Smart cockpit and entertainment system

Abstract

The utility model discloses an intelligent cockpit and entertainment system relates to cockpit technical field, wherein, the interactive space is formed in the intelligent cockpit, the intelligent cockpit is formed by the enclosure of outer veneer, the outer veneer includes heat conduction veneer, the inboard of heat conduction veneer is installed with power amplifier, the power amplifier includes box body and the circuit board of installation in the box body, the box body is connected with heat conduction veneer through first side surface heat conduction, the utility model provides technical scheme aims at guaranteeing reliable heat dissipation to power amplifier, realizes the miniaturization and light weight of power amplifier.

Description

Technical Field

[0001] This utility model relates to the field of cockpit technology, and in particular to an intelligent cockpit and entertainment system. Background Technology

[0002] In related technologies, smart cockpits are equipped with power amplifiers. The outer side of the power amplifier's housing has heat dissipation fins. While these heat dissipation fins improve the heat dissipation performance of the power amplifier, they also result in a relatively large size and weight of the power amplifier, which makes installation inconvenient. Utility Model Content

[0003] The main purpose of this invention is to propose an intelligent cockpit and entertainment system that ensures reliable heat dissipation for the power amplifier.

[0004] To achieve the above objectives, the present invention proposes an intelligent cockpit with an interactive space. The intelligent cockpit is formed by an outer trim panel, which includes a heat-conducting trim panel. A power amplifier is installed on the inner side of the heat-conducting trim panel. The power amplifier includes a housing and a circuit board installed inside the housing. The housing is thermally connected to the heat-conducting trim panel through a first side.

[0005] In one embodiment, the first side of the box body is the side that needs to dissipate heat, and the area of ​​the heat-conducting decorative plate is larger than the area of ​​the first side.

[0006] In one embodiment, the height of the box is 30mm to 50mm.

[0007] In one embodiment, the inner side of the heat-conducting decorative plate is provided with an abutting boss, and the first side abuts against the abutting boss.

[0008] In one embodiment, the area ratio of the abutting boss to the first side surface is greater than or equal to 50%.

[0009] In one embodiment, the housing and the thermally conductive decorative plate are detachably connected.

[0010] In one embodiment, the inner side of the heat-conducting decorative plate is provided with a plurality of mounting portions, the mounting portions being provided with mounting blind holes, and the box body being detachably connected to the mounting blind holes by fasteners or buckles.

[0011] In one embodiment, the inner side of the heat-conducting decorative plate is further provided with a plurality of positioning posts, and the box body is provided with positioning holes corresponding to the positioning posts, and the positioning posts are configured to be inserted into the corresponding positioning holes.

[0012] In one embodiment, the smart cockpit includes a plurality of exterior panels, which are spliced ​​together and enclosed to form the interactive space, and at least one of the plurality of exterior panels is the heat-conducting panel.

[0013] In one embodiment, among the plurality of said exterior panels, at least the thermally conductive panel is configured to be made of metal; and / or, at least the outer surface of the thermally conductive panel is covered with a heat-radiating layer.

[0014] In one embodiment, the box body is made of metal.

[0015] In one embodiment, the circuit board is equipped with flip chips, including power amplifier chips.

[0016] In one embodiment, the interaction space is provided with a seat, and the heat-conducting trim panel and the seat are staggered.

[0017] This utility model also proposes an entertainment system, including the aforementioned smart cockpit.

[0018] In this invention, after the heat generated by the circuit board is transferred to the first side of the housing, the heat can continue to be efficiently conducted to the heat-conducting decorative plate due to the thermally conductive connection between the first side of the housing and the heat-conducting decorative plate. As part of the outer decorative plate, the heat-conducting decorative plate is exposed to the external environment and exchanges heat with the ample air there. Thus, the power amplifier does not need to be exposed outside the cabin, which preserves the aesthetic design of the outer decorative plate. Simultaneously, the heat generated by the power amplifier can be promptly dissipated into the external air, ensuring reliable heat dissipation for the power amplifier. Furthermore, the heat dissipation method employed in this invention eliminates the need for heat dissipation fins on the outside of the housing, or reduces the number or size of the heat dissipation fins. This facilitates the miniaturization and weight reduction of the power amplifier, thereby reducing the requirements for installation space and structural strength, and facilitating power amplifier installation. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the structure of an embodiment of the intelligent cockpit provided by this utility model;

