Heating device and dispensing apparatus
By designing an independently operable heating module and an air channel network heating device, the problem of low efficiency in heating dispensing equipment at different locations was solved, enabling flexible heating of different electronic substrates and improving work efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ILLINOIS TOOL WORKS INC
- Filing Date
- 2025-05-29
- Publication Date
- 2026-06-16
AI Technical Summary
In the existing technology, when dispensing equipment heats different positions on different electronic substrates, different heating plates need to be replaced, resulting in low efficiency and lack of flexibility.
A heating device is designed, which includes an air channel network and multiple independently operable heating modules. Each heating module can move between a first position and a second position to achieve flexible heating of different positions.
It improves the heating efficiency and flexibility of dispensing equipment, enabling it to adapt to the heating requirements of different electronic substrates, reducing the time required to change heating plates, and improving work efficiency.
Smart Images
Figure CN224358785U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of circuit board processing technology, and more particularly to heating devices and dispensing equipment having the heating device. Background Technology
[0002] During circuit board manufacturing, electronic components such as integrated circuit chips need to be assembled into desired locations on an electronic substrate. During this assembly process, dispensing equipment is used to apply dots of liquid epoxy resin or solder paste to these desired locations on the electronic substrate. The dispensing equipment is typically equipped with a heating plate, which is used to heat the desired locations on the electronic substrate during the dispensing process, allowing the adhesive material to better encapsulate and protect the electronic components located at the desired locations and / or fill those locations. Utility Model Content
[0003] The purpose of this disclosure is to address at least one aspect of the problems and / or defects present in the prior art.
[0004] According to one aspect of this disclosure, a heating device is provided, comprising an air passage network and a plurality of heating modules. The air passage network is configured to introduce and heat air. Each of the plurality of heating modules is independently operable relative to the others, wherein each heating module is configured to selectively guide heated air from the air passage network to that heating module.
[0005] According to an exemplary embodiment of the present disclosure, each heating module is configured to move independently of the other heating modules between a first position and a second position, in which heated air is guided from the air channel network to the heating module, and in the second position, heated air is not guided from the air channel network to the heating module.
[0006] According to an exemplary embodiment of the present disclosure, each heating module includes a heating body having a heating surface, the heating body having an interior cavity, and the heating surface having an aperture in fluid communication with the cavity; wherein, when the heating module is in the first position, heated air enters the interior cavity of the heating body from the air channel network and exits the heating surface through the aperture.
[0007] According to an exemplary embodiment of the present disclosure, each heating module further includes: a shaft member connected to the heating body; wherein the shaft member has a flow channel and a flow hole in fluid communication with the flow channel, the flow channel being in fluid communication with the cavity of the heating body; wherein when the heating module is in the first position, the flow hole is in fluid communication with the air channel network, and when the heating module is in the second position, the flow hole is not in fluid communication with the air channel network.
[0008] According to an exemplary embodiment of this disclosure, the shaft member is integral with the heating body.
[0009] According to an exemplary embodiment of the present disclosure, each heating module further includes a drive mechanism acting on the shaft member and configured to move the heating module between the first position and the second position by driving the shaft member.
[0010] According to an exemplary embodiment of the present disclosure, the air channel network includes an air containment chamber in which heated air is contained; wherein, when the heating module is in the first position, the guide hole of the shaft member is in fluid communication with the air containment chamber, and when the heating module is in the second position, the guide hole of the shaft member is not in fluid communication with the air containment chamber.
[0011] According to an exemplary embodiment of the present disclosure, the air channel network further includes an air inlet, an air heating path, and an air outlet, wherein the air inlet is in communication with the outside to introduce air, the air outlet is in fluid communication with the air containment chamber, and the air heating path is in fluid communication with the air inlet and the air outlet and is configured to heat the air flowing through the air heating path.
[0012] According to an exemplary embodiment of the present disclosure, the heating device further includes an air heating path plate and a heating module mounting plate; wherein the air inlet, the air heating path, and the air outlet are disposed in the air heating path plate; wherein the air heating path plate and the heating module mounting plate together define the air receiving chamber.
