A circuit board plating thickness control jig device

Abstract

The utility model relates to circuit board processing technical field discloses a kind of circuit board plating layer thickness control fixture device, including the mounting bracket for supporting, the fixed component for being used to clamping circuit board is installed in the lower end of mounting bracket, the shielding component for being used to suppress circuit board edge effect is installed in the upper end of fixed component.The utility model is through the even clamping of fixed component circuit board four around, improve conductive uniformity, effectively reduce edge high current density area, suppress plating layer edge thickening phenomenon, shielding component is automatically turned over to board piece two sides when clamping, pass through physical shielding optimization power line distribution, both suppress board edge current gathering effect, and promote current to board piece center and hole permeation, to significantly improve the consistency of board face and hole plating layer thickness, realize the overall plating layer uniformity comprehensive improvement.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a circuit board plating thickness control fixture device. Background Technology

[0002] As the core carrier of electronic components, circuit boards need to form a conductive layer on their surface through electroplating to achieve electrical connection and corrosion protection. During the electroplating process, metal ions are deposited on the surface of the circuit board and the walls of the holes under the action of an electric field. The uniformity of the plating thickness directly affects the stability of circuit impedance and signal transmission quality. Vertical electroplating, as an advanced process, involves clamping the circuit board with a fixture and then vertically immersing the circuit board and fixture into the electroplating tank. It has advantages such as saving tank space, improving production efficiency, reducing bubble adhesion, improving the coverage of the plating layer in the holes, and facilitating automated continuous production.

[0003] Existing circuit board electroplating fixtures concentrate the clamping points on localized areas along the board edges, resulting in excessively high edge current density and plating thickness at the edges, reaching one to two times that of the center region. This negatively impacts circuit board performance. Furthermore, the fixtures lack adequate shielding structures, causing electric field distortion at the board edges when the board is immersed in the plating bath. This hinders the effective guidance of current to the center and deep holes, leading to uneven plating thickness, insufficient metal coverage within holes, and consequently, affecting circuit impedance stability. Therefore, those skilled in the art provide a circuit board plating thickness control fixture device to address the problems described in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board plating thickness control fixture device to solve the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a circuit board plating thickness control fixture device, including a mounting frame for support, a fixing component for clamping the circuit board is installed at the lower end of the mounting frame, and a shielding component for suppressing the edge effect of the circuit board is installed at the upper end of the fixing component.

[0006] As a preferred embodiment of the above technical solution, the fixing component includes a fixing rod, which is fixedly connected to the lower end of the mounting bracket. A sliding opening is provided in the middle of the fixing rod, and a first one-way screw is rotatably connected to the inner wall of the sliding opening. A sliding plate is slidably connected inside the sliding opening, and a top clamping plate is fixedly connected to the lower end of the sliding plate. A limit plate is fixedly connected to one side of the lower end of the fixing rod, and a first knob is rotatably connected to the side wall of the fixing rod. The output end of the first knob passes through the fixing rod and is fixedly connected to one end of the first one-way screw.

[0007] As a preferred embodiment of the above technical solution, a movable groove is provided on the lower side of the limiting plate near the top clamping plate. A bidirectional screw is rotatably connected to the inner wall of the movable groove. Two symmetrically arranged movable plates are slidably connected in the movable groove. The bidirectional screw passes through the two movable plates, and the two movable plates and the bidirectional screw are externally threaded. Side clamping plates are fixedly connected to the side of each of the two movable plates near the top clamping plate. A second knob is rotatably connected to the lower side of the limiting plate. The output end of the second knob passes through the limiting plate and is fixedly connected to one end of the bidirectional screw.

[0008] As a preferred embodiment of the above technical solution, one of the side clamps has a lifting port at its lower part, and the other side clamp has a lifting groove at its lower part on the side away from the second knob. The inner wall of the lifting groove is rotatably connected to a second one-way screw, and the inner wall of the lifting groove is slidably connected to a bottom clamp. The second one-way screw passes through the bottom clamp, and the bottom clamp and the second one-way screw are externally threaded together. The bottom clamp is slidably disposed in the lifting port. The lower end of the other side clamp is rotatably connected to a third knob. The output end of the third knob passes through the side clamp and is fixedly connected to the lower end of the second one-way screw.

