Heat generating body and aerosol generating device

Abstract

The application provides a heating body and an aerosol generating device, relates to the technical field of atomization, and the heating body comprises a substrate, a heating circuit layer and a first conductive strip. The heating circuit layer is arranged on the surface of the substrate. The heating circuit layer comprises a plurality of mutually spaced heating wires. The heating wires extend in a straight line direction. The first conductive strip extends in a straight line direction and connects two adjacent heating wires. The first conductive strip is used for conducting the heating circuit layer. The heating body provided by the application can solve the technical problem of reduced reliability of the heating body.

Description

Technical Field

[0001] This application belongs to the field of atomization technology, and more specifically, relates to a heating element aerosol generating device. Background Technology

[0002] The aerosol production device uses a heating element to heat the aerosol matrix, causing the aerosol matrix to atomize. The heating element generates heat through a heating circuit layer printed on the substrate.

[0003] In related technologies, the heating circuit layer has multiple bends. The uneven heat generation on the inner and outer sides of the bends poses a risk of breakage and reduces reliability. Utility Model Content

[0004] The purpose of this application is to provide a heating element and an aerosol generating device to solve the problem of reduced reliability of the heating element.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, this application provides a heating element, which includes a substrate, a heating circuit layer and a first conductive strip. The heating circuit layer is disposed on the surface of the substrate and includes a plurality of heating wires spaced apart from each other. The heating wires extend in a straight line direction. The first conductive strip extends in a straight line direction and connects two adjacent heating wires. The first conductive strip is used to conduct electricity through the heating circuit layer.

[0007] Through the above technical solution, the heating element provided in this application uses a first conductive strip to connect two adjacent heating wires, making the heating circuit layer conductive. This allows the heating wires to extend in a straight line, avoiding bending sections in the heating circuit layer and thus preventing breakage of bending sections. This helps to solve the technical problem of reduced reliability of the heating element.

[0008] Therefore, the heating element provided in this application can solve the technical problem of reduced reliability of heating elements.

[0009] In some embodiments, the first conductive strip is bonded to the heating wire; and / or, the extension direction of the first conductive strip intersects the extension direction of at least one of the two adjacent heating wires.

[0010] This allows for a stable and secure connection between the first conductive strip and the heating wire. Furthermore, the first conductive strip can be connected to two heating wires extending in different directions, eliminating the need for bent sections.

[0011] In some embodiments, at least two adjacent heating wires intersect in their extension directions; or, every two adjacent heating wires are parallel. This allows the heating element provided in this application to have heating wires with different arrangements, thus offering good applicability.

[0012] In some embodiments, the first conductive strip is located on the side of the heating wire facing away from the substrate. This way, the first conductive strip does not interfere with the printing of the heating wire onto the substrate.

[0013] In some embodiments, a support portion is provided on the side of the first conductive strip facing the substrate. The support portion is located between two adjacent heating wires and is in contact with the substrate. In this way, the portion of the first conductive strip between two adjacent heating wires can be supported by the support portion, which can prevent the portion of the first conductive strip between two adjacent heating wires from being suspended, thereby improving the structural stability of the first conductive strip.

[0014] In some embodiments, the first conductive strip is located on the side of the heating wire facing the substrate. This way, the first conductive strip does not affect the application of the protective layer on the side of the heating wire facing away from the substrate.

[0015] In some embodiments, the substrate has a first recess, and at least a portion of the first conductive strip is located within the first recess. This helps to maintain the flatness of the heating wire.

[0016] In some embodiments, the heating wire includes a first heating wire and a second heating wire, the extension direction of the first heating wire intersects the extension direction of the second heating wire, at least two adjacent first heating wires are parallel, and a first conductive strip connects the first heating wire and the second heating wire.

[0017] In this way, the heating element provided in this application can have heating wires with different arrangements, and the arrangement of the heating wires can be selected according to the product and application scenario, which has good applicability.

