Aerosol-generating device

Abstract

The application discloses an aerosol generating device, comprising: a housing, the housing has a containing cavity inside, and the housing is provided with a ventilation opening communicating with the containing cavity and an external atmosphere; a microwave heating body, arranged in the containing cavity and used for heating an aerosol generating substrate; a circuit board, arranged in the containing cavity, the circuit board at least has a radio frequency component and a power supply control component, the radio frequency component is coupled with the microwave heating body; a heat dissipation structure, arranged in the containing cavity and in thermal contact with the circuit board; an airflow generating device, arranged in the containing cavity and corresponding to the ventilation opening, the airflow generating device is used for generating an airflow in forced convection with the heat dissipation structure. In use, the airflow in forced convection with the heat dissipation structure can quickly take out the heat of the heat dissipation structure to the external atmospheric environment of the housing through heat exchange, which is beneficial to improve the heat dissipation efficiency of the heat dissipation structure, thereby reducing the risk of overheating of the related components with heat loss on the circuit board, such as the radio frequency component and the power supply control component.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to an aerosol generating device. Background Technology

[0002] For aerosol generation devices used to provide inhalable aerosols, related technologies have proposed a technique of heating the aerosol generation matrix using microwave heating. Specifically, radio frequency (RF) microwaves are emitted from an RF source and act on the target area of ​​the aerosol generation matrix to form a primary coupling, allowing the area to fully absorb microwave energy and rapidly heat up, thereby achieving atomization. Compared to traditional heating methods such as resistance contact heating, infrared radiation heating, and electromagnetic induction heating, microwave heating has significant advantages in terms of heating speed and heating uniformity.

[0003] However, when the aerosol generating device is in operation, the electrical components on the circuit board generate a lot of heat, which can cause the temperature of the relevant components to rise rapidly, posing a risk of overheating and affecting the working performance and service life of the aerosol generating device. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an aerosol generating apparatus that helps reduce the risk of overheating of related components with heat loss on a circuit board.

[0005] An aerosol generating apparatus according to an embodiment of this application includes:

[0006] A housing having a receiving cavity inside, and a vent on the housing connecting the receiving cavity to the outside atmosphere;

[0007] A microwave heating element, which is disposed within the receiving cavity and used to heat the aerosol generation matrix;

[0008] A circuit board is disposed within the receiving cavity. The circuit board has at least a radio frequency component and a power control component, and the radio frequency component is coupled to the microwave heating element.

[0009] A heat dissipation structure is disposed within the receiving cavity and in thermal contact with the circuit board;

[0010] An airflow generating device is disposed within the receiving cavity and arranged corresponding to the vent. The airflow generating device is used to generate airflow that is forced to convect with the heat dissipation structure.

[0011] The aerosol generating apparatus according to the embodiments of this application has at least the following beneficial effects: In use, the heat dissipation structure disposed in the accommodating cavity dissipates heat from the circuit board through thermal contact, thereby reducing the operating temperature of components with heat loss, such as radio frequency components and power control components, on the circuit board. The airflow generating device generates airflow that is forced to convect with the heat dissipation structure. The forced convection airflow with the heat dissipation structure can quickly carry the heat of the heat dissipation structure to the atmospheric environment outside the housing through heat exchange, which is beneficial to improving the heat dissipation efficiency of the heat dissipation structure. This is beneficial to further reduce the operating temperature of components with heat loss, such as radio frequency components and power control components, on the circuit board, thereby reducing the risk of overheating of components with heat loss, such as radio frequency components and power control components, on the circuit board.

[0012] According to some embodiments of this application, the heat dissipation structure includes a heat dissipation part, which includes a plurality of spaced-apart sheet-like protrusions or a plurality of spaced-apart columnar protrusions.

[0013] According to some embodiments of this application, the heat dissipation structure includes a heat dissipation section and an extension connected to the heat dissipation section for conducting heat, wherein at least a portion of the radio frequency component is attached to the extension.

[0014] According to some embodiments of this application, a thermally conductive layer is provided between the extension and the radio frequency component.

