Motor controller heat dissipation structure

Abstract

The utility model relates to motor controller technical field, concretely provides a motor controller heat radiation structure, including controller metal base, shell and printed circuit board, the printed circuit board is equipped with a plurality of MOS tubes, the metal base upper end is welded with the ceramic support seat, and the printed circuit board is equipped on the ceramic support seat upper end, and a plurality of MOS tubes are all welded in the printed circuit board lower extreme and the tube body of MOS tube is pasted on the ceramic support seat side end face, the lower extreme of metal base is equipped with a plurality of heat dissipation grooves, the utility model utilizes the ceramic support seat to realize the heat conduction insulation support of MOS tube, and the heat dissipation efficiency is promoted with the base heat dissipation groove cooperation, utilizes the elastic pressure of triangular seat and fixed spring plate and enhances MOS tube installation stability and heat conduction reliability, adopts double -deck PCB structure optimization space layout, satisfies the miniaturization demand while guaranteeing component assembly, improves overall heat dissipation performance and market applicability.

Description

Technical Field

[0001] This utility model relates to the field of motor controller technology, and specifically to a heat dissipation structure for a motor controller. Background Technology

[0002] The motor controller for electric vehicles is one of the core components of the electric vehicle drive system. It is responsible for controlling the operating status of the motor, converting the DC power from the battery into AC power (or regulating the DC power) required by the motor, and precisely controlling the motor's speed, torque, and direction.

[0003] Currently, heat sinks are used to dissipate heat from the motor controller as a whole. However, the main power and heat-generating components in a motor controller are MOSFETs. MOSFETs have a certain on-resistance when they are conducting, and heat is generated when current flows through them. Furthermore, the internal resistance of a MOSFET changes with temperature. When the temperature rises, the resistance of the MOSFET decreases, resulting in more heat generation. Heat sinks do not provide targeted heat dissipation, and the multiple MOSFETs in the motor controller still suffer from severe overheating, affecting the performance of the motor controller. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a heat dissipation structure for a motor controller, which solves the problem that the heat dissipation effect of setting heat sinks to dissipate heat from the motor controller as a whole is not good for MOSFETs.

[0005] To achieve the above and other related objectives, this utility model provides a heat dissipation structure for a motor controller, including a controller metal base, a housing, and a printed circuit board, wherein a plurality of MOSFETs are mounted on the printed circuit board;

[0006] A ceramic support is welded to the upper end of the metal base, a printed circuit board is mounted on the upper end of the ceramic support, and several MOS transistors are welded to the lower end of the printed circuit board with the transistor bodies attached to the side end face of the ceramic support.

[0007] The lower end of the metal base is provided with several heat dissipation grooves.

[0008] In one embodiment of this utility model, a triangular seat is welded to the upper end of the metal base. A fixing spring plate is detachably mounted on the triangular seat by bolts. Several arc-shaped spring pieces are provided at the upper end of the fixing spring plate. The arc-shaped spring pieces are used to elastically press the MOS tube so that the tube body fits tightly against the ceramic support.

[0009] In one embodiment of the present invention, the upper end of the ceramic support base is provided with a support column, and the ceramic support base is connected to the printed circuit board through the support column.

[0010] In one embodiment of the present invention, the printed circuit board is composed of an upper PCB board and a lower PCB board stacked on top of each other. A plurality of MOS transistors are soldered to the lower end of the lower PCB board, and conductive pillars are soldered to the upper end of the lower PCB board. Conductive through holes are opened in the mounting area of ​​the conductive pillars on the upper PCB board, and the conductive pillars pass through the conductive through holes and are electrically connected to the upper PCB board.

[0011] In one embodiment of the present invention, a pin header connector is soldered to the upper end of the upper PCB board, and the upper ends of both the conductive post and the pin header connector extend through the housing to the outside of the controller.

[0012] In one embodiment of the present invention, the edge of the outer shell is provided with an internal thread seat, and the metal base is provided with a threaded hole that communicates with the internal thread seat. The outer shell is locked to the metal base by simultaneously connecting the threaded hole and the internal thread seat with a bolt.

[0013] In one embodiment of the present invention, a circumferentially closed glue-filling groove is provided on the metal base in the area corresponding to the inner side of the outer shell edge, and glue is poured into the glue-filling groove to form a sealed protection between the metal base and the outer shell.

[0014] As described above, the heat dissipation structure of the motor controller of this utility model has the following beneficial effects:

[0015] 1. This utility model provides a ceramic support base to support and mount the printed circuit board, allowing the MOSFET to be soldered to the lower end of the printed circuit board and its body to fit against the ceramic support base. The ceramic support base has thermal conductivity and insulation properties, and together with several heat dissipation grooves at the lower end of the base, it maintains air circulation. This allows the heat generated by the MOSFET to be quickly conducted to the outside of the controller, improving the targeted heat dissipation of power components in the controller and thus improving the performance of the motor controller.

