Shockproof and non-deformable wafer cutting machine base structure

Abstract

The utility model relates to wafer cutting machine technical field discloses the base structure of shockproof deformation of wafer cutting machine, including support seat, the inside fixed connection of support seat has first motor, the output of first motor is provided with transmission assembly, the outer wall of support seat is provided with sliding assembly, the outer wall fixed connection of transmission assembly has support station, the outer wall of support seat is provided with cutting machine body, transmission assembly includes transmission axle, the inside fixed connection of transmission axle's upside has screw rod, the outer wall screw connection of screw rod has the lifting plate. In the utility model, first motor drives transmission axle to rotate, and then drives screw rod to rotate, and screw rod drives lifting plate to lift, and then adjusts support station height, and simultaneously, the outer wall sliding of roller in slide rail guarantees the stability of support station lifting process, thereby can reach the effect of accurately adjusting wafer cutting height, improves cutting accuracy.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing machine technology, and in particular to a wafer dicing machine base structure that is shockproof and not easily deformed. Background Technology

[0002] A wafer dicing machine is used to cut large semiconductor wafers into smaller chip wafers or chip units that meet specific specifications. Its core function is to divide the wafers using high-precision cutting blades (such as diamond saw blades or laser cutting heads) or cutting processes, ensuring that the cut wafers have smooth edges and no surface damage, so as to meet the requirements of subsequent packaging, testing and other processes.

[0003] Traditional wafer dicing machines typically use a fixed-height base design or rely on manual adjustment, which is time-consuming and labor-intensive, and makes it difficult to achieve high-precision dynamic adjustments. This results in low dicing accuracy and consequently affects product quality. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a shockproof and deformation-resistant wafer dicing machine base structure, aiming to improve the problem that traditional wafer dicing machine bases are difficult to dynamically adjust with high precision.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A shockproof and deformation-resistant wafer dicing machine base structure includes a support base, a first motor fixedly connected inside the support base, a transmission component provided at the output end of the first motor, a sliding component provided on the outer wall of the support base, a support platform fixedly connected to the outer wall of the transmission component, and a dicing machine body provided on the outer wall of the support base.

[0007] Preferably, the transmission assembly includes a transmission bearing, the interior of which is disposed at the output end of the first motor. A threaded rod is fixedly connected to the upper interior of the transmission bearing, and a lifting plate is threadedly connected to the outer wall of the threaded rod. The outer wall of the support platform is fixedly connected to the outer wall of the lifting plate.

[0008] Preferably, the sliding assembly includes a slide rail, the outer wall of which is fixedly connected to the outer wall of the support base, and a roller is rotatably connected to the outer wall of the lifting plate, the outer wall of which is slidably connected to the outer wall of the slide rail.

[0009] Preferably, a fixed platform is fixedly connected to the upper surface of the support platform, a clamping assembly is provided on the middle upper surface of the support platform, a clamping plate is fixedly connected to the outer wall of the clamping assembly, and a holding platform is fixedly connected to the upper surface of the fixed platform.

[0010] Preferably, the clamping assembly includes a second motor, the outer wall of which is fixedly connected to the upper surface of the middle part of the support platform, the output end of the second motor is connected to a transmission gear, the inner wall of the transmission gear is slidably connected to a sliding column, the outer wall of the sliding column is fixedly connected to a sliding plate, and the outer wall of the clamping plate is fixedly connected to the outer wall of the sliding plate.

[0011] Preferably, the sliding column has a sliding groove inside, and the outer wall of the sliding column is slidably connected to the inner wall of the sliding groove.

[0012] Preferably, the lower surface of the transmission gear is rotatably connected to the upper surface of the fixed platform, and the outer wall of the sliding plate is slidably connected to the inner wall of the fixed platform.

[0013] Preferably, the outer wall of the transmission bearing is rotatably connected to the inner wall of the support base, and the outer wall of the threaded rod is rotatably connected to the inner wall of the support base.

[0014] This utility model has the following beneficial effects:

[0015] 1. In this utility model, the first motor drives the transmission bearing shaft to rotate, which in turn drives the threaded rod to rotate. The threaded rod drives the lifting plate to rise and fall, thereby adjusting the height of the support platform. At the same time, the roller slides on the outer wall of the slide rail to ensure the stability of the lifting process of the support platform. This can achieve the effect of accurately adjusting the wafer cutting height and improving the cutting accuracy.

[0016] 2. In this utility model, the second motor drives the transmission gear to rotate, and then the transmission gear drives the sliding column to slide, which in turn drives the sliding plate to slide, so that the clamping plate moves and clamps the wafer, thereby achieving the effect of conveniently clamping the wafer for cutting and adapting to the fixing of wafers of different sizes. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the shockproof and non-deformable wafer dicing machine base structure proposed in this utility model.