[0021] Figure 2A schematic diagram of the mating structure of the power amplifier and heat-conducting trim panel of the intelligent cockpit provided by this utility model;

[0022] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0023] Figure 4 A partial cross-sectional structural schematic diagram of an embodiment of the power amplifier and heat-conducting trim panel of the intelligent cockpit provided by this utility model;

[0024] Figure 5 A schematic diagram of the structure of a heat-conducting decorative panel for an intelligent cockpit provided by this utility model;

[0025] Figure 6 for Figure 5 A magnified view of a section at point B in the middle;

[0026] Figure 7 A schematic diagram of the structure of an embodiment of the power amplifier for the intelligent cockpit provided by this utility model;

[0027] Figure 8 for Figure 7 A magnified view of a section at point C.

[0028] Explanation of icon numbers:

[0029] 100. Interactive space; 110. Seating;

[0030] 200. Exterior trim panel; 210. Thermally conductive trim panel; 211. Abutment boss; 212. Mounting part; 213. Mounting blind hole; 214. Positioning post;

[0031] 300, Power amplifier; 310, Housing; 311, First side; 312, Lug; 313, Positioning hole; 320, Circuit board; 400, Fastener.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] This invention proposes an intelligent cockpit that can be mounted on a vehicle or installed in other stationary spaces, such as a home entertainment device installed in a user's home or a commercial entertainment device installed in a game experience center.

[0037] Please see Figure 1 In one embodiment of this utility model, an interactive space 100 is formed within the smart cockpit. This interactive space 100 is a semi-open space with a connection port that connects to the external environment. After entering the interactive space 100 through the connection port, the user can sit down in the interactive space 100. Functional modules for user interaction are installed within the interactive space 100. These modules include speakers and displays for audiovisual interaction, as well as cameras, lighting, and wireless charging modules. The camera is used to acquire images of the user and identify relevant control signals, such as posture signals or gesture signals, thereby controlling the relevant functional modules to execute different commands. The lighting provides illumination to the interactive space 100, and the color of the lighting can be configured and controlled as needed. The wireless charging module is used for portable wireless charging of the user's mobile phone or other electrical devices.

[0038] Please see Figure 1 and Figure 2The intelligent cockpit is formed by an outer trim panel 200. The outer trim panel 200 includes a heat-conducting trim panel 210. A power amplifier 300 is installed on the inner side of the heat-conducting trim panel 210. The power amplifier 300 includes a housing 310 and a circuit board 320 installed in the housing 310. The housing 310 is thermally connected to the heat-conducting trim panel 210 through a first side 311.

[0039] Power amplifiers generate a lot of heat and have a strong need for heat dissipation. In related technologies, heat dissipation fins are protruding on the outside of the power amplifier. Although these heat dissipation fins improve the heat dissipation performance of the power amplifier, they also make the power amplifier larger and heavier, which makes the installation of the power amplifier inconvenient.

[0040] In this invention, after the heat generated by the circuit board 320 of the power amplifier 300 is transferred to the first side 311 of the housing 310, the heat can continue to be efficiently conducted to the heat-conducting decorative plate 210 because the first side 311 of the housing 310 and the heat-conducting decorative plate 210 are thermally connected. As part of the outer decorative plate 200, the heat-conducting decorative plate 210 is exposed to the external environment and exchanges heat with sufficient air. Thus, the power amplifier 300 does not need to be exposed outside the cabin, which does not disrupt the appearance design of the outer decorative plate 200. Simultaneously, the heat generated by the power amplifier 300 can be promptly diffused into the external air, ensuring reliable heat dissipation for the power amplifier 300. Furthermore, the heat dissipation method adopted in this invention allows for the elimination of heat dissipation fins on the outside of the housing 310, or a reduction in the number or size of the heat dissipation fins. This facilitates the miniaturization and weight reduction of the power amplifier 300, thereby reducing the requirements for installation space and structural strength, and facilitating the installation of the power amplifier 300.

[0041] The first side 311 of the housing 310 can abut against the inner surface of the thermally conductive decorative plate 210, or it can indirectly contact it through structures such as thermally conductive grease or thermally conductive pads, thereby achieving a thermally conductive connection. That is, between the housing 310 and the thermally conductive decorative plate 210, heat can be directly conducted from the first side 311 to the thermally conductive decorative plate 210, or indirectly conducted to the thermally conductive decorative plate 210 through an intermediate thermally conductive medium. It should be noted that the thermally conductive decorative plate 210 refers to a thermally conductive material with a relatively high thermal conductivity; the thermal conductivity is not specifically limited, as long as it is distinct from thermally insulating materials with a relatively low thermal conductivity.

