Thermal management mechanism, physiotherapy patch and thermal management system

Abstract

The application provides a heat management mechanism, a physiotherapy patch and a heat management system, and the heat management mechanism is used for cooling and / or heating the patch; wherein the patch has an application surface for being applied to an application site and a back surface opposite to the application surface; the heat management mechanism comprises an upper film and a lower film; the upper film is connected with the lower film and forms a containing space for containing a heat-conducting medium; and one side of the lower film opposite to the upper film is used for being attached to the back surface of the patch. The heat management mechanism simplifies the structure of the heat management mechanism, improves the convenience of the heat management mechanism, and further exchanges heat with the patch through the heat-conducting medium in the containing space, thereby improving the heating and / or cooling efficiency of the patch.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and more specifically, to a thermal management mechanism, a physiotherapy patch, and a thermal management system. Background Technology

[0002] Patches are typically applied to target areas for care or treatment. During therapeutic application, patches usually work based on principles such as iontophoresis and the generation of electric fields. Thermal management mechanisms are typically used to cool / dissipate heat and / or heat the patches during treatment. For example, in the case of electric field generating electrodes used to treat tumors, the areas where the electrode layer directly or indirectly contacts the body may generate heat and sweat, potentially causing redness, itching, and discomfort due to high temperatures. In such cases, a thermal management mechanism is needed to cool the electric field generating electrodes to reduce heat and discomfort for the patient. Similarly, in the case of iontophoresis-based facial masks, to further enhance the mask's effectiveness, a heat application method can be used. In this case, a thermal management mechanism is typically needed to heat the mask.

[0003] Currently, thermal management mechanisms used for cooling or heating surface mount devices (SMDs) typically rely on methods such as semiconductor cooling or air cooling. However, semiconductor cooling generates heat during operation, resulting in relatively low heat dissipation efficiency. Air cooling is also not very efficient.

[0004] In other words, current thermal management systems are not efficient enough at cooling or heating patches. Utility Model Content

[0005] The purpose of this application is to provide a thermal management mechanism, a physiotherapy patch, and a thermal management system that can improve the efficiency of cooling and / or heating the patch.

[0006] In a first aspect, this application provides a thermal management mechanism for cooling and / or heating a patch or a user's application site; wherein the patch has an application surface for applying to the application site and a back surface facing away from the application surface; the mechanism includes an upper film and a lower film; the upper film is connected to the lower film and forms a receiving space for accommodating a heat-conducting medium; the side of the lower film facing away from the upper film is used to attach to the back surface of the patch; or, the side of the lower film facing away from the upper film directly acts on the user's application site.

[0007] The aforementioned thermal management mechanism, while simplifying its structure and improving ease of use, also improves the efficiency of heating and / or cooling the patch or the user's application area by exchanging heat with the heat-conducting medium within the containment space.

[0008] In conjunction with the first aspect, optionally, the connection between the upper membrane and the lower membrane further forms a medium outlet and a medium inlet; the medium outlet allows the heat-conducting medium to be discharged from the containment space, and the medium inlet allows the heat-conducting medium to enter the containment space; the containment space includes at least two containment subspaces; the upper membrane has at least two containment portions, which are connected to the lower membrane to form the containment subspaces; and / or, the lower membrane has at least two containment portions, which are connected to the upper membrane to form the containment subspaces; at least two containment subspaces are connected in series to form the containment space; the medium outlet and the medium inlet are respectively connected to the containment subspaces located at the beginning and end of the containment space.

[0009] The aforementioned thermal management mechanism, by incorporating a medium outlet and a medium inlet for connection to a heat transfer medium source, continuously heats and / or cools the heat transfer medium during circulation. This improves the continuity of heating and / or cooling of the patch and further enhances the efficiency of heating and / or cooling. Furthermore, by dividing the containment space into multiple sub-spaces and connecting them in series, the proportion of heat transfer medium circulating within the entire containment space is increased. This ensures that the heat transfer medium flows through and covers all locations requiring heating and / or cooling, thereby further improving the efficiency of heating and / or cooling the patch.

[0010] In conjunction with the first aspect, optionally, the connected accommodating subspaces are connected by at least two flow channels.

[0011] The aforementioned thermal management mechanism reduces the pressure in the flow channels compared to a single flow channel by increasing the number of flow channels between interconnected accommodating subspaces.

[0012] In conjunction with the first aspect, optionally, the receiving space has an upper inner wall and a lower inner wall; the upper inner wall is located on the side of the upper membrane facing the lower membrane, and the lower inner wall is located on the side of the lower membrane facing the upper membrane; a middle portion of the upper inner wall and a middle portion of the lower inner wall are connected to form a connecting body.

[0013] The aforementioned thermal management mechanism may bulge after the heat transfer medium is contained, which hinders the adhesion between the mechanism and the patch, reducing the contact area between the lower film and the patch and affecting heating and cooling efficiency. Therefore, by connecting the middle sections of the upper and lower films, this bulging phenomenon can be avoided. This improves the adhesion of the thermal management mechanism and consequently enhances heating and cooling efficiency.

[0014] In conjunction with the first aspect, optionally, the connecting bodies have a spacing between them, the spacing forming a plurality of connecting channels between the accommodating subspaces.

[0015] The aforementioned thermal management mechanism allows the heat transfer medium to circulate through the spacing between the connecting bodies. The resulting multiple flow channels enable the heat transfer medium to circulate over a wider range within the containment space. Furthermore, the multiple flow channels reduce the pressure exerted by the heat transfer medium flow on any single flow channel.

[0016] In conjunction with the first aspect, optionally, the connector includes dot-shaped connectors uniformly distributed between the upper membrane and the lower membrane; and / or, the connector includes strip-shaped connectors arranged parallel to the bending axis of the thermal management mechanism.

[0017] The aforementioned thermal management mechanism, with its dotted connectors, improves the fit by preventing bulging of the middle sections of the upper and lower films after accommodating the heat-conducting medium. Furthermore, the dotted connectors occupy less space, minimizing space loss due to insufficient accommodating space. The strip connectors, arranged parallel to the bending axis of the thermal management mechanism, facilitate bending to conform to the curved surface of the application area, further enhancing its fit.

[0018] In conjunction with the first aspect, optionally, the upper membrane is provided with at least one upper membrane perforation; the lower membrane is provided with lower membrane perforations of the same number and shape as the upper membrane perforations at the corresponding positions; the edges of the upper membrane perforations are sealed to the edges of the corresponding lower membrane perforations.

[0019] The aforementioned thermal management mechanism, by creating perforations in both the upper and lower films and sealing these perforations, achieves a structure similar to vias on a PCB board. This structure prevents the thermal management mechanism from bubbling and reducing its adhesion to the surface mount device (SMD), thus improving the adhesion between the thermal management mechanism and the SMD, and consequently increasing the efficiency of heating and cooling the SMD.

[0020] In conjunction with the first aspect, optionally, the edge of the upper film is provided with at least one upper film notch; the lower film is provided with a lower film notch at a position corresponding to the upper film notch, and the number and shape of the lower film notches are the same; the edge of the upper film notch is sealed to the edge of the corresponding lower film notch.

[0021] In the aforementioned thermal management mechanism, without corresponding upper and lower film notches at the edges of the upper and lower films respectively, wrinkles typically appear at the edges when dealing with patches of different curved shapes. These wrinkles exert a force that restores their original flatness, especially after the thermally conductive medium is filled, thus hindering the adhesion between the thermal management mechanism and the patch. By providing corresponding upper and lower film notches at the edges of the upper and lower films respectively, the wrinkles are effectively eliminated, reducing wrinkle formation and improving the adhesion between the thermal management mechanism and the patch. Consequently, the efficiency of the thermal management mechanism in heating and cooling the patch is improved.

[0022] In conjunction with the first aspect, optionally, the thermally conductive medium includes a thermally conductive liquid; and the containment space is filled with an adsorption layer.

[0023] After the aforementioned thermal management mechanism is filled with an adsorption layer, the adsorption layer can adsorb the heat-conducting liquid. After adsorbing the heat-conducting liquid, the adsorption layer can always lock in a portion of the heat-conducting medium, thereby increasing the weight of the adsorption layer. Under the action of the gravity of the adsorption layer, the thermal management mechanism can be better attached to the patch, which means that the contact area between the lower film and the patch is increased.

[0024] In conjunction with the first aspect, optionally, the upper membrane has a greater flexibility than the lower membrane.

[0025] The aforementioned thermal management mechanism, through the design that the upper film is more flexible than the lower film, ensures that under the extrusion pressure of the heat-conducting medium, the lower film is deformed less than the upper film. This allows the deformation of the upper film to absorb most of the extrusion pressure, thereby improving the adhesion between the lower film and the patch.

[0026] In conjunction with the first aspect, optionally, the upper film is made of a first flexible material; the lower film is made of a second flexible material; wherein the flexibility of the first flexible material is greater than that of the second flexible material.

[0027] The aforementioned thermal management mechanism uses materials with different flexibility as the upper and lower film materials, respectively. By selecting different flexible materials, the deformation degree of the upper film is greater than that of the lower film. This allows the deformation of the upper film to absorb most of the extrusion pressure, thereby improving the fit of the thermal management mechanism.

[0028] In conjunction with the first aspect, optionally, the upper film and the lower film are made of the same material, and the thickness of the upper film is less than the thickness of the lower film.

