SMT chip mounter facilitating welding

Abstract

This utility model discloses an SMT pick-and-place machine that facilitates soldering, comprising: an SMT pick-and-place machine body, the SMT pick-and-place machine body being provided with: a moving suction cup mechanism, a placement area, and a chip placement area, the placement area being provided with a conveyor belt for transporting PCB boards, the chip placement area including: a horizontal placement surface and a chip tray; the chip tray is placed on the horizontal placement surface; the chip tray includes a substrate, the substrate being provided with a plurality of unit grooves for placing electronic chips, the substrate being provided with a connecting structure, the substrate being placed on the horizontal placement surface through the connecting structure; the moving suction cup mechanism is used to attract and move the electronic chips to the corresponding positions on the PCB board. This utility model utilizes the chip tray method to place electronic chips, avoiding the flipping of electronic chips that could cause the moving suction cup mechanism to fail to attract them. It has high reliability and improves the overall placement efficiency. It is mainly used in the field of PCB manufacturing technology.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, specifically to an SMT placement machine that is easy to solder. Background Technology

[0002] A surface mount technology (SMT) pick-and-place machine is an automated device used to accurately place electronic components onto printed circuit boards (PCBs). SMT pick-and-place machines are configured in the production line after dispensing machines or screen printers, and use a moving placement head to accurately place surface mount components onto PCB pads.

[0003] Existing SMT (Surface Mount Technology) placement machines typically use a vibrating feeder to connect to the IC tubing during chip soldering. The feeder shakes the IC from the tubing to the target position, where it is then moved by a suction cup on the SMT placement machine, held in place, and positioned on the corresponding location on the PCB. However, in actual production, this method of shaking the IC off the PCB via a vibrating feeder is prone to causing the IC to flip or deviate from its target position due to vibration. This results in low efficiency throughout the placement process. Therefore, improving the efficiency of SMT placement machines is a pressing technical issue that requires research in the industry. Utility Model Content

[0004] This invention provides an SMT placement machine that is easy to solder, thereby solving one or more technical problems existing in the prior art, and at least providing a beneficial option or creating conditions.

[0005] This utility model provides an SMT placement machine that facilitates soldering, comprising: an SMT placement machine body, the SMT placement machine body being provided with: a movable suction cup mechanism, a placement area, and a chip placement area, the placement area being provided with a conveyor belt for transporting PCB boards, the chip placement area including: a horizontal placement surface and a chip tray; the chip tray being placed on the horizontal placement surface; the chip tray including a substrate, the substrate being provided with a plurality of unit grooves for placing electronic chips, the substrate being provided with a connecting structure, the substrate being placed on the horizontal placement surface through the connecting structure; the movable suction cup mechanism being used to attract and move the electronic chips to the corresponding positions on the PCB board.

[0006] Furthermore, the connection structure includes: connection holes respectively provided at the four top corners of the substrate, permanent magnets embedded in the connection holes, the horizontal placement surface being made of iron, and the substrate being magnetically connected to the horizontal placement surface through the permanent magnets.

[0007] Furthermore, the plurality of unit grooves are arranged in an array by horizontal and vertical arrangement.

[0008] Furthermore, the substrate is a glass fiber board.

[0009] Furthermore, the substrate is provided with a plurality of positioning grooves, and the horizontal placement surface is provided with a plurality of positioning protrusions corresponding to each other, the positioning protrusions falling into the positioning grooves.

[0010] Furthermore, the number of positioning grooves is four, which are respectively disposed on the four sides of the substrate.

[0011] Furthermore, the SMT placement machine body is also provided with a first cover door, which is used to cover the placement area.

[0012] Furthermore, the SMT placement machine body is also provided with a second cover door, which is used to cover the chip placement area.

[0013] Furthermore, the first cover door is provided with a transparent window.

[0014] Furthermore, the second cover door is provided with a transparent window.

[0015] This invention has at least the following beneficial effects: By setting a chip placement area in the SMT pick-and-place machine body and using a chip tray to place the electronic chips, the shape of the electronic chips is fixed, thereby preventing the electronic chips from flipping and causing the moving suction cup mechanism to fail to pick them up. Simultaneously, placing the chip tray on a horizontal surface in the chip placement area ensures that the position of the electronic chips is relatively fixed. This also avoids the failure of the moving suction cup mechanism to pick up the chips due to changes in their position. Compared with existing technologies, this invention has higher reliability, and in this respect, it also improves the overall efficiency of SMT placement. This invention is mainly used in the field of PCB manufacturing technology. Attached Figure Description

[0016] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.