[0018] In some embodiments, the heating circuit layer includes a first terminal and a second terminal. The first terminal is disposed on one of the heating wires, and the second terminal is disposed on the other heating wire. The heating element also includes two second conductive strips for connecting to a power source. One second conductive strip is bonded to the first terminal, and the other second conductive strip is bonded to the second terminal. This eliminates the need for soldering leads to the heating circuit layer, simplifying the manufacturing process of the heating element and reducing costs.

[0019] Secondly, this application provides an aerosol generating apparatus, which includes the heating element of any of the above embodiments. The aerosol generating apparatus provided by this application has the same or similar technical effects as the heating element of any of the above embodiments, and will not be described in detail here. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the planar structure of a heating element in related technologies;

[0022] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0023] Figure 3 This is one of the schematic diagrams of the planar structure of the heating element provided in the embodiments of this application;

[0024] Figure 4 This is a second schematic diagram of the planar structure of the heating element provided in the embodiments of this application;

[0025] Figure 5 This is the third schematic diagram of the planar structure of the heating element provided in the embodiments of this application;

[0026] Figure 6 Fourth schematic diagram of the planar structure of the heating element provided in the embodiments of this application;

[0027] Figure 7 For along Figure 3 Cross-sectional view of the middle BB line;

[0028] Figure 8 Fifth schematic diagram of the planar structure of the heating element provided in the embodiments of this application;

[0029] Figure 9 For along Figure 8 Cross-sectional view of the CC line;

[0030] Figure 10 For along Figure 8 Cross-sectional view of the DD line.

[0031] The following are the labeling elements in the figure:

[0032] 100-Heating element; 10-Substrate; 20-Heating circuit layer; 201-Bending section; 2011-First region; 2012-Second region; 2013-Third region; 2014-Fourth region; 21-First heating wire; 22-Second heating wire; 30-Electrode layer; 40-Pad; 50-First lead; 60-First conductive strip; 61-Support; 70-Second conductive strip; 71-Second lead. Detailed Implementation

[0033] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0034] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0035] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] This application provides an aerosol production apparatus. The aerosol production apparatus can use a heating element to heat the aerosol matrix, causing the aerosol matrix to atomize. The heating element generates heat through a heating circuit layer printed on the substrate.

[0038] The aerosol production apparatus includes an atomizer and a power supply. The atomizer includes a heating element and a cavity for containing the aerosol matrix. The power supply provides power to the heating element, which transfers heat to the aerosol matrix, causing the aerosol matrix to atomize.

[0039] Please see Figure 1 and Figure 2In related technologies, the heating element 100 includes a substrate 10 and a heating circuit layer 20 disposed on the substrate 10. The heating circuit layer 20 has multiple curved sections 201. The curved section 201 includes a first region 2011, a second region 2012, a third region 2013, and a fourth region 2014. The first region 2011 is located inside the curved section 201, and the second region 2012, the third region 2013, and the fourth region 2014 are located outside the curved section 201. The second region 2012 is located between the third region 2013 and the fourth region 2014. The first region 2011 and the second region 2012 are disposed opposite to each other.

[0040] The inventors discovered that when the heating circuit layer 20 is energized and generates heat, the temperature of the first region 2011 is greater than or equal to 235°C and less than or equal to 240°C; for example, the temperature of the first region 2011 is 237.2°C. The temperature of the second region 2012 is greater than or equal to 215°C and less than or equal to 220°C; for example, the temperature of the second region 2012 is 216.8°C. The temperature of the third region 2013 is greater than or equal to 215°C and less than or equal to 220°C; for example, the temperature of the third region 2013 is 216.9°C. The temperature of the fourth region 2014 is greater than or equal to 215°C and less than or equal to 220°C; for example, the temperature of the third region 2013 is 216.9°C.

[0041] As a result, the heat generation on the inner and outer sides of the bending section 201 is uneven, with the temperature on the inner side of the bending section 201 being higher than that on the outer side. This can lead to a risk of breakage in the bending section 201 and reduce its reliability.