[0029] When the above-mentioned heat management mechanism uses the same material to prepare the upper and lower films respectively, by processing the upper and lower films with different thicknesses, the flexibility of the upper film is greater than that of the lower film. In this way, the deformation of the upper film can absorb most of the extrusion pressure. This not only improves the fit of the heat management mechanism, but also simplifies the types of raw materials and reduces the difficulty of procuring them.

[0030] In conjunction with the first aspect, the mechanism may optionally further include a heat insulation layer; the heat insulation layer is located on the side of the upper membrane facing away from the lower membrane.

[0031] The aforementioned thermal management mechanism, by setting a heat insulation layer on the side of the upper membrane opposite to the lower membrane, reduces the efficiency of heat exchange between the heat-conducting medium and the air through the upper membrane, thus providing thermal insulation for the heat-conducting medium. This further improves the heating and cooling efficiency of the thermal management mechanism.

[0032] Secondly, this application provides a physiotherapy patch, including an electrode layer and a thermal management mechanism described in the first aspect; the electrode layer has an active surface and a back surface; wherein the active surface is used to be applied to a user's application site, and the back surface faces away from the active surface; the active surface of the electrode layer is used to be attached to the user's application site and to be connected to a first electrode of a power source; wherein the second electrode of the power source acts on other parts of the user's body besides the application site; the side of the lower membrane facing away from the upper membrane is attached to the back surface of the electrode layer.

[0033] The above-described physiotherapy patch has the same beneficial effects as the thermal management mechanism provided in the first aspect or any alternative embodiment of the first aspect, which will not be elaborated here.

[0034] In conjunction with the second aspect, optionally, the thermal management mechanism further includes a first adhesive layer; the first adhesive layer is located on the side where the upper surface of the upper film is located; the first adhesive layer has a first adhesive surface facing the upper film and coated with a first reversible adhesive material; the middle portion of the first adhesive surface is attached to the side of the upper film facing away from the lower film, and the edge portion of the first adhesive surface is used to attach to the electrode layer.

[0035] The aforementioned physiotherapy patch connects the thermal management mechanism and the electrode layer via a first adhesive layer, improving the ease of connection between the two. Furthermore, the use of a first reversible adhesive material enhances the ease of separation between the thermal management mechanism and the electrode layer, enabling multiple reuses of both components. This significantly improves the overall convenience of using the physiotherapy patch.

[0036] In conjunction with the second aspect, optionally, the patch further includes a second adhesive layer; the second adhesive layer is located between the electrode layer and the lower film; the second adhesive layer has a second adhesive surface facing the upper film and coated with a second reversible adhesive material; the electrode layer is attached to the center of the second adhesive surface, and the edge portion of the second adhesive surface is used to attach to other parts of the user.

[0037] The aforementioned physiotherapy patch connects the electrode layer to the user's skin via a second adhesive layer, improving the ease of connection between the electrode layer and the user's skin. Furthermore, by using a second reversible adhesive material as the adhesive, the ease of separation between the electrode layer and the user's skin is further improved. Ultimately, this significantly enhances the ease of use of the physiotherapy patch.

[0038] In conjunction with the second aspect, optionally, the second reversible adhesive material includes a thermally conductive adhesive material.

[0039] The aforementioned physiotherapy patch, by using a thermally conductive adhesive material as a second reversible adhesive, improves the ease of use while ensuring efficient heat conduction between the lower membrane of the thermal management mechanism and the electrode layer. This, in turn, ensures efficient heating and cooling of the physiotherapy patch.

[0040] In conjunction with the second aspect, optionally, the second adhesive layer is provided with through holes; the portion of the lower film corresponding to the through holes contacts the electrode layer.

[0041] The aforementioned physiotherapy patch, by having through holes in the second adhesive layer, and with the portion of the lower membrane corresponding to the through holes contacting the electrode layer, further ensures the heat conduction efficiency between the lower membrane and the electrode layer of the thermal management mechanism. This further ensures the heating and cooling efficiency of the physiotherapy patch.

[0042] In conjunction with the second aspect, optionally, the through hole is filled with at least one of thermally conductive grease, thermally conductive silicone, thermally conductive paste, thermally conductive potting compound, phase change thermally conductive sheet, and liquid metal thermally conductive paste.

[0043] The aforementioned physiotherapy patch, by filling the through holes with the aforementioned thermally conductive adhesive material, further improves the heat exchange efficiency between the portion of the lower membrane corresponding to the through holes and the electrode layer, thereby further improving the heating and cooling efficiency of the physiotherapy patch.

[0044] In conjunction with the second aspect, optionally, the patch is a face mask, and the area to be applied includes the face; the face mask includes a mask body; one side of the mask body is attached to the working surface of the electrode layer, and the other side of the mask body is used to apply to the user's face.

[0045] The aforementioned physiotherapy patches, when applied to face masks using the physiotherapy patches provided in the various embodiments of this application, allow users to apply hot or cold compresses to their faces during the process of using the face mask to care for their faces, based on actual application needs, through the heating and cooling functions of the heat management mechanism, thereby improving the care efficacy of the face mask.

[0046] In conjunction with the second aspect, optionally, the upper or lower membrane has a first strip-shaped connecting portion and a second strip-shaped connecting portion; the first strip-shaped connecting portion is located at the cheek position of the upper or lower membrane, and both ends of the first strip-shaped connecting portion are not located at the edge of the upper or lower membrane; wherein, the cheek position is the position on the upper or lower membrane corresponding to the cheek of the face when the mask is applied to the face; the second strip-shaped connecting portion is located at the forehead position of the upper or lower membrane; the length direction of the second strip-shaped connecting portion is consistent with the vertical direction; at least one end of the second strip-shaped connecting portion is not located at the edge of the upper or lower membrane; wherein, the forehead position is the position on the upper or lower membrane corresponding to the forehead of the face when the mask is applied to the face; the vertical direction is the vertical direction of the face when the mask is applied to the face; the first strip-shaped connecting portion and the second strip-shaped connecting portion are respectively attached to the corresponding positions on the lower or upper membrane.

[0047] The aforementioned therapeutic patch, through the connection between the first strip-shaped connecting part and the upper and lower membranes, requires the heat-conducting medium inside the mask to bypass the first strip-shaped connecting part during its flow, passing through both ends. Similarly, the heat-conducting medium also needs to bypass the second strip-shaped connecting part, flowing through at least one end. This allows for a larger flow range of the heat-conducting medium within the receiving cavity, enabling as much heat-conducting medium as possible to participate in circulation within the receiving cavity. This avoids the tendency for fluid pressure concentration in a single flow channel, which can cause the patch to bulge at pressure concentration points, further improving the patch's fit. Ultimately, this increases the efficiency of heating and cooling the mask body.

[0048] In conjunction with the second aspect, optionally, neither end of the second strip-shaped connecting portion is located at the edge of the upper or lower membrane.

[0049] The aforementioned therapeutic patch, by positioning the second strip-shaped connecting portion as the middle part of the upper or lower film excluding the edge, allows the heat-conducting medium to bypass the second strip-shaped connecting portion from both ends when flowing through it. This effectively achieves flow diversion through the connecting portion, further increasing the proportion of heat-conducting medium participating in circulation within the containment space. Moreover, compared to only being able to bypass it from one end, it reduces the pressure of the flow channel at the corresponding position of that end, thereby improving the stability of the mask.

[0050] In conjunction with the second aspect, optionally, the mask further includes a protective layer located on the back side of the electrode layer, and the thermal management mechanism is coupled to the side of the protective layer opposite to the electrode layer.

[0051] The aforementioned therapeutic patches are designed to ensure the flatness of the electrode layer, thus guaranteeing the effectiveness of the electrode layer on the face, because the masks typically need to be very thin to adhere better to the face after being soaked in the mask liquid. Furthermore, the electrode layer usually uses a thin-film metal layer, which is prone to curling, affecting the adhesion between the mask and the face.

[0052] Thirdly, this application provides a thermal management system, including a heat transfer medium source and the thermal management mechanism described in the first aspect; the heat transfer medium source is respectively connected to the medium outlet and the medium inlet of the containment space to deliver the heat transfer medium to the containment space through the medium inlet and to receive the heat transfer medium through the medium outlet; the heat transfer medium source is used to heat and / or cool the heat transfer medium.

[0053] The above-described thermal management system has the same beneficial effects as the thermal management mechanism provided in the first aspect or any alternative embodiment of the first aspect, which will not be elaborated here.

[0054] In conjunction with the third aspect, optionally, the heat-conducting medium source is provided with a temperature sensor; the temperature sensor is used to detect the temperature of the heat-conducting medium in the heat-conducting medium source.

[0055] The aforementioned thermal management system monitors the temperature of the heat-conducting medium or the skin near the application site using temperature sensors, allowing users to access relevant temperature information in real time. This facilitates the activation of the thermal management system when cooling or heating is needed, or the immediate implementation of countermeasures in case of abnormal temperatures.

[0056] In conjunction with the third aspect, optionally, the heat-conducting medium source includes a thermos cup body; the cup cavity of the thermos cup body is connected to the medium outlet and the medium inlet respectively.

[0057] The aforementioned thermal management system, by employing an insulated cup as a container to hold the heat transfer medium, reduces the efficiency of heat exchange between the heat transfer medium and the outside air. This achieves a heat preservation effect, ultimately further improving the heating and / or cooling efficiency of the thermal management system.