[0018] Figure 2 This is a partial structural diagram of the support base of the shockproof and non-deformable wafer dicing machine base structure proposed in this utility model.

[0019] Figure 3 This is a partial structural diagram of the support platform of the shockproof and non-deformable wafer dicing machine base structure proposed in this utility model.

[0020] Figure 4 This is a partial structural diagram of the holding platform of the shockproof and non-deformable wafer dicing machine base structure proposed in this utility model.

[0021] Figure 5 This is a partial structural diagram of the clamping plate of the shockproof and non-deformable wafer dicing machine base structure proposed in this utility model.

[0022] Legend:

[0023] 1. Support base; 2. First motor; 3. Transmission assembly; 301. Transmission bearing; 302. Threaded rod; 303. Lifting plate; 4. Sliding assembly; 401. Slide rail; 402. Roller; 5. Support platform; 6. Fixed platform; 7. Clamping assembly; 701. Second motor; 702. Transmission gear; 703. Sliding column; 704. Sliding plate; 8. Clamping plate; 9. Container platform; 10. Slide groove; 11. Cutting machine body. Detailed Implementation

[0024] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] Reference Figures 1-3 An embodiment of this utility model provides a shockproof and non-deformable wafer dicing machine base structure, including a support base 1, a first motor 2 fixedly connected inside the support base 1, a transmission component 3 provided at the output end of the first motor 2, a sliding component 4 provided on the outer wall of the support base 1, a support platform 5 fixedly connected to the outer wall of the transmission component 3, and a dicing machine body 11 provided on the outer wall of the support base 1.

[0026] Specifically, the support base 1 is used to fix the first motor 2, the first motor 2 is used to drive the transmission component 3 to operate, the transmission component 3 is used to realize the lifting and lowering of the support platform 5, the sliding component 4 is used to ensure the stability of the lifting and lowering process, the support platform 5 is used to support the fixed platform 6 to fix it, and provides a support platform for wafer cutting related operations, and the cutting machine body 11 is used to realize the wafer cutting function.

[0027] Reference Figures 2-4 The transmission assembly 3 includes a transmission bearing 301, the inside of which is located at the output end of the first motor 2. A threaded rod 302 is fixedly connected to the upper side of the transmission bearing 301. A lifting plate 303 is threadedly connected to the outer wall of the threaded rod 302. The outer wall of the support platform 5 is fixedly connected to the outer wall of the lifting plate 303. The sliding assembly 4 includes a slide rail 401, the outer wall of which is fixedly connected to the outer wall of the support base 1. A roller 402 is rotatably connected to the outer wall of the lifting plate 303. The outer wall of the roller 402 is slidably connected to the outer wall of the slide rail 401.

[0028] Specifically, the transmission bearing 301 is used to drive the threaded rod 302 to rotate, the threaded rod 302 is used to drive the lifting plate 303 to rise and fall, the lifting plate 303 is used to drive the support platform 5 to rise and fall, and at the same time drive the roller 402 to rotate. The slide rail 401 plays the role of supporting the roller 402 to slide on the outer wall of the slide rail 401. The roller 402 is used to make the lifting process more stable, thereby achieving the effect of accurately adjusting the wafer cutting height.

[0029] Reference Figures 3-5 A fixed platform 6 is fixedly connected to the upper surface of the support platform 5. A clamping assembly 7 is provided on the upper surface of the middle part of the support platform 5. A clamping plate 8 is fixedly connected to the outer wall of the clamping assembly 7. A holding platform 9 is fixedly connected to the upper surface of the fixed platform 6. The clamping assembly 7 includes a second motor 701. The outer wall of the second motor 701 is fixedly connected to the upper surface of the middle part of the support platform 5. A transmission gear 702 is connected to the output end of the second motor 701. A sliding column 703 is slidably connected to the inner wall of the transmission gear 702. A sliding plate 704 is fixedly connected to the outer wall, and the outer wall of the clamping plate 8 is fixedly connected to the outer wall of the sliding plate 704; a sliding groove 10 is opened inside the sliding column 703, and the outer wall of the sliding column 703 is slidably connected to the inner wall of the sliding groove 10; the lower surface of the transmission gear 702 is rotatably connected to the upper surface of the fixed platform 6, and the outer wall of the sliding plate 704 is slidably connected to the inner wall of the fixed platform 6; the outer wall of the transmission bearing 301 is rotatably connected to the inner wall of the support base 1, and the outer wall of the threaded rod 302 is rotatably connected to the inner wall of the support base 1.

