Substrate heat treatment apparatus

Abstract

A substrate heat treatment apparatus includes a heat treatment chamber having a heat treatment space, a gas injection unit located inside the heat treatment chamber and having a gas outlet configured to inject a gas into the heat treatment chamber, and a heat dissipation guide positioned inside the heat treatment chamber adjacent to the gas injection unit and extending along a first horizontal direction intersecting with a discharge direction of the gas discharged through the gas outlet, wherein an inner surface of the heat dissipation guide facing the gas outlet includes a recessed surface recessed formed along a second horizontal direction intersecting with the first horizontal direction.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and all benefits derived therefrom to Korean Patent Application No. 10-2024-0062066, filed on May 10, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This utility model relates to a substrate heat treatment apparatus, and more specifically, to a substrate heat treatment apparatus that provides a uniform gas flow rate. Background Technology

[0004] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. For example, display devices are incorporated into a variety of electronic devices such as smartphones, digital cameras, laptops, navigation systems, and smart televisions (TVs).

[0005] Several types of display devices are currently in use, such as liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs). Among these display devices, OLEDs use organic light-emitting elements (OLEDs) that generate light through the recombination of electrons and holes to display images. OLEDs include multiple transistors that provide drive current to the OLEDs.

[0006] In particular, display panels (such as organic light-emitting display panels) are trending towards miniaturization and thinning.

[0007] In addition to these display devices, the substrates used in the manufacture of semiconductors and solar cells undergo various thermal processing techniques for the formation of inorganic, organic, and / or semiconductor components.

[0008] Specifically, in the manufacture of flat panel displays, semiconductors, and solar cells, the substrates used undergo heat treatment processes within a substrate heat treatment apparatus to crystallize or change the phase of the film deposited on the substrate through heat treatment.

[0009] In a heat treatment apparatus, the substrate to be heat-treated can be positioned spaced apart from the upper side of the heater, allowing the substrate to be heated uniformly by the heater. Due to this heat treatment, it may be necessary to maintain low concentrations of oxygen and water vapor within the heat treatment apparatus. Reducing and maintaining the concentrations of oxygen and moisture is crucial for the quality and yield of the substrate, and to achieve this, gases can be supplied to the heat treatment apparatus.

[0010] However, when gas is injected towards the substrate within the substrate heat treatment apparatus, it can be directly sprayed towards the substrate in a straight direction. This direct injection, and the resulting airflow deviation in the injected area, can cause stains on the substrate. In other words, direct gas injection towards the substrate and the resulting uneven gas flow velocity can cause stains on the substrate, necessitating improvements in the uniformity of the gas flow velocity. Utility Model Content

[0011] This invention provides a substrate heat treatment apparatus that can provide a uniform gas flow velocity by guiding heat dissipation guides to prevent gas from being directly sprayed toward the substrate in a straight direction.

[0012] However, the aspects of this invention are not limited to those set forth herein. The above and other aspects of this invention will become more apparent to those skilled in the art from the detailed description of the invention given below.

[0013] According to an embodiment, a substrate heat treatment apparatus is provided, the substrate heat treatment apparatus comprising: a heat treatment chamber having a heat treatment space; a gas injection unit located inside the heat treatment chamber and having a gas outlet configured to inject gas into the heat treatment chamber; and a heat dissipation guide positioned inside the heat treatment chamber adjacent to the gas injection unit, wherein the heat dissipation guide extends along a first horizontal direction intersecting the discharge direction of the gas discharged through the gas outlet, wherein the inner surface of the heat dissipation guide facing the gas outlet includes a recessed surface recessedly formed along a second horizontal direction intersecting the first horizontal direction.

[0014] In one embodiment, the heat dissipation guide may include a centerline, a first wing located on one side of the centerline in the second horizontal direction, and a second wing located on the other side of the centerline in the second horizontal direction.

[0015] In one embodiment, the centerline may overlap with the gas outlet.

[0016] In one embodiment, the first wing and the second wing may have a symmetrical shape relative to the centerline.

[0017] In one embodiment, as the first wing and the second wing extend away from the centerline, each of the first wing and the second wing can approach the gas injection unit.

[0018] In one embodiment, each of the first wing and the second wing may be spaced apart from the gas injection unit.

[0019] In an embodiment, the space between the first wing and the gas injection unit, and the space between the second wing and the gas injection unit, can constitute a gas emission space.

[0020] In one embodiment, the gas emission space may have a slit shape extending in the first horizontal direction.

[0021] In an embodiment, the angles formed by the first wing and the second wing relative to a vertical direction perpendicular to the first horizontal direction and the second horizontal direction can each be between approximately 70 degrees and approximately 89 degrees.

[0022] In one embodiment, the gas injection unit may include a plurality of gas outlets arranged along the longitudinal direction of the gas injection unit, wherein the plurality of gas outlets may be spaced apart from each other at intervals of about 60 mm to about 75 mm.

[0023] In an embodiment, the substrate heat treatment may further include a heating unit located inside the heat treatment chamber and including a gas exhaust port connected to the gas outlet, wherein the gas injection unit may be coupled to the heating unit at the location where the gas outlet and the gas exhaust port are connected.

[0024] In an embodiment, the heating unit may be continuously arranged along the first horizontal direction, wherein the heating unit may include a heating plate containing the gas exhaust hole and a heating tube coupled to the heating plate, wherein the gas injection unit may include a gas supply pipe coupled to the heating plate while being spaced apart from the heating tube and overlapping the gas exhaust hole.

[0025] In one embodiment, the heat dissipation guide may be spaced apart from the heating plate, and the gas emission space is disposed between the heat dissipation guide and the heating plate.