[0013] According to an exemplary embodiment of this disclosure, the air heating path plate has a plurality of first mounting holes corresponding to the number of the plurality of heating modules, and the heating module mounting plate has a plurality of second mounting holes corresponding to the number of the plurality of heating modules; the shaft member in each heating module is configured to: pass through the corresponding first mounting hole and the corresponding second mounting hole in an airtight manner, and be movable relative to the air heating path plate and the heating module mounting plate.
[0014] According to an exemplary embodiment of this disclosure, the heating device further includes: a frame and a drive mechanism mounting plate; wherein the drive mechanism is mounted on the drive mechanism mounting plate; wherein the air heating path plate, the heating module mounting plate, and the drive mechanism mounting plate are fixedly disposed to the frame.
[0015] According to an exemplary embodiment of the present disclosure, a plurality of heating modules are arranged in an array, and the plurality of heating modules have the same construction.
[0016] According to an exemplary embodiment of the present disclosure, the first position of each heating module is an upward position relative to the air channel network, and the second position of each heating module is a downward position relative to the air channel network.
[0017] According to one aspect of this disclosure, a dispensing apparatus is provided, comprising: a fixed track, a movable track, and a heating device as described in any of the foregoing aspects / exemplary embodiments; the fixed track and the movable track are arranged side by side and configured to transport an electronic substrate into / out of an operating station, wherein the movable track is movable toward or away from the fixed track to adjust the distance between the fixed track and the movable track; the operating station is located above the heating device.
[0018] According to an exemplary embodiment of this disclosure, the movable track is also configured to move over the heating device.
[0019] According to an exemplary embodiment of this disclosure, the first position of each heating module in the heating device is closer to the operating station than the second position.
[0020] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.
[0021] In this disclosure, "multiple" includes two, three, four, and more. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural schematic diagram showing a dispensing device according to an exemplary embodiment of the present disclosure.
[0023] Figure 2 This is a three-dimensional structural schematic diagram showing another dispensing device according to an exemplary embodiment of the present disclosure.
[0024] Figure 3 This is a three-dimensional structural schematic diagram showing a heating device according to an exemplary embodiment of the present disclosure.
[0025] Figure 4This is a side view schematic diagram showing the heating device according to an exemplary embodiment of the present disclosure.
[0026] Figure 5 yes Figure 4 The diagram shows a cross-sectional view of the heating device.
[0027] Figure 6 This is an enlarged structural schematic diagram showing a single heating module in a heating apparatus according to an exemplary embodiment of the present disclosure.
[0028] Figure 7 yes Figure 6 The diagram shows a cross-sectional view of a single heating module.
[0029] Figure 8 This is a three-dimensional structural schematic diagram showing a heating module mounting plate in a heating device according to an exemplary embodiment of the present disclosure.
[0030] Figure 9 This is a three-dimensional structural schematic diagram showing another heating module mounting plate in a heating device according to an exemplary embodiment of the present disclosure.
[0031] Figure 10 This is a three-dimensional structural schematic diagram showing the air heating path plate in a heating device according to an exemplary embodiment of the present disclosure.
[0032] Figure 11 This is a schematic cross-sectional view of a heating device according to an exemplary embodiment of the present disclosure. Detailed Implementation
[0033] The technical solutions of this disclosure will be further described in detail below through exemplary embodiments and in conjunction with the accompanying drawings. It should be understood that although terms indicating direction, such as "front," "rear," "upper," "lower," "left," and "right," are used in this disclosure to describe various example structural parts and elements, their use is merely for ease of explanation and is based on the example orientations shown in the accompanying drawings. Since the exemplary embodiments described in this disclosure can be arranged in different orientations, these terms indicating direction are for illustrative purposes only and should not be considered as limiting. Where possible, the same or similar reference numerals used in this disclosure refer to the same or similar components.
[0034] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a full understanding of the exemplary embodiments of this disclosure. However, it will be apparent that one or more exemplary embodiments may be practiced without these specific details. In other instances, well-known structures and apparatuses are illustrated to simplify the figures.
[0035] Embodiments of this disclosure relate to a heating device and a dispensing apparatus having the heating device.