[0042] To resolve the above technical issues, please refer to [link / reference]. Figure 3 This application provides a heating element 100, which includes a substrate 10.

[0043] Optionally, the substrate 10 can be a metal.

[0044] Optionally, the substrate 10 can be a porous material. For example, the substrate 10 can be a porous ceramic. For example, the substrate 10 can be alumina or zirconia ceramic.

[0045] The aerosol matrix can be a liquid, and the aerosol matrix can enter the pores of the substrate 10, thereby allowing the substrate 10 to heat and atomize the aerosol matrix.

[0046] The heating element 100 provided in this embodiment further includes a heating circuit layer 20, which is formed on the surface of the substrate 10 by a printing process. During the fabrication of the heating circuit layer 20, a metal paste is printed on the substrate 10, and then baked to form the heating circuit layer 20. The heating circuit layer 20 includes a plurality of spaced-apart heating lines that extend in a straight line, thus eliminating the possibility of bending sections 201 in the heating circuit layer 20. For example, the heating lines can extend along… Figure 3 It extends in the X direction.

[0047] The heating element 100 provided in this embodiment further includes a first conductive strip 60. The first conductive strip 60 extends in a straight line and connects two adjacent heating wires. In this way, the first conductive strip 60 can conduct electricity to the heating circuit layer 20, allowing the heating circuit layer 20 to generate heat when energized. For example, the first conductive strip 60 can extend in a straight line... Figure 3 It extends along the Y direction. The X direction is perpendicular to the Y direction.

[0048] Through the above technical solution, the heating element 100 provided in this application embodiment uses the first conductive strip 60 to connect two adjacent heating wires, so that the heating circuit layer 20 is conductive. This allows the heating wires to extend in a straight line, avoiding the existence of bending sections 201 in the heating circuit layer 20, and thus avoiding the situation of breakage of bending sections 201. This helps to solve the technical problem of reduced reliability of the heating element 100.

[0049] Therefore, the heating element 100 provided in this application embodiment can solve the technical problem of reduced reliability of the heating element 100.

[0050] In some embodiments, the first conductive strip 60 is bonded to the heating wire. This allows the first conductive strip 60 to connect to the heating wire, thereby making the heating circuit layer 20 conductive.

[0051] Optionally, the material of the first conductive strip 60 can be a material with good conductivity, such as gold (Au), aluminum (Al), copper (Cu), or silver (Ag), so as to conduct the heating circuit layer 20.

[0052] Optionally, the first conductive strip 60 and the heating wire can be connected by thermo-compression bonding. That is, under high temperature and pressure, the contact surfaces of the first conductive strip 60 and the heating wire form a chemical bond. This allows for a stable and strong connection between the first conductive strip 60 and the heating wire.

[0053] Optionally, the first conductive strip 60 and the heating wire can be connected by ultrasonic bonding. That is, the ultrasonic energy generated by high-frequency ultrasonic vibration can generate local high temperature and pressure at the contact surface between the first conductive strip 60 and the heating wire, thereby forming a bonding connection between the first conductive strip 60 and the heating wire. This allows the first conductive strip 60 and the heating wire to form a bonding connection at a relatively low temperature.

[0054] Optionally, the frequency of the ultrasound can be f, and the value of f can be in the range of 20kHz≤f≤80kHz.

[0055] For example, the value of f can be: 20kHz, 25kHz, 30kHz, 35kHz, 40kHz, 45kHz, 50kHz, 55kHz, 60kHz, 65kHz, 70kHz, 75kHz, 80kHz, etc.

[0056] Optionally, the first conductive strip 60 and the heating wire can be connected by thermo-sonic bonding. That is, while heating the first conductive strip 60 and the heating wire, ultrasonic energy generated by ultrasonic vibration is used to bond the first conductive strip 60 and the heating wire together. This helps to improve the connection strength between the first conductive strip 60 and the heating wire.

