A device for preparing nanometer silicon nitride powder

By introducing cooling and pressure control mechanisms into the silicon nitride nanoscale powder preparation device, the problem of high particle temperature caused by the long heat transfer path of the reaction chamber wall was solved, achieving efficient cooling and pressure monitoring, and ensuring the stability and quality of the nanoscale powder.

CN224353566UActive Publication Date: 2026-06-12GONGYI CITY HONGTAI SILICON NITRIDE MATERIAL

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GONGYI CITY HONGTAI SILICON NITRIDE MATERIAL
Filing Date
2025-07-29
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

In existing silicon nitride nanoscale powder preparation devices, the heat transfer path of the reaction chamber wall is long, which causes the particles to remain at a high temperature after leaving the reaction zone, making them prone to secondary growth or agglomeration and difficult to maintain nanoscale size.

Method used

The cooling and pressure control mechanisms on the support plate include a melting tank, a conical tube, a discharge pipe, a cooling component, a suction component, and a collection component. Multiple cooling methods are used to reduce the particle temperature, and pressure is monitored by a vacuum pump and infrared lamps to ensure the stability and safety of the production process.

Benefits of technology

This method achieves multiple cooling and temperature reduction of molten particles, maintains the stability and quality of nanoscale powders, prevents secondary growth or agglomeration, and improves the cooling effect and pressure control capability of the preparation device.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to nanometer material technical field discloses a kind of silicon nitride nanometer grade powder preparation devices, including support plate, the bottom of support plate is provided with cooling mechanism, the cooling mechanism is used to cool down cooling to molten finished product, the top of support plate is provided with pressure control mechanism, the pressure control mechanism is used to control pressure, the cooling mechanism includes two melting boxes, the outer wall of two melting boxes is fixedly connected with the top left side and right side of support plate, the bottom of melting box is communicated with conical tube, the bottom of conical tube is communicated with discharge pipe, the bottom of discharge pipe is provided with bottom plate. In the utility model, liquid falls to the top surface of triangular plate and slides along the groove, the groove prolongs the cooling path, the powder is sucked from the feed port by starting the air blower, the collection box is pulled up, the exhaust pipe and the communication pipe are connected, the powder is blown up for further cooling, the cooling effect is improved, and the subsequent use is facilitated.
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Description

Technical Field

[0001] This utility model relates to the field of nanomaterials technology, and in particular to a device for preparing silicon nitride nanoscale powder. Background Technology

[0002] As semiconductor devices develop towards higher power, higher frequency, and more centralized designs, the thermal effects of these devices increase significantly. This necessitates substrates with high thermal conductivity to absorb heat from the chip and facilitate heat exchange. Silicon nitride, with its high strength, excellent thermal conductivity, and strong thermal shock resistance, is considered one of the best-performing ceramic substrate materials and has broad application prospects. The preparation of high-purity, low-oxygen-content, and fine-particle-size silicon nitride powder is crucial for the development of high-thermal-conductivity silicon nitride ceramics, driving research into related preparation equipment. Silicon nitride ceramics possess excellent thermal stability, oxidation resistance, and corrosion resistance, as well as extremely high-temperature strength, wear resistance, and hardness. They are widely used in the machinery, chemical, electronics, and military industries, and can be used to manufacture high-temperature components for gas engines and high-speed cutting tools. Furthermore, due to its lack of metallic elements, it exhibits excellent non-reactivity with molten silicon, making it the preferred coating material in the polycrystalline silicon ingot casting process for solar cells. With the development of related fields, the requirements for the purity and particle size of silicon nitride powder are becoming increasingly stringent, prompting the development of more advanced preparation equipment to produce high-quality silicon nitride nanoscale powder.

[0003] For nanoscale silicon nitride powder, a new laser-induced process is used for preparation. However, the domestic laser method for preparing ultrafine silicon nitride powder is small in scale and expensive. Existing related devices have problems such as energy dispersion and unstable arc flame. In the existing technology, a jacketed cooling chamber is set up outside the reaction chamber, and a cooling medium is introduced into the jacket to remove the heat from the reaction zone by heat conduction, thereby reducing the overall temperature of the reaction chamber. However, the heat transfer is through the reaction chamber wall, and the heat transfer path is long, which cannot meet the cooling requirements. As a result, the particles are still at a high temperature after leaving the reaction zone, which makes them prone to secondary growth or agglomeration and makes it difficult to maintain the nanoscale size. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a silicon nitride nanoscale powder preparation device, which aims to improve the problem in the prior art where heat is transferred through the reaction chamber wall, the heat transfer path is long, and it is impossible to meet the cooling requirements. As a result, the particles are still at a high temperature after leaving the reaction zone, which makes them prone to secondary growth or agglomeration and makes it difficult to maintain the nanoscale size.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon nitride nanoscale powder preparation device, including a support plate, a cooling mechanism at the bottom of the support plate for cooling the molten finished product, and a pressure control mechanism at the top of the support plate for controlling the pressure.