[0058] In conjunction with the third aspect, optionally, the heat-conducting medium source includes a temperature-controlled cup body, a temperature-controlled component, and a heat-conducting cup body; the temperature-controlled cup body has a placement space for placing the heat-conducting cup body; the cup cavity of the heat-conducting cup body is connected to the medium outlet and the medium inlet respectively; the heat-conducting cup body is located within the placement space of the temperature-controlled cup body; the temperature-controlled component is disposed on the temperature-controlled cup body and is used to heat and / or cool the heat-conducting cup body.

[0059] The aforementioned thermal management system uses a heat-conducting cup as a container for the heat-conducting medium, and places it and the temperature control component separately in the placement space of the temperature control body. This allows the heat-conducting cup to be placed in any cooling or heating device, thus enabling the thermal management system to adapt to more application scenarios.

[0060] In conjunction with the third aspect, optionally, the heat transfer medium source is connected to the medium outlet and the medium inlet via pipes; a flow sensor or a pressure sensor is provided on the heat transfer medium source and / or the pipes.

[0061] The aforementioned thermal management system, by equipping it with a flow sensor, enables users to monitor the flow rate of the heat transfer medium in real time. This facilitates users in controlling the flow rate of the heat transfer medium based on the flow rate information, thereby monitoring whether the flow channel is blocked. Attached Figure Description

[0062] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 A first perspective view of a thermal management mechanism provided in an embodiment of this application;

[0064] Figure 2 A schematic diagram of the flow channel in the thermal management mechanism provided in the embodiments of this application;

[0065] Figure 3 A second perspective view of the thermal management mechanism provided in the embodiments of this application;

[0066] Figure 4 for Figure 3 A simplified sectional view of section AA;

[0067] Figure 5 This is a fifth structural diagram of the physiotherapy patch provided in the embodiments of this application when it is a face mask;

[0068] Figure 6 for Figure 5 A simplified sectional view of section BB;

[0069] Figure 7 A third perspective view of the thermal management mechanism provided in the embodiments of this application;

[0070] Figure 8 A fourth perspective view of the thermal management mechanism provided in the embodiments of this application;

[0071] Figure 9 A cross-sectional view of the thermal management mechanism provided in an embodiment of this application;

[0072] Figure 10 A perspective view of the insulation layer in the thermal management mechanism provided in the embodiments of this application;

[0073] Figure 11 The data diagrams provided in this application embodiment are experimental verifications of the thermal management mechanism.

[0074] Figure 12 This is a first cross-sectional view of the physiotherapy patch provided in the embodiments of this application;

[0075] Figure 13 This is a second cross-sectional view of the physiotherapy patch provided in the embodiments of this application;

[0076] Figure 14 A third cross-sectional view of the physiotherapy patch provided in the embodiments of this application;

[0077] Figure 15 An exploded view of the physiotherapy patch provided in the embodiments of this application when it is a face mask;

[0078] Figure 16 This application provides a schematic diagram of the first structural design of a physiotherapy patch in the case of a face mask.

[0079] Figure 17 This is a schematic diagram of a second structure for a physiotherapy patch provided in the embodiments of this application, where the patch is a face mask.

[0080] Figure 18 This is a schematic diagram of a third structure for a physiotherapy patch provided in the embodiments of this application, where the patch is a face mask.

[0081] Figure 19 This is a schematic diagram of a fourth structure for a physiotherapy patch provided in the embodiments of this application, where the patch is a face mask.

[0082] Figure 20 This is a fourth cross-sectional view of the physiotherapy patch provided in the embodiments of this application;

[0083] Figure 21 A first perspective view of a thermal management system provided in an embodiment of this application;

[0084] Figure 22 This is a second perspective view of the thermal management system provided in an embodiment of this application.

[0085] Icons: 100, Thermal management mechanism; 110, Upper membrane; 111, Receiving part; 112, Connector; 113, Upper membrane perforation; 114, Upper membrane notch; 115, First strip-shaped connecting part; 116, Second strip-shaped connecting part; 120, Lower membrane; 121, Lower membrane perforation; 122, Lower membrane notch; 130, Medium outlet; 140, Medium inlet; 150, Adsorption layer; 160, Heat insulation layer; 170, First adhesive layer; 180, Second adhesive layer; 181, Through hole; 190, Protective layer; 600, Patch; 10, Therapeutic patch; 200, Electrode layer; 300, Mask body; 20, Thermal management system; 400, Thermal medium source; 410, Temperature sensor; 420, Insulated cup body; 430, Temperature control cup body; 440, Temperature control component; 450, Thermally conductive cup body. Detailed Implementation

[0086] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0087] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0088] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0089] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0090] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0091] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0092] Please refer to Figure 1 , Figure 1 This is a first perspective view of the thermal management mechanism 100 provided in this application embodiment. The thermal management mechanism 100 provided in this application embodiment can be used to cool and / or heat the patch 600 or the user's application site. The patch 600 may have an application surface for application to the application site and a back surface opposite to the application surface. The thermal management mechanism 100 may include an upper film 110 and a lower film 120. The upper film 110 and the lower film 120 are connected and form a receiving space for accommodating a heat-conducting medium. The side of the lower film 120 opposite to the upper film 110 can be attached to the back surface of the patch 600. In another application scenario, the side of the lower film 120 opposite to the upper film 110 can directly act on the user's application site.

[0093] The patch 600 can be an electrical stimulation therapy patch 600 used to treat dysmenorrhea, an electric field generating electrode patch 600 used to treat tumors, or a facial mask used for facial care, etc.

[0094] The upper membrane 110 and lower membrane 120 of the thermal management mechanism 100 can be made of a flexible material with good thermal conductivity. The resulting containment space can be used to contain a heat-conducting medium. The heat-conducting medium can be solid, liquid, or gaseous. During operation, the heat-conducting medium exchanges heat with the patch 600 and the skin surrounding the patch 600 through the lower membrane 120. Specifically, the heat-conducting medium can be preheated or cooled before the thermal management mechanism 100 is attached to the patch 600, thereby cooling or heating the patch 600 through heat exchange. Alternatively, after the thermal management mechanism 100 is attached to the patch 600, a heating mechanism such as a heat-conducting medium source 400 can continuously heat or cool the heat-conducting medium in the containment space.

[0095] In the above implementation process, on the basis of simplifying the structure of the thermal management mechanism 100 and improving the ease of use of the thermal management mechanism 100, heat exchange is also carried out between the heat-conducting medium in the containment space and the patch 600, thereby improving the efficiency of heating and / or cooling the patch 600.

[0096] Please combine Figure 1 Reference Figure 2 , Figure 2 This is a schematic diagram of the flow channel in the thermal management mechanism 100 provided in this application embodiment. In some optional embodiments, the connection between the upper membrane 110 and the lower membrane 120 may further form a medium outlet 130 and a medium inlet 140. The medium outlet 130 allows the heat-conducting medium to be discharged from the receiving space, and the medium inlet 140 allows the heat-conducting medium to enter the receiving space. The receiving space may include at least two receiving subspaces. The upper membrane 110 may have at least two receiving portions 111, and the receiving portions 111 may be connected to the lower membrane 120 to form a receiving subspace. And / or, the lower membrane 120 may have at least two receiving portions 111, and the receiving portions 111 may be connected to the upper membrane 110 to form a receiving subspace. At least two receiving subspaces may be connected in series to form a receiving space. The medium outlet 130 and the medium inlet 140 may be connected to the receiving subspaces located at the beginning and end of the receiving space, respectively.

[0097] The receiving portion 111 is a part of the upper film 110 that can together with the lower film 120 form a receiving space. It can be any shape, such as planar, concave / convex, or irregular. In some embodiments, please refer to... Figure 3 and Figure 4 , Figure 5 and Figure 6 ,in, Figure 3 This is a second perspective view of the thermal management mechanism provided in the embodiments of this application; Figure 4 yes Figure 3 A simplified sectional view of section AA; Figure 5This is a schematic diagram of the fifth structure of the physiotherapy patch provided in the embodiments of this application when it is a face mask; Figure 6 yes Figure 5 A simplified cross-sectional view of section BB shows the structure of the housing 111 of the thermal management mechanism. It can be seen that the housing 111 is a cavity structure formed by the upper film 110 in the direction away from the lower film 120. For example, a vacuum forming process can be used to form the upper film 110 into a concave shape. During vacuum forming, the side of the upper film 110 away from the lower film 120 should be as flat as possible. This structural design can pre-form a cavity (such as a rectangular cavity) to accommodate the heat-conducting medium, and at the same time, it can increase the volume of the accommodating space to a certain extent. The combination of 0 and 1 creates a relatively sealed space. Therefore, after the heat-conducting medium enters the thermal management mechanism 100, it will first flow into the space formed by the upper membrane 110. The space promptly contains and buffers the heat-conducting medium, thus greatly reducing the pressure on the lower membrane 120. This avoids the lower membrane 120 forming an arc-shaped convex surface, which would lead to poor adhesion and improves the adhesion between the thermal management mechanism 100 and the patch or the user's application area. Similarly, the lower membrane 120 can also adopt the above structural design, which will not be elaborated here.

[0098] The medium outlet 130 and medium inlet 140 can be connected to the heat transfer medium source 400 via pipelines. The heat transfer medium can circulate between the containment space and the heat transfer medium source 400 under the action of the pump. During the circulation of the heat transfer medium, the heat transfer medium source 400 can heat or cool the heat transfer medium flowing through it.