[0026] In one embodiment, the heat dissipation guide may include a block shape continuously arranged along the longitudinal direction of the heating plate.

[0027] In an embodiment, the substrate heat treatment apparatus may further include a substrate support located inside the heat treatment chamber and positioned facing the heating unit to support the substrate to be heat treated.

[0028] In an embodiment, the substrate heat treatment apparatus may further include: a gas supply unit connected to the gas injection unit to supply gas to the gas injection unit; and a gas discharge unit for discharging the gas supplied to the heat treatment chamber to the outside of the heat treatment chamber.

[0029] According to another embodiment, a substrate heat treatment apparatus is provided, the substrate heat treatment apparatus comprising: a heat treatment chamber having a heat treatment space; a gas injection unit located inside the heat treatment chamber and including a gas outlet configured to inject gas into the heat treatment chamber; and a diffuser plate positioned inside the heat treatment chamber adjacent to the gas injection unit, the diffuser plate being located in a first horizontal direction intersecting with the emission direction of the gas discharged through the gas outlet, wherein the diffuser plate includes a guide surface configured to move the gas in a direction opposite to the emission direction.

[0030] In one embodiment, the diffuser plate may include a bent portion located in a central region and a pair of inclined portions extending symmetrically from the bent portion in two directions, wherein each of the pair of inclined portions may include the guide surface.

[0031] In an embodiment, the pair of inclined portions may each have an inclination angle ranging from about 70 degrees to about 89 degrees relative to a straight line oriented in the discharge direction.

[0032] In one embodiment, the gas injection unit may include a plurality of gas outlets arranged along the longitudinal direction of the gas injection unit, wherein the plurality of gas outlets may be spaced apart from each other at intervals of about 60 mm to about 75 mm.

[0033] It should be noted that the effects of this utility model are not limited to those described above, and other effects of this utility model will be apparent from the following description. Attached Figure Description

[0034] The above and other aspects and features of the present invention will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0035] Figure 1 This is a perspective view of the substrate heat treatment apparatus according to an embodiment;

[0036] Figure 2 According to the embodiments Figure 1 A front view of the substrate heat treatment apparatus;

[0037] Figure 3 According to the embodiments Figure 1 A cross-sectional side view of the substrate heat treatment apparatus;

[0038] Figure 4 According to the embodiments Figure 1 A perspective view of the heating module;

[0039] Figure 5 According to the embodiments Figure 4 Top view of the heating module;

[0040] Figure 6 This illustrates a device according to an embodiment having a pitch of approximately 68 mm between gas outlets for... Figure 4 A diagram of the gas supply pipe and heat dissipation guide of the heating module;

[0041] Figure 7 According to the embodiments Figure 4 Bottom perspective view of the heating module;

[0042] Figure 8 According to the embodiments Figure 4 Rear bottom view of the heating module;

[0043] Figure 9 According to the embodiments Figure 7 Exploded bottom view of the heating module and heat dissipation guide;

[0044] Figure 10 This illustrates an embodiment. Figure 7 A partially enlarged cross-sectional view of the combination of the heating plate and the heat dissipation guide;

[0045] Figure 11 According to the embodiments Figure 9 A perspective view of the heat dissipation guide;

[0046] Figure 12 This illustrates the basis according to the embodiment. Figure 2 A partial enlarged view of the arrangement of the heating module, heat dissipation guide, and substrate;

[0047] Figure 13 This illustrates an embodiment. Figure 12 A partially enlarged cross-sectional view of the heating module, heat dissipation guide, and substrate;

[0048] Figure 14 This illustrates an embodiment. Figure 13 Enlarged cross-sectional view of the heating module and heat dissipation guide;

[0049] Figure 15 This illustrates the passage of gas according to an embodiment. Figure 14 A partially enlarged cross-sectional view of the heating module and heat dissipation guide flowing toward the substrate;

[0050] Figure 16 This illustrates an embodiment for... Figure 15 A photograph of the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 75 degrees;

[0051] Figure 17 This illustrates an embodiment. Figure 10A partially enlarged cross-sectional view of the heat dissipation guides arranged at an angle of approximately 80 degrees on the bottom surface of the heating plate;

[0052] Figure 18 This illustrates an embodiment for... Figure 17 A photograph of the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 80 degrees;

[0053] Figure 19 This illustrates an embodiment. Figure 10 A partially enlarged cross-sectional view of the heat dissipation guides arranged at an angle of approximately 85 degrees on the bottom surface of the heating plate.

[0054] Figure 20 This illustrates an embodiment for... Figure 19 A photograph of the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 85 degrees;

[0055] Figure 21 This illustrates an embodiment. Figure 10 A view showing the state of the heat dissipation guides arranged at an angle of approximately 90 degrees on the bottom surface of the heating plate;

[0056] Figure 22 This illustrates an embodiment for... Figure 21 A photograph of the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 90 degrees;

[0057] Figure 23 According to the embodiments Figure 4 A cross-sectional view of a gas supply pipe with a pitch of approximately 136 mm between gas outlets; and

[0058] Figure 24 According to the embodiments, Figure 6 The gas supply pipe with a pitch of approximately 68 mm and Figure 23 A graph comparing the flow uniformity of a gas supply pipe with a pitch of approximately 136 mm. Detailed Implementation

[0059] Embodiments of the present invention will now be described more fully below with reference to the accompanying drawings, which illustrate embodiments of the present invention. However, the present invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Throughout the specification, the same reference numerals denote the same components. In the drawings, the thickness of layers and regions is exaggerated for clarity.

[0060] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or segments, these elements, components, areas, layers, and / or segments should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, and / or segment from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first area,” “first layer,” or “first segment” discussed below may be referred to as “second element,” “second component,” “second area,” “second layer,” and / or “second segment.”