[0016] 2. By setting up a triangular seat and a fixed spring plate, the fixed spring plate can elastically press the MOSFET through the arc-shaped spring, thereby improving the reliability of the MOSFET's mounting relative to the printed circuit board and the reliability of the MOSFET's contact and heat conduction relative to the ceramic support.

[0017] 3. This utility model, by setting up a double-layer PCB board structure with overlapping and matching, has better structural compactness. While retaining more space for electronic component assembly, it can reduce the space occupied by the printed circuit board in the controller, meet the miniaturization design requirements of motor controller products, and has better market application prospects. Attached Figure Description

[0018] Figure 1 The diagram shown is a schematic representation of the overall structure of this utility model.

[0019] Figure 2 The diagram shown is an exploded view of the present invention.

[0020] Figure 3 Displayed as Figure 2 Side view.

[0021] Component designation explanation

[0022] Metal base 1; outer shell 2; printed circuit board 3; upper PCB board 31; lower PCB board 32; the printed circuit board 3; MOS transistor 4; ceramic support base 5; heat dissipation groove 6; triangular base 7; fixing spring plate 8; arc-shaped spring 81; support column 9; conductive column 10; pin connector 11; potting groove 12. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0024] Please see Figures 1 to 3 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should fall within the scope of the disclosed technical content. Furthermore, terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0025] Please see Figures 1-3 This utility model provides a heat dissipation structure for a motor controller, including a controller metal base 1, a housing 2, and a printed circuit board 3. The printed circuit board 3 is equipped with several MOSFETs 4. It should be noted that the printed circuit board 3 is also soldered with at least a main control chip and other electronic components to realize the basic operating functions of the motor controller. This solution solves the heat dissipation problem of the motor controller. Other electronic components in the motor controller will not be described in detail.

[0026] A ceramic support 5 is welded to the upper end of the metal base 1. The printed circuit board 3 is mounted on the upper end of the ceramic support 5. Several MOSFETs 4 are welded to the lower end of the printed circuit board 3, and the bodies of the MOSFETs 4 are attached to the side end face of the ceramic support 5. Several heat dissipation grooves 6 are provided at the lower end of the metal base 1 to maintain air circulation at the lower end of the base 1, which is conducive to heat dissipation of the product. By setting the ceramic support 5, the printed circuit board 3 can be supported and installed, so that the MOSFETs 4 are welded to the lower end of the printed circuit board and the bodies of the MOSFETs 4 are attached to the ceramic support 5. The ceramic support 5 has the function of thermal conductivity and insulation. With the heat dissipation grooves provided at the lower end of the base 1, the heat of the MOSFETs 4 can be quickly conducted to the outside of the controller by the ceramic support 5, which improves the targeted heat dissipation of power components in the controller and thus improves the performance of the motor controller.

[0027] The outer shell 2 has an internal threaded seat on its edge, and the metal base 1 has a threaded hole that connects to the internal threaded seat. The outer shell 2 is locked to the metal base 1 by simultaneously connecting the threaded hole and the internal threaded seat with a bolt. The metal base 1 has a circumferentially closed glue-filling groove 12 in the area corresponding to the inner side of the edge of the outer shell 2. Glue is filled into the glue-filling groove 12 to form a seal between the metal base 1 and the outer shell 2.

[0028] A triangular base 7 is welded to the upper end of the metal base 1. A fixing spring plate 8 is detachably mounted on the triangular base 7 via bolts. The triangular base 7 allows the fixing spring plate 8 to be installed at a certain tilt angle. The upper end of the fixing spring plate 8 is provided with several arc-shaped spring pieces 81. The fixing spring plate 8 uses the arc-shaped spring pieces 81 to elastically press against the MOS transistor 4, making the transistor body tightly fit against the ceramic support base 5. This improves the reliability of the MOS transistor 4's mounting relative to the printed circuit board and the reliability of the MOS transistor's contact with the ceramic support base for heat conduction. In this application, there are two ceramic support bases 5 and two triangular bases 7, with the two triangular bases 7 distributed on the outer sides of the two ceramic support bases 5. The arrangement of multiple ceramic support bases 5 allows for more MOS transistors 4 to contact and conduct heat.

[0029] The upper end of the ceramic support base 5 is provided with a support column 9. The ceramic support base 5 is connected to the printed circuit board 3 through the support column 9, which is beneficial to increase the printing layout area of ​​the printed circuit board 3.