[0015] According to some embodiments of this application, the heat dissipation structure includes a heat dissipation part and a flow guiding part connected to the heat dissipation part. The flow guiding part, the housing, and the circuit board enclose a first flow guiding channel. The air outlet of the airflow generating device is connected to the first flow guiding channel. The first flow guiding channel is used to guide the airflow generated by the airflow generating device to the heat dissipation part.

[0016] According to some embodiments of this application, the circuit board includes a first sub-circuit board and a second sub-circuit board. The first flow channel is formed by the flow guide portion, the housing, and the first sub-circuit board. The first sub-circuit board and the second sub-circuit board overlap and are spaced apart, so that a second flow channel is formed between the first sub-circuit board and the second sub-circuit board for airflow to pass through and is different from the first flow channel. The air outlet of the airflow generating device is connected to the second flow channel.

[0017] According to some embodiments of this application, the radio frequency component is disposed on the side of the first sub-circuit board facing the second sub-circuit board, and the power control component is disposed on the side of the second sub-circuit board facing the first sub-circuit board.

[0018] According to some embodiments of this application, a supporting frame is provided between the first sub-circuit board and the second sub-circuit board. The frame, together with the first sub-circuit board and the second sub-circuit board, forms a cavity for airflow. The frame is provided with an air outlet that connects the airflow generating device and an air inlet that connects the cavity.

[0019] According to some embodiments of this application, a flow guide plate is provided within the frame, which can at least guide airflow to the radio frequency component and the power control component.

[0020] According to some embodiments of this application, there are multiple guide plates, which are spaced apart within the frame along the extension direction of the second guide channel, and adjacent guide plates are staggered along directions intersecting the extension direction.

[0021] According to some embodiments of this application, the frame is a metal component.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the structure of an aerosol generating apparatus according to an embodiment of this application;

[0025] Figure 2 This is a cross-sectional schematic diagram of an aerosol generating apparatus according to an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of an aerosol generating device according to an embodiment of this application after the housing is hidden;

[0027] Figure 4 This is another cross-sectional schematic diagram of an aerosol generating apparatus according to an embodiment of this application;

[0028] Figure 5 yes Figure 4 Enlarged view of a portion of point A in the middle;

[0029] Figure 6 This is a schematic diagram of the heat dissipation structure, the first sub-circuit board, the second sub-circuit board, and the frame according to an embodiment of this application.

[0030] Figure 7 yes Figure 6 Enlarged view of a portion of point B in the middle;

[0031] Figure 8 This is a schematic diagram of the heat dissipation structure and the first sub-circuit board according to an embodiment of this application;

[0032] Figure 9 This is a schematic diagram of the structure of the second sub-circuit board and the frame according to an embodiment of this application.

[0033] Figure label:

[0034] First guide channel a, second guide channel b;

[0035] Casing 100, Vent 110;

[0036] Microwave heating element 200;

[0037] Airflow generating device 300;

[0038] Heat dissipation section 410, airflow guiding section 420, extension section 430;

[0039] First sub-circuit board 510, radio frequency component 511, second sub-circuit board 520;

[0040] Frame 600, air inlet 610, air deflector 620. Detailed Implementation

[0041] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0042] In the description of this application, it should be understood that if directional descriptions are involved, such as up, down, front, back, left, right, etc., indicating the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] In the description of this application, if words such as several, greater than, less than, exceeding, above, below, or within appear, "several" means one or more, "more than" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the number itself, and "above," "below," "within," etc. are understood to include the number itself.

[0044] In the description of this application, the use of terms such as "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0045] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0046] Reference Figures 1 to 9 An aerosol generating apparatus according to an embodiment of this application includes a housing 100, a microwave heating element 200, a circuit board, a heat dissipation structure, and an airflow generating device 300.

[0047] Specifically, the housing 100 has a receiving cavity, and the housing 100 is provided with a vent 110 that connects the receiving cavity to the external atmosphere. The microwave heating element 200 is disposed in the receiving cavity and is used to heat the aerosol generation matrix. The circuit board is disposed in the receiving cavity and has at least a radio frequency component 511 and a power control component. The radio frequency component 511 is coupled to the microwave heating element 200. The heat dissipation structure is disposed in the receiving cavity and is in thermal contact with the circuit board. The airflow generating device 300 is disposed in the receiving cavity and is arranged corresponding to the vent 110. The airflow generating device 300 is used to generate airflow that is forced to convect with the heat dissipation structure.