[0061] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on another layer or substrate, or an intermediary layer may exist. Conversely, when an element is referred to as being "directly on" another element, there is no intermediary element.

[0062] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms that include “at least one.” “Or” means “and / or.” “At least one of A and B” means “A and / or B.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms “comprises and / or comprising” or “includes and / or including” indicate the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or groups thereof.

[0063] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, “about” or “approximately” includes the stated values ​​and refers to a range of acceptable deviations from the particular values ​​as determined by one of ordinary skill in the art.

[0064] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that, unless expressly defined herein, terms (such as those defined in a general dictionary) shall be understood to have a meaning consistent with their meaning in the context of the relevant field and in this disclosure, and shall not be interpreted in an idealized or overly formalized sense.

[0065] Embodiments are described herein with reference to cross-sectional views as schematic representations of idealized embodiments. Thus, variations in the shape of the illustrated areas will be expected due to factors such as manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown, but should include deviations in shape due to factors such as manufacturing. For example, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0066] Embodiments of this utility model will be described with reference to the accompanying drawings.

[0067] Figure 1 This is a perspective view of the substrate heat treatment apparatus according to an embodiment. Figure 2 According to the embodiments Figure 1 A front view of the substrate heat treatment apparatus, and Figure 3 According to the embodiments Figure 1 A cross-sectional side view of the substrate heat treatment apparatus.

[0068] In the embodiments and referenced Figure 1 and Figure 2 The substrate heat treatment apparatus 1 may include a heat treatment chamber 20 including a heat treatment space 10 for one or more substrates 300, a substrate support 400 supporting the substrates 300 within the heat treatment chamber 20, a heating module including a plurality of heating units 100 for heating the substrates 300 disposed on the substrate support 400, and one or more heat dissipation guides 200 positioned below the heating units 100.

[0069] In an embodiment, the heat treatment chamber 20 includes an internally hollow receiving space, which can be used as a heat treatment space 10 capable of receiving the substrate 300 and performing heat treatment on the substrate 300.

[0070] A single heat treatment space 10 may be provided, or multiple heat treatment spaces 10 may be obtained by dividing a receiving space. For example, when a single heat treatment space 10 is provided, the heat treatment space 10 may receive a single substrate 300 and perform heat treatment on the single substrate 300, but the present invention is not limited thereto.

[0071] In another embodiment, in another example, such as Figure 1 As shown, a single receiving space formed by the heat treatment chamber 20 can be divided by three base supports 400, and thus divided into three heat treatment spaces 10, but the present invention is not limited thereto. That is, based on the number of installed base supports 400, more than three heat treatment spaces 10 can be formed. Figure 1 The heat treatment spaces 10 can be independent spaces that are not connected to each other, or they can be spaces that are connected to each other. When there are multiple heat treatment spaces 10, multiple substrates 300 can be introduced and multiple substrates 300 can be heat treated simultaneously, but the present invention is not limited thereto. In another embodiment, substrates 300 can be received and heat treated one at a time.

[0072] In an embodiment, the heat treatment chamber 20 may have a cubic shape and may include a heat treatment space 10. For example... Figure 1 As shown, the heat treatment chamber 20 may have a rectangular cube shape, but the present invention is not limited thereto. In another embodiment, the heat treatment chamber 20 may have a cube shape, a cylindrical shape, an elliptical cylinder shape, or a long tube shape.

[0073] For example, if the heat treatment chamber 20 has a cubic shape, the heat treatment chamber 20 may include a bottom surface 21 located on the mounting surface of the mounting base heat treatment apparatus 1, a top surface 22 disposed opposite to the bottom surface 21, and three side surfaces 23 located circumferentially between the bottom surface 21 and the top surface 22, except for the front opening of the heat treatment chamber 20.

[0074] In one embodiment, the heat treatment chamber 20 may have a cubic shape with a front opening, through which the base 300 can be introduced into the heat treatment space 10. For example... Figure 1 As depicted, the opening may be located at the front of the heat treatment chamber 20, and the heat treatment chamber 20 may be provided as a sealed chamber capable of sealing its internal space by further including a door for opening or closing the front opening. However, the present invention is not limited thereto. That is, the heat treatment chamber 20 may take various other forms, as long as the heat treatment chamber 20 is capable of forming an open or sealed space inside for heat treatment.

[0075] In the embodiments and referenced Figure 2 The base support 400 can support the base 300 introduced into the heat treatment space 10 within the internal space of the heat treatment chamber 20, and the base 300, which is the target to be heat treated, can be placed on the base support 400.

[0076] In embodiments, the base support 400 can be integrally provided with the chamber-side surface 23 of the heat treatment chamber 20. The base support 400 can be fixedly coupled to the heat treatment chamber 20, or the base support 400 can be detachably coupled to allow the base support 400 to be introduced into and removed from the heat treatment chamber 20. When the base support 400 is detachably coupled, a sliding device can be provided on the inner surface of the base support 400 and the chamber-side surface 23. For example, the sliding device may include a sliding rib and a rib guide into which the sliding rib is inserted, allowing the base support 400 to slide along the rib guide for introduction and removal, but the invention is not limited thereto. Furthermore, when the base support 400 is detachably coupled, the base support 400 can be used as a partition to separate the internal space of the heat treatment chamber 20.

[0077] In an embodiment, the base support 400 may include a support plate 420 positioned separate from the base 300 and a support pin 410 protruding from the support plate 420 to support the bottom surface of the base 300. Figure 2 As shown, the support pins 410 may be provided in pairs on the two side edge regions of the support plate 420, or may be provided in multiple quantities along the circumferential direction of the support plate 420. However, the present invention is not limited thereto.