[0057] Optionally, the first conductive strip 60 and the heating wire can be connected by laser bonding. That is, a laser beam is used to irradiate the contact surface between the first conductive strip 60 and the heating wire, forming a metallic connection through localized heating. This helps to avoid deformation of the heating wire caused by mechanical pressure.

[0058] Optionally, the first conductive strip 60 and the heating wire can be connected by electromagnetic bonding. That is, the first conductive strip 60 and the heating wire are heated by the action of an electromagnetic field, so that the contact surfaces of the first conductive strip 60 and the heating wire form a bond connection. This helps to avoid deformation of the heating wire caused by mechanical pressure.

[0059] In some embodiments, please refer to the following: Figure 3 , Figure 4 , Figure 5 and Figure 6 The extension direction of the first conductive strip 60 intersects with the extension direction of at least one of the two adjacent heating wires.

[0060] For example, please refer to Figure 3 The extension direction of the first conductive strip 60 can be perpendicular to the extension direction of either of the two adjacent heating wires. Specifically, the extension direction of either of the two adjacent heating wires can be... Figure 3In the X direction, the extension direction of the first conductive strip 60 can be... Figure 3 in the Y direction.

[0061] For example, please refer to Figure 4 The extension direction of the first conductive strip 60 can intersect the extension direction of either of the two adjacent heating wires. Specifically, the extension direction of either of the two adjacent heating wires can be... Figure 4 In the X direction, the extension direction of the first conductive band 60 can be parallel to... Figure 4 The X and Y directions intersect.

[0062] For example, please refer to Figure 5 The extension direction of the first conductive strip 60 can intersect with the extension direction of one of the two adjacent heating wires, or it can be parallel to the extension direction of the other of the two adjacent heating wires. For example, the extension direction of the first conductive strip 60 can be perpendicular to the extension direction of one of the two adjacent heating wires. The extension direction of one of the two adjacent heating wires can be... Figure 5 In the Y direction, the extension direction of the other of two adjacent heating wires can be... Figure 5 In the X direction, the extension direction of the first conductive band 60 can also be... Figure 5 The X direction in the equation.

[0063] For example, please refer to Figure 6 The extension direction of the first conductive strip 60 can be perpendicular to the extension direction of one of the two adjacent heating wires, and the extension direction of the first conductive strip 60 can also intersect but not be perpendicular to the extension direction of the other of the two adjacent heating wires. The extension direction of one of the two adjacent heating wires can be... Figure 6 In the X direction, the extension direction of the other of the two adjacent heating wires is respectively with Figure 6 The X and Y directions intersect, and the extension direction of the first conductive band 60 can also be... Figure 6 in the Y direction.

[0064] Understandably, the first conductive strip 60 can be connected to two heating wires with different extension directions, which can avoid the use of the bent section 201 and thus improve the reliability of the heating element 100.

[0065] In some embodiments, the first conductive strip 60 is connected to the end of the heating wire, thereby maximizing the heating area of ​​the heating wire. The first conductive strip 60 has good conductivity, so the current from one of two adjacent heating wires will preferentially flow through the first conductive strip 60 to the other of the two adjacent heating wires.

[0066] Optionally, please refer to Figure 3 and Figure 6Multiple heating wires are spaced apart along a first direction, with at least three heating wires, along the first direction (e.g., Figure 3 In the Y direction (of the circuit), the length of the two heating wires located at the edge is greater than the length of the heating wire located in the middle. This facilitates the connection of the heating circuit layer 20 to the power supply through the two heating wires at the edge.

[0067] Optionally, please refer to Figure 3 Each pair of adjacent heating wires is parallel.

[0068] In some embodiments, please refer to Figure 5 and Figure 6 At least two adjacent heating wires intersect in their extension directions. Therefore, the heating element 100 provided in this embodiment can have heating wires arranged in different ways, thus offering good applicability.

[0069] For example, please refer to Figure 5 Each pair of adjacent heating wires is connected to the first conductive strip 60, and the extension directions of each pair of adjacent heating wires are perpendicular.