[0036] During the manufacturing of printed circuit boards (PCBs), the heating plate in the dispensing equipment needs to heat one or more desired locations on the electronic substrate so that the dispensing unit can effectively distribute viscous materials such as liquid epoxy resin or solder paste to these desired locations on the electronic substrate. For various electronic substrates with different electronic component layouts and / or different sizes, the desired locations requiring heat treatment are typically different, thus necessitating the design and use of dedicated heating plates for each type of electronic substrate. Furthermore, for the manufacturing of different electronic substrates, the dispensing equipment needs to replace different heating plates to match the desired locations on that electronic substrate. In addition, different electronic substrates, or even the same electronic substrate, may require heat treatment at different times for different desired locations on that electronic substrate.
[0037] To address this issue, the inventors developed a heating device that can flexibly adjust the heating area to adapt to the heating requirements of various electronic substrates with different desired positions, thus making the heating device flexible and versatile. Furthermore, this heating device can also be applied to existing dispensing equipment, improving the efficiency of the dispensing equipment.
[0038] For illustrative purposes, the technical content of this disclosure will now be described with reference to a heating apparatus and a dispensing device according to exemplary embodiments of this disclosure.
[0039] Figure 1 and Figure 2 These are three-dimensional structural schematic diagrams of a dispensing apparatus according to exemplary embodiments of the present disclosure, wherein... Figure 2 An electronic substrate G to be processed is shown laid on an operating station above a heating device 10 of a dispensing apparatus 1. The dispensing apparatus 1 is used to dispense an adhesive material onto a desired location P on the electronic substrate G. In some examples, the adhesive material may be an adhesive, encapsulant, epoxy resin, solder paste, etc. In some examples, the electronic substrate G is a printed circuit board (“PCB”) substrate or a semiconductor wafer. It should be understood that the specific types of electronic substrates and / or adhesive materials used herein are exemplary and intended to be non-limiting. Exemplary embodiments of this disclosure relate primarily to the application of the dispensing apparatus 1 in the manufacture of printed circuit board substrates. It should also be understood that the dispensing apparatus 1 may alternatively be used in other applications, such as for applying automotive liner materials, or in certain medical applications, or for applying conductive inks.
[0040] See Figure 1 and Figure 2The dispensing apparatus 1 provided in the exemplary embodiments of this disclosure includes at least a frame 11 and a heating device 10 disposed on the frame 11. The dispensing apparatus 1 also includes a pair of tracks 12a and 12b arranged side-by-side, at least one of which is movable toward or away from the other to adjust the distance between the tracks. In the exemplary embodiments of this disclosure, 12b is a movable track, and 12a is a fixed track. The electronic substrate G to be processed is conveyed via the pair of tracks 12a and 12b to an operating station located above the heating device 10 to perform related operations (including but not limited to: heating the desired position P of the electronic substrate G and dispensing operations, etc.), and after the related operations on the electronic substrate G are completed, the electronic substrate G is then conveyed along the pair of tracks 12a and 12b to the next station. Figure 1 and Figure 2 In the exemplary embodiment shown, track 12b is configured to move toward or away from track 12a, and track 12b is also configured to move over the heating device 10. Thus, for electronic substrates of different sizes, the distance between the pair of tracks 12a and 12b is adjusted by moving the movable track 12b to match the width of the electronic substrates of different sizes. Furthermore, in some embodiments, the pair of tracks 12a and 12b may also be configured to adjust the height difference between the pair of tracks 12a and 12b and the heating device 10, thereby adjusting the distance between the electronic substrate G located on the pair of tracks 12a and 12b and the heating device 10 to optimize the heating effect.
[0041] It should be noted that, in addition to the components and / or structures described and illustrated above, the dispensing equipment provided in this disclosure should also include other components and / or structures necessary to achieve its functions and / or effects. For example, a dispensing unit for dispensing viscous materials, a power unit for providing power to the moving parts of the dispensing equipment, a control unit for controlling the operation of the dispensing equipment, and so on. For the sake of brevity, these components and / or structures are not described or illustrated herein.
[0042] The heating device disclosed herein includes an air channel network and multiple heating modules. The air channel network is configured to introduce and heat air. Each of the multiple heating modules is configured to selectively guide heated air from the air channel network to that heating module. According to the design concept of this disclosure, each of the multiple heating modules is independently operable relative to the others; that is, each heating module can perform a heating operation independently relative to the others. Thus, for various electronic substrates with different electronic component layouts and / or different sizes, the heating device provided herein can select one or more heating modules corresponding to the desired location on the electronic substrate where the heating operation needs to be performed to perform the heating operation.