[0048] In use, the heat dissipation structure located within the housing cavity dissipates heat from the circuit board through thermal contact, thereby reducing the operating temperature of components with heat loss, such as the RF component 511 and the power control component. The airflow generating device 300 generates airflow that is forced to convect with the heat dissipation structure. This forced airflow can quickly carry the heat from the heat dissipation structure to the atmosphere outside the housing 100 through heat exchange, which helps improve the heat dissipation efficiency of the heat dissipation structure. This further helps to reduce the operating temperature of components with heat loss, such as the RF component 511 and the power control component, and thus helps to reduce the risk of overheating of these components.

[0049] It should be noted that the power module of the aerosol generation device includes a battery and a power control component integrated on a circuit board. The power control component is a component on the circuit board with relatively large heat loss.

[0050] It should be noted that the RF component 511 can be a non-integrated structure, including at least an RF transceiver chip and an RF power chip. Among them, the RF power chip has more prominent heat loss. Of course, the RF component 511 can also be an integrated structure, specifically an integrated chip that integrates RF transceiver and power amplifier circuits.

[0051] In some embodiments, the vent 110 is an air inlet, the air inlet end of the airflow generating device 300 faces the vent 110, and the positive pressure generated by the air outlet end of the airflow generating device 300 is used to generate airflow that blows towards the heat dissipation structure. In this case, an air outlet for airflow to flow out to the atmosphere outside the housing 100 can be provided on the housing 100, or the airflow can flow out to the atmosphere outside the housing 100 can be provided by the fitting gap between the housing 100 and other structures; this is not limited here.

[0052] It should be noted that in some other embodiments, the vent 110 is an air outlet, the air outlet end of the airflow generating device 300 faces the vent 110, and the negative pressure formed by the air inlet end of the airflow generating device 300 is used to generate airflow through the heat dissipation structure. In this case, an air inlet for airflow to flow into the housing 100 can be provided on the housing 100, or airflow can flow into the housing 100 by relying on the fitting gap between the housing 100 and other structures; no limitation is made here.

[0053] Reference Figures 2 to 6 as well as Figure 8 In some embodiments, the heat dissipation structure includes a heat dissipation section 410, which includes a plurality of spaced-apart sheet-like protrusions to form heat dissipation fins. The heat dissipation fins can increase the heat exchange area between the heat dissipation section 410 and the airflow, thereby improving the heat dissipation efficiency of the heat dissipation section 410.

[0054] It should be noted that in some other embodiments, the above-mentioned sheet-like protrusion structure can also be replaced by a columnar protrusion structure or a protrusion structure of other shapes, which is not limited here.

[0055] Reference Figure 8 In some embodiments, the heat dissipation structure includes a heat dissipation portion 410 and an extension portion 430 connected to the heat dissipation portion 410 and used for heat conduction. At least a portion of the radio frequency component 511 is attached to the extension portion 430. The extension portion 430 can conduct the heat generated by the radio frequency component 511 during operation to the heat dissipation portion 410 for heat dissipation, thereby improving the heat dissipation efficiency of the radio frequency component 511 and further reducing the risk of overheating of the radio frequency component 511. Specifically, when the radio frequency component 511 is a non-integrated structure, it is configured such that the radio frequency power chip is attached to the extension portion 430, thereby improving the heat dissipation efficiency of the radio frequency power chip, which has significant heat loss.

[0056] In some embodiments, a heat-conducting layer is provided between the extension 430 and the radio frequency component 511, which is beneficial to improving the heat transfer efficiency between the radio frequency component 511 and the extension 430, thereby further improving the heat dissipation efficiency of the radio frequency component 511.

[0057] Specifically, the thermal conductive layer is made of thermal interface materials with high thermal conductivity, such as silicone grease, phase change metal sheets, and thermally conductive adhesive, which helps to ensure the thermal conductivity of the thermal conductive layer.