[0017] Figure 1 This is a three-dimensional structural diagram of an SMT pick-and-place machine designed for easy soldering.

[0018] Figure 2 This is a side view diagram of an SMT pick-and-place machine designed for easy soldering.

[0019] Figure 3 This is a top view of the chip tray structure. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0021] It should be noted that although functional modules are divided in the system diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than the module division in the system or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0022] refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a three-dimensional structural diagram of an SMT pick-and-place machine designed for easy soldering. Figure 2 This is a side view diagram of an SMT pick-and-place machine designed for easy soldering. Figure 3 This is a top view of the chip tray structure.

[0023] The purpose of this invention is to avoid the misalignment or detachment of electronic chips caused by the vibration of the vibrating feeder in the prior art, which would affect the placement efficiency of the entire SMT placement machine.

[0024] For this technical purpose, this application provides an SMT placement machine that facilitates soldering. The SMT placement machine includes an SMT placement machine body. The SMT placement machine body refers to a device with basic functions for placing electronic components.

[0025] The SMT placement machine body includes a movable suction cup mechanism 100, a placement area 200, and a chip placement area 300.

[0026] The function of the movable suction cup mechanism 100 is to transfer electronic chips from the chip placement area 300 to the movable mounting area 200. The mounting area 200 is equipped with a conveyor belt 210. The conveyor belt 210 transports PCB boards 220 transferred from the preceding station. The chip placement area 300 includes a horizontal placement surface and a chip tray 400.

[0027] The horizontal placement surface is used to place the chip tray 400, which is used to load electronic chips (ICs). To determine the position of the electronic chips, the chip tray 400 includes a substrate 410. The substrate 410 has a plurality of unit grooves 420 for placing electronic chips. Each unit groove 420 holds one electronic chip. The movable suction cup mechanism 100, through a pre-set movement program, can pick up the electronic chip from the unit groove 420 and place it at the corresponding position on the PCB board 220.

[0028] In some further embodiments, the plurality of unit grooves 420 are arranged in a horizontal and vertical manner to form an array, thereby maximizing the utilization of the area of ​​the substrate 410 and thus loading more electronic chips.

[0029] To ensure that the substrate 410 can be stably placed on a horizontal surface, a connecting structure is provided on the substrate 410, through which the substrate 410 is positioned on the horizontal surface. The function of the connecting structure is to allow the substrate 410 to be placed horizontally on the horizontal surface, and to ensure that the position of the substrate 410 on the horizontal surface is relatively stable.

[0030] In some further specific embodiments, the connection structure includes connection holes located at the four corners of the substrate 410. These four connection holes can be designated as: first connection hole 401, second connection hole 402, third connection hole 403, and fourth connection hole 404. Permanent magnets are embedded in each of these four connection holes using an embedding process. Furthermore, the material of the horizontal placement surface is set to iron. In this way, the permanent magnets in the connection holes can magnetically connect the substrate 410 to a specific position on the horizontal placement surface. Moreover, since the magnetic connection is easy to disassemble, when the electronic chip on the substrate 410 is used up, the substrate 410 can be removed from the horizontal placement surface to replace the electronic chip.

[0031] Regarding the material of the substrate 410, in some further specific embodiments, the substrate 410 is a glass fiber board, that is, the substrate 410 is a glass fiber material component.

[0032] In actual operation, workers pre-place the electronic chip in the unit recess 420. Then, the substrate 410 is placed on the horizontal placement surface. Of course, the horizontal placement surface will be provided with corresponding markings to facilitate workers placing the substrate 410 into the corresponding marked areas.

[0033] By programming the mobile suction cup mechanism 100, it can move into the chip placement area 300 and locate the corresponding electronic chip by positioning the unit groove 420, then suction it. The suctioned electronic chip is then transferred to the placement area 200. At this time, the PCB board 220 transported by the conveyor belt 210 in the placement area 200 reaches the set position, and the mobile suction cup mechanism 100 places the electronic chip into the corresponding position on the PCB board 220, thus completing the chip placement. After the electronic chip and other electronic components are placed, the PCB board 220 is conveyed by the conveyor belt 210 to the reflow soldering station for soldering.

[0034] This invention fixes the shape of electronic chips by setting a chip placement area 300 in the SMT pick-and-place machine body and using a chip tray 400 to place the electronic chips, thereby preventing the electronic chips from flipping and causing the moving suction cup mechanism 100 to fail to pick them up. Simultaneously, placing the chip tray 400 on a horizontal placement surface in the chip placement area 300 ensures that the position of the electronic chips is relatively fixed. This also prevents the moving suction cup mechanism 100 from failing to pick up the chips due to changes in their position. Compared with existing technologies, this invention has higher reliability, and in this respect, it also improves the overall efficiency of SMT placement.