[0078] In the embodiments and referenced Figure 2 The substrate heat treatment apparatus 1 may further include a gas supply unit 11 for supplying gas to the interior of the heat treatment chamber 20, and a gas discharge unit 12 for discharging gas from the interior of the heat treatment chamber 20.

[0079] In one embodiment, the gas supply unit 11 can supply gas to the interior of the heat treatment chamber 20 via the gas supply pipe 120, and may include a gas supply pump connected to the gas supply pipe 120 for supplying gas, but the present invention is not limited thereto. The gas supply unit 11 can supply gas to each of a plurality of heating units 100, or a plurality of sub-gas supply units can branch from a single gas supply unit 11 and jointly supply gas to the heating units 100. However, the present invention is not limited thereto.

[0080] In one embodiment, the gas emission unit 12 can discharge gas supplied to the heat treatment chamber 20 via the gas supply pipe 120 to the outside of the heat treatment chamber 20, and may include a gas emission pump connected to the internal space of the heat treatment chamber 20 for gas emission, but the present invention is not limited thereto. The gas emission unit 12 can emit gas from each of the spaces defined by the base support 400, or multiple sub-gas emission units can branch from a single gas emission unit 12 and simultaneously emit gas from the heat treatment chamber 20. However, the present invention is not limited thereto.

[0081] In the embodiments and referenced Figure 2 and Figure 3 The heating module may include multiple heating units 100 that generate heat. Specifically, the heating module may be an assembly formed by heating units 100 arranged continuously along the X-axis in a block shape. That is, the heating module may be an assembly of multiple heating units 100.

[0082] In an embodiment, the heating unit 100 may be positioned separate from the upper portion of the base 300 disposed on the base support 400, and may heat the base 300. Specifically, the heating unit 100 may generate and provide heat from a position separated from the base 300 in the Z-axis direction, which is the upward direction of the base 300.

[0083] Figure 4 According to the embodiments Figure 1 A perspective view of the heating module. Figure 5 According to the embodiments Figure 4 A top view of the heating module, and Figure 6 This illustrates a device according to an embodiment having a pitch of approximately 68 mm between gas outlets for... Figure 4 A diagram of the gas supply pipe and heat dissipation guide of the heating module.

[0084] In the embodiments and referenced Figure 4 It can be on a substrate of 300 (see Figure 1 Above along the X-axis (see above) Figure 1 Multiple heating units 100 are arranged. In another embodiment, a heat treatment chamber 20 (see [reference]) can be provided. Figure 1 A single heating unit 100 having the same width in the X-axis direction.

[0085] Specifically, multiple heating units 100 can be continuously connected to each other to form a single unit by fastening devices, or they can be continuously contacted and then fixed to the heat treatment chamber 20 without individual fastening devices. The heating units 100 can be arranged to be continuously connected while in contact with each other in the X-axis direction, or they can be arranged with a gap between the heating units 100.

[0086] In an embodiment, each of the plurality of heating units 100 may include a heating plate (which includes a bottom surface 101, a top surface 102, a side surface 103, a front surface 104, and a rear surface 105), a heating tube 110 embedded in the heating plate, and a gas supply tube 120 positioned parallel to the heating tube 110.

[0087] In an embodiment, the heating plate may include an internally hollow receiving space, and the receiving space may be a space capable of accommodating the heating tube 110 and the gas supply tube 120.

[0088] The heating plate may have a cubic shape with an internal space to accommodate the heating tube 110 and the gas supply tube 120. The heating plate may have a cubic shape with a rectangular cross-section, but the present invention is not limited thereto. In another embodiment, the heating plate may have a polyhedral shape with a triangular, square, pentagonal, or hexagonal cross-section, or it may have a long tube shape.

[0089] In an embodiment, when the heating plate has a cubic shape with a rectangular cross section, the heating plate may include a bottom surface 101 facing the substrate 300, a top surface 102 opposite to the bottom surface 101, a front surface 104 located on the front opening side of the heat treatment chamber 20, a rear surface 105 opposite to the front surface 104, and a pair of side surfaces 103.

[0090] In this embodiment, the heating plate may be formed of a metallic material such as aluminum or stainless steel, but the present invention is not limited thereto. When the heating tube 110 generates heat, the heat is transferred to the front surface 104 and rear surface 105 of the heating plate that are in contact with the heating tube 110. The heated plate can then provide heat to the substrate 300 located in the corresponding heat treatment space 10. Therefore, the heating plate can be formed of various materials. Here, the heating plate can be heated by the heating tube 110 to heat treat the substrate 300, but the present invention is not limited thereto. The heating tube 110 can also heat a gas, which can then be used to heat treat the substrate 300.

[0091] In this embodiment, the top surface 102 of the heating plate may face the top surface 22 of the heat treatment chamber 20, and a plurality of gas vent holes 111 may be formed in the bottom surface 101 of the heating plate. The bottom surface 101 of the heating plate with the gas vent holes 111 may face the heat dissipation guide 200.

[0092] In an embodiment, the terminal portion of each of the heating tube 110 and the gas supply tube 120 may be coupled to the front surface 104 and the rear surface 105 of the heating plate. Here, the heating tube 110 and the gas supply tube 120 may be configured to have a spacing between them, so that in the Y-axis direction (see...). Figure 1 They are arranged parallel to each other.

[0093] In one embodiment, in a single heating unit 100, a pair of heating tubes 110 may be provided with a gas supply pipe 120 positioned between the pair of heating tubes 110, but the present invention is not limited thereto. In another embodiment, a single heating tube 110 or more than two heating tubes 110 may be provided in a heating unit 100.