[0058] Reference Figures 2 to 6 as well as Figure 8 In some embodiments, the heat dissipation structure includes a heat dissipation part 410 and a flow guide part 420 connected to the heat dissipation part 410. The flow guide part 420, the housing 100, and the circuit board enclose a first flow guide channel a. The air outlet of the airflow generating device 300 is connected to the first flow guide channel a. The first flow guide channel a is used to guide the airflow generated by the airflow generating device 300 to the heat dissipation part 410, so that the airflow generated by the airflow generating device 300 can flow to the heat dissipation part 410 efficiently, thereby improving the utilization rate of the airflow and thus improving the heat dissipation efficiency of the heat dissipation part 410.

[0059] Reference Figure 4 and Figure 5 In some embodiments, the circuit board includes a first sub-circuit board 510 and a second sub-circuit board 520. A first flow channel a is formed by a flow guide portion 420, a housing 100, and the first sub-circuit board 510. The first sub-circuit board 510 and the second sub-circuit board 520 overlap and are spaced apart, forming a second flow channel b between them for airflow passage and distinct from the first flow channel a. The air outlet of the airflow generating device 300 is connected to the second flow channel b. In use, the airflow generated by the airflow generating device 300 can flow not only through the first flow channel a to the heat dissipation portion 410, but also into the second flow channel b. The airflow into the second flow channel b can directly exchange heat with the first sub-circuit board 510 and the second sub-circuit board 520, carrying away the heat generated during operation of the first and second sub-circuit boards 510 and 520, thereby further improving the heat dissipation effect of the circuit board. In addition, the circuit board is arranged in layers, with overlapping and spaced first sub-circuit board 510 and second sub-circuit board 520. This can prevent the circuit board from being too long or too wide, thereby facilitating the optimization of the spatial layout and thus enabling the miniaturization of the product.

[0060] In some embodiments, the radio frequency component 511 is disposed on the side of the first sub-circuit board 510 facing the second sub-circuit board 520, and the power control component is disposed on the side of the second sub-circuit board 520 facing the first sub-circuit board 510, so that both the radio frequency component 511 and the power control component are located in the second flow channel b, so that the airflow flowing into the second flow channel b can directly exchange heat with the radio frequency component 511 and the power control component, and carry away the heat generated by the radio frequency component 511 and the power control component during operation, thereby helping to improve the heat dissipation efficiency of the radio frequency component 511 and the power control component in a targeted manner.

[0061] Specifically, the extension 430 passes through the first sub-circuit board 510 and extends into the second flow channel b, so that at least a portion of the radio frequency component 511 can be attached to the extension 430.

[0062] Reference Figure 3 , Figure 6 and Figure 7 In some embodiments, a supporting frame 600 is provided between the first sub-circuit board 510 and the second sub-circuit board 520. The frame 600, together with the first sub-circuit board 510 and the second sub-circuit board 520, forms a cavity for airflow. The frame 600 is provided with an air outlet connecting the airflow generating device 300 and an air inlet 610 connecting the cavity. Compared to a second flow channel b without the aforementioned cavity, the cavity reduces the dissipation velocity of the airflow flowing between the first sub-circuit board 510 and the second sub-circuit board 520, allowing the airflow flowing between the first sub-circuit board 510 and the second sub-circuit board 520 to fully exchange heat with them, thereby improving heat dissipation. Furthermore, the frame 600 provides fixation and support for the first sub-circuit board 510 and the second sub-circuit board 520.

[0063] Specifically, an air outlet can be provided on the frame 600 to allow airflow to exit the cavity, or the airflow can be allowed to exit the cavity by relying on the fit gap between the frame 600 and other structures; this is not limited here.

[0064] Reference Figure 9 In some embodiments, a guide plate 620 is provided within the frame 600. The guide plate 620 can at least guide the airflow to the radio frequency component 511 and the power control component, so that the airflow entering the cavity can fully exchange heat with the radio frequency component 511 and the power control component to improve the heat dissipation effect. The position and shape of the guide plate 620 can also be designed so that the airflow entering the cavity can also be guided to other related components with high heat loss.

[0065] Reference Figure 9In some embodiments, there are multiple guide vanes 620, which are spaced apart along the extension direction. Two adjacent guide vanes 620 are staggered along directions intersecting the extension direction, which helps to extend the airflow path in the cavity, thereby increasing the heat exchange time so that the airflow can carry away more heat, thereby improving the heat dissipation efficiency.

