Adjustable gantry plating line edge flow guide device

By designing an adjustable gantry electroplating line edge guiding device and using a stainless steel plating plate with an anti-electrolytic corrosion layer, the copper consumption was reduced, the production efficiency was improved, and the copper plating layer thickness was made more uniform. This solved the problems of increased copper consumption, low production efficiency, and uneven current distribution caused by plating plates in the existing technology.

CN224350797UActive Publication Date: 2026-06-12JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI
Filing Date
2025-07-02
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

In existing technologies, the use of plating plates leads to problems such as increased copper consumption, low production efficiency, uneven current distribution, high risk of contamination, and poor pattern transfer.

Method used

An adjustable gantry electroplating line edge guiding device is designed, which adopts a stainless steel plating plate with an anti-electrolytic corrosion layer. The working section and clamping section are adjustable. By optimizing the width and length of the plating plate, it can adapt to circuit boards of different specifications, and dynamically adjust the current parameters to achieve uniform electroplating.

Benefits of technology

It reduces copper consumption, improves production efficiency, reduces downtime, improves the uniformity of copper plating thickness and pattern transfer quality, and reduces the risk of contamination.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224350797U_ABST
    Figure CN224350797U_ABST
Patent Text Reader

Abstract

This utility model discloses an adjustable gantry electroplating line edge guiding device, including a plating plate adjacent to the first and last plates of the circuit board to be plated. The plating plate includes a working section for planar flow guidance and extendable in length, and a clamping section formed by bending and extending one end of the working section. The working section has a width of 50-60 mm, and the clamping section has a width of 20-30 mm. The surface of the plating plate has an anti-electrolytic corrosion layer. The adjustable gantry electroplating line edge guiding device provided by this utility model can effectively reduce production costs, improve production efficiency, and enhance copper plating uniformity.
Need to check novelty before this filing date? Find Prior Art