[0030] Specifically, the support platform 5 is used to fix the fixed platform 6, the fixed platform 6 is used to fix the holding platform 9, and at the same time provides rotational support for the transmission gear 702. The holding platform 9 is used to place the wafer to be cut. The second motor 701 is used to drive the transmission gear 702 to rotate. The transmission gear 702 is used to drive the sliding column 703 to slide. The sliding column 703 is used to drive the sliding plate 704 to slide. The sliding plate 704 is used to slide on the inner wall of the fixed platform 6, thereby driving the clamping plate 8 to move. The clamping plate 8 is used to directly clamp the wafer, realizing stable clamping of wafers of different sizes. The slide groove 10 plays the role of supporting the sliding column 703 to slide on the inner wall of the slide groove 10, thereby achieving the effect of conveniently clamping and fixing the wafer for cutting.

[0031] Working principle: When using the shockproof and non-deformable wafer dicing machine base structure, the wafer to be diced is first placed on the holding platform 9. Then, the first motor 2 starts and drives the transmission bearing shaft 301 to rotate, which in turn drives the threaded rod 302 to rotate. The threaded rod 302 is connected to the lifting plate 303. The rotation of the threaded rod 302 drives the lifting plate 303 to rise and fall, thereby adjusting the height of the support platform 5. At the same time, the roller 402 slides on the outer wall of the slide rail 401 to ensure the stability of the lifting process of the support platform 5. This can achieve the effect of accurately adjusting the wafer dicing height and improving the dicing accuracy.

[0032] After the height adjustment is completed, the second motor 701 starts and drives the transmission gear 702 to rotate. Then, the rotation of the transmission gear 702 will drive the sliding column 703 to slide in the sliding groove 10, which in turn drives the sliding plate 704 to slide on the inner wall of the fixed table 6, so that the clamping plate 8 moves and clamps the wafer. Finally, the cutting machine body 11 performs a cutting operation on the clamped and fixed wafer, thereby achieving the effect of conveniently clamping the wafer for cutting and adapting to the fixing of wafers of different sizes.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A shockproof and deformation-resistant wafer dicing machine base structure, comprising a support base (1), characterized in that: The support base (1) is internally fixedly connected to a first motor (2), and the output end of the first motor (2) is provided with a transmission assembly (3). The outer wall of the support base (1) is provided with a sliding assembly (4), and the outer wall of the transmission assembly (3) is fixedly connected to a support platform (5). The outer wall of the support base (1) is provided with a cutting machine body (11).

2. The shockproof and deformation-resistant wafer dicing machine base structure according to claim 1, characterized in that: The transmission assembly (3) includes a transmission bearing (301), the inside of which is located at the output end of the first motor (2). A threaded rod (302) is fixedly connected to the upper side of the transmission bearing (301), and a lifting plate (303) is threadedly connected to the outer wall of the threaded rod (302). The outer wall of the support platform (5) is fixedly connected to the outer wall of the lifting plate (303).

3. The shock-resistant and deformation-resistant wafer dicing machine base structure according to claim 2, characterized in that: The sliding assembly (4) includes a slide rail (401), the outer wall of which is fixedly connected to the outer wall of the support base (1), and a roller (402) is rotatably connected to the outer wall of the lifting plate (303), the outer wall of which is slidably connected to the outer wall of the slide rail (401).

4. The shockproof and deformation-resistant wafer dicing machine base structure according to claim 1, characterized in that: A fixed platform (6) is fixedly connected to the upper surface of the support platform (5), a clamping assembly (7) is provided on the middle upper surface of the support platform (5), a clamping plate (8) is fixedly connected to the outer wall of the clamping assembly (7), and a holding platform (9) is fixedly connected to the upper surface of the fixed platform (6).

5. The shock-resistant and deformation-resistant wafer dicing machine base structure according to claim 4, characterized in that: The clamping assembly (7) includes a second motor (701), the outer wall of which is fixedly connected to the upper surface of the middle part of the support platform (5). The output end of the second motor (701) is connected to a transmission gear (702). The inner wall of the transmission gear (702) is slidably connected to a sliding column (703). The outer wall of the sliding column (703) is fixedly connected to a sliding plate (704). The outer wall of the clamping plate (8) is fixedly connected to the outer wall of the sliding plate (704).

6. The shock-resistant and deformation-resistant wafer dicing machine base structure according to claim 5, characterized in that: The sliding column (703) has a sliding groove (10) inside, and the outer wall of the sliding column (703) is slidably connected to the inner wall of the sliding groove (10).

7. The shock-resistant and deformation-resistant wafer dicing machine base structure according to claim 6, characterized in that: The lower surface of the transmission gear (702) is rotatably connected to the upper surface of the fixed platform (6), and the outer wall of the sliding plate (704) is slidably connected to the inner wall of the fixed platform (6).

8. The shock-resistant and deformation-resistant wafer dicing machine base structure according to claim 2, characterized in that: The outer wall of the transmission bearing (301) is rotatably connected to the inner wall of the support base (1), and the outer wall of the threaded rod (302) is rotatably connected to the inner wall of the support base (1).

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