[0042] The first side 311 of the housing 310 is the side requiring heat dissipation. That is, the first side 311 of the housing 310 is positioned opposite the side of the circuit board 320 where electrical components are mounted. This allows for timely heat transfer from the electrical components on the circuit board 320, ensuring reliable heat dissipation for the power amplifier. Furthermore, multiple power devices are mounted on the side of the circuit board 320 closest to the first side 311. Since these power devices generate significant heat, concentrating the heat-generating components on this side of the circuit board 320 allows for faster heat dissipation, preventing heat buildup and overheating that could affect the performance of the electrical components.

[0043] Furthermore, the area of ​​the thermally conductive trim 210 is larger than the area of ​​the first side surface 311. This allows the thermally conductive trim 210 to quickly dissipate heat from the housing 310, preventing heat accumulation. Simultaneously, the thermally conductive trim 210 provides a larger heat exchange area to improve heat dissipation efficiency, thereby ensuring the operating performance of the power amplifier 300. In other embodiments, heat dissipation efficiency can also be improved through other means, such as installing a fan on the outside of the smart cockpit that directs airflow towards the thermally conductive trim 210 to achieve forced convection heat transfer.

[0044] In one embodiment, please refer to Figure 2 and Figure 7 The height H of the housing 310 is 30mm to 50mm. It can be understood that the first side 311 is located on one side of the housing 310 along its height. The height of the housing 310 can be 30mm, 35mm, 40mm, 45mm, or 50mm. In this embodiment, by eliminating the heat sink fins, the height of the housing 310 can be significantly reduced. The height of the housing 310 is also the height of the power amplifier 300. Compared with power amplifiers with heat sink fins in related technologies, the height of the power amplifier 300 of this invention can be reduced by at least 20%, which is beneficial to improving the miniaturization of the power amplifier 300.

[0045] In one embodiment, please refer to Figure 4 and Figure 5The inner side of the heat-conducting trim 210 is provided with an abutment boss 211, and the first side 311 abuts against the abutment boss 211. Due to the requirements of the appearance design of the smart cockpit, the heat-conducting trim 210 needs to have a certain shape. When the heat-conducting trim 210 abuts against the first side 311 through the abutment boss 211, the shape and material of the abutment boss 211 can be designed according to the abutment requirements of the first side 311. At the same time, the abutment boss 211 has a smaller area and better surface flatness control, which is more conducive to reliable abutment with the first side 311, so as to ensure that there is a sufficient abutment area between the abutment boss 211 and the first side 311, thereby ensuring that the heat generated by the power amplifier 300 can be transferred to the heat-conducting trim 210 more efficiently. In other embodiments, an elastic thermal pad may be sandwiched between the thermally conductive decorative plate 210 and the first side surface 311, so that reliable heat conduction between the box body 310 and the thermally conductive decorative plate 210 can be ensured through the adaptive deformation of the thermal pad.

[0046] Furthermore, the area ratio of the abutment boss 211 to the first side surface 311 is greater than or equal to 50%. This area ratio is also the ratio between the area of ​​the abutment boss 211 and the area of ​​the first side surface 311, meaning the area of ​​the abutment boss 211 is greater than 60% of the area of ​​the first side surface 311. This ensures sufficient contact area between the first side surface 311 and the abutment boss 211, while also better controlling the surface flatness of the abutment boss 211, thereby ensuring efficient heat conduction between the housing 310 and the heat-conducting decorative plate 210. The abutment boss 211 can intersect with the central area of ​​the first side surface 311, allowing heat from the first side surface 311 to be evenly transferred to the first boss, ensuring effective heat dissipation for the power amplifier 300. Specifically, the aforementioned area ratio can be 50%, 60%, 70%, or 80%. In other embodiments, the area ratio described above may also be less than 50%, for example, 30%, 40%, or 45%.