[0094] In embodiments, the heating tube 110 may be composed of various heaters (e.g., sheath heaters), but the present invention is not limited thereto. Here, the sheath heater is a metal tube densely filled and compressed with magnesia (MgO), referred to as a metal sheath, and has a heating wire and terminal pin connected and fixed at the center of the sheath to enhance thermal conductivity and reduce the temperature difference between the heating wire and the metal sheath. Due to the high-density compression of the insulator, the sheath heater has excellent thermal conductivity and efficiency, prevents oxidation of the heating wire, and extends their lifespan. When ceramic coatings, metal cladding, PTFE tubing, or other coatings are used, the sheath heater also exhibits excellent corrosion resistance, acid resistance, and heat resistance. The sheath heater can emit infrared radiation upwards and downwards, and the substrate 300 can be uniformly heated by convection of heated air and infrared radiation heating.

[0095] When the heating element 110 is equipped with a sheathed heater, a heater cable (not shown) can be used to electrically connect the heating element 110 to achieve electrical connectivity. The heater cable (not shown) used for wiring can also be used to connect multiple sheathed heaters into a single integrated structure.

[0096] In the embodiments and referenced Figure 5 and Figure 6 Each gas supply pipe 120, serving as a gas injection component, can be positioned between a pair of heating pipes 110, but the present invention is not limited thereto. In another embodiment, a plurality of gas supply pipes 120 can be positioned between a pair of heating pipes 110.

[0097] In this embodiment, the gas supply pipe 120 can supply gas to the heat treatment chamber 20 (see [link]). Figure 1 In this process, reducing and maintaining the concentration of oxygen and moisture within the heat treatment chamber 20 is crucial for maintaining the quality and yield of the substrate. Specifically, this is used for substrate 300 (see...). Figure 1 The heating process requires a low concentration of oxygen and water vapor. To achieve this, nitrogen can be used to replace most of the gases and pressurized. Nitrogen can be injected in the heating process for substrate 300, but this invention is not limited thereto.

[0098] Each of the plurality of gas supply pipes 120 may include the bottom surface 101 of the heating plate facing each of the gas supply pipes 120 (see Figure 4On the surface of ) along the Y-axis direction (see Figure 1 The heating plate has multiple gas outlets 121 arranged therein and a heat dissipation guide 200 located below the bottom surface 101 of the heating plate. The gas outlets 121 may be holes that penetrate the surface of the gas supply pipe 120.

[0099] In this embodiment, multiple gas outlets 121 can be arranged at regular intervals along the gas supply pipe 120, and the spacing W (or pitch) between the gas outlets 121 can be between approximately 60 mm and approximately 75 mm. Specifically, the pitch between the gas outlets 121 can be between approximately 60 mm and approximately 75 mm, but the present invention is not limited thereto. For example, when the spacing W between the gas outlets 121 is approximately 68 mm, 60 gas outlets 121 can be provided in one gas supply pipe 120, but the present invention is not limited thereto. When the spacing W between the gas outlets 121 is approximately 68 mm, the internal pressure of the gas supply pipe 120 can be reduced, and the uniformity of the gas discharge rate through the gas outlets 121 can be improved. Ultimately, the flow velocity of the gas discharged to the substrate 300 can be balanced.

[0100] Figure 7 According to the embodiments Figure 4 Bottom perspective view of the heating module. Figure 8 According to the embodiments Figure 4 The rear bottom view of the heating module, and Figure 9 According to the embodiments Figure 7 Exploded bottom view of the heating module and heat dissipation guide.

[0101] In this embodiment, the gas outlet 121 of each of the plurality of gas supply pipes 120 is arranged to face the bottom surface 101 of the heating plate. For example... Figure 14 As shown, a gas vent 111 can be formed in the bottom surface 101 of the heating plate to correspond to and communicate with the gas outlet 121.

[0102] In one embodiment, the gas supply pipe 120 is connected to a gas connection pipe 122 located on the rear surface 105 of the heating plate, wherein the gas connection pipe 122 connects the gas supply pipe 120 to the gas supply unit 11 (see [link]). Figure 2 )connect.

[0103] In one embodiment, the gas discharge port 111 of each of the plurality of gas supply pipes 120 is formed to penetrate the bottom surface 101 of the heating plate, and may have the same shape, position and number as the gas outlet 121, but the present invention is not limited thereto. The gas discharge port 111 can ultimately discharge the gas supplied from the gas outlet 121 of each of the plurality of gas supply pipes 120 into the interior space of the heat treatment chamber 20.

[0104] Therefore, the gas from the gas supply unit 11 is supplied to the gas supply pipe 120 through the gas connection pipe 122. The gas flowing through the gas supply pipe 120 is discharged through the gas outlet 121, and the gas discharged through the gas outlet 121 is finally discharged into the internal space of the heat treatment chamber 20 through the gas discharge hole 111 on the bottom surface 101 of the heating plate, which is connected to the gas outlet 121.

[0105] In the embodiments and referenced Figure 8 and Figure 9 The heat dissipation guide 200 can be spaced apart from the bottom surface 101 of the heating plate and along the gas vent 111 of the bottom surface 101 of the heating plate (i.e., along the Y-axis direction (see...) Figure 1 Arranged continuously.

[0106] In one embodiment, multiple heat dissipation guides 200 (also referred to as diffusers) may be provided on the bottom surface 101 of the heating plate and arranged along the Y-axis, but the present invention is not limited thereto. In another embodiment, a single heat dissipation guide 200 may be provided in the form of a strip.

