Liquid cooling equipment for high-speed integrated circuit heat dissipation

Abstract

A kind of liquid cooling equipment for high-speed integrated circuit heat dissipation, including high-speed integrated circuit board and circuit device, the top of the high-speed integrated circuit board is fixedly connected with the bottom of circuit device, the top of the high-speed integrated circuit board is connected with cooling structure behind, the bottom of the front left and right sides of the cooling structure is respectively connected with square board, into pump body by straight pipe, realize cooling liquid circulation, in cooling liquid passes through circuit device, the heat generated by circuit device is mixed with passing cooling liquid through cooling pipe, heat is taken away with the flow of cooling liquid, after cooling liquid enters straight pipe, cooling liquid will contact with vertical plate, vertical plate guides heat to straight plate by copper material itself, straight plate spreads heat to surrounding environment by copper material itself, so that liquid cooling equipment for high-speed integrated circuit heat dissipation meets high-speed integrated circuit heat dissipation, ensure normal use of high-speed integrated circuit.

Description

Technical Field

[0001] This utility model relates to liquid cooling equipment for heat dissipation of high-speed integrated circuits, and more particularly to a liquid cooling equipment for heat dissipation of high-speed integrated circuits. Background Technology

[0002] The main functions of liquid cooling equipment for high-speed integrated circuit heat dissipation are efficient heat dissipation, noise reduction, space saving, and improved equipment reliability.

[0003] For example, a liquid cooling device for integrated circuit heat dissipation with authorization announcement number "CN219124674U" can ensure the normal power supply and operation of multiple cooling frames by setting multiple power supply mechanisms on the integrated circuit. The independent operation of multiple power supply mechanisms can also ensure the normal cooling function of another cooling frame. The number of cooling frames can be set according to the actual area and range of the integrated circuit board, flexibly changing the cooling range. However, in the use of liquid cooling devices for high-speed integrated circuit heat dissipation, a single-point fan is used to dissipate heat from the condenser tube. This causes the heat from the condenser tube to be concentrated. Since liquid cooling requires circulation, when the heat is concentrated, the heat from the liquid cooling cannot be reduced quickly, and the uncooled liquid cooling continues to circulate. This makes the liquid cooling device for high-speed integrated circuit heat dissipation unable to meet the heat dissipation needs of high-speed integrated circuits, affecting the normal use of high-speed integrated circuits. Summary of the Invention

[0004] This invention aims to solve the problems existing in the prior art by providing a liquid cooling device for high-speed integrated circuits, which enables the liquid cooling device to meet the heat dissipation requirements of high-speed integrated circuits and ensures the normal operation of high-speed integrated circuits.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: This liquid cooling device for heat dissipation of high-speed integrated circuits includes a high-speed integrated circuit board and circuit devices. The top of the high-speed integrated circuit board is fixedly connected to the bottom of the circuit devices. A cooling structure is connected to the rear of the top of the high-speed integrated circuit board. Square plates are respectively connected to the bottom of the left and right sides of the front of the cooling structure. Fixed structures are respectively connected to the four corners of the top of the high-speed integrated circuit board.

[0006] To further improve the design, the cooling structure includes a pump body and liquid cooling pipes. The bottom of the pump body is attached to the rear top of the high-speed integrated circuit board. The left and right sides of the pump body are respectively connected to the rear inner sides of two liquid cooling pipes. A straight pipe is connected to the front of the outer wall of the liquid cooling pipe. The rear end face of the straight pipe is fixedly connected to the front of the pump body. Multiple vertical plates are connected through the top of the straight pipe, and a straight plate is fixedly connected to the top of the vertical plate.

[0007] Further improvements include fixing the bottom left and right sides of the front of the pump body to the rear ends of two square plates, and attaching the bottom of the square plates to the top of the high-speed integrated circuit board.

[0008] Further improvements include fixing the outer wall of the liquid cooling pipe to the inner wall of the circuit device.

[0009] Further improvements include a fixed structure comprising a vertical cylinder and a circular ring. The outer wall of the vertical cylinder is inserted into the top circular opening of the high-speed integrated circuit board, and the top of the outer wall of the vertical cylinder is fixedly connected to the inner wall of the circular ring. The inner wall of the vertical cylinder is threaded with bolts.

[0010] Further improvements include ensuring that the bottom of the ring fits into the top of the high-speed integrated circuit board.

