA board is provided in the second rotating seat. The second PCBA receiving cavity is provided corresponding to the second material head.

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