[0107] The heat dissipation guides 200 can be continuously connected to each other to form an integral unit by fastening devices, or they can be continuously arranged to contact and then fixed to the bottom surface 101 of the heating plate without individual fastening devices. A plurality of heat dissipation guides 200 can be arranged to be continuously connected to each other in contact along the Y-axis direction, or the heat dissipation guides 200 can be arranged with a spacing between them. Furthermore, the end of each of the plurality of heat dissipation guides 200 can be aligned with the end of each of the plurality of front surfaces 104 and the plurality of rear surfaces 105 of the heating plate, or they can protrude beyond the end of each of the front surfaces 104 and the rear surfaces 105 of the heating plate, or be recessed from the end of each of the front surfaces 104 and the rear surfaces 105 of the heating plate.

[0108] In one embodiment, while spaced apart from the bottom surface 101 of the heating plate, the heat dissipation guide 200 can be coupled to the bottom surface 101 of the heating plate at a position overlapping with the gas supply pipe 120. The heat dissipation guide 200 indirectly deflects the gas so that the gas discharged from the gas outlet 121 of the gas supply pipe 120 and the gas exhaust hole 111 of the bottom surface 101 of the heating plate is not directly sprayed onto the substrate 300.

[0109] The heat dissipation guide 200 may be formed of the same metal (e.g., aluminum or stainless steel) as the bottom surface 101 of the heating plate, or it may be formed of a plastic material that does not undergo heat deformation.

[0110] Figure 10 This illustrates an embodiment. Figure 7A partially enlarged cross-sectional view of the combination of the heating plate and the heat dissipation guide, and Figure 11 According to the embodiments Figure 9 A perspective view of the heat dissipation guide.

[0111] In the embodiments and referenced Figure 10 The heat dissipation guide 200 can be coupled to the bottom surface 101 of the heating plate via a coupling device (which includes a fastening bolt 500, a first fastening hole 501 and a second fastening hole 502).

[0112] In one embodiment, the coupling device may include a first fastening hole 501 formed in the heat dissipation guide 200, a second fastening hole 502 formed in the bottom surface 101 of the heating plate, and fastening members (such as fastening bolts 500) respectively embedded in the first fastening hole 501 and the second fastening hole 502 to fix the heat dissipation guide 200 to the bottom surface 101 of the heating plate. However, the present invention is not limited thereto. In another embodiment, the coupling device may include coupling protrusions and coupling grooves to fix the heat dissipation guide 200 to the bottom surface 101 of the heating plate, or a thermosetting adhesive may be used to bond the heat dissipation guide 200 to the bottom surface 101 of the heating plate.

[0113] In the embodiments and referenced Figure 10 and Figure 11 The heat dissipation guide 200 may include a bent portion 213 with a recessed surface, and a first wing 211 and a second wing 212 respectively symmetrically arranged on both sides of the bent portion 213 and used as guide surfaces or inclined portions to guide gas in the opposite direction of gas discharge.

[0114] The heat dissipation guide 200 can be installed in a mounting unit (which includes a first mounting surface 101a and a second mounting surface 101b) formed in a recess in the bottom surface 101 of the heating plate. Here, the mounting unit may include a first mounting surface 101a facing the bent portion 213 and a pair of second mounting surfaces 101b facing the ends of the wings 211 and 212.

[0115] The heat dissipation guide 200 may have a V-shape in cross-sectional view, but the present invention is not limited thereto. In another embodiment, the heat dissipation guide 200 may have various other recessed shapes, such as U-shape or W-shape.

[0116] In an embodiment, in the heat dissipation guide 200, the bent portion 213 can be positioned relative to the Z-axis direction (see [reference]). Figure 1 In the opposite direction of gas emission, and wings 211 and 212 can be arranged in the X-axis direction perpendicular to the gas emission direction (see...). Figure 1 The space between the heat dissipation guide 200 and the bottom surface 101 of the heating plate can correspond to... Figure 14 The gas discharge space 220. For example, the vertical width of the gas discharge space 220 provided along the first reference line L1 can be from about 1 mm to about 3 mm, preferably about 2.5 mm, and when it is about 2.5 mm, the uniformity of the gas flow velocity can be excellent.

[0117] In the heat dissipation guide 200, based on a first reference line L1 and a second reference line L2 intersecting the first reference line L1, the first wing 211 can have an inclination angle of approximately 70 degrees to approximately 89 degrees with respect to the first reference line L1. If the second wing 212 is symmetrical to the first wing 211, the inclination angle of the second wing 212 can also be approximately 70 degrees to approximately 89 degrees. For example, if the inclination angle of the heat dissipation guide 200 is as follows... Figure 10 The angle shown is approximately 75 degrees, which can change the flow through the gas supply pipe 120 (see...). Figure 2 The gas flow is directed to the heat sink, and a gas discharge space 220 is formed in the internal space between the bottom surface 101 of the heating plate and the heat dissipation guide 200, which can improve the uniformity of the gas flow velocity through the gas discharge space 220. That is, when the tilt angle of the heat dissipation guide 200 is about 75 degrees, the gas discharge space 220 can act as a common chamber, resulting in a uniform gas flow velocity through the heat dissipation guide 200.

[0118] In the heat dissipation guide 200, the inner surfaces of wings 211 and 212 serve as guide surfaces to direct the gas discharged through the gas discharge hole 111 so that it does not travel directly toward the substrate 300. Specifically, the gas discharged through the gas discharge hole 111 is guided by the guide surface toward the bottom surface 101 of the heating plate, causing the gas to impact the mounting unit of the bottom surface 101 of the heating plate before traveling toward the substrate 300.

[0119] The following will refer to the embodiments. Figures 12 to 16 Describe how to use a heat dissipation guide to direct gas to the substrate.