[0006] The cooling mechanism includes two melting tanks. The outer walls of the two melting tanks are fixedly connected to the top left and right sides of the support plate. The bottom of the melting tanks is connected to a conical tube, and the bottom of the conical tube is connected to a discharge pipe. A bottom plate is provided at the bottom of the discharge pipe, a cooling component is provided at the top of the bottom plate, a suction component is provided at the top of the cooling component, a collection component is provided in the middle of the top surface of the cooling component, and a connecting component is provided at the top of the collection component.

[0007] As a further description of the above technical solution:

[0008] The pressure control mechanism includes two vacuum pumps. The bottom of the vacuum pumps is fixedly connected to the top left and right sides of the support plate. A connecting pipe is fixedly connected between the two adjacent melting boxes. Multiple light-transmitting plates are fixedly connected to the left and right sides of the outer wall of the connecting pipe. Infrared lamps are fixedly connected to the left and right ends of the rear side of the inner wall of the connecting pipe. A pressure control component is provided on the inner wall of the connecting pipe.

[0009] As a further description of the above technical solution:

[0010] The cooling component includes a heat dissipation ring, the inner wall of which is fixedly connected to the outer wall of the discharge pipe. A cooling box is fixedly connected to the center of the top surface of the base plate. Triangular plates are fixedly connected to the left and right sides of the inner wall of the cooling box near the edge. The top surface of the triangular plates has a groove.

[0011] As a further description of the above technical solution:

[0012] The suction assembly includes a blower, the bottom of which is fixedly connected to the left side of the top surface of the cooling box, and an exhaust pipe is connected to the rear side of the blower.

[0013] As a further description of the above technical solution:

[0014] The collection assembly includes two sealing plates, the outer walls of which are fixedly connected to the left and right sides of the inner wall of the cooling box. A collection box is slidably connected to the center of the top surface of the cooling box, and the outer walls of the collection box are provided with inlets on the left and right sides.

[0015] As a further description of the above technical solution:

[0016] The connecting component includes a connecting pipe, the bottom of which is connected to the top of the collecting box, and a plug is provided at the top of the connecting pipe.

[0017] As a further description of the above technical solution:

[0018] The pressure control assembly includes a disc, the outer wall of which is fixedly connected to the middle of the inner wall of the connecting pipe. Springs are fixedly connected to both the left and right sides of the disc, and baffles are fixedly connected to the opposite sides of the two springs.

[0019] As a further description of the above technical solution:

[0020] The support plate is provided with support mechanisms on both the left and right sides of its bottom. Each support mechanism includes a diagonal rod. The top of the diagonal rod is fixedly connected to the bottom left and right sides of the support plate near the edge. The front and rear sides of the diagonal rod are fixedly connected with uprights.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, the molten liquid flows into the cooling box along the conical tube and the discharge pipe. The heat dissipation ring absorbs some of the heat and dissipates it into the air. The liquid falls onto the top surface of the triangular plate and slides down along the groove. The groove extends the cooling path and fully utilizes the cooling effect. The cooled liquid becomes solid powder. The blower is started to reduce the air pressure in the collection box and suck the powder in from the inlet. After it is completely sucked in, the collection box is pulled up, the sealing plate blocks the inlet and seals it, the plug is opened, and the exhaust pipe is sealed and connected to the connecting pipe. Under the action of the blower, the air in the collection box is circulated, the powder is blown up, and further cooled. This achieves multiple cooling of the finished product, improves the cooling effect, and facilitates subsequent use.