[0043] The heating apparatus according to an exemplary embodiment of the present disclosure will now be described in detail with reference to the accompanying drawings.
[0044] Figure 3 This is a three-dimensional structural schematic diagram showing a heating device according to an exemplary embodiment of the present disclosure. Figure 4 This is a side view schematic diagram of the heating device. Figure 5 It is a display Figure 4 A schematic cross-sectional view of the heating device is shown. (See also...) Figures 3 to 5 The heating device 10 includes a frame 101, a plurality of heating modules 100 disposed on the frame 101, and an air channel network. The frame 101 can be used to mount the heating device 10 to the rack 11 of the aforementioned dispensing equipment 1. According to this disclosure, in the heating device 10, the air channel network is configured to introduce and heat air from outside the heating device 10 and to store the heated air. Each of the plurality of heating modules 100 is independently operable relative to the remaining heating modules, and each heating module 100 is configured to selectively guide heated air from the air channel network to that heating module 100.
[0045] According to this disclosure, multiple heating modules are arranged in an array. For example, in... Figure 3 In the exemplary embodiment shown, multiple heating modules 100 are arranged in a regular row-column matrix. Furthermore, according to this disclosure, the multiple heating modules 100 can adopt the same structure, or they can be designed with different structures according to the specific requirements of the heating operation. Figure 3 In the exemplary embodiment shown, multiple heating modules 100 employ the same construction, which simplifies the manufacturing and maintenance of the heating modules.
[0046] According to this disclosure, each heating module is configured to move independently of the other heating modules between a first position and a second position, in which heated air is guided from the air channel network to the heating module, and in the second position, heated air is not guided from the air channel network to the heating module. See specifically... Figures 3 to 5 In the exemplary embodiment shown, in the heating device 10, a plurality of heating modules 100 are movably mounted to a heating module mounting plate 102, which is fixedly disposed to a frame 101. Each heating module 100 is capable of being in a first position relative to the heating module mounting plate 102 independently of the other heating modules. Figures 3 to 5 The rising position relative to the heating module mounting plate 102) and the second position ( Figures 3 to 5 It moves between the lowered position relative to the heating module mounting plate 102. Figure 3For example, the heating module 100 in the lower right corner is in a raised position (i.e., in the first position) relative to the heating module mounting plate 102, while the other heating modules 100 are in a lowered position (i.e., in the second position) relative to the heating module mounting plate 102. At this time, heated air is guided from the air channel network to the heating module 100 in the raised position, but not to the other heating modules 100 in the lowered position. According to this disclosure, when the heating device 10 performs a heating operation on the electronic substrate conveyed above it, in Figure 3 In the illustrated state, the heating device 10 provides heated air only to the desired position of the heating module 100 corresponding to the lower right corner of the electronic substrate. That is, heating is performed only on the desired position of the heating module 100 corresponding to the lower right corner of the electronic substrate. Thus, for various electronic substrates with different desired positions, the heating device 10 provided in this disclosure flexibly performs heating operations on different desired positions of various electronic substrates by moving one or more heating modules corresponding to the desired position of the electronic substrate from a second position to a first position. Furthermore, the heating device 10 provided in this disclosure can also perform heating operations on different desired positions on the same electronic substrate at different time periods by moving different heating modules at different time periods. Therefore, the heating device 10 provided in this disclosure has flexibility and versatility for various electronic substrates with different desired positions, thereby saving time spent changing heating plates in dispensing equipment and improving heating efficiency.
[0047] Figure 6 This is an enlarged structural schematic diagram showing a single heating module in a heating apparatus according to an exemplary embodiment of the present disclosure. Figure 7 yes Figure 6 A schematic cross-sectional view of a single heating module is shown. See also, according to this disclosure. Figures 5 to 7 Each heating module 100 includes a heating body 110, a shaft member 120, and a drive mechanism 130. The heating body 110 performs the heating operation of the heating module 100, the drive mechanism 130 provides driving force for movement of the heating module 100 between a first position and a second position, and the shaft member 120 transmits the driving force from the drive mechanism 130 to the heating body 110. According to the design concept of this disclosure, the shaft member 120 also enables selective fluid communication between the heating body 110 and the air channel network.