[0030] The printed circuit board 3 is composed of an upper PCB board 31 and a lower PCB board 32 stacked on top of each other. Several MOSFETs 4 are soldered to the lower end of the lower PCB board 32, and conductive posts 10 are soldered to the upper end of the lower PCB board 32. Conductive vias are provided on the upper PCB board 31 corresponding to the mounting areas of the conductive posts 10, and the conductive posts 10 pass through these vias to be electrically connected to the upper PCB board 31. This invention, by setting up a stacked double-layer PCB board structure, achieves better structural compactness. While retaining more space for electronic component assembly, it reduces the space occupied by the printed circuit board 3 in the controller, meeting the miniaturization design requirements of motor controller products and possessing better market application prospects.

[0031] A pin header connector 11 is soldered to the upper end of the upper PCB board 31. The upper ends of both the conductive posts 10 and the pin header connector 11 extend through the housing 2 to the outside of the controller. The conductive posts 10 are mainly used for electrical connection and signal transmission in the motor controller. They ensure the transmission of electrical signals by providing physical connections between circuits. Furthermore, the conductive posts 10 also serve a mechanical fixing function, ensuring the stability and reliability of the connection. The pin header connector 11, in the motor controller, enables the transmission of electrical signals by providing physical connections between circuits. They can connect different types of wires, conductors, components on circuit boards, etc., to form a complete circuit path. The pin header connector 11 not only provides electrical connections but also firmly fixes the connected components or equipment, ensuring the stability and reliability of the connection. The pin header connector 11 has a plug-in / plug-out function, facilitating operation during maintenance and component replacement.

[0032] In summary, this invention utilizes a ceramic support base 5 to provide thermally conductive and insulating support for the MOSFET 4, and works in conjunction with the heat dissipation grooves in the base 1 to improve heat dissipation efficiency; the elastic clamping of the fixing spring plate 8 enhances the installation stability and thermal reliability of the MOSFET 4; and the adoption of a double-layer PCB structure optimizes the space layout, ensuring component assembly while meeting miniaturization requirements, thus improving overall heat dissipation performance and market applicability. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0033] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A heat dissipation structure for a motor controller, comprising a controller metal base (1), a housing (2), and a printed circuit board (3), wherein a plurality of MOSFETs (4) are mounted on the printed circuit board (3); Its features are: A ceramic support base (5) is welded to the upper end of the metal base (1), a printed circuit board (3) is mounted on the upper end of the ceramic support base (5), and several MOS transistors (4) are welded to the lower end of the printed circuit board (3) and the tube body of the MOS transistors (4) is attached to the side end face of the ceramic support base (5). The lower end of the metal base (1) is provided with several heat dissipation grooves (6).

2. The heat dissipation structure for the motor controller according to claim 1, characterized in that: The metal base (1) is also welded with a triangular seat (7). A fixed spring plate (8) is detachably mounted on the triangular seat (7) by bolts. The upper end of the fixed spring plate (8) is provided with several arc-shaped spring pieces (81). The arc-shaped spring pieces (81) are used to elastically press the MOS tube (4) so ​​that the tube body is tightly fitted relative to the ceramic support base (5).

3. The heat dissipation structure for the motor controller according to claim 2, characterized in that: The upper end of the ceramic support base (5) is provided with a support column (9), and the ceramic support base (5) is connected to the printed circuit board (3) through the support column (9).

4. The heat dissipation structure for the motor controller according to claim 1, characterized in that: The printed circuit board (3) is composed of an upper PCB board (31) and a lower PCB board (32) stacked on top of each other. Several MOS transistors (4) are soldered to the lower end of the lower PCB board (32). A conductive post (10) is soldered to the upper end of the lower PCB board (32). A conductive through hole is opened in the mounting area of ​​the upper PCB board (31) corresponding to the conductive post (10). The conductive post (10) passes through the conductive through hole and is electrically connected to the upper PCB board (31).

5. The heat dissipation structure for the motor controller according to claim 4, characterized in that: The upper end of the upper PCB board (31) is welded with a pin header connector (11), and the upper ends of the conductive post (10) and the pin header connector (11) both extend through the outer shell (2) to the outside of the controller.

6. The heat dissipation structure for the motor controller according to claim 1, characterized in that: The outer shell (2) is provided with an internal thread seat on its edge, and the metal base (1) is provided with a threaded hole that connects to the internal thread seat. The outer shell (2) is locked onto the metal base (1) by using bolts to simultaneously pass through the threaded hole and the internal thread seat.

7. The heat dissipation structure for the motor controller according to claim 6, characterized in that: The metal base (1) is provided with a circumferentially closed glue-filling groove (12) in the area corresponding to the inner edge of the outer shell (2). Glue is poured into the glue-filling groove (12) to form a sealed protection between the metal base (1) and the outer shell (2).

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