[0023] 2. In this utility model, when the vacuum pump is started, it can extract the air from the melting tank. During the extraction, the baffle slides inside the connecting pipe. At the same time, the infrared lamp emits infrared rays and projects them onto the light-transmitting plate. When the baffle blocks the infrared lamp, the light-transmitting plate no longer transmits infrared rays. The operator can judge the pressure inside the melting tank by observing the position of the baffle blocking the light-transmitting plate, thus realizing the monitoring of the internal pressure of the melting tank and preventing the pressure from being too high or too low, which would affect the melting process. Attached Figure Description

[0024] Figure 1 This is a perspective view of the front side of the base plate of a silicon nitride nanoscale powder preparation device proposed in this utility model;

[0025] Figure 2 This is a partial structural breakdown of the melting box of a silicon nitride nanoscale powder preparation device proposed in this utility model;

[0026] Figure 3 This is a partial structural diagram of the cooling box of a silicon nitride nanoscale powder preparation device proposed in this utility model;

[0027] Figure 4 This is a partial structural diagram of the collection box of a silicon nitride nanoscale powder preparation device proposed in this utility model;

[0028] Figure 5 This is a partial structural diagram of the connecting pipe of a silicon nitride nanoscale powder preparation device proposed in this utility model.

[0029] Legend:

[0030] 1. Support plate; 2. Cooling mechanism; 201. Melting tank; 202. Conical tube; 203. Discharge pipe; 204. Base plate; 205. Cooling component; 2051. Heat dissipation ring; 2052. Cooling tank; 2053. Triangular plate; 2054. Groove; 206. Suction component; 2061. Blower; 2062. Exhaust pipe; 207. Collection component; 2071. Sealing plate; 2072. Collection box; 2073. Feed inlet; 208. Connecting component; 2081. Connecting pipe; 2082. Plug; 3. Pressure control mechanism; 301. Connecting pipe; 302. Vacuum pump; 303. Light-transmitting plate; 304. Infrared lamp; 305. Pressure control component; 3051. Disc; 3052. Spring; 3053. Baffle; 4. Support mechanism; 401. Diagonal bar; 402. Vertical pole. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see the appendix Figure 1 Appendix Figure 3 and attached Figure 4 An embodiment of this utility model is provided: a silicon nitride nanoscale powder preparation device, including a support plate 1, a cooling mechanism 2 is provided at the bottom of the support plate 1, the cooling mechanism 2 is used to cool the molten finished product, and a pressure control mechanism 3 is provided at the top of the support plate 1, the pressure control mechanism 3 is used to control the pressure.

[0033] The cooling mechanism 2 includes two melting tanks 201. The outer walls of the two melting tanks 201 are fixedly connected to the top left and right sides of the support plate 1. The bottom of the melting tank 201 is connected to a conical tube 202. The bottom of the conical tube 202 is connected to a discharge pipe 203. The bottom of the discharge pipe 203 is provided with a bottom plate 204. The top of the bottom plate 204 is provided with a cooling component 205. The top of the cooling component 205 is provided with a suction component 206. The middle of the top surface of the cooling component 205 is provided with a collection component 207. The top of the collection component 207 is provided with a connecting component 208. The bottom left and right sides of the support plate 1 are provided with a support mechanism 4. The support mechanism 4 includes a diagonal rod 401. The top of the diagonal rod 401 is fixedly connected to the bottom left and right sides of the support plate 1 near the edge. The front and rear sides of the diagonal rod 401 are fixedly connected with vertical rods 402.

[0034] Specifically, the main function of the cooling mechanism 2 is to perform precise and efficient cooling of the molten finished product to ensure that the finished product maintains stable quality and performance during the cooling process. The pressure control mechanism 3 is responsible for precisely controlling the pressure in the entire system to maintain the stability and safety of the production process.

[0035] The melting box 201 is fixedly connected to the support plate 1 to ensure stability under high temperature and high pressure. The cooling component 205 ensures that the molten product can be cooled down quickly. The collection component 207 can efficiently collect the cooled product and avoid any leakage or waste. The inclined rod 401 is fixedly connected to the support plate 1 to ensure the stability of the entire structure. The upright rod 402 further enhances the load-bearing capacity and deformation resistance of the entire support mechanism 4, ensuring that it maintains a highly efficient and stable working state under complex production environments.

[0036] Please see the appendix Figure 1 Appendix Figure 2 and attached Figure 5 The pressure control mechanism 3 includes two vacuum pumps 302. The bottom of the vacuum pumps 302 is fixedly connected to the top left and right sides of the support plate 1. A connecting pipe 301 is fixedly connected between the two adjacent melting boxes 201. Multiple light-transmitting plates 303 are fixedly connected to the left and right sides of the outer wall of the connecting pipe 301. Infrared lamps 304 are fixedly connected to the left and right ends of the rear side of the inner wall of the connecting pipe 301. A pressure control component 305 is provided on the inner wall of the connecting pipe 301. The pressure control component 305 includes a disc 3051. The outer wall of the disc 3051 is fixedly connected to the middle of the inner wall of the connecting pipe 301. Springs 3052 are fixedly connected to the left and right sides of the disc 3051. Baffles 3053 are fixedly connected to the opposite sides of the two springs 3052.