[0070] For example, please refer to Figure 6 Each pair of adjacent heating wires is connected to the first conductive strip 60, and the extension directions of each pair of adjacent heating wires intersect but are not perpendicular.

[0071] It is understandable that the preparation process of the heating element 100 is as follows: an insulating layer is printed or sprayed on the surface of the substrate 10, the insulating layer is sintered and then the heating circuit layer 20 is printed, the heating circuit layer 20 is sintered and then a protective layer is sprayed, the protective layer is sintered and then the first conductive strip 60 is formed at the location where the first conductive strip 60 needs to be bonded by electroplating, deposition and other methods, and then the first conductive strip 60 is bonded to the heating wire.

[0072] Please see Figure 7 In some embodiments, the first conductive strip 60 is located on the side of the heating wire away from the substrate 10. In this way, the first conductive strip 60 does not affect the printing and forming of the heating wire on the substrate 10.

[0073] It is understandable that when the protective layer is sprayed after the heating circuit layer 20 is sintered, it is necessary to cover the part of the bonding first conductive strip 60 to avoid affecting the bonding between the first conductive strip 60 and the heating wire.

[0074] Optionally, a support portion 61 is provided on the side of the first conductive strip 60 facing the substrate 10. The support portion 61 is located between two adjacent heating wires and is in contact with the substrate 10. In this way, the portion of the first conductive strip 60 located between two adjacent heating wires can be supported by the support portion 61, which can prevent the portion of the first conductive strip 60 located between two adjacent heating wires from being suspended, thereby improving the structural stability of the first conductive strip 60.

[0075] In some embodiments, please refer to the following: Figure 8 and Figure 9 The first conductive strip 60 is located on the side of the heating wire facing the substrate 10. In this way, the first conductive strip 60 does not affect the application of the protective layer on the side of the heating wire away from the substrate 10.

[0076] It is understood that in this embodiment, the preparation process of the heating element 100 is as follows: an insulating layer is printed or sprayed on the surface of the substrate 10, and after the insulating layer is sintered, a first conductive strip 60 is formed by electroplating, deposition or other methods. Then, a heating circuit layer 20 is printed. After the heating circuit layer 20 is sintered, the first conductive strip 60 is bonded to the heating wire. After the first conductive strip 60 is bonded to the heating wire, a protective layer is sprayed on the heating circuit layer 20.

[0077] In some embodiments, the substrate 10 is provided with a first recess, and at least a portion of the first conductive strip 60 is located within the first recess. In this way, at least a portion of the first conductive strip 60 can be located within the first recess, thereby at least partially preventing the heating wire covering the first conductive strip 60 from protruding in a direction away from the substrate 10, which helps maintain the flatness of the heating wire.

[0078] Please see Figure 5 In some embodiments, the heating wire includes a first heating wire 21 and a second heating wire 22, the extension direction of the first heating wire 21 intersects the extension direction of the second heating wire 22, at least two adjacent first heating wires 21 are parallel, and a first conductive strip 60 connects the first heating wire 21 and the second heating wire 22.

[0079] In this way, the heating element 100 provided in this application embodiment can have heating wires with different arrangements, and the arrangement of the heating wires can be selected according to the product and application scenario, which has good applicability.

[0080] Optionally, the extension direction of the first heating wire 21 is perpendicular to the extension direction of the second heating wire 22, and every two adjacent first heating wires 21 are parallel.

[0081] Please continue reading. Figure 1 and Figure 2 The inventors discovered that, in order for the heating circuit layer 20 to connect to the power supply via the first lead 50, electrode layers 30 and pads 40 need to be set at both ends. The electrode layers 30 are connected to the heating circuit layer 20, and the pads 40 are located on the side of the electrode layers 30 facing away from the substrate 10. The first lead 50 is soldered to the pads 40. However, the soldering of the first lead 50 to the pads 40 requires precise positioning, and the soldering process for the first lead 50 is complex.