[0009] As a preferred embodiment of the above technical solution, the shielding assembly includes a first shielding plate, a second shielding plate, a rotating rod, and a rack. The first shielding plate is fixedly connected to the middle of the outer side of the mounting frame, the second shielding plate is rotatably connected to the lower outer side of the mounting frame, the rotating rod is rotatably connected to the lower inner wall of the mounting frame, both ends of the rotating rod penetrate the mounting frame, and both ends of the rotating rod are fixedly connected to both ends of the mounting frame, and the rack is fixedly connected to the upper end of the sliding plate.

[0010] As a preferred embodiment of the above technical solution, a spur gear is fixedly sleeved at the middle of the outer side of the rotating rod, the spur gear and the rack mesh with each other, the first shielding plate is located on the side of the limiting plate away from the top clamping plate, and the second shielding plate and the first shielding plate are symmetrically arranged.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The clamping device can clamp the circuit board around its perimeter by setting fixed components, making the contact points between the circuit board and the clamp more uniform and the conductivity more uniform. This can reduce the high current density area at the edge, suppress the thickening of the plating edge, and improve the consistency of the plating thickness on the board surface and inside the holes.

[0013] 2. When the fixing component clamps the circuit board, the shielding component flips synchronously, so that the shielding component is located on both sides of the circuit board. By physically shielding, the distribution of electric lines is optimized, the current accumulation effect at the edge of the board is suppressed, and the current is promoted to penetrate deeply into the center area and holes of the circuit board, thereby significantly improving the uniformity of the plating thickness on the board surface and improving the overall plating consistency of the circuit board. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a circuit board plating thickness control fixture device.

[0015] Figure 2 A schematic diagram of the top clamping plate structure of a circuit board plating thickness control fixture device;

[0016] Figure 3 A schematic diagram of the side clamping plate structure of a circuit board plating thickness control fixture device;

[0017] Figure 4 A schematic diagram of the bottom clamping plate structure of a circuit board plating thickness control fixture device;

[0018] Figure 5 This is a schematic diagram of the shielding component structure of a circuit board plating thickness control fixture device.

[0019] Legend:

[0020] 1. Mounting bracket; 2. Fixing assembly; 201. Fixing rod; 202. Sliding port; 203. First one-way screw; 204. Sliding plate; 205. Top clamping plate; 206. Limiting plate; 207. First knob; 208. Moving groove; 209. Two-way screw; 210. Moving plate; 211. Side clamping plate; 212. Second knob; 213. Lifting port; 214. Lifting groove; 215. Second one-way screw; 216. Bottom clamping plate; 217. Third knob; 3. Shielding assembly; 301. First shielding plate; 302. Second shielding plate; 303. Rotating rod; 304. Rack; 305. Spur gear. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] Please see Figures 1-5 As shown, this utility model provides a technical solution: a circuit board plating thickness control fixture device, including a mounting frame 1 for support, a fixing component 2 for clamping the circuit board installed at the lower end of the mounting frame 1, and a shielding component 3 for suppressing the edge effect of the circuit board installed at the upper end of the fixing component 2.

[0023] Furthermore, the upper end of the mounting bracket 1 is equipped with bolts for fixing, and the upper end of the mounting bracket 1 is directly connected to the cathode to ensure that the current is uniformly transmitted to the circuit board surface to optimize the plating quality. The clamping device, by setting the fixing component 2, can clamp the circuit board around its perimeter, making the contact point between the circuit board and the clamp more uniform and the conductivity more uniform. This reduces the high current density area at the edge, suppresses the thickening phenomenon at the edge of the plating, and improves the consistency of the plating thickness on the board surface and inside the holes. When the fixing component 2 clamps the circuit board, the shielding component 3 flips simultaneously, so that the shielding component 3 is located on both sides of the circuit board. This optimizes the distribution of electric lines through physical shielding, suppresses the current accumulation effect at the edge of the board, and promotes the current to penetrate deeply into the center area of ​​the circuit board and inside the holes, thereby significantly improving the uniformity of the plating thickness on the board surface and improving the overall plating consistency of the circuit board.