[0037] Specifically, the vacuum pump 302 is fixedly connected to the support plate 1 to ensure its stability and reliability during operation. The light-transmitting plate 303 can not only effectively transmit light, but also enhance the transparency and monitoring effect of the entire system to a certain extent. The infrared lamp 304 can provide uniform infrared light within a specific wavelength range. The disc 3051 is fixedly connected to the connecting pipe 301 to ensure its stable operation under high pressure. The spring 3052 can not only effectively buffer pressure fluctuations, but also provide necessary elastic support during system operation. The baffle 3053 plays a key role in limiting and regulating pressure during pressure control, ensuring that the entire pressure control mechanism 3 can maintain efficient and stable operation under various working conditions.

[0038] Please see the appendix Figure 1 Appendix Figure 2 and attached Figure 3 The cooling component 205 includes a heat dissipation ring 2051, the inner wall of which is fixedly connected to the outer wall of the discharge pipe 203. A cooling box 2052 is fixedly connected to the middle of the top surface of the bottom plate 204. Triangular plates 2053 are fixedly connected to the left and right sides of the inner wall of the cooling box 2052 near the edge. A groove 2054 is opened on the top surface of the triangular plate 2053. The suction component 206 includes a blower 2061, the bottom of which is fixedly connected to the left side of the top surface of the cooling box 2052. An exhaust pipe 2062 is connected to the rear side of the blower 2061.

[0039] Specifically, the heat dissipation ring 2051 is fixedly connected to the discharge pipe 203 to ensure that the heat transfer efficiency between the two reaches the optimal level. The groove 2054 is used to increase the cooling path, thereby improving the cooling efficiency. The blower 2061 is fixedly connected to the cooling box 2052 to ensure its stable operation. The rear side of the blower 2061 is connected to the exhaust pipe 2062 to form a smooth airflow channel to achieve efficient heat dissipation and cooling effect.

[0040] Please see the appendix Figure 1 Appendix Figure 2 and attached Figure 3 The collection component 207 includes two sealing plates 2071. The outer walls of the two sealing plates 2071 are fixedly connected to the left and right sides of the inner wall of the cooling box 2052. The collection box 2072 is slidably connected to the middle of the top surface of the cooling box 2052. The outer walls of the collection box 2072 are provided with inlets 2073 on the left and right sides. The communication component 208 includes a communication pipe 2081. The bottom of the communication pipe 2081 is connected to the top of the collection box 2072. A plug 2082 is provided at the top of the communication pipe 2081.

[0041] Specifically, the sealing plate 2071 is fixedly connected to the cooling box 2052 to ensure that there will be no loosening or displacement during operation. The cooling box 2052 is slidably connected to the collection box 2072, which not only facilitates the installation and disassembly of the collection box 2072, but also allows for flexible adjustment of its position when needed. The feed inlet 2073 ensures that the material can enter the collection box 2072 smoothly and evenly, avoiding the impact on overall work efficiency due to uneven feeding. The connecting pipe 2081 is connected to the collection box 2072 to ensure that there will be no leakage or breakage at the connection during long-term use. The plug 2082 can maintain good sealing performance in various complex environments, ensuring the stable operation of the entire system. The connecting component 208 greatly improves the working efficiency and reliability of the entire device.

[0042] Working principle: The molten liquid flows along the conical tube 202 and the discharge pipe 203 into the cooling tank 2052. The heat dissipation ring 2051 absorbs some heat and dissipates it into the air. The flowing liquid falls onto the top surface of the triangular plate 2053 and slides down along the groove 2054. The groove 2054 extends the cooling path, thus fully utilizing the cooling effect of the cooling tank 2052. The cooled liquid gradually turns into a solid powder. At this time, the blower 2061 is started, which reduces the air pressure inside the collection box 2072. The solid powder is drawn into the inlet 2073 and completely sucked in. Then, the collection box 2072 is pulled upwards, and the sealing plate 2071 will block the inlet 2073 and seal it. At this time, the plug 2082 is opened and the exhaust pipe 2062 is sealed to the connecting pipe 2081. Under the action of the blower 2061, the air inside the collection box 2072 will circulate, and the powder inside will be continuously blown up, further cooling the powder. This achieves multiple cooling of the finished product, improves the cooling effect, and facilitates subsequent use.

