Adjustable gantry plating line edge flow guide device
By designing an adjustable gantry electroplating line edge guiding device and using a stainless steel plating plate with an anti-electrolytic corrosion layer, the copper consumption was reduced, the production efficiency was improved, and the copper plating layer thickness was made more uniform. This solved the problems of increased copper consumption, low production efficiency, and uneven current distribution caused by plating plates in the existing technology.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-12
AI Technical Summary
In existing technologies, the use of plating plates leads to problems such as increased copper consumption, low production efficiency, uneven current distribution, high risk of contamination, and poor pattern transfer.
An adjustable gantry electroplating line edge guiding device is designed, which adopts a stainless steel plating plate with an anti-electrolytic corrosion layer. The working section and clamping section are adjustable. By optimizing the width and length of the plating plate, it can adapt to circuit boards of different specifications, and dynamically adjust the current parameters to achieve uniform electroplating.
It reduces copper consumption, improves production efficiency, reduces downtime, improves the uniformity of copper plating thickness and pattern transfer quality, and reduces the risk of contamination.
Smart Images

Figure CN224350797U_ABST