[0024] As one implementation method in this embodiment, please refer to Figures 1-2 As shown, the fixing component 2 includes a fixing rod 201, which is fixedly connected to the lower end of the mounting bracket 1. A sliding opening 202 is provided in the middle of the fixing rod 201. A first one-way screw 203 is rotatably connected to the inner wall of the sliding opening 202. A sliding plate 204 is slidably connected inside the sliding opening 202. A top clamping plate 205 is fixedly connected to the lower end of the sliding plate 204. A limit plate 206 is fixedly connected to one side of the lower end of the fixing rod 201. A first knob 207 is rotatably connected to the side wall of the fixing rod 201. The output end of the first knob 207 passes through the fixing rod 201 and is fixedly connected to one end of the first one-way screw 203.

[0025] Furthermore, by rotating the first knob 207, the first one-way screw 203 rotates, the sliding plate 204 slides within the sliding opening 202, and the top clamping plate 205 can move closer to the circuit board. The top clamping plate 205 cooperates with the side wall of the limiting plate 206, and the lower end of the fixing rod 201 can limit the circuit board to ensure that the circuit board is aligned, thus achieving the clamping and fixing of the upper part of the circuit board.

[0026] As one implementation method in this embodiment, please refer to Figures 1-3 As shown, a movable groove 208 is provided on the lower side of the limiting plate 206 near the top clamping plate 205. A bidirectional screw 209 is rotatably connected to the inner wall of the movable groove 208. Two symmetrically arranged movable plates 210 are slidably connected in the movable groove 208. The bidirectional screw 209 passes through the two movable plates 210, and the two movable plates 210 and the bidirectional screw 209 are externally threaded. Side clamping plates 211 are fixedly connected to the side of the two movable plates 210 near the top clamping plate 205. A second knob 212 is rotatably connected to the lower side of the limiting plate 206. The output end of the second knob 212 passes through the limiting plate 206, and the output end of the second knob 212 is fixedly connected to one end of the bidirectional screw 209.

[0027] Furthermore, by rotating the second knob 212, the bidirectional screw 209 can be rotated, and the two moving plates 210 can be brought closer to each other, so that the two side clamps 211 can clamp and fix the two sides of the circuit board.

[0028] As one implementation method in this embodiment, please refer to Figures 1-4 As shown, a lifting port 213 is provided at the lower part of one side clamping plate 211, and a lifting groove 214 is provided at the lower part of the other side clamping plate 211 away from the second knob 212. A second one-way screw 215 is rotatably connected to the inner wall of the lifting groove 214, and a bottom clamping plate 216 is slidably connected to the inner wall of the lifting groove 214. The second one-way screw 215 passes through the bottom clamping plate 216, and the bottom clamping plate 216 and the second one-way screw 215 are externally threaded together. The bottom clamping plate 216 is slidably disposed in the lifting port 213. A third knob 217 is rotatably connected to the lower end of the other side clamping plate 211. The output end of the third knob 217 passes through the side clamping plate 211, and the output end of the third knob 217 is fixedly connected to the lower end of the second one-way screw 215.

[0029] Furthermore, rotating the third knob 217 causes the second one-way screw 215 to rotate, which allows the bottom clamp 216 to rise within the lifting groove 214 until the bottom clamp 216 contacts the lower end face of the circuit board. When adjusting the distance between the two side clamps 211, one side of the bottom clamp 216 slides within the lifting port 213. The bottom clamp 216 can slide left and right and up and down within the lifting port 213, thus not affecting the adjustment of the distance between the two side clamps 211. The upper end of the bottom clamp 216 cooperates with the lower end face of the fixing rod 201 to achieve compression and fixation of the lower end of the circuit board.