[0048] Specifically, in such Figures 5 to 7In the illustrated exemplary embodiment, the heating body 110 has a heating surface 111, and the interior of the heating body 110 is provided with a cavity 112. The heating surface 111 has holes (not labeled) that are in fluid communication with the cavity 112. According to this disclosure, when the heating module 100 is in a first position, heated air enters the cavity 112 of the heating body 110 from the air channel network and exits the heating surface 111 through the holes, thereby performing the heating operation of the heating module 100; while when the heating module 100 is in a second position, heated air cannot enter the cavity 112 of the heating body 110 from the air channel network, and therefore the heating operation of the heating module 100 is not performed. Furthermore, the heating surface 111 of the heating body 110 is designed with a suitable shape for performing heating operations at a desired position. For example, in the illustrated exemplary embodiment, the heating surface 111 has a rectangular or square shape. In other embodiments, the heating surface 111 may also be designed as a circle, ellipse, or other polygonal shape, depending on actual needs. In addition, the heating surface 111 is designed to be the appropriate size for performing heating operations on the desired location.
[0049] Specifically, in such Figures 5 to 7 In the illustrated exemplary embodiment, the shaft member 120 is connected to the heating body 110. The shaft member 120 has a flow channel 121 and a flow hole 122 in fluid communication with the flow channel 121. The flow channel 121 is in fluid communication with the cavity 112 of the heating body 110. According to this disclosure, when the heating module 100 is in the first position, the flow hole 122 is in fluid communication with the air channel network. At this time, heated air is guided from the air channel network through the flow hole 122 and the flow channel 121 of the shaft member 120 to the heating body 110. However, when the heating module 100 is in the second position, the flow hole 122 is not in fluid communication with the air channel network. At this time, heated air cannot enter the flow hole 122 of the shaft member 120 from the air channel network and therefore cannot be guided to the heating body 110. In the illustrated exemplary embodiment, the shaft member 120 and the heating body 110 are integrally formed components. This integrated design simplifies the structure of the heating module and improves the stability and reliability of the heating module. However, in other embodiments, the shaft member 120 and the heating body 110 may also be independent components that are assembled together.
[0050] Specifically, in such Figures 5 to 7In the illustrated exemplary embodiment, the drive mechanism 130 is disposed on the drive mechanism mounting plate 103, which is fixedly disposed to the frame 101. According to this disclosure, the drive mechanism 130 acts on the shaft member 120 and moves the heating module 100 between the first position and the second position by driving the shaft member 120. In the illustrated exemplary embodiment, the drive mechanism 130 is cylinder-driven. Those skilled in the art will understand that the drive mechanism 130 can also be hydraulically driven, electrically driven, or mechanically driven.
[0051] Figure 8 This is a three-dimensional structural schematic diagram showing a heating module mounting plate in a heating device according to an exemplary embodiment of the present disclosure. Figure 9 This is another perspective structural schematic diagram showing the heating module mounting plate in a heating device according to an exemplary embodiment of the present disclosure. Figure 10 This is a three-dimensional structural schematic diagram showing the air heating path plate in a heating device according to an exemplary embodiment of the present disclosure. Figure 11 This is a schematic cross-sectional view of a heating device according to an exemplary embodiment of the present disclosure. Figure 11 The image shows the air heating path in the air heating path plate.
[0052] According to this disclosure, see Figure 5 and Figures 8 to 11 The air channel network includes an air inlet 210, an air heating path 220, an air outlet 230, and an air containment chamber 240. The air inlet 210 is used to communicate with the outside of the heating device 10 to introduce air. The air heating path 220 is in fluid communication with the air inlet 210 and the air outlet 230 and is used to heat the air flowing through it. The air outlet 230 is in fluid communication with the air containment chamber 240 and is used to guide the heated air to the air containment chamber 240. The air containment chamber 240 is used to contain and store the heated air.