[0047] In one embodiment, the housing 310 and the thermally conductive trim 210 are detachably connected. This allows for easy separation and replacement of either the power amplifier 300 or the thermally conductive trim 210 if either is damaged, reducing cabin maintenance costs. Alternatively, the thermally conductive trim 210 can be easily disassembled and reassembled to meet cabin aesthetic requirements. In other embodiments, the housing 310 comprises two detachably connected parts for easy access to the internal circuit board 320. One part of the housing 310 is integrally formed or welded to the thermally conductive trim 210 to ensure reliable heat conduction and can be replaced along with the trim 210.

[0048] In one embodiment, please refer to Figure 3 , Figures 5 to 8The inner side of the heat-conducting trim 210 has multiple mounting portions 212, each with a blind mounting hole 213. The housing 310 is detachably connected to the blind mounting hole 213 via fasteners or snap-fits. The fasteners can be screws or pins; that is, the housing 310 can be securely connected to the blind mounting hole 213 by screw fastening or pin engagement. Specifically, the outer periphery of the housing 310 has lugs 312, each with corresponding holes in the blind mounting hole 213 for fastener insertion. Alternatively, the blind mounting hole 213 can be a snap-fit ​​hole, with snap-fits on the housing 310. This snap-fit ​​connection between the power amplifier 300 and the heat-conducting trim 210 also allows for detachable connection. Furthermore, the blind mounting hole 213 is not exposed on the outer side of the heat-conducting trim 210, thus not affecting the integrity and aesthetics of the cabin's appearance. It should be noted that the protrusion height of the mounting part 212 should be designed according to the protrusion height of the abutting protrusion, so that after the box body 310 is connected to the mounting blind hole 213, the first side 311 can abut against the abutting protrusion.

[0049] In one embodiment, please refer to Figure 3 , Figures 5 to 8 The inner side of the heat-conducting decorative plate 210 is also provided with a plurality of positioning posts 214. The box body 310 is provided with positioning holes 313 corresponding to the positioning posts 214. The positioning posts 214 are configured to be inserted into the corresponding positioning holes 313. Before the relevant structure of the box body 310 and the mounting blind hole 213 are aligned, the positioning posts 214 can be inserted into the positioning holes 313 to provide positioning for the alignment of the relevant structure of the box body 310 and the mounting blind hole 213, so as to ensure the accuracy of the alignment and thus ensure the reliable connection between the box body 310 and the heat-conducting decorative plate 210. In other embodiments, the first side surface 311 may also be provided with a groove structure corresponding to the abutment boss 211. The positioning effect is achieved by the matching and engaging of the groove and the abutment boss 211.

[0050] In one embodiment, please refer to Figure 1 The intelligent cockpit includes multiple exterior panels 200, which are spliced ​​together to form an interactive space 100. At least one of the exterior panels 200 is a heat-conducting panel 210. Thus, each exterior panel 200 can be molded independently, and can be produced using molds with relatively simple structures and small volumes, reducing mold development and maintenance costs, and also reducing the processing difficulty of the exterior panel 200. Each exterior panel 200 can be configured with different colors, allowing users to personalize their selection and combination of different colors to enhance the user experience and improve overall usability.

[0051] Specifically, among the multiple exterior panels 200, at least the thermally conductive panel 210 is made of metal. This ensures that the thermally conductive panel 210 has sufficient thermal conductivity to guarantee reliable heat dissipation for the power amplifier 300, and also provides sufficient structural strength to ensure stable installation of the power amplifier 300. Specifically, the thermally conductive panel 210 can be made of aluminum alloy or copper alloy, etc. The remaining exterior panels 200 can be made of metal, plastic, wood, etc.

[0052] Among the multiple exterior panels 200, at least the outer surface of the thermally conductive panel 210 is covered with a heat radiation layer. This enhances the radiative heat dissipation effect of the thermally conductive panel 210, thereby improving the heat dissipation of the power amplifier 300. Specifically, a film layer with a high thermal emissivity can be applied to the outer side of the thermally conductive panel 210, or a paint with a high thermal emissivity can be sprayed to form a heat radiation layer, ensuring the bonding stability between the heat radiation layer and the thermally conductive panel 210.

[0053] In one embodiment, the housing 310 is made of metal. This helps ensure the structural strength of the housing 310, thus providing good protection for the internal circuit board 320. Furthermore, the housing 310 also has good thermal conductivity, allowing the heat generated by the circuit board 320 to be quickly transferred to the heat-conducting decorative plate 210, ensuring reliable heat dissipation for the power amplifier 300. Specifically, the housing 310 can be made of aluminum alloy or copper alloy, etc. Of course, in other embodiments, the housing 310 can also be made of non-metallic materials, such as thermally conductive plastic, or ceramic materials such as aluminum nitride and silicon carbide.