[0099] To ensure that all the heat transfer medium within the container participates in circulation during its flow, the container can be divided into multiple sub-spaces. These sub-spaces are connected in series to form a single circulation channel, guaranteeing that the heat transfer medium flows through all locations requiring cooling or heating. The circulation method of the circulation channel can be as follows: Figure 7 As shown by the arrow in the image.

[0100] In the above implementation process, by providing a medium outlet 130 and a medium inlet 140 on the thermal management mechanism 100 and connecting them to the heat transfer medium source 400, the heat transfer medium is continuously heated and / or cooled during the circulation process. This improves the continuity of heating and / or cooling of the patch 600 by the thermal management mechanism 100 and further enhances the efficiency of heating and / or cooling the patch 600. Furthermore, by dividing the accommodating space into multiple accommodating subspaces and connecting these subspaces in series, the proportion of heat transfer medium participating in the circulation within the entire accommodating space is increased. This ensures that the heat transfer medium can flow through and cover all locations requiring heating and / or cooling, thereby further improving the efficiency of heating and / or cooling the patch 600.

[0101] In some alternative implementations, the connected accommodating subspaces can be connected by at least two flow channels.

[0102] In other words, such as Figure 7 As shown, Figure 7 This is a second perspective view of the thermal management mechanism 100 provided in an embodiment of this application. The interconnected accommodating subspaces are connected by a flow channel. In this embodiment, the interconnected accommodating subspaces may have at least two flow channels, such as... Figure 8 as well as Figures 17 to 19 As shown, Figure 8 This is a fourth perspective view of the thermal management mechanism provided in the embodiments of this application; Figure 17 This is a schematic diagram of the second structure of the physiotherapy patch provided in the embodiments of this application when it is a face mask; Figure 18 This is a schematic diagram of the third structure of the physiotherapy patch provided in the embodiments of this application when it is a face mask; Figure 19 This is a schematic diagram of the fourth structure of the physiotherapy patch provided in the embodiments of this application when it is a face mask.

[0103] In the above implementation process, by increasing the number of flow channels between connected accommodating subspaces, the pressure of the flow channels is reduced compared to a single flow channel.

[0104] Please continue to refer to Figure 7 In some alternative embodiments, the receiving space may have an upper inner wall and a lower inner wall. The upper inner wall may be located on the side of the upper membrane 110 facing the lower membrane 120, and the lower inner wall may be located on the side of the lower membrane 120 facing the upper membrane 110. A middle portion of the upper inner wall may be connected to a middle portion of the lower inner wall.

[0105] The upper and lower inner walls are connected to form a receiving space, and the connection point is typically a ring around the receiving space. If this connection point is defined as the edge of the upper inner wall and the edge of the lower inner wall, then the middle part of the upper inner wall can refer to the middle portion of the upper inner wall surrounded by its edge. The middle section of the upper inner wall can refer to a local area on the middle portion of the upper inner wall that does not contact the edge of the upper inner wall. Similarly, the middle part of the lower inner wall can refer to the middle portion of the lower inner wall surrounded by its edge. The middle section of the lower inner wall can also refer to a local area on the middle portion of the lower inner wall that also does not contact the edge of the lower inner wall.

[0106] The connection between the middle section of the upper inner wall and the middle section of the lower inner wall can be achieved by directly joining them after heating or pressing, or by bonding them together with adhesive. A connector 112 can be formed at the joint between the two.

[0107] Of course, based on the foregoing embodiments of multiple accommodating subspaces, each accommodating subspace may adopt the structure described in the embodiments of this application.

[0108] In the above implementation process, the accommodating space may bulge after accommodating the heat-conducting medium. This bulging is detrimental to the adhesion between the thermal management mechanism 100 and the patch 600, reducing the contact area between the lower film 120 and the patch 600 and affecting heating and cooling efficiency. Therefore, by connecting the middle portion of the upper film 110 to the middle portion of the lower film 120, bulging of the middle portions of the upper film 110 and the lower film 120 after accommodating the heat-conducting medium can be avoided. This improves the adhesion of the thermal management mechanism 100, thereby improving heating and cooling efficiency.

[0109] Please continue to refer to Figure 8 In some alternative implementations, the connectors 112 may have a spacing between them, which may form a plurality of connecting channels between the subspaces.

[0110] Since the connector 112 is formed by connecting corresponding parts of the upper film 110 and the lower film 120, the connector 112 partially obstructs the flow of the heat-conducting medium. That is, when the heat-conducting medium flows near the connector 112, it needs to bypass the connector 112. However, since there is a gap between the connectors 112, the gap can be used for the heat-conducting medium to flow, thus forming a flow channel.

[0111] In the above implementation process, the spacing between the connecting bodies 112 allows the heat transfer medium to circulate, and the resulting multiple channels enable the heat transfer medium to circulate in the containment space over a larger range. In addition, the multiple channels also reduce the pressure on a single channel caused by the flow of the heat transfer medium.

[0112] Please continue to refer to Figure 8 , Figures 15 to 19 , Figure 15 This is an exploded view of the physiotherapy patch provided in the embodiments of this application when it is a face mask; Figure 16 This is a schematic diagram of the first structure of the physiotherapy patch provided in this application embodiment when it is a face mask. In some optional embodiments, the connector 112 includes dot-shaped connectors 112, which are evenly distributed between the upper membrane 110 and the lower membrane 120; and / or, the connector 112 includes strip-shaped connectors 112, which are arranged parallel to the bending axis of the thermal management mechanism 100.

[0113] For example, in a certain application scenario, thermal management unit 100 needs to follow the... Figure 8 , Figure 17 and Figure 18 If the straight line where the arrow is located at the inlet and outlet of the medium is bent, then the length direction of the connector 112 can be parallel to the straight line where the arrow is located, or the angle of inclination relative to the straight line where the arrow is located can be less than 20°.

[0114] In the above implementation process, the dot-shaped connectors 112 improve the fit of the thermal management mechanism 100 by preventing bulging of the middle portions of the upper film 110 and the lower film 120 after accommodating the heat-conducting medium. Furthermore, since the dot-shaped connectors 112 occupy a small space, the space loss due to the accommodating space is minimized. By arranging the strip-shaped connectors 112 parallel to the bending axis of the thermal management mechanism 100, it is easier for the thermal management mechanism to bend to conform to the curved surface of the application position, which also improves the fit of the thermal management mechanism 100.

[0115] In some alternative implementations, please refer to Figure 3 and Figure 4 , Figure 5 and Figure 6In some exemplary structures of the combined receiving portion 111, a connector 112 is further disposed in the structure, connecting the upper film 110 and the lower film 120 at the middle. The deformation of the upper film 110 is also restricted by the connector 112, thereby greatly reducing the deformation of both the upper film 110 and the lower film 120. The fit of the thermal management mechanism 100 is greatly improved, increasing its effective heat dissipation area and improving the heat dissipation effect. At this time, since the deformation of both the upper film 110 and the lower film 120 is controlled, either one (i.e., the upper film 110 or the lower film 120) can be selected to act on the electrode layer 200, and a good cooling and heat dissipation effect can be achieved.

[0116] Please continue to refer to Figure 8 as well as Figures 17 to 19 In some optional embodiments, the upper membrane 110 may be provided with at least one upper membrane perforation 113. The lower membrane 120 may be provided with lower membrane perforations 121 in the same number and shape as the upper membrane perforations 113. The edges of the upper membrane perforations 113 may be sealed to the edges of the corresponding lower membrane perforations 121.

[0117] In other words, the upper film through-hole 113 and the lower film through-hole 121 form a structure similar to a via on a PCB. Specifically, after the upper film 110 and lower film 120 are connected to form a receiving space, holes are drilled in the combined upper film 110 and lower film 120. After drilling, the edges of the upper film through-hole 113 and the lower film through-hole 121 are sealed together to ensure that the receiving space does not communicate with the outside through the drilled holes, preventing leakage of the heat-conducting medium. The connection method can be adhesive bonding, or hot-melt, hot-pressing, etc. Alternatively, the upper film through-hole 113 and lower film through-hole 121 can be drilled on each film before the upper film 110 and lower film 120 are combined.

[0118] It is worth mentioning that the number, shape, and size of the upper membrane perforations 113 and the lower membrane perforations 121 can be determined according to actual application requirements, such as... Figures 17 to 19 The holes can be elliptical, rhomboid, curved, or irregularly shaped. Generally, to ensure that the contact area between the thermal management mechanism 100 and the patch 600 is not affected, thus impacting the efficiency of heating or cooling the patch 600, the larger and more numerous the upper film perforations 113 and lower film perforations 121 are, the better the adhesion of the thermal management mechanism 100 to the patch 600 when it has a curved surface. The curved shape of the patch 600 may be due to the curved surface of the area to which it is applied, such as the face.

[0119] In the above implementation process, by creating perforations on the upper film 110 and the lower film 120 respectively, and sealing the perforations, the entire thermal management mechanism 100 has a structure similar to a via on a PCB board. These perforations are equivalent to a hollow structure. Compared to a patch without perforations, a patch with a hollow structure can further disperse the interaction forces within the patch when filled with thermally conductive medium, increasing the patch's flexibility and facilitating its fit with the application position during operation. This structure prevents the thermal management mechanism 100 from bulging after being filled with thermally conductive medium, thus avoiding a decrease in its fit with the patch 600. In other words, it improves the fit between the thermal management mechanism 100 and the patch 600, thereby increasing the efficiency of the thermal management mechanism 100 in heating and cooling the patch 600.