[0120] Figure 12 This illustrates an embodiment. Figure 2 A partial enlarged view of the arrangement of the heating module, heat dissipation guide, and substrate. Figure 13 This illustrates an embodiment. Figure 12 A partially enlarged cross-sectional view of the heating module, heat dissipation guide, and substrate. Figure 14 This illustrates an embodiment. Figure 13 Enlarged cross-sectional view of the heating module and heat dissipation guide. Figure 15 This illustrates the passage of gas according to an embodiment. Figure 14 A partially enlarged cross-sectional view of the heating module and heat dissipation guide flowing toward the substrate, and Figure 16 This illustrates an embodiment for... Figure 15A photograph showing the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 75 degrees.

[0121] In the embodiments and referenced Figures 12 to 16 When gas is supplied to gas supply pipe 120, gas begins to be discharged through gas outlet 121 of gas supply pipe 120. Then, refer to... Figure 13 The gas passing through gas outlet 121 is discharged through gas discharge hole 111 on the bottom surface 101 of the heating plate. For example... Figure 14 and Figure 15 As shown, the gas passing through the gas exhaust port 111 then impacts the wings 211 and 212 of the heat dissipation guide 200, which are arranged at an angle of approximately 75 degrees, causing the gas to diffuse extensively toward the substrate 300 in the radial direction rather than vertically. Then, as... Figure 16 As shown, when gas is guided to be indirectly injected onto the substrate 300, the temperature distribution on the bottom surface 101 of the heating plate at locations corresponding to the substrate 300 exhibits uniformity, displaying a low-temperature distribution. A flow uniformity closer to 1 is more advantageous, and it can be seen that... Figures 12 to 16 The flow uniformity of the embodiment is approximately 0.85, close to 1. Therefore, according to Figure 10 In the embodiments, it is possible to obtain Figure 16 It is confirmed that excellent flow uniformity can be provided. Here, flow uniformity can be calculated, for example, by subtracting the sum of the deviations in gas flow velocity of each column of gas discharge holes 111 and dividing by the average gas flow velocity of the corresponding column of gas discharge holes 111, but the present invention is not limited thereto.

[0122] The heat dissipation guide of a substrate heat treatment apparatus according to another embodiment will be described below.

[0123] Figure 17 This is a partially enlarged cross-sectional view showing the state of heat dissipation guides arranged at an angle of approximately 80 degrees on the bottom surface of the heating plate according to an embodiment. Figure 18 This illustrates an embodiment for... Figure 17 A photograph showing the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 80 degrees.

[0124] Figure 17 Implementation examples and Figure 10 The difference in the embodiment is that the heat dissipation guide 200a is arranged at an angle of about 80 degrees relative to the reference line.

[0125] In the embodiments and referenced Figure 17 and Figure 18 ,like Figure 18As shown, when the heat dissipation guide 200a is arranged at an angle of approximately 80 degrees, the temperature distribution on the bottom surface 101 of the heating plate at the location corresponding to the substrate 300 exhibits uniformity, displaying a low-temperature distribution. A flow uniformity closer to 1 is more advantageous, and it can be seen that... Figure 17 and Figure 18 The flow uniformity of the embodiment is 0.85, which is excellent.

[0126] Figure 19 It is shown in Figure 10 A partially enlarged cross-sectional view of the heat dissipation guides arranged at an angle of approximately 85 degrees on the bottom surface of the heating plate, and... Figure 20 This illustrates an embodiment for... Figure 19 A photograph showing the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 85 degrees.

[0127] Except for the heat dissipation guide 200b being arranged at an angle of approximately 85 degrees relative to the reference line. Figure 19 Implementation examples and Figure 10 The embodiments are the same.

[0128] In the embodiments and referenced Figure 19 and Figure 20 ,like Figure 20 As shown, when the heat dissipation guide 200b is arranged at an angle of approximately 85 degrees, except for the yellow areas at both ends ( Figure 20 In the light-colored area (as shown in the image), the temperature distribution on the bottom surface 101 of the heating plate exhibits uniformity, indicating a low-temperature distribution. A flow uniformity closer to 1 is more advantageous, and it can be seen that... Figure 18 and Figure 19 The flow uniformity of the embodiment is about 0.84, which is excellent.

[0129] Figure 21 This is a view showing the state of heat dissipation guides arranged at an angle of approximately 90 degrees on the bottom surface of the heating plate according to an embodiment, and Figure 22 An example of an embodiment is shown. Figure 21 A photograph showing the temperature simulation results of the bottom surface of a heating plate with heat dissipation guides arranged at an angle of approximately 90 degrees.

[0130] Figure 21 Implementation examples and Figure 10 The difference in the embodiment is that the heat dissipation guide 200_1 is arranged at an angle of approximately 90 degrees relative to the reference line.

[0131] In the embodiments and referenced Figure 21 and Figure 22 ,like Figure 22As shown, when the heat dissipation guide 200_1 is arranged at an angle of approximately 90 degrees, the temperature distribution on the bottom surface 101 of the heating plate at the location corresponding to the substrate 300 exhibits a completely yellow color. Figure 22 The lighter-colored areas (in the diagram) represent high and uneven temperature distribution. A flow uniformity closer to 1 is more advantageous, but... Figure 21 and Figure 22 The flow uniformity is approximately 0.83, confirming that the flow is non-uniform. Furthermore, the gas from the gas supply pipe 120 directly impacts the substrate 300 (see...). Figure 1 Furthermore, the vertically injected gas does not diffuse widely but concentrates in a specific area, causing stains on the substrate 300.