[0066] It should be noted that the aforementioned extension direction is the X direction in the attached diagram.

[0067] In some embodiments, the frame 600 is made of metal, which also enables the frame 600 to perform electromagnetic shielding, which helps to prevent electromagnetic radiation leakage generated when the radio frequency component 511 is working, thereby helping to avoid radiation damage to users.

[0068] Reference Figures 3 to 5 In some embodiments, the airflow generating device 300 is a fan, wherein the relevant dimensions of the fan are larger than the gap between the first sub-circuit board 510 and the second sub-circuit board 520, so that the air outlet side of the fan can cover not only the inlet end of the first guide channel a, but also the inlet end (or air inlet 610) of the second guide channel b, simplifying the spatial layout and thus helping to simplify the relevant structure.

[0069] It should be noted that in some other embodiments, the airflow generating device 300 may also be a miniature vacuum pump or other device capable of generating airflow, which is not limited here.

[0070] In the description of this specification, the use of terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An aerosol generating device, characterized in that, include: A housing having a receiving cavity inside, and a vent on the housing connecting the receiving cavity to the outside atmosphere; A microwave heating element, which is disposed within the receiving cavity and used to heat the aerosol generation matrix; A circuit board is disposed within the receiving cavity. The circuit board has at least a radio frequency component and a power control component, and the radio frequency component is coupled to the microwave heating element. A heat dissipation structure is disposed within the receiving cavity and in thermal contact with the circuit board; An airflow generating device is disposed within the receiving cavity and arranged corresponding to the vent. The airflow generating device is used to generate airflow that is forced to convect with the heat dissipation structure.

2. The aerosol generating apparatus as described in claim 1, characterized in that, The heat dissipation structure includes a heat dissipation section, which includes a plurality of spaced-apart sheet-like protrusions or a plurality of spaced-apart columnar protrusions.

3. The aerosol generating apparatus as described in claim 1, characterized in that, The heat dissipation structure includes a heat dissipation section and an extension connected to the heat dissipation section for conducting heat, with at least a portion of the radio frequency component attached to the extension.

4. The aerosol generating apparatus as described in claim 3, characterized in that, A thermally conductive layer is provided between the extension and the radio frequency component.

5. The aerosol generating apparatus as described in claim 1, characterized in that, The heat dissipation structure includes a heat dissipation part and a flow guiding part connected to the heat dissipation part. The flow guiding part, the housing, and the circuit board form a first flow guiding channel. The air outlet of the airflow generating device is connected to the first flow guiding channel. The first flow guiding channel is used to guide the airflow generated by the airflow generating device to the heat dissipation part.

6. The aerosol generating apparatus as described in claim 5, characterized in that, The circuit board includes a first sub-circuit board and a second sub-circuit board. The first flow channel is formed by the flow guide portion, the housing and the first sub-circuit board. The first sub-circuit board and the second sub-circuit board overlap and are spaced apart, so that a second flow channel is formed between the first sub-circuit board and the second sub-circuit board for airflow to pass through and is different from the first flow channel. The air outlet of the airflow generating device is connected to the second flow channel.

7. The aerosol generating apparatus as described in claim 6, characterized in that, The radio frequency component is disposed on the side of the first sub-circuit board facing the second sub-circuit board, and the power control component is disposed on the side of the second sub-circuit board facing the first sub-circuit board.

8. The aerosol generating apparatus as described in claim 6, characterized in that, A supporting frame is provided between the first sub-circuit board and the second sub-circuit board. The frame, together with the first sub-circuit board and the second sub-circuit board, forms a cavity for airflow. The frame is provided with an air outlet that connects to the airflow generating device and an air inlet that connects to the cavity.

9. The aerosol generating apparatus as described in claim 8, characterized in that, A flow guide plate is provided within the frame, which can guide airflow to at least the radio frequency component and the power control component.

10. The aerosol generating apparatus as described in claim 9, characterized in that, The number of the guide plates is multiple, and the multiple guide plates are spaced apart within the frame along the extension direction of the second guide channel, with adjacent two guide plates being staggered along directions intersecting the extension direction.

11. The aerosol generating apparatus as described in claim 8, characterized in that, The frame is made of metal.

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