[0120] Please continue to refer to Figure 8 as well as Figures 16 to 19 In some optional embodiments, the edge of the upper membrane 110 may be provided with at least one upper membrane notch 114. Corresponding to the upper membrane notch 114, the lower membrane 120 may be provided with lower membrane notches 122 in the same number and shape as the upper membrane notches 114. The edges of the upper membrane notches 114 are sealed to the edges of the corresponding lower membrane notches 122.

[0121] The upper film notch 114 and the lower film notch 122 can be linear, semi-circular, or rectangular. Specifically, one possible implementation is to create the notch at the overall edge of the combined upper film 110 and lower film 120 after they are joined. Alternatively, the upper film notch 114 and lower film notch 122 can be created on the upper film 110 and lower film 120 respectively before they are joined, and then the upper film 110 and lower film 120 are sealed together. The purpose of sealing the edges of the notches is also to ensure that the accommodating space does not communicate with the outside through the gaps at the notches. The sealing connection can also be achieved through methods such as adhesive bonding, heat fusion, or hot pressing.

[0122] It is also worth mentioning that the shape, size, and number of the upper film notch 114 and the lower film notch 122 can be determined according to the illustrative application requirements.

[0123] In the above implementation process, without corresponding upper film notches 114 and lower film notches 122 at the edges of the upper film 110 and lower film 120 respectively, wrinkles usually appear at the edges of the thermal management mechanism 100 when dealing with patches 600 of different curved shapes. These wrinkles have a force that restores the original flatness, especially after the thermally conductive medium is filled, this force increases, thus hindering the adhesion between the thermal management mechanism and the patch. By providing corresponding upper film notches 114 and lower film notches 122 at the edges of the upper film 110 and lower film 120 respectively, it is equivalent to removing the wrinkled part, thus reducing the formation of wrinkles, thereby improving the adhesion between the thermal management mechanism 100 and the patch 600, and correspondingly improving the efficiency of the thermal management mechanism 100 in heating and cooling the patch 600.

[0124] Please refer to Figure 9 , Figure 9 This is a cross-sectional view of the thermal management mechanism 100 provided in an embodiment of this application. In some optional embodiments, the thermally conductive medium may include a thermally conductive liquid. The containment space may be filled with an adsorption layer 150.

[0125] The heat-conducting liquid can be water, oil, etc. The adsorption layer 150 filling the containment space can be a sponge or other material.

[0126] In the above implementation process, after the adsorption layer 150 is filled in the accommodating space, the adsorption layer 150 can adsorb the heat-conducting liquid. After adsorbing the heat-conducting liquid, the adsorption layer 150 can always lock in a part of the heat-conducting medium, thereby increasing the weight of the adsorption layer 150. Under the action of the gravity of the adsorption layer 150, the thermal management mechanism 100 can be better attached to the patch 600, which means that the contact area between the lower film 120 and the patch 600 is increased.

[0127] In some alternative embodiments, the upper membrane 110 may be more flexible than the lower membrane 120.

[0128] In order to make the upper film 110 more flexible than the lower film 120, the thickness of the upper film 110 can be less than the thickness of the lower film 120, or the flexibility of the material of the upper film 110 itself can be greater than the flexibility of the material of the lower film 120 itself.

[0129] In the above implementation process, by designing that the upper film 110 is more flexible than the lower film 120, the lower film 120 is deformed less than the upper film 110 under the extrusion pressure of the heat-conducting medium. Thus, the deformation of the upper film 110 absorbs most of the extrusion pressure, improving the adhesion between the lower film 120 and the patch 600.

[0130] In some alternative embodiments, the upper membrane 110 may be made of a first flexible material. The lower membrane 120 may be made of a second flexible material. The flexibility of the first flexible material may be greater than that of the second flexible material.

[0131] For example, the first flexible material is a PVC film, and the second flexible material is a TPU film, with the PVC film being more flexible than the TPU film. Based on this principle, the flexible material can also be PE, PET, PI, PPS, PP, PA, latex, rubber, etc., and can be arbitrarily combined according to the different hardness of the materials, with the first flexible material being more flexible than the second.

[0132] In the above process, by using materials with different flexibility as the materials of the upper film 110 and the lower film 120 respectively, the deformation degree of the upper film 110 is greater than that of the lower film 120 by selecting different flexible materials. In this way, the deformation of the upper film absorbs most of the extrusion pressure, thereby improving the fit of the thermal management mechanism 100.

[0133] In some alternative embodiments, the upper film 110 may be made of the same material as the lower film 120, and the thickness of the upper film 110 may be less than the thickness of the lower film 120.

[0134] For example, the thickness of the upper film 110 is 0.05mm-1.8mm, and the thickness of the lower film 120 is 0.1mm-2mm.

[0135] In the above process, when the upper film 110 and the lower film 120 are prepared using the same material, by processing the upper film 110 and the lower film 120 with different thicknesses, the flexibility of the upper film 110 is greater than that of the lower film 120. Thus, the deformation of the upper film 110 is used to absorb most of the extrusion pressure. This improves the fit of the thermal management mechanism 100, simplifies the types of raw materials, and reduces the difficulty of procuring raw materials.

[0136] Please combine Figure 9 Reference Figure 10 , Figure 10 This is a perspective view of the heat insulation layer 160 in the thermal management mechanism 100 provided in this application embodiment. In some optional embodiments, the thermal management mechanism 100 provided in this application may further include the heat insulation layer 160. The heat insulation layer 160 may be located on the side of the upper membrane 110 facing away from the lower membrane 120.

[0137] The isolation layer and the containing sub-space correspond one-to-one. The heat insulation layer 160 and the heat dissipation patch 600 only act on the area covered by the patch 600 to avoid affecting the natural heat dissipation of the skin around the patch 600.

[0138] The insulation layer 160 can be a novel foam-based thermal insulation material, such as EPS (polystyrene foam), XPS (extruded polystyrene insulation board), PUF (polyurethane foam), PET (polyethylene terephthalate), or aerogel insulation coating, or EVA (ethylene-vinyl acetate copolymer), insulating silicone, carbon fiber felt, etc., preferably melamine aerogel foam. Furthermore, in some embodiments, the insulation layer 160 can be made of porous vacuum silicone insulation cotton (ultra-thin aerogel insulation sheet), which, while providing good thermal insulation, is also lightweight and flexible. Its flexibility allows the material to be folded without damage, thus ensuring that the use of porous vacuum silicone insulation cotton does not affect the fit of the thermal management system and the good performance of the insulation layer 160.

[0139] In the above-described process, by providing a heat insulation layer 160 on the side of the upper membrane 110 facing away from the lower membrane 120, the efficiency of heat exchange between the heat-conducting medium and the air through the upper membrane 110 is reduced, which also serves to insulate the heat-conducting medium. This further improves the heating and cooling efficiency of the thermal management mechanism 100.

[0140] The thermal management mechanism 100 provided in the various embodiments of this application will be verified by experiments below.

[0141] Experimental Procedure: Prepare a PVC thermal management unit 100, an electrode layer 200 (patch 600), a melamine aerogel insulation layer 160, and non-woven fabric, and attach them to form a complete test sample according to the descriptions and accompanying drawings of the various embodiments of this application. Simultaneously prepare a cooling source, hoses, and a water pump control system, and assemble them together with the thermal management unit 100. The heat transfer medium used in the test is pure water, and the cooling is achieved using fully frozen medical ice packs. The two test samples, assembled according to the descriptions and accompanying drawings of the various embodiments of this application, are connected with the electrode layer 200 to a dedicated tumor treatment device. The thermal management unit 100 is connected to the cooling source and water pump control system via hoses. The test is conducted according to the following steps:

[0142] Experimental Subject 1: Testing of this heat dissipation solution

[0143] 1) Set the test environment to 25℃;

[0144] 2) Using this heat dissipation solution, the two completed test samples will be attached to the front and back of the abdominal cavity respectively using non-woven fabric;

[0145] 3) Apply a voltage of 200kHz and 160V to the electrode layer 200 of the test sample before and after the abdominal cavity using a dedicated tumor electric field therapy instrument, and wait for the host computer software of the tumor electric field therapy instrument to display that the temperature of the electrode layer 200 has risen to 50℃.

[0146] 4) Turn off the voltage switch of the tumor electric field therapy device and confirm that the load voltage of electrode layer 200 is 0V; at the same time, add pure water and medical ice packs to the cooling source, turn on the water pump control system switch to make the heat transfer medium circulate in the system; at the same time, the host computer software of the tumor electric field therapy device starts to collect temperature data of electrode layer 200 at a frequency of 1 time / s.

[0147] 5) Wait for the host computer software of the tumor electric field therapy instrument to display that the temperature of electrode layer 200 has dropped to 35°C, turn off the water pump control system, export the temperature acquisition data of the host computer of the tumor electric field therapy instrument, and turn off the tumor electric field therapy instrument.