[0132] Therefore, when the arrangement angle of the heat dissipation guide 200 is between approximately 70 degrees and approximately 89 degrees, the airflow of the gas discharged from the gas supply pipe 120 can be modified, and a space can be formed between the heat dissipation guide 200 and the bottom surface 101 of the heating plate, thereby improving the uniformity of the airflow passing through the heat dissipation guide 200. Specifically, when the arrangement angle of the heat dissipation guide 200 is approximately 75 degrees, the internal space of the heat dissipation guide 200 can act as a common chamber, resulting in a more uniform flow velocity of the gas passing through the heat dissipation guide 200.

[0133] Figure 23 According to the embodiments Figure 4 A cross-sectional view of a gas supply pipe with a pitch of approximately 136 mm between gas outlets, and Figure 24 It is Figure 6 The gas supply pipe with a pitch of approximately 68 mm is connected to... Figure 23 The curves compare the flow uniformity of a gas supply pipe with a pitch of approximately 136 mm.

[0134] Figure 23 Implementation examples and Figure 6 The difference in the embodiment is that the pitch (or spacing W1) between the gas outlets 121 of the gas supply pipe 120a is about 136 mm.

[0135] Reference Figure 24 ,Compare Figure 6 and Figure 23 According to the embodiments, it can be determined that when such Figure 6 When the distance W between the gas outlets 121 shown is approximately 68 mm, the internal pressure of the gas supply pipe 120 decreases and the flow rate of the gas discharged through the gas outlets 121 is uniform. Specifically, in Figure 6 In the embodiment, the distance W1 between them is approximately 136 mm. Figure 23The difference in this embodiment is that the uniformity of the gas rate discharged through gas outlet 121 is also increased. This illustrates that if the blow-out holes (such as...) are formed with a narrow spacing... Figure 6 If the gas outlet 121 is used, the flow uniformity can be improved.

[0136] Therefore, substrate heat treatment apparatus 1 (see Figure 1 This can guide the gas toward the bottom surface 101 of each heating plate (see...) Figure 4 ), thus avoiding direct impact on each substrate 300 (see Figure 1 Furthermore, since the gas outlets 121 are formed with a small pitch between them, the uniformity of the internal airflow rate can be improved.

[0137] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the present invention without substantially departing from the principles and scope thereof. Therefore, the disclosed embodiments are used in a general and descriptive sense only and are not intended to be limiting. Those skilled in the art to which this invention pertains will understand that the present invention can be implemented with other specific embodiments besides those described herein without altering the technical spirit or essential characteristics of the invention. Therefore, it should be understood that the exemplary embodiments described above are illustrative and not restrictive in all respects. The disclosed embodiments of the present invention are used in a general and descriptive sense only and are not intended to be limiting. Each component specifically shown in the embodiments of the present invention can be implemented by modification, and such modifications and differences relating to the present invention should be understood to be included within the scope of the present invention. Furthermore, embodiments or parts thereof can be combined in whole or in part without departing from the scope of the present invention.

Claims

1. A substrate heat treatment apparatus, characterized in that, The substrate heat treatment includes: A heat treatment chamber, which has a space for heat treatment; A gas injection unit, located inside the heat treatment chamber, has a gas outlet configured to inject gas into the heat treatment chamber; and A heat dissipation guide is positioned adjacent to the gas injection unit within the heat treatment chamber, wherein the heat dissipation guide extends along a first horizontal direction intersecting the discharge direction of the gas discharged through the gas outlet. The inner surface of the heat dissipation guide facing the gas outlet includes a recessed surface formed along a second horizontal direction intersecting the first horizontal direction.

2. The substrate heat treatment apparatus according to claim 1, characterized in that, The heat dissipation guide includes a centerline, a first wing located on one side of the centerline and oriented in the second horizontal direction, and a second wing located on the other side of the centerline and oriented in the second horizontal direction.

3. The substrate heat treatment apparatus according to claim 2, characterized in that, As the first wing and the second wing extend away from the centerline, each of the first wing and the second wing approaches the gas injection unit.

4. The substrate heat treatment apparatus according to claim 3, characterized in that, Each of the first wing and the second wing is spaced apart from the gas injection unit.

5. The substrate heat treatment apparatus according to claim 4, characterized in that, The space between the first wing and the gas injection unit, and the space between the second wing and the gas injection unit constitute a gas emission space.

6. The substrate heat treatment apparatus according to claim 5, characterized in that, The gas emission space has a slit shape extending in the first horizontal direction.

7. The substrate heat treatment apparatus according to claim 1, characterized in that, The gas injection unit includes a plurality of gas outlets arranged along the longitudinal direction of the gas injection unit, and The plurality of gas outlets are spaced apart from each other at intervals of 60 mm to 75 mm.

8. The substrate heat treatment apparatus according to claim 1, characterized in that, The substrate heat treatment apparatus further includes: A gas supply unit, connected to the gas injection unit to supply gas to the gas injection unit; and A gas emission unit is used to discharge the gas supplied to the heat treatment chamber to the outside of the heat treatment chamber.

9. A substrate heat treatment apparatus, characterized in that, The substrate heat treatment apparatus includes: Heat treatment chamber, a defined space for heat treatment; A gas injection unit, located inside the heat treatment chamber, includes a gas outlet configured to inject gas into the heat treatment chamber; and A diffuser plate is positioned within the heat treatment chamber adjacent to the gas injection unit, and the diffuser plate is located in a first horizontal direction intersecting with the emission direction of the gas discharged through the gas outlet. The diffuser plate includes a guide surface configured to move the gas in a direction opposite to the emission direction.

10. The substrate heat treatment apparatus according to claim 9, characterized in that, The diffuser plate includes a bent portion located in a central region and a pair of inclined portions extending symmetrically from the bent portion in two directions, wherein each of the pair of inclined portions includes the guide surface.

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