[0053] Specifically, in such Figure 5 and Figures 8 to 11 In the exemplary embodiment shown, the heating device 10 further includes an air heating path plate 104, such as... Figure 10 and 11 As shown. An air inlet 210, an air heating path 220, and an air outlet 230 are formed in an air heating path plate 104, which is fixedly mounted to a frame 101. According to this disclosure, depending on the design dimensions of the air heating path plate 104, one or more sets of air heating paths can be provided in the air heating path plate 104. For example, in the illustrated exemplary embodiment, two sets of air heating paths are formed in the air heating path plate 104, and the dashed lines with arrows in the figure indicate the direction of air travel in each set of air heating paths. Furthermore, as... Figure 5and Figure 9 As shown, in an exemplary embodiment, the air heating path plate 104 and the heating module mounting plate 102 together define an air containment chamber 240. Those skilled in the art will understand that in other embodiments, the air containment chamber 240 may be formed separately in the air heating path plate 104, or separately in the heating module mounting plate, or separately defined by an additional plate structure. Furthermore, according to this disclosure, the air heating path 220 may employ, for example, a heatable aluminum tube, so that air can be continuously heated by absorbing heat from the aluminum tube as it travels from the air inlet 210 through the air heating path 220 to the air outlet 230.
[0054] Furthermore, according to this disclosure, such as Figure 5 As shown, the shaft member 120 in each heating module 100 is also configured to pass through the air heating path plate 104 and the heating module mounting plate 102 in an airtight manner, and is movable relative to the air heating path plate 104 and the heating module mounting plate 102. Specifically, as Figure 8 and Figure 9 As shown, the air heating path plate 104 has a plurality of first mounting holes 1040 corresponding to the number of heating modules 100, and the heating module mounting plate 102 has a plurality of second mounting holes 1020 corresponding to the number of heating modules 100. See also Figure 5 , Figure 8 and Figure 9 It is understood that the shaft member 120 in each heating module 100 movably passes through a corresponding first mounting hole 1040 and a corresponding second mounting hole 1020. Furthermore, each first mounting hole 1040 is provided with a first sealing gasket to achieve an airtight fit between the shaft member 120 and the first mounting hole 1040, and each second mounting hole 1020 is provided with a second sealing gasket to achieve an airtight fit between the shaft member 120 and the second mounting hole 1020. This design ensures an airtight connection between the heating module and the air channel network, preventing leakage of heated air.
[0055] Thus, see Figure 5 In the figure, the leftmost heating module 100 is in the first position. At this time, the guide hole 122 of the shaft member 120 is exposed in the air receiving chamber 240 and is thus in fluid communication with the air receiving chamber 240. The heated air in the air receiving chamber 240 can be guided to the heating body 110 along the guide hole 122 and the guide channel 121 of the shaft member 120. The other heating modules 100 in the figure are in the second position, and the guide hole 122 of the shaft member 120 is hermetically hidden in the first mounting hole 1040 of the air heating path plate 104 (e.g., Figure 10As shown, the heated air in the air chamber 240 is not in fluid communication with the air receiving chamber 240, and therefore cannot be guided to the heating body 110 along the guide hole 122 and guide channel 121 of the shaft member 120.
[0056] As can be seen, through the above design of the heating module 100 and the air circulation network, each heating module 100 can selectively receive heated air as needed, thereby realizing independent control of each heating module.
[0057] Furthermore, the dispensing equipment provided in this disclosure is equipped with the heating device described above according to embodiments of this disclosure, and the dispensing equipment provided in this disclosure may also include a control system (not shown), which can be used to control the dispensing operation of the dispensing unit, the movement of the aforementioned pair of tracks, the independent operation of each heating module in the heating device, etc. Moreover, the control system can automatically or manually adjust relevant parameters according to various electronic substrates with different electronic component layouts and / or different sizes and / or different dispensing requirements, to achieve efficient production.
[0058] Although this disclosure has been described for the foregoing in conjunction with exemplary embodiments, various alternatives, modifications, variations, improvements, and / or substantially equivalents, whether known or currently or soon to be foreseen, will likely be apparent to those skilled in the art. Furthermore, the technical effects and / or technical problems described in this disclosure are exemplary and not limiting; therefore, the technical content of this disclosure may be used to solve other technical problems and have other technical effects. Accordingly, the exemplary embodiments of this disclosure described above are intended to be illustrative rather than limiting. Various changes may be made without departing from the spirit or scope of this disclosure. The solutions described in the various exemplary embodiments can be freely combined without causing structural or principled conflicts. The scope of protection of this disclosure is defined by the claims and their equivalents.