[0148] Experimental Subject 2: Natural Cooling Test

[0149] 1) Set the test environment to 25℃;

[0150] 2) Apply the two electrode layers 200 directly to the front and back of the abdominal cavity without any heat dissipation measures;

[0151] 3) Apply a voltage of 200kHz and 160V to the electrode layer 200 of the test sample before and after the abdominal cavity using a dedicated tumor electric field therapy instrument, and wait for the host computer software of the tumor electric field therapy instrument to display that the temperature of the electrode layer 200 has risen to 50℃.

[0152] 4) Turn off the voltage switch of the tumor electric field therapy device and confirm that the load voltage of electrode layer 200 is 0V; at the same time, the host computer software of the tumor electric field therapy device starts to collect temperature data of electrode layer 200 at a frequency of 1 time / s.

[0153] 5) Wait for the host computer software of the tumor electric field therapy instrument to display that the temperature of electrode layer 200 has dropped to 35℃, export the temperature acquisition data of the host computer of the tumor electric field therapy instrument, and turn off the tumor electric field therapy instrument.

[0154] The experimental data obtained through testing are as follows: Figure 11 As shown, Figure 11 This is a data graph showing the experimental verification of the thermal management mechanism 100 provided in the embodiments of this application. Obviously, when the temperature of the electrode layer 200 is cooled from the initial 50°C to 35°C, the natural cooling time is 1365s, while the time for heat dissipation of the tumor treatment electric field generating electrode using the thermal management mechanism 100 provided in the embodiments of this application is 724s, which is about half the time, and the heat dissipation efficiency is significantly improved.

[0155] Please refer to Figure 12 , Figure 12This is a first cross-sectional view of the physiotherapy patch 10 provided in this application embodiment. Based on the same concept, this application embodiment provides a physiotherapy patch 10, which may include an electrode layer 200 and the thermal management mechanism 100 described above. The electrode layer 200 may have an active surface and a back surface. The active surface can be applied to the user's treatment area, and the back surface faces away from the active surface. The active surface of the electrode layer 200 can be attached to the user's treatment area and can be connected to a first electrode of a power source. The second electrode of the power source can be used on other parts of the user's body besides the treatment area. The side of the lower membrane 120 facing away from the upper membrane 110 can be attached to the back surface of the electrode layer 200.

[0156] Taking the physiotherapy patch 10 for treating head tumors as an example, the first electrode can be connected to one polarity of the power supply and applied to the user's scalp, and the second electrode can be connected to the other polarity of the power supply and applied to the position corresponding to the projected area of ​​the first electrode. This allows the first electrode and the second electrode to generate an electric field when connected to the power supply (alternating current), and the tumor in the user's head is treated by the action of the electric field.

[0157] Taking a facial mask for user care as an example, the mask is applied to the user's face, and the second electrode can be applied to other parts of the user's body. The electrode layer 200 in the mask can be electrically connected to the positive or negative terminal of a power source, and the second electrode can be electrically connected to the negative or positive terminal of a power source. With the first and second electrodes respectively connected to the power source, a conductive circuit is formed with the human body, thereby achieving iontophoresis and improving the effect of facial care. When iontophoresis is required, the heat management mechanism can heat or cool the application site according to the human body's tolerance. When the heat management mechanism heats up the skin at the application site, it increases blood circulation and opens the skin pores, which helps the iontophoresis medicine solution enter and improves the iontophoresis effect. When the heat management mechanism cools down the application site, it can soothe the skin at the application site during the iontophoresis process.

[0158] Taking the physiotherapy patch 10 for treating the user's abdomen or waist as an example, the patch has at least two independent electrode units that directly contact the skin at the application site and are electrically connected to the two poles of the power supply. The heating and / or cooling functions of the thermal management mechanism can promote blood circulation during treatment to enhance the physiotherapy effect of the physiotherapy patch 10, thereby further enhancing the relief of dysmenorrhea or muscle pain, or can soothe the skin at the application site through the cooling function of the thermal management mechanism.

[0159] The above implementation process can be the same as that described in the previous embodiment regarding the thermal management mechanism 100, and will not be repeated here.

[0160] Please continue to refer to Figure 12 In some optional embodiments, the thermal management mechanism 100 provided in this application may further include a first adhesive layer 170. The first adhesive layer 170 may be located on the side where the upper surface of the upper film 110 is located. The first adhesive layer 170 may have a first adhesive surface, which may face the upper film 110 and may be coated with a first reversible adhesive material. The middle portion of the first adhesive surface may be attached to the side of the upper film 110 facing away from the lower film 120, and the edge portion of the first adhesive surface may be used to attach to the electrode layer 200.

[0161] The first adhesive layer 170 can be a non-woven fabric. The first reversible adhesive material usually refers to a material that, after bonding two target objects together, can still be separated without damaging the two target objects. Examples include: thermal paste, thermal silicone, thermal grease, thermal potting compound, phase change thermal pad, liquid metal thermal paste, etc.

[0162] When the thermal management unit 100 includes a thermal insulation layer 160, the thermal insulation layer 160 can be disposed on the outermost layer, that is, the thermal insulation layer 160 is attached to the first adhesive layer 170.

[0163] In the above implementation process, the connection between the thermal management mechanism 100 and the electrode layer 200 is achieved through the first adhesive layer 170, improving the convenience of the connection between the thermal management mechanism 100 and the electrode layer 200. Furthermore, by using a first reversible adhesive material as the adhesive, the convenience of separating the thermal management mechanism 100 and the electrode layer 200 is also improved. This enables the thermal management mechanism 100 and the electrode layer 200 to be reused multiple times, thereby improving the ease of use of the physiotherapy patch 10.

[0164] Please refer to Figure 13 , Figure 13 This is a second cross-sectional view of the physiotherapy patch 10 provided in this application embodiment. In some optional embodiments, the patch 600 may further include a second adhesive layer 180. The second adhesive layer 180 may be located between the electrode layer 200 and the lower membrane 120. The second adhesive layer 180 may have a second adhesive surface, which may face the upper membrane 110 and be coated with a second reversible adhesive material. The electrode layer 200 may be attached to the middle portion of the second adhesive surface, and the edges of the second adhesive surface may be used for attachment to other parts of the user's body.

[0165] The second adhesive layer 180 can also be non-woven fabric, and the second reversible adhesive material can also be thermal paste, thermally conductive silicone, thermal paste, thermally conductive potting compound, phase change thermal sheet, liquid metal thermal paste, etc.

[0166] In the above-described process, the electrode layer 200 is connected to the user's skin through the second adhesive layer, improving the convenience of the connection between the electrode layer 200 and the user's skin. Furthermore, by using a second reversible adhesive material as the adhesive, the convenience of separating the electrode layer 200 from the user's skin is further improved. Ultimately, this further enhances the ease of use of the physiotherapy patch 10.

[0167] In some alternative implementations, the second reversible adhesive material may include a thermally conductive adhesive material.

[0168] In the above-mentioned process, by using a thermally conductive adhesive material as a second reversible adhesive material, the ease of use of the physiotherapy patch 10 is improved, while ensuring the thermal conduction efficiency between the lower membrane 120 of the thermal management mechanism 100 and the electrode layer 200. This ensures the efficiency of heating and cooling of the physiotherapy patch 10.

[0169] Please refer to Figure 14 , Figure 14 This is a third cross-sectional view of the physiotherapy patch 10 provided in this application embodiment. In some optional embodiments, the second adhesive layer 180 may be provided with a through hole 181. The portion of the lower membrane 120 corresponding to the through hole 181 may contact the electrode layer 200.

[0170] The number of through holes 181 can be one or more. When there is only one through hole 181, the through hole 181 can be a through hole 181 with a size that is close to but not equal to, or even exceeds, the size of the electrode layer 200.

[0171] In the above implementation process, by providing through holes 181 in the second adhesive layer 180, and having the portion of the lower membrane 120 corresponding to the through holes 181 in contact with the electrode layer 200, the heat conduction efficiency between the lower membrane 120 and the electrode layer 200 of the thermal management mechanism 100 is further ensured. This further ensures the heating and cooling efficiency of the physiotherapy patch 10.

[0172] Please continue to refer to Figure 14 In some optional embodiments, the through hole 181 may be filled with at least one of thermal grease, thermal silicone, thermal paste, thermal potting compound, phase change thermal pad, and liquid metal thermal paste.

[0173] In the above-mentioned implementation process, by filling the through hole 181 with the above-mentioned thermally conductive adhesive material, the heat exchange efficiency between the portion of the lower membrane 120 corresponding to the through hole 181 and the electrode layer 200 is further improved, thereby further improving the heating and cooling efficiency of the physiotherapy patch 10.

[0174] Please continue to refer to Figure 15In some optional embodiments, the patch 600 can be a face mask, and the area to be applied can include the face. The face mask can include a mask body 300. One side of the mask body 300 can be attached to the working surface of the electrode layer 200, and the other side of the mask body 300 can be applied to the user's face.

[0175] The mask body 300 may contain a mask liquid for applying to the user's face. Based on the iontophoresis principle described in the previous embodiments, it can improve the absorption rate of the mask liquid by the user's face.

[0176] In the above implementation process, by specifically applying the physiotherapy patch 10 provided in the various embodiments of this application to the face mask, the face can be treated with hot or cold compresses by means of the heating and cooling functions of the heat management mechanism 100 according to actual application needs, thereby improving the care efficacy of the face mask.