[0011] The beneficial effects of this utility model are as follows: By connecting the pump body to the power supply in the cooling structure, a suction force is formed on the front of the pump body, drawing coolant from the straight pipe into the pump body. The coolant then flows through the pump body into the liquid cooling pipes on both sides, and finally enters the straight pipe through the front of the liquid cooling pipe, ultimately returning to the pump body, thus achieving coolant circulation. As the coolant passes through the circuit components, the heat generated by the circuit components mixes with the passing coolant through the cooling pipe, carrying away the heat with the flow of the coolant. After entering the straight pipe, the coolant comes into contact with the vertical plate. The vertical plate, through its copper material, directs the heat to the straight plate, which in turn dissipates the heat to the surrounding environment through its copper material. This ensures that the liquid cooling equipment for high-speed integrated circuits meets the heat dissipation requirements of high-speed integrated circuits, guaranteeing their normal operation. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 for Figure 1 A schematic diagram showing the connection relationship between the pump body, liquid cooling pipes, and straight pipes;

[0014] Figure 3 for Figure 1 A schematic diagram showing the connection relationship between the central straight pipe, vertical plate, and straight plate;

[0015] Figure 4 for Figure 1 A schematic diagram showing the connection structure between the neutral plate and the straight plate;

[0016] Figure 5 for Figure 1 A schematic diagram of the structure of A in the middle;

[0017] Figure 6 for Figure 1 A schematic diagram showing the connection relationship between the central vertical cylinder, the ring, and the bolts.

[0018] Explanation of reference numerals in the attached drawings: 1. High-speed integrated circuit board; 2. Cooling structure; 201. Pump body; 202. Liquid cooling pipe; 203. Straight pipe; 204. Vertical plate; 205. Straight plate; 3. Fixing structure; 301. Vertical cylinder; 302. Ring; 303. Bolt; 4. Circuit device; 5. Square plate. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings:

[0020] See attached document Figure 1-6 In this embodiment, a liquid cooling device for heat dissipation of high-speed integrated circuits includes a high-speed integrated circuit board 1 and circuit devices 4. The high-speed integrated circuit board 1 is model ETC-680. The top of the high-speed integrated circuit board 1 is fixedly connected to the bottom of the circuit devices 4. A cooling structure 2 is connected to the rear of the top of the high-speed integrated circuit board 1. Square plates 5 are respectively connected to the bottom of the left and right sides of the front of the cooling structure 2. Fixing structures 3 are respectively connected to the four corners of the top of the high-speed integrated circuit board 1.

[0021] Cooling structure 2 includes a pump body 201 and liquid cooling pipes 202. The bottom of the pump body 201 is attached to the rear top of the high-speed integrated circuit board 1. The left and right sides of the pump body 201 are respectively connected to the rear inner sides of two liquid cooling pipes 202. A straight pipe 203 is connected to the front of the outer wall of the liquid cooling pipe 202. The rear end face of the straight pipe 203 is fixed to the front face of the pump body 201. The pump body 201, liquid cooling pipes 202, straight pipes 203 and circuit devices 4 constitute a liquid cooling device, model a. de-function-360, the top of the straight pipe 203 is connected to multiple vertical plates 204, the top of the vertical plate 204 is fixed to a straight plate 205, the bottom left and right sides of the front of the pump body 201 are fixed to the rear end faces of two square plates 5 respectively, the vertical plates 204 and the straight plates 205 are both made of copper and have good thermal conductivity, the bottom of the square plate 5 is attached to the top of the high-speed integrated circuit board 1, and the outer wall of the liquid cooling pipe 202 is fixed to the inner wall of the circuit device 4.

[0022] When the pump body 201 in the cooling structure 2 is powered on, a suction force is formed on the front of the pump body 201, and the coolant in the straight pipe 203 enters the pump body 201. Then, the coolant enters the liquid cooling pipes 202 on the left and right sides through the pump body 201. Finally, the coolant enters the straight pipe 203 through the front of the liquid cooling pipe 202, and finally enters the pump body 201 through the straight pipe 202, realizing the circulation of coolant. When the coolant passes through the circuit device 4, the heat generated by the circuit device 4 mixes with the passing coolant through the cooling pipe 202. As the coolant flows, it carries away the heat. After the coolant enters the straight pipe 203, the coolant comes into contact with the vertical plate 204. The vertical plate 204 conducts the heat to the straight plate 205 through its own copper material. The straight plate 205 dissipates the heat to the surrounding environment through its own copper material. This enables the liquid cooling equipment for high-speed integrated circuit heat dissipation to meet the heat dissipation needs of high-speed integrated circuits and ensures the normal operation of high-speed integrated circuits.

[0023] The fixing structure 3 includes a vertical cylinder 301 and a circular ring 302. The outer wall of the vertical cylinder 301 is inserted into the top circular opening of the high-speed integrated circuit board 1. The vertical cylinder 301 is made of stainless steel to avoid the bolts being directly connected to the circuit board and causing the connection to crack. The top of the outer wall of the vertical cylinder 301 is fixedly connected to the inner wall of the circular ring 302. The inner wall of the vertical cylinder 301 is threaded with bolts 303. The bottom of the circular ring 302 is attached to the top of the high-speed integrated circuit board 1.

