A high-frequency head mainboard probe assembly tool

Abstract

The utility model discloses a kind of high-frequency head mainboard probe assembly tool, it is related to probe assembly tool technical field, two through holes are provided with interval on mainboard;The end of arbitrary probe is provided with limit cap;The assembly tool includes base and blanking mechanism, welding mechanism and stamping mechanism being all set on base, and mainboard is detachably arranged on base during assembly;Blanking mechanism makes two probes fall into two through holes, and makes two probes parallel and perpendicular to mainboard;Welding mechanism is used to weld two probes on mainboard;Stamping mechanism is used to bend the free end of one of probe into 90 °.It is composed of blanking mechanism, welding mechanism and stamping mechanism, blanking mechanism can make two probes fall into two through holes on mainboard respectively;Welding mechanism fixes two probes on mainboard by welding mode;Stamping mechanism can bend the free end of one of probe into 90 °, and it is convenient to complete the assembly of one mainboard at a time.

Description

Technical Field

[0001] This utility model relates to the field of probe assembly tooling technology, and more specifically, to a high-frequency head motherboard probe assembly tooling. Background Technology

[0002] The local oscillator frequency refers to the frequency used in radio frequency circuits to generate local oscillation signals, which plays an important role in communication systems such as superheterodyne receivers and amplitude-modulation (AM / FM) transmitters.

[0003] On some motherboards used for receiving frequency waves, two probes need to be installed at intervals to receive two different local oscillator frequencies. When installing the probes on such motherboards, both probes need to be perpendicular to the motherboard, and the free end of one of the probes needs to be bent at 90°.

[0004] The probe installation process for motherboards used in the above-mentioned situations requires several steps, but there is currently no suitable tooling to complete these steps. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-frequency head motherboard probe assembly fixture.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A high-frequency head motherboard probe assembly fixture has two through holes spaced apart on the motherboard; a limit cap is provided at one end of any probe; the assembly fixture includes a base and a blanking mechanism, a welding mechanism, and a stamping mechanism all disposed on the base; during assembly, the motherboard is detachably disposed on the base; the blanking mechanism causes two probes to fall into the two through holes, and the two probes are parallel to each other and perpendicular to the motherboard; the welding mechanism is used to weld the two probes to the motherboard; the stamping mechanism is used to bend the free end of one of the probes to 90°.

[0008] Furthermore, in this utility model, the above-mentioned unloading mechanism is connected to two first grippers, and during unloading, the two first grippers are used to clamp the two probes respectively.

[0009] Furthermore, in this utility model, the stamping mechanism includes a second gripper and a stamping body both disposed on the base. The stamping direction of the stamping body is perpendicular to the central axis of any of the probes. After the probes are soldered onto the motherboard, the second gripper clamps one of the probes, and the stamping body stamps the free end of the currently clamped probe.

[0010] Furthermore, in this utility model, the aforementioned stamping body is a hydraulic cylinder.

[0011] Furthermore, in this utility model, the motherboard is fixed to the base by a fixing mechanism.

[0012] The beneficial effects of this utility model are:

[0013] This utility model provides a high-frequency head motherboard probe assembly fixture, which consists of a blanking mechanism, a welding mechanism and a stamping mechanism. The blanking mechanism allows two probes to fall into two through holes on the motherboard respectively; the welding mechanism fixes the two probes to the motherboard by welding; the stamping mechanism can bend the free end of one of the probes to 90°, so as to complete the assembly of a motherboard in one go. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the probe assembled on the motherboard according to an embodiment of the present invention;

[0015] Figure 2 This is a schematic diagram of the probe assembly process according to an embodiment of the present invention;

[0016] Figure 3 This is a schematic diagram of the probe assembly process according to an embodiment of the present invention;

[0017] Figure 4 This is a schematic diagram of the probe assembly process according to an embodiment of the present invention.

[0018] In the diagram: 101-Main board; 201-Probe; 301-Base; 401-First gripper; 501-Second gripper; 502-Stamping body; 601-Fixing mechanism. Detailed Implementation

[0019] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] Please see Figures 1-4 This utility model provides a technical solution:

[0021] A high-frequency head motherboard probe assembly fixture includes two through holes spaced apart on the motherboard 101 to facilitate the mounting of two probes 201 onto the motherboard 101. The diameter of each through hole is the same as the diameter of the probe 201, and the central axes of the two through holes are parallel to each other and perpendicular to the upper and lower surfaces of the motherboard 101. A limiting cap with a diameter larger than the probe's own diameter is installed at one end of each probe 201. The assembly fixture includes a base 301 and a blanking mechanism, a welding mechanism (not shown in the figure), and a stamping mechanism, all mounted on the base 301. During assembly, the motherboard 101 is detachably mounted on the base 301. The blanking mechanism causes the two probes 201 to fall into the two through holes, ensuring that the two probes 201 are parallel to each other and perpendicular to the upper and lower surfaces of the motherboard 101. The welding mechanism then welds the two probes 201 onto the motherboard 101. Finally, the stamping mechanism bends the free end of one of the probes 201 at a 90° angle.