[0177] Please continue to refer to Figure 16 In some optional embodiments, the upper membrane 110 or the lower membrane 120 may have a first strip-shaped connecting portion 115 and a second strip-shaped connecting portion 116. The first strip-shaped connecting portion 115 may be located at the cheek position of the upper membrane 110 or the lower membrane 120, and both ends of the first strip-shaped connecting portion 115 may not be located at the edges of the upper membrane 110 or the lower membrane 120, that is, neither end of the connecting portion contacts the edge of the receiving space. Wherein, the cheek position can be the position on the upper membrane 110 or the lower membrane 120 corresponding to the cheek when the mask is applied to the face. The second strip-shaped connecting portion 116 may be located at the forehead position of the upper membrane 110 or the lower membrane 120. The length direction of the second strip-shaped connecting portion 116 may be consistent with the vertical direction. At least one end of the second strip-shaped connecting portion 116 may not be located at the edge of the upper membrane 110 or the lower membrane 120. Wherein, the forehead position can be the position on the upper membrane 110 or the lower membrane 120 corresponding to the forehead when the mask is applied to the face. The vertical direction can refer to the vertical direction of the face when the mask is applied to the face. The first strip-shaped connecting part 115 and the second strip-shaped connecting part 116 can be attached to corresponding positions on the lower film 120 and the upper film 110 respectively, or the corresponding positions of the upper film 110 and the lower film 120 can be attached together by means of cold pressing or hot pressing to form the strip-shaped connecting part.

[0178] The first strip-shaped connecting portion 115 can be straight or curved. When it is straight, the first strip-shaped connecting portion 115 can be inclined or parallel to the vertical direction. The two ends of the first strip-shaped connecting portion 115 are not located at the edges of the upper film 110 or the lower film 120, which generally means that the first strip-shaped connecting portion 115 is located in the middle portion of the upper film 110 or the lower film 120, excluding the edges.

[0179] At least one end of the second strip-shaped connecting portion 116 is not located at the edge of the upper membrane 110 or the lower membrane 120. This generally means that the second strip-shaped connecting portion 116 is located in the middle part of the upper membrane 110 or the lower membrane 120 excluding the edge, or one end of the second strip-shaped connecting portion 116 is located at the edge of the upper membrane 110 or the lower membrane 120 (the edge at the bridge of the nose or the edge at the forehead), and the rest is located in the middle part of the upper membrane 110 or the lower membrane 120 excluding the edge.

[0180] The thickness of the first strip-shaped connecting portion 115 can be determined by those skilled in the art based on the illustrative application requirements, and this application embodiment does not impose specific limitations on it.

[0181] The connection between the first strip-shaped connecting portion 115 and the corresponding position of the lower film 120 or the upper film 110 can be achieved by bonding with sealant or by direct connection through heat fusion or other methods. Similarly, the connection between the second strip-shaped connecting portion 116 and the corresponding position of the lower film 120 or the upper film 110 can be achieved by bonding with sealant or by direct connection through heat fusion or other methods.

[0182] In the above implementation process, by connecting the first strip-shaped connecting portion 115 to the upper film 110 and the lower film 120, the heat-conducting medium inside the mask needs to bypass the first strip-shaped connecting portion 115 during its flow, flowing through both ends of it. This achieves the function of flow diversion and pressure division, preventing the patch from bulging due to concentrated fluid pressure. Similarly, the heat-conducting medium also needs to bypass the second strip-shaped connecting portion 116, flowing through at least one end of it. This allows for a larger flow range of the heat-conducting medium within the receiving cavity, enabling as much heat-conducting medium as possible to participate in circulation within the receiving cavity. Ultimately, this ensures that the patch retains good flexibility even after being filled with heat-conducting medium, thus providing good fit and improving the efficiency of heating and cooling the mask body 300.

[0183] Please continue to refer to Figure 17 In some alternative embodiments, the two ends of the second strip-shaped connecting portion 116 may not be located at the edge of the upper film 110 or the lower film 120.

[0184] In other words, in this embodiment of the application, the second strip-shaped connecting portion 116 is located entirely in the middle part of the upper film 110 or the lower film 120, excluding the edge.

[0185] In the above implementation process, by determining the overall position of the second strip-shaped connecting portion 116 as the middle portion excluding the edge on the upper film 110 or lower film 120, the heat-conducting medium can bypass the second strip-shaped connecting portion 116 from both ends when flowing through it. This further increases the proportion of heat-conducting medium participating in circulation within the accommodating space. Furthermore, compared to only being able to bypass it from one end, the pressure in the flow channel corresponding to that one end is reduced. This improves the stability of the film.

[0186] Please refer to Figure 20 , Figure 20 This is a fourth cross-sectional view of the physiotherapy patch 10 provided in the embodiments of this application. In some optional embodiments, the thermal management mechanism 100 may further include a protective layer 190, which may be located on the back side of the electrode layer 200, and the thermal management mechanism 100 may be combined with the side of the protective layer 190 facing away from the electrode layer 200.

[0187] The protective layer 190 can be an insulating layer, specifically made of materials such as PI, PET, PVA, TPU, PEN, PPS, and PP, to form a flexible thin-film electrode layer 200 with the electrode layer 200, preventing breakage. The protective layer 190 also includes nylon fabric, with the insulating electrode layer 200 located between the nylon fabric and the mask body 300.

[0188] In the above implementation process, since the mask usually needs to be very thin so that it can fit better with the face after being soaked in the mask liquid, and the electrode layer 200 usually uses a thin film metal layer, which is prone to curling and affecting the fit between the mask and the face, the protective layer 190 and the mask body 300 play a role in ensuring the good flexibility and flatness of the electrode layer 200, thereby ensuring the effectiveness of the electrode layer 200 in acting on the mask.

[0189] Please combine Figure 17 Reference Figure 18 and Figure 19 In conjunction with the previous embodiments regarding the heat management mechanism 100, the multiple accommodating subspaces between the upper film 110 and the lower film 120, connected in series to form flow channels and distributed throughout the entire heat management mechanism 100 as much as possible, when applied to the face mask in this embodiment, can have the following structure: Figure 19 As shown. The upper membrane 110 and lower membrane 120 are respectively provided with upper membrane perforations 113 and lower membrane perforations 121 to improve the fit of the heat management mechanism 100. When applied to the face mask provided in the embodiments of this application, its structure can be as follows: Figure 17 , Figure 18 As shown. Among them, Figure 17 , Figure 18Different shapes of perforations are shown. The description of providing upper film notches 114 and lower film notches 122 at the edges of the upper film 110 and lower film 120 respectively to improve the fit of the thermal management mechanism 100, when applied to the face mask provided in the embodiments of this application, can have the following structure: Figure 17 , Figure 18 As shown.

[0190] Please refer to Figure 21 , Figure 21 This is a first perspective view of the thermal management system 20 provided in this application embodiment. Based on the same concept, this application embodiment provides a thermal management system 20, which may include a heat transfer medium source 400 and the thermal management mechanism 100 described above. The heat transfer medium source 400 may be connected to the medium outlet 130 and the medium inlet 140 of the receiving space, respectively, to deliver heat transfer medium to the receiving space through the medium inlet 140 and to receive heat transfer medium through the medium outlet 130. The heat transfer medium source 400 may be used to heat and / or cool the heat transfer medium.

[0191] The heat transfer medium source 400 can be connected to the containing space via a flexible hose. For example, a rubber foam hose, a thickened silicone / rubber hose, or a hose made of a new type of foamed plastic insulation material.

[0192] As a preferred embodiment, the connection between the hose and the heat transfer medium source 400 and the thermal management mechanism 100 can be achieved using the corresponding quick-release technology in the prior art.

[0193] The heating and / or cooling of the heat-conducting medium by the heat-conducting medium source 400 can be achieved based on existing technology known to those skilled in the art.

[0194] The above implementation process can be the same as that described in the previous embodiment regarding the thermal management mechanism 100, and will not be repeated here.

[0195] Please continue to refer to Figure 21 In some alternative embodiments, the heat transfer medium source 400 may be equipped with a temperature sensor 410. The temperature sensor 410 can be used to detect the temperature of the heat transfer medium in the heat transfer medium source 400.

[0196] Temperature sensor 410 can be disposed in the heat transfer medium source 400 and / or the housing space of thermal management unit 100. Temperature sensor 410 can communicate with an external control system to transmit the collected temperature information to the control system. The control system can also issue alarm information in the event of abnormal temperature.

[0197] In the above implementation process, by setting a temperature sensor 410 to monitor the temperature of the heat-conducting medium or the skin near the application site, the user can grasp the relevant temperature information in real time, which makes it convenient for the user to start the thermal management system 20 when cooling or heating is needed, or to take countermeasures immediately when the temperature is abnormal.

[0198] Please continue to refer to Figure 21 In some optional embodiments, the heat transfer medium source 400 may include an insulated cup body 420. The cup cavity of the insulated cup body 420 may be connected to the medium outlet 130 and the medium inlet 140, respectively.

[0199] In this embodiment, the heat-conducting medium may be preheated or cooled before being added to the cavity of the insulated cup body 420. Alternatively, a corresponding cooling and / or heating mechanism may be built into the insulated cup body 420 to heat and / or cool the heat-conducting medium.

[0200] In the above implementation process, by using the insulated cup body 420 as a container for the heat transfer medium source 400, the efficiency of heat exchange between the heat transfer medium in the heat transfer medium source 400 and the outside air is reduced. This achieves the effect of heat preservation, and ultimately further improves the heating and / or cooling efficiency of the thermal management system 20.