[0082] In some embodiments, please refer to the following: Figure 8 and Figure 10The heating circuit layer 20 includes a first terminal and a second terminal. The first terminal is disposed on one of the heating wires, and the second terminal is disposed on the other heating wire. The first terminal and the second terminal are the two ends of the heating circuit layer 20 used to connect to the power supply.

[0083] The heating element 100 also includes two second conductive strips 70 for connecting to a power source. One second conductive strip 70 is bonded to a first terminal, and the other second conductive strip 70 is bonded to a second terminal. The second conductive strips 70 can be directly connected to the power source. This eliminates the need for soldering leads in the heating circuit layer 20, simplifying the manufacturing process of the heating element 100 and reducing costs.

[0084] Optionally, the second conductive strip 70 is provided with a second lead 71, which can be connected to a power source.

[0085] Optionally, the second conductive strip 70 can be disposed on the side of the heating wire away from the substrate 10. Similarly, the second conductive strip 70 does not affect the printing and forming of the heating wire on the substrate 10.

[0086] Optionally, the second conductive strip 70 can be disposed on the side of the heating wire facing the substrate 10. Similarly, the second conductive strip 70 does not affect the application of a protective layer on the side of the heating wire away from the substrate 10.

[0087] Optionally, the substrate 10 is provided with a second recess, and at least a portion of the second conductive strip 70 is located within the second recess. Similarly, at least a portion of the second conductive strip 70 can be located within the second recess, thereby at least partially preventing the heating wire covering the second conductive strip 70 from protruding in a direction away from the substrate 10, which helps to maintain the flatness of the heating wire.

[0088] Optionally, the substrate 10 may be provided with a second recess.

[0089] It is understood that the atomizer provided in this application embodiment has the same or similar technical effects as the heating element 100 in any of the above embodiments, and will not be described again here.

[0090] Furthermore, the aerosol generating device provided in this application embodiment has the same or similar technical effects as the atomizer in the above embodiment, and will not be described again here.

[0091] The above description is merely a specific embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heating element, characterized in that, include: Matrix; A heating circuit layer is disposed on the surface of the substrate, and the heating circuit layer includes a plurality of heating wires spaced apart from each other, the heating wires extending in a straight line direction; A first conductive strip extends in a straight line and connects two adjacent heating wires. The first conductive strip is used to conduct the heating circuit layer.

2. The heating element as described in claim 1, characterized in that, The first conductive strip is bonded to the heating wire; and / or, the extension direction of the first conductive strip intersects the extension direction of at least one of the two adjacent heating wires.

3. The heating element as described in claim 1, characterized in that, At least two adjacent heating wires extend in the same direction; or, every two adjacent heating wires are parallel.

4. The heating element as described in claim 1, characterized in that, The first conductive strip is located on the side of the heating wire away from the substrate.

5. The heating element as described in claim 4, characterized in that, The first conductive strip has a support portion on the side facing the substrate. The support portion is located between two adjacent heating wires and is in contact with the substrate.

6. The heating element as described in claim 1, characterized in that, The first conductive strip is located on the side of the heating wire facing the substrate.

7. The heating element as described in claim 6, characterized in that, The substrate has a first recess, and at least a portion of the first conductive strip is located within the first recess.

8. The heating element as described in claim 1, characterized in that, The heating wire includes a first heating wire and a second heating wire. The extension direction of the first heating wire intersects the extension direction of the second heating wire. At least two adjacent first heating wires are parallel. The first conductive strip connects the first heating wire and the second heating wire.

9. The heating element as described in claim 1, characterized in that, The heating circuit layer includes a first terminal and a second terminal. The first terminal is disposed on one of the heating wires, and the second terminal is disposed on the other heating wire. The heating element also includes two second conductive strips for connecting to the power supply. One second conductive strip is bonded to the first terminal, and the other second conductive strip is bonded to the second terminal.

10. An aerosol generating device, characterized in that, Includes the heating element as described in any one of claims 1 to 9.

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