[0030] The two side clamps 211, the bottom clamp 216, and the top clamp 205 work together to clamp the circuit board around its perimeter, making the contact points between the circuit board and the clamping device more uniform and improving conductivity uniformity. This reduces high current density areas at the edges, suppresses edge thickening of the plating, and improves the consistency of plating thickness on the circuit board surface and inside the holes. Furthermore, the contact surfaces between the two side clamps 211, the bottom clamp 216, and the top clamp 205 and the circuit board are all equipped with protective pads to prevent damage to the edges of the circuit board caused by rigid clamping.

[0031] As one implementation method in this embodiment, please refer to Figure 1 , Figure 2 and Figure 5As shown, the shielding assembly 3 includes a first shielding plate 301, a second shielding plate 302, a rotating rod 303, and a rack 304. The first shielding plate 301 is fixedly connected to the middle of the outer side of the mounting frame 1. The second shielding plate 302 is rotatably connected to the lower outer side of the mounting frame 1. The rotating rod 303 is rotatably connected to the lower inner wall of the mounting frame 1. Both ends of the rotating rod 303 pass through the mounting frame 1, and both ends of the rotating rod 303 are fixedly connected to both ends of the mounting frame 1. The rack 304 is fixedly connected to the upper end of the sliding plate 204.

[0032] A spur gear 305 is fixedly sleeved at the middle of the outer side of the rotating rod 303. The spur gear 305 and the rack 304 mesh with each other. The first shielding plate 301 is located on the side of the limiting plate 206 away from the top clamping plate 205. The second shielding plate 302 and the first shielding plate 301 are symmetrically arranged.

[0033] Furthermore, when the first knob 207 is operated, the rack 304 at the upper end of the sliding plate 204 moves synchronously. The rack 304 drives the spur gear 305 to rotate, which causes the second shielding plate 302 to rotate. After the top clamping plate 205 clamps the circuit board, the second shielding plate 302 rotates to the front of the circuit board. At this time, the spur gear 305 is still meshed with the rack 304. Therefore, the second shielding plate 302 will not rotate during vertical electroplating. By using the first shielding plate 301 and the second shielding plate 302 set on both sides of the circuit board, the distribution of electric lines is optimized by physical shielding, the current accumulation effect at the edge of the circuit board is suppressed, and the current is promoted to penetrate deeply into the center area and holes of the circuit board, thereby significantly improving the uniformity of the plating thickness on the circuit board surface and improving the overall plating consistency of the circuit board.

[0034] Working principle: The device uses a fixing component 2. When fixing the circuit board, hold the lower edge of the circuit board and place the upper end of the circuit board against the lower end of the fixing rod 201. At this time, rotating the second knob 212 will rotate the bidirectional screw 209, causing the two moving plates 210 to move closer together, so that the two side clamps 211 clamp and fix the two sides of the circuit board. Then, rotating the third knob 217 will rotate the second unidirectional screw 215, causing the bottom clamp 216 to rise in the lifting groove 214 until the bottom clamp 216 contacts the lower end surface of the circuit board. The upper end of the bottom clamp 216 cooperates with the lower end surface of the fixing rod 201 to press and fix the lower end of the circuit board. Then, rotating the first knob 207 will rotate the first unidirectional screw 203, causing the sliding plate 204 to slide in the sliding opening 202, and the top clamp 205 will move closer to the circuit board to clamp and fix the upper end of the circuit board. The clamping plate 216 and the top clamping plate 205 work together to clamp the circuit board around its perimeter, making the contact points between the circuit board and the clamping device more uniform and improving conductivity uniformity. This reduces high current density areas at the edges, suppresses edge thickening of the plating, and improves the consistency of plating thickness on the circuit board surface and inside the holes. When the first knob 207 is operated, the rack 304 at the upper end of the sliding plate 204 moves synchronously. The rack 304 drives the spur gear 305 to rotate, which causes the second shielding plate 302 to rotate and move to the front of the circuit board. Through the first shielding plate 301 and the second shielding plate 302 set on both sides of the circuit board, the distribution of electric lines is optimized by physical shielding, suppressing the current accumulation effect at the edge of the circuit board, and promoting the current to penetrate deeply into the center area of ​​the circuit board and inside the holes. This significantly improves the uniformity of the plating thickness on the circuit board surface and enhances the overall plating consistency of the circuit board.