[0201] Please refer to Figure 22 , Figure 22 This is a second perspective view of the thermal management system 20 provided in this application embodiment. In some optional embodiments, the heat transfer medium source 400 may include a temperature-controlled cup 430, a temperature control component 440, and a heat transfer cup 450. The temperature-controlled cup 430 may have a placement space for placing the heat transfer cup 450. The cup cavity of the heat transfer cup 450 may be connected to the medium outlet 130 and the medium inlet 140, respectively. The heat transfer cup 450 may be located within the placement space of the temperature-controlled cup 430. The temperature control component 440 may be disposed on the temperature-controlled cup 430 and may be used to heat or cool the heat transfer cup 450.

[0202] The temperature control component 440 can be a heating component and / or a cooling component. The temperature control component 440 can be specifically disposed on the outer wall of the heat-conducting cup body 450.

[0203] In the above implementation process, by using the heat-conducting cup 450 as a container for the heat-conducting medium source 400 to hold the heat-conducting medium, and placing it and the temperature control component 440 respectively in the placement space of the temperature control body, the heat-conducting cup 450 can be placed in any cooling or heating device, thereby enabling the thermal management system 20 to adapt to more application scenarios.

[0204] In some alternative embodiments, the heat transfer medium source 400 can be connected to the medium outlet 130 and the medium inlet 140 via pipes. A flow sensor or pressure sensor (not shown in the figure) may be installed on the heat transfer medium source 400 and / or the pipes.

[0205] The thermal management system 20 may include a pump body, which may be integrated into the heat transfer medium source 400 or mounted on a pipeline. A flow sensor can also communicate with an external control system to transmit flow information. Based on the received flow information, the control system can control the flow rate of the heat transfer medium circulating in the thermal management system 20 by controlling the pump body to monitor for blockages in the flow channels. Alternatively, a pressure sensor can be used to monitor the flow pressure of the heat transfer medium to determine if the flow channels are blocked.

[0206] In the above implementation process, by configuring a flow sensor for the thermal management system 20, the user can monitor the flow rate information of the heat transfer medium in real time, which facilitates the user to control the flow rate of the heat transfer medium based on the flow rate information.

[0207] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A thermal management mechanism, characterized in that, Used for cooling and / or heating the patch or the area to which it is to be applied; wherein the patch has an application surface for applying to the area to which it is to be applied and a back surface facing away from the application surface; The mechanism includes an upper membrane and a lower membrane; The upper membrane is connected to the lower membrane and forms a receiving space for accommodating the heat-conducting medium; The side of the lower film facing away from the upper film is used to adhere to the back of the patch; or, the side of the lower film facing away from the upper film directly applies to the user's application site.

2. The thermal management mechanism according to claim 1, characterized in that, The connection between the upper membrane and the lower membrane also forms a medium outlet and a medium inlet; The medium outlet allows the heat-conducting medium to be discharged from the containment space, and the medium inlet allows the heat-conducting medium to enter the containment space; The accommodating space includes at least two accommodating sub-spaces; The upper membrane has at least two receiving portions, which are connected to the lower membrane to form the receiving subspace; And / or, the lower membrane has at least two receiving portions, which are connected to the upper membrane to form the receiving subspace; At least two of the aforementioned accommodating subspaces are connected in series to form the accommodating space; The medium outlet and medium inlet are respectively connected to the receiving sub-spaces located at the beginning and end of the receiving space.

3. The thermal management mechanism according to claim 2, characterized in that, The connected accommodating subspaces are connected by at least two flow channels.

4. The thermal management mechanism according to claim 2, characterized in that, The accommodating space has an upper inner wall and a lower inner wall; The upper inner wall is located on the side of the upper membrane facing the lower membrane, and the lower inner wall is located on the side of the lower membrane facing the upper membrane; The middle portion of the upper inner wall is connected to the middle portion of the lower inner wall to form a connecting body.

5. The thermal management mechanism according to claim 4, characterized in that, The connectors are spaced apart, and the spaced apart forms a plurality of connecting channels between the accommodating subspaces.

6. The thermal management mechanism according to claim 5, characterized in that, The connector includes dot-shaped connectors, which are uniformly distributed between the upper membrane and the lower membrane; And / or, the connector includes a strip connector arranged parallel to the bending axis of the thermal management mechanism.

7. The thermal management mechanism according to claim 1, characterized in that, The upper membrane is provided with at least one upper membrane perforation; The lower membrane is provided with perforations of the same number and shape as the perforations of the upper membrane at positions corresponding to the perforations of the upper membrane; The edge of the upper membrane perforation is sealed to the edge of the corresponding lower membrane perforation.

8. The thermal management mechanism according to claim 1, characterized in that, in, The heat-conducting medium includes a heat-conducting liquid; The containment space is filled with an adsorption layer.

9. The thermal management mechanism according to claim 1, characterized in that, in, The upper membrane is more flexible than the lower membrane.

10. The thermal management mechanism according to claim 9, characterized in that, The upper membrane is made of a first flexible material; The lower membrane is made of a second flexible material; The flexibility of the first flexible material is greater than that of the second flexible material.

11. The thermal management mechanism according to claim 9, characterized in that, in, The upper film and the lower film are made of the same material, and the thickness of the upper film is less than the thickness of the lower film.

12. The thermal management mechanism according to any one of claims 1 to 11, characterized in that, The mechanism also includes a heat insulation layer; The heat insulation layer is located on the side of the upper membrane facing away from the lower membrane.

13. A physiotherapy patch, characterized in that, Includes an electrode layer and a thermal management mechanism as described in any one of claims 1 to 12; The electrode layer has an active surface and a back surface; wherein, the active surface is used to be applied to the user's application site, and the back surface faces away from the active surface; The functional surface of the electrode layer is used to adhere to the user's application site and to connect to the first electrode of the power supply; wherein, the second electrode of the power supply acts on other parts of the user's body besides the application site. The side of the lower membrane facing away from the upper membrane is attached to the back side of the electrode layer.

14. The physiotherapy patch according to claim 13, characterized in that, The thermal management mechanism also includes a first adhesive layer; The first adhesive layer is located on the side where the upper surface of the upper film is located; The first adhesive layer has a first adhesive surface facing the upper film and is coated with a first reversible adhesive material; The middle portion of the first adhesive surface is attached to the side of the upper film facing away from the lower film, and the edge portion of the first adhesive surface is used to attach to the electrode layer.

15. The physiotherapy patch according to claim 13, characterized in that, The patch further includes a second adhesive layer; The second adhesive layer is located between the electrode layer and the lower film; The second adhesive layer has a second adhesive surface facing the upper film and coated with a second reversible adhesive material; The electrode layer is attached to the center of the second adhesive surface, and the edge of the second adhesive surface is used to attach to other parts of the user's body.

16. The physiotherapy patch according to claim 15, characterized in that, in, The second reversible adhesive material includes a thermally conductive adhesive material.

17. The physiotherapy patch according to claim 15, characterized in that, The second adhesive layer is provided with through holes; The portion of the lower membrane corresponding to the through-hole contacts the electrode layer.

18. The physiotherapy patch according to claim 17, characterized in that, The through-hole is filled with at least one of the following: thermal grease, thermal silicone, thermal paste, thermal potting compound, phase change thermal pad, and liquid metal thermal paste.

19. The physiotherapy patch according to claim 13, characterized in that, in, The patch is a face mask, and the area to be applied includes the face; The face mask includes a face mask body; One side of the mask body is attached to the working surface of the electrode layer, and the other side of the mask body is used to apply to the user's face.

20. The physiotherapy patch according to claim 19, characterized in that, The mask also includes a protective layer located on the back of the electrode layer, and the thermal management mechanism is attached to the side of the protective layer opposite to the electrode layer.

21. A thermal management system, characterized in that, Includes a heat transfer medium source and a thermal management mechanism as described in any one of claims 1 to 12; The heat-conducting medium source is connected to both the medium outlet and the medium inlet of the containing space, so as to deliver the heat-conducting medium to the containing space through the medium inlet and to receive the heat-conducting medium through the medium outlet; The heat transfer medium source is used to heat and / or cool the heat transfer medium.

22. The thermal management system according to claim 21, characterized in that, The heat-conducting medium source is equipped with a temperature sensor; The temperature sensor is used to detect the temperature of the heat-conducting medium in the heat-conducting medium source.

23. The thermal management system according to claim 21, characterized in that, The heat-conducting medium source includes the thermos cup body; The cavity of the insulated cup is connected to both the medium outlet and the medium inlet.

24. The thermal management system according to claim 21, characterized in that, The heat-conducting medium source includes a temperature-controlled cup, a temperature-controlled component, and a heat-conducting cup. The temperature-controlled cup body has a placement space for placing the heat-conducting cup body; The cavity of the heat-conducting cup is connected to the medium outlet and the medium inlet, respectively. The heat-conducting cup body is located within the placement space of the temperature-controlled cup body; The temperature control component is disposed on the temperature control cup body and is used to heat and / or cool the heat-conducting cup body.

25. The thermal management system according to any one of claims 21 to 24, characterized in that, The heat-conducting medium source is connected to the medium outlet and the medium inlet via pipes; A flow sensor or pressure sensor is installed on the heat transfer medium source and / or the pipeline.

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