[0043] When the vacuum pump 302 is started, it can extract the air from inside the melting tank 201. During the air extraction process, the baffle 3053 will slide inside the connecting pipe 301. The infrared lamp 304 will emit infrared rays and project them onto the light-transmitting plate 303. When the baffle 3053 blocks the infrared lamp 304, the light-transmitting plate 303 will no longer transmit infrared rays. The operator can judge the pressure inside the melting tank 201 by observing the position of the light-transmitting plate 303 blocked by the baffle 3053, thus realizing the monitoring of the pressure inside the melting tank 201 and preventing the pressure from being too high or too low, which would affect the melting process.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for preparing silicon nitride nanoscale powder, comprising a support plate (1), characterized in that: The bottom of the support plate (1) is provided with a cooling mechanism (2), which is used to cool the molten finished product. The top of the support plate (1) is provided with a pressure control mechanism (3), which is used to control the pressure. The cooling mechanism (2) includes two melting tanks (201). The outer walls of the two melting tanks (201) are fixedly connected to the top left and right sides of the support plate (1). The bottom of the melting tank (201) is connected to a conical tube (202). The bottom of the conical tube (202) is connected to a discharge pipe (203). The bottom of the discharge pipe (203) is provided with a bottom plate (204). The top of the bottom plate (204) is provided with a cooling component (205). The top of the cooling component (205) is provided with a suction component (206). The top surface of the cooling component (205) is provided with a collection component (207). The top of the collection component (207) is provided with a connecting component (208).

2. The apparatus for preparing silicon nitride nanoscale powder according to claim 1, characterized in that: The pressure control mechanism (3) includes two vacuum pumps (302). The bottom of the vacuum pumps (302) is fixedly connected to the top left and right sides of the support plate (1). A connecting pipe (301) is fixedly connected between the two adjacent melting boxes (201). Multiple light-transmitting plates (303) are fixedly connected to the left and right sides of the outer wall of the connecting pipe (301). Infrared lamps (304) are fixedly connected to the left and right ends of the rear side of the inner wall of the connecting pipe (301). A pressure control component (305) is provided on the inner wall of the connecting pipe (301).

3. The apparatus for preparing silicon nitride nanoscale powder according to claim 1, characterized in that: The cooling component (205) includes a heat dissipation ring (2051), the inner wall of which is fixedly connected to the outer wall of the discharge pipe (203), a cooling box (2052) is fixedly connected to the center of the top surface of the base plate (204), and triangular plates (2053) are fixedly connected to the left and right sides of the inner wall of the cooling box (2052) near the edge, and a groove (2054) is provided on the top surface of the triangular plate (2053).

4. The apparatus for preparing silicon nitride nanoscale powder according to claim 3, characterized in that: The suction assembly (206) includes a blower (2061), the bottom of which is fixedly connected to the left side of the top surface of the cooling box (2052), and an exhaust pipe (2062) is connected to the rear side of the blower (2061).

5. The apparatus for preparing silicon nitride nanoscale powder according to claim 3, characterized in that: The collection assembly (207) includes two sealing plates (2071). The outer walls of the two sealing plates (2071) are fixedly connected to the left and right sides of the inner wall of the cooling box (2052). A collection box (2072) is slidably connected to the center of the top surface of the cooling box (2052). The left and right sides of the outer wall of the collection box (2072) are provided with inlets (2073).

6. The apparatus for preparing silicon nitride nanoscale powder according to claim 5, characterized in that: The connecting component (208) includes a connecting pipe (2081), the bottom of which is connected to the top of the collecting box (2072), and a plug (2082) is provided on the top of the connecting pipe (2081).

7. The apparatus for preparing silicon nitride nanoscale powder according to claim 2, characterized in that: The pressure control assembly (305) includes a disc (3051), the outer wall of the disc (3051) is fixedly connected to the middle of the inner wall of the connecting pipe (301), and springs (3052) are fixedly connected to both the left and right sides of the disc (3051). Baffles (3053) are fixedly connected to the opposite sides of the two springs (3052).

8. The apparatus for preparing silicon nitride nanoscale powder according to claim 1, characterized in that: The support plate (1) is provided with a support mechanism (4) on both the left and right sides of the bottom. The support mechanism (4) includes a diagonal rod (401). The top of the diagonal rod (401) is fixedly connected to the bottom left and right sides of the support plate (1) near the edge. The front and rear sides of the diagonal rod (401) are fixedly connected with uprights (402).