[0022] Specifically, refer to Figures 2-4 In this embodiment, the feeding mechanism has two first grippers 401 connected to it. During feeding, the two first grippers 401 are used to hold the two probes 201 respectively. When not holding, the first grippers 401 remain open so that the probes 201 can be placed into the first grippers 401.

[0023] like Figure 3 As shown, after the two probes 201 are positioned, they cannot fall further due to the action of the limiting caps. The welding pins of the welding mechanism then move to the connection points between the probes 201 and the main board 101 to perform welding. After welding is completed, the probes can be removed from the assembly area. Since the welding mechanism and welding method are existing technologies, they will not be described in detail here.

[0024] Specifically, refer to Figures 2-4 In this embodiment, the stamping mechanism includes a second gripper 501 and a stamping body 502, both mounted on the base 301. The stamping direction of the stamping body 502 is perpendicular to the central axis of any probe 201. After the probe 201 is soldered onto the main board 101, the second gripper 501 clamps one of the probes 201, and the stamping body 502 stamps the free end of the currently clamped probe 201. During the blanking and welding processes, the second gripper 501 is not open. After welding is completed, the second gripper 501 clamps the corresponding probe 201. Figure 4 From the perspective of the stamped part, the probe 201 located on the right is then bent.

[0025] In this embodiment, the stamping body 502 is a hydraulic cylinder. In other embodiments of this embodiment, the stamping body 502 may be replaced by other mechanisms capable of linear reciprocating movement, such as electric actuators and rack and pinion mechanisms.

[0026] In this embodiment, the motherboard 101 is fixed to the base 301 by the fixing mechanism 601. The fixing mechanism 601 can use common clips or nuts to achieve temporary fixing.

[0027] Assembly process:

[0028] 1. Before assembly, the main board 101 is temporarily fixed on the base 301, and then the feeding mechanism causes the two probes 201 to fall into the two through holes on the main board 101 respectively.

[0029] 2. The welding pins of the welding mechanism move to the connection point between probe 201 and main board 101 to perform welding. After welding is completed, they can be removed from the assembly area.

[0030] 3. The second gripper 501 holds the probe 201 that needs to be bent, and the stamping body 502 stamps the free end of the currently held probe 201.

[0031] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should be protected within the scope of the appended claims.

Claims

1. A high-frequency head motherboard probe assembly fixture, wherein two through holes are spaced apart on the motherboard (101); a limit cap is provided at one end of any probe (201); characterized in that: The assembly fixture includes a base (301) and a blanking mechanism, a welding mechanism, and a stamping mechanism, all of which are mounted on the base (301). During assembly, the main board (101) is detachably mounted on the base (301). The blanking mechanism causes two probes (201) to fall into the two through holes, and makes the two probes (201) parallel to each other and perpendicular to the main board (101). The welding mechanism is used to weld the two probes (201) onto the main board (101). The stamping mechanism is used to bend the free end of one of the probes (201) to 90°.

2. The high-frequency head motherboard probe assembly fixture according to claim 1, characterized in that: The material feeding mechanism is connected to two first grippers (401). During material feeding, the two first grippers (401) are used to clamp the two probes (201) respectively.

3. The high-frequency head motherboard probe assembly fixture according to claim 1, characterized in that: The stamping mechanism includes a second gripper (501) and a stamping body (502) both disposed on the base (301). The stamping direction of the stamping body (502) is perpendicular to the central axis of any of the probes (201). After the probes (201) are soldered onto the main board (101), the second gripper (501) clamps one of the probes (201), and the stamping body (502) stamps the free end of the currently clamped probe (201).

4. The high-frequency head motherboard probe assembly fixture according to claim 3, characterized in that: The stamping body (502) is a hydraulic cylinder.

5. The high-frequency head motherboard probe assembly fixture according to claim 1, characterized in that: The motherboard (101) is fixed to the base (301) by the fixing mechanism (601).

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