[0035] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A circuit board plating thickness control fixture device, comprising a mounting bracket (1) for support, characterized in that: The mounting bracket (1) has a fixing component (2) for clamping the circuit board installed at its lower end, and a shielding component (3) for suppressing the edge effect of the circuit board installed at its upper end.

2. The circuit board plating thickness control fixture device according to claim 1, characterized in that: The fixing component (2) includes a fixing rod (201), which is fixedly connected to the lower end of the mounting bracket (1). A sliding opening (202) is provided in the middle of the fixing rod (201). A first one-way screw (203) is rotatably connected to the inner wall of the sliding opening (202). A sliding plate (204) is slidably connected inside the sliding opening (202). A top clamping plate (205) is fixedly connected to the lower end of the sliding plate (204). A limit plate (206) is fixedly connected to one side of the lower end of the fixing rod (201). A first knob (207) is rotatably connected to the side wall of the fixing rod (201). The output end of the first knob (207) passes through the fixing rod (201), and the output end of the first knob (207) is fixedly connected to one end of the first one-way screw (203).

3. The circuit board plating thickness control fixture device according to claim 2, characterized in that: The limiting plate (206) has a moving groove (208) on the lower side near the top clamping plate (205). A bidirectional screw (209) is rotatably connected to the inner wall of the moving groove (208). Two symmetrically arranged moving plates (210) are slidably connected in the moving groove (208). The bidirectional screw (209) passes through the two moving plates (210), and the two moving plates (210) and the bidirectional screw (209) are externally threaded. A side clamping plate (211) is fixedly connected to the side of the two moving plates (210) near the top clamping plate (205). A second knob (212) is rotatably connected to the lower side of the limiting plate (206). The output end of the second knob (212) passes through the limiting plate (206), and the output end of the second knob (212) is fixedly connected to one end of the bidirectional screw (209).

4. The circuit board plating thickness control fixture device according to claim 3, characterized in that: One of the side clamps (211) has a lifting port (213) at the lower part of its interior. The other side clamp (211) has a lifting groove (214) at the lower part of its interior on the side away from the second knob (212). The inner wall of the lifting groove (214) is rotatably connected to a second one-way screw (215). The inner wall of the lifting groove (214) is slidably connected to a bottom clamp (216). The second one-way screw (215) passes through the bottom clamp (216), and the bottom clamp (216) is threadedly connected to the outside of the second one-way screw (215). The bottom clamp (216) is slidably disposed in the lifting port (213). The lower end of the other side clamp (211) is rotatably connected to a third knob (217). The output end of the third knob (217) passes through the side clamp (211), and the output end of the third knob (217) is fixedly connected to the lower end of the second one-way screw (215).

5. The circuit board plating thickness control fixture device according to claim 2, characterized in that: The shielding assembly (3) includes a first shielding plate (301), a second shielding plate (302), a rotating rod (303), and a rack (304). The first shielding plate (301) is fixedly connected to the middle of the outer side of the mounting frame (1). The second shielding plate (302) is rotatably connected to the lower outer side of the mounting frame (1). The rotating rod (303) is rotatably connected to the lower inner wall of the mounting frame (1). Both ends of the rotating rod (303) penetrate the mounting frame (1), and both ends of the rotating rod (303) are fixedly connected to both ends of the mounting frame (1). The rack (304) is fixedly connected to the upper end of the sliding plate (204).

6. The circuit board plating thickness control fixture device according to claim 5, characterized in that: A spur gear (305) is fixedly sleeved at the middle of the outside of the rotating rod (303). The spur gear (305) and the rack (304) mesh with each other. The first shielding plate (301) is located on the side of the limiting plate (206) away from the top clamping plate (205). The second shielding plate (302) and the first shielding plate (301) are symmetrically arranged.

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