[0035] To facilitate the placement of the substrate 410 on a specific position on a horizontal surface, in some further embodiments, the substrate 410 is provided with a plurality of positioning grooves, and a plurality of positioning protrusions are correspondingly provided on the horizontal surface, with the positioning protrusions falling into the positioning grooves. In some further embodiments, the substrate 410 uses four positioning grooves, namely a first positioning groove 411, a second positioning groove 412, a third positioning groove 413, and a fourth positioning groove 414. These four positioning grooves are respectively located on the four edges of the substrate 410 and are etched into a semi-circle shape. Simultaneously, corresponding positioning protrusions are also provided at corresponding positions on the horizontal surface. The positioning protrusions correspond one-to-one with the positioning grooves. Specifically, they are the first positioning protrusion, the second positioning protrusion, the third positioning protrusion, and the fourth positioning protrusion. The first positioning protrusion falls into the first positioning groove, the second positioning protrusion falls into the second positioning groove, the third positioning protrusion falls into the third positioning groove, and the fourth positioning protrusion falls into the fourth positioning groove.

[0036] In some further specific embodiments, the SMT placement machine body is also provided with a first cover door, which is used to cover the placement area 200. The first cover door has a transparent window. The first cover door protects the placement area 200 from unrelated objects entering it. Simultaneously, the transparent window allows workers to observe the operations in the placement area 200.

[0037] In some further specific embodiments, the SMT placement machine body is also provided with a second cover door, which is used to cover the chip placement area 300. The second cover door has a transparent window. The second cover door protects the chip placement area 300 from unrelated objects entering it. At the same time, the transparent window allows workers to observe the operations within the chip placement area 300.

[0038] Although the description of this application has been quite detailed and particularly focused on several described embodiments, it is not intended to limit itself to any of these details or embodiments or any particular embodiment. Rather, it should be considered as effectively covering the intended scope of this application by referring to the appended claims and taking into account the broad possible interpretations of these claims provided by the prior art. Furthermore, the foregoing description of this application with respect to embodiments foreseeable by the inventor is intended to provide a useful description, and non-substantial modifications to this application that have not yet been foreseen may still represent equivalent modifications.

Claims

1. An SMT placement machine that is easy to solder, characterized in that, include: The SMT pick and place machine body is provided with: a moving suction cup mechanism (100), a placement area (200) and a chip placement area (300). The placement area (200) is provided with a conveyor belt (210) for transporting PCB boards (220). The chip placement area (300) includes: a horizontal placement surface and a chip tray (400). The chip tray (400) is placed on the horizontal placement surface. The chip tray (400) includes a substrate (410). The substrate (410) is provided with a plurality of unit grooves (420) for placing electronic chips. The substrate (410) is provided with a connecting structure, and the substrate (410) is placed on the horizontal placement surface through the connecting structure. The moving suction cup mechanism (100) is used to attract and move the electronic chips to the corresponding positions on the PCB board (220).

2. The SMT placement machine for easy soldering according to claim 1, characterized in that, The connection structure includes: connection holes are respectively provided at the four top corners of the substrate (410), permanent magnets are embedded in the connection holes, the horizontal placement surface is made of iron, and the substrate (410) is magnetically connected to the horizontal placement surface through the permanent magnets.

3. The SMT placement machine for easy soldering according to claim 1, characterized in that, The plurality of unit grooves (420) are arranged in a horizontal and vertical array.

4. The SMT placement machine for easy soldering according to claim 1, characterized in that, The substrate (410) is a glass fiber board.

5. The SMT placement machine for easy soldering according to claim 1, characterized in that, The substrate (410) is provided with a plurality of positioning grooves, and the horizontal placement surface is provided with a plurality of positioning protrusions corresponding to each other, and the positioning protrusions fall into the positioning grooves.

6. The SMT placement machine for easy soldering according to claim 5, characterized in that, The number of positioning grooves is 4, which are respectively arranged on the 4 sides of the substrate (410).

7. The SMT placement machine for easy soldering according to claim 1, characterized in that, The SMT placement machine body is also provided with a first cover door, which is used to cover the placement area (200).

8. The SMT placement machine for easy soldering according to claim 1, characterized in that, The SMT placement machine body is also provided with a second cover door, which is used to cover the chip placement area (300).

9. An SMT placement machine for easy soldering according to claim 7, characterized in that, The first cover door is equipped with a transparent window.

10. An SMT placement machine for easy soldering according to claim 8, characterized in that, The second cover door is equipped with a transparent window.

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