[0024] Working principle:

[0025] Installation of liquid cooling equipment for high-speed integrated circuit heat dissipation:

[0026] Make the pins at the bottom of the circuit device 4 fit with the connection point at the top of the high-speed integrated circuit board 1, and then fix the circuit device 4 to the high-speed integrated circuit board 1 by soldering. At this time, since the liquid cooling pipe 202 is fixed inside the circuit device 4, and the pump body 201 is connected to the rear of the liquid cooling pipe 202, after the circuit device 4 is fixed, the bottom of the pump body 201 will fit with the rear of the top of the high-speed integrated circuit board 1, and the bottom of the square plate 5 will fit with the top of the high-speed integrated circuit board 1. Then, the screw passes through the square plate 5 from top to bottom and connects with the round thread at the top of the high-speed integrated circuit board 1.

[0027] High-speed integrated circuit board mounting:

[0028] Make the bottom of the high-speed integrated circuit board 1 fit with the contact surface, then insert the outer walls of multiple vertical cylinders 301 into the top circular opening of the high-speed integrated circuit board 1 respectively, and fit the bottom of the straight cylindrical ring 302 with the top of the high-speed integrated circuit board 1. Then, the bolts 303 pass through the vertical cylinders 301 from top to bottom and are threaded to the contact surface until the top nut of the bolt 303 is pressed against the ring 302, thus completing the installation of the high-speed integrated circuit board 1.

[0029] Liquid cooling equipment is used for high-speed integrated circuit boards:

[0030] After the high-speed integrated circuit board 1 is powered on, electrical energy is sent to the circuit device 4. The circuit device 4 has a resistor inside that generates heat due to the current. At this time, the pump body 201 is powered on, which creates a suction force on the front of the pump body 201. The coolant in the straight pipe 203 enters the pump body 201. Then, the coolant enters the liquid cooling pipes 202 on the left and right sides through the pump body 201. Finally, the coolant enters the straight pipe 203 through the front of the liquid cooling pipe 202 and then enters the pump body 201 through the straight pipe 202, realizing the circulation of coolant. When the coolant passes through the circuit device 4, the heat generated by the circuit device 4 comes into contact with the passing coolant through the cooling pipe 202. The heat is carried away by the flow of the coolant. After the coolant enters the straight pipe 203, the coolant comes into contact with the vertical plate 204. The vertical plate 204 conducts the heat to the straight plate 205 through its own copper material. The straight plate 205 dissipates the heat to the surrounding environment through its own copper material.

[0031] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A liquid cooling device for heat dissipation of high-speed integrated circuits, comprising a high-speed integrated circuit board (1) and circuit devices (4), characterized in that: The top of the high-speed integrated circuit board (1) is fixedly connected to the bottom of the circuit device (4). A cooling structure (2) is connected to the rear of the top of the high-speed integrated circuit board (1). Square plates (5) are connected to the bottom of the left and right sides of the front of the cooling structure (2). Fixed structures (3) are connected to the four corners of the top of the high-speed integrated circuit board (1).

2. The liquid cooling device for high-speed integrated circuit heat dissipation according to claim 1, characterized in that: The cooling structure (2) includes a pump body (201) and a liquid cooling pipe (202). The bottom of the pump body (201) is attached to the rear top of the high-speed integrated circuit board (1). The left and right sides of the pump body (201) are respectively connected to the rear inner sides of two liquid cooling pipes (202). A straight pipe (203) is connected to the front of the outer wall of the liquid cooling pipe (202). The rear end face of the straight pipe (203) is fixedly connected to the front face of the pump body (201). A plurality of vertical plates (204) are connected through the top of the straight pipe (203). A straight plate (205) is fixedly connected to the top of the vertical plate (204).

3. The liquid cooling device for high-speed integrated circuit heat dissipation according to claim 2, characterized in that: The pump body (201) is fixedly connected to the rear end faces of two square plates (5) on the left and right sides of the bottom front side, respectively, and the bottom of the square plates (5) is attached to the top of the high-speed integrated circuit board (1).

4. The liquid cooling device for high-speed integrated circuit heat dissipation according to claim 2, characterized in that: The outer wall of the liquid cooling pipe (202) is fixedly connected to the inner wall of the circuit device (4).

5. The liquid cooling device for high-speed integrated circuit heat dissipation according to claim 1, characterized in that: The fixing structure (3) includes a vertical cylinder (301) and a ring (302). The outer wall of the vertical cylinder (301) is inserted into the top circular opening of the high-speed integrated circuit board (1). The top of the outer wall of the vertical cylinder (301) is fixedly connected to the inner wall of the ring (302). The inner wall of the vertical cylinder (301) is threaded with a bolt (303).

6. The liquid cooling device for high-speed integrated circuit heat dissipation according to claim 5, characterized in that: The bottom of the ring (302) is attached to the top of the high-speed integrated circuit board (1).

Images