Claims
1. A heating device, characterized in that, The heating device includes: An air passage network configured to introduce and heat air; and Multiple heating modules, each of which is independently operable relative to the others, wherein each heating module is configured to selectively direct heated air from the air channel network to the heating module.
2. The heating device as described in claim 1, characterized in that, Each heating module is configured to move independently of the other heating modules between a first position and a second position, in which heated air is guided from the air channel network to the heating module, and in the second position, heated air is not guided from the air channel network to the heating module.
3. The heating device as described in claim 2, characterized in that, Each heating module includes a heating body with a heating surface, the heating body having an interior cavity, and the heating surface having an opening that is in fluid communication with the cavity; When the heating module is in the first position, heated air enters the cavity of the heating body from the air channel network and exits the heating surface through the holes.
4. The heating device as described in claim 3, characterized in that, Each heating module also includes: a shaft member connected to the heating body; The shaft member has a flow guide channel and a flow guide hole in fluid communication with the flow guide channel, and the flow guide channel is in fluid communication with the cavity of the heating body; When the heating module is in the first position, the guide hole is in fluid communication with the air channel network, while when the heating module is in the second position, the guide hole is not in fluid communication with the air channel network.
5. The heating device as described in claim 4, characterized in that, The shaft component is integral with the heating body.
6. The heating device as described in claim 4, characterized in that, Each heating module further includes a drive mechanism that acts on the shaft member and is configured to move the heating module between the first position and the second position by driving the shaft member.
7. The heating device as described in claim 4, characterized in that, The air passage network includes an air containment chamber in which heated air is contained; When the heating module is in the first position, the guide hole of the shaft member is in fluid communication with the air receiving chamber, while when the heating module is in the second position, the guide hole of the shaft member is not in fluid communication with the air receiving chamber.
8. The heating device as described in claim 7, characterized in that, The air channel network further includes an air inlet, an air heating path, and an air outlet, wherein the air inlet is connected to the outside to introduce air, the air outlet is in fluid communication with the air containment chamber, and the air heating path is in fluid communication with the air inlet and the air outlet and is configured to heat the air flowing through the air heating path.
9. The heating device as described in claim 8, characterized in that, The heating device also includes an air heating path plate and a heating module mounting plate; The air inlet, the air heating path, and the air outlet are disposed in the air heating path plate; The air heating path plate and the heating module mounting plate together define the air containment chamber.
10. The heating device as described in claim 9, characterized in that, The air heating path plate has a plurality of first mounting holes corresponding to the number of the plurality of heating modules, and the heating module mounting plate has a plurality of second mounting holes corresponding to the number of the plurality of heating modules; The shaft member in each heating module is configured to pass through a corresponding first mounting hole and a corresponding second mounting hole in an airtight manner, and is movable relative to the air heating path plate and the heating module mounting plate.
11. The heating device as claimed in claim 10, characterized in that, The heating device also includes: a frame and a drive mechanism mounting plate; The drive mechanism is mounted on the drive mechanism mounting plate; The air heating path plate, the heating module mounting plate, and the drive mechanism mounting plate are fixedly mounted to the frame.
12. The heating device according to any one of claims 1 to 11, characterized in that, Multiple heating modules are arranged in an array, and the multiple heating modules have the same structure.
13. The heating device according to any one of claims 2 to 11, characterized in that, The first position of each heating module is an upward position relative to the air channel network, and the second position of each heating module is a downward position relative to the air channel network.
14. A dispensing device, characterized in that, The dispensing equipment includes: A fixed track and a movable track, arranged side-by-side and configured to transport an electronic substrate into / out of an operating station, wherein the movable track is movable toward or away from the fixed track to adjust the distance between the fixed track and the movable track; and The heating device according to any one of claims 2 to 13, wherein the operating station is located above the heating device.
15. The dispensing equipment as described in claim 14, characterized in that, The movable track is also configured to move over the heating device.
16. The dispensing equipment as described in claim 14, characterized in that, The first position of each heating module in the heating device is closer to the operating station than the second position.