[0054] In one embodiment, a power amplifier chip is mounted on the side of the circuit board 320 closest to the first side 311. This allows the heat generated by the power amplifier chip to be dissipated promptly, ensuring its performance. Furthermore, the power amplifier chip is configured as a flip chip. A flip chip is a bare chip directly mounted on the circuit board 320 in an inverted manner, with electrical connections and mechanical fixation achieved through solder balls on the bottom of the chip. This eliminates the need for a casing and wire bonding space required in traditional packaging, reducing the overall package height and area, and improving the miniaturization and weight reduction of the power amplifier 300. Of course, other circuit modules besides the power amplifier chip can also be flip chips. In other embodiments, the chips on the circuit board 320 can also be packaged using conventional processes.

[0055] In one embodiment, the interaction space 100 includes a seat 110, and the heat-conducting trim 210 is offset from the seat 110. This ensures that both the power amplifier 300 and the heat-conducting trim 210 avoid the seat 110, preventing heating and discomfort to the user. Of course, if sufficient heat insulation measures are available at the seat 110 location, the heat-conducting trim 210 can also be positioned opposite the seat 110.

[0056] This utility model also proposes an entertainment system, which includes a smart cockpit. The specific structure of the smart cockpit is as described in the above embodiments. Since this entertainment system adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The entertainment system may also include a head-mounted display device (VR device or AR device). In this case, the user can sit in the interactive space, allowing the user to experience the head-mounted display device more comfortably. Of course, the entertainment system may also include a projector, allowing the user to watch a movie projected by the projector in the interactive space.

[0057] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. An intelligent cockpit, characterized in that, An interactive space is formed within the intelligent cockpit, which is enclosed by an outer trim panel. The outer trim panel includes a heat-conducting trim panel, and a power amplifier is installed on the inner side of the heat-conducting trim panel. The power amplifier includes a housing and a circuit board installed inside the housing. The housing is thermally connected to the heat-conducting trim panel via a first side.

2. The intelligent cockpit as described in claim 1, characterized in that, The first side of the box is the side that needs heat dissipation, and the area of ​​the heat-conducting decorative plate is larger than the area of ​​the first side. And / or, the height of the box body is 30mm to 50mm.

3. The intelligent cockpit as described in claim 1, characterized in that, The inner side of the heat-conducting decorative plate is provided with an abutting boss, and the first side abuts against the abutting boss.

4. The intelligent cockpit as described in claim 3, characterized in that, The area ratio of the abutment boss to the first side surface is greater than or equal to 50%.

5. The intelligent cockpit as described in claim 1, characterized in that, The box body and the heat-conducting decorative plate are detachably connected.

6. The intelligent cockpit as described in claim 5, characterized in that, The inner side of the heat-conducting decorative plate is provided with multiple mounting parts, and each mounting part is provided with a blind mounting hole. The box body is detachably connected to the blind mounting hole by fasteners or buckles.

7. The intelligent cockpit as described in claim 6, characterized in that, The inner side of the heat-conducting decorative plate is also provided with a plurality of positioning posts, and the box body is provided with positioning holes corresponding to the positioning posts, and the positioning posts are configured to be inserted into the corresponding positioning holes.

8. The intelligent cockpit as described in claim 1, characterized in that, The intelligent cockpit includes multiple exterior panels, which are spliced ​​together and enclosed to form the interactive space, and at least one of the multiple exterior panels is the heat-conducting panel.

9. The intelligent cockpit as described in claim 8, characterized in that, In the plurality of said exterior panels, at least the thermally conductive panel is configured to be made of metal; and / or, at least the outer surface of the thermally conductive panel is covered with a heat radiation layer.

10. The intelligent cockpit as described in any one of claims 1 to 9, characterized in that, The box body is made of metal. And / or, a power amplifier chip is mounted on the side of the circuit board near the first side, and the power amplifier chip is configured as a flip chip; And / or, the interactive space is equipped with a seat, and the heat-conducting trim panel and the seat are staggered.

11. An entertainment system, characterized in that, Including the smart cockpit as described in any one of claims 1 to 10.

Images