A cooling liquid separating and collecting device for silicon wafer cutting

Abstract

The utility model discloses a cooling liquid separation and collection device for silicon wafer cutting relates to the technical field of cooling liquid separation and collection for silicon wafer cutting. This cooling liquid separation and collection device for silicon wafer cutting, including cooling liquid cylinder, the top of cooling liquid cylinder is provided with the cylinder cover, the inside of cooling liquid cylinder is provided with the filter mechanism. This cooling liquid separation and collection device for silicon wafer cutting, through setting up inner tube, when needing to filter and separate cooling liquid, first through the liquid inlet pipe and transport the silicon wafer cutting cooling liquid after use to the inside of cooling liquid cylinder, cooling liquid filters through filter plate at this moment, make the filtered cooling liquid enter the inside of inner tube, then through the liquid pump and drive the liquid extraction pump extraction inner tube inside filtered cooling liquid and transport to the outside of cooling liquid cylinder and collect, and the device is convenient for filtering and separating cooling liquid.

Description

Technical Field

[0001] This utility model belongs to the field of coolant separation and collection technology for silicon wafer cutting, and specifically relates to a coolant separation and collection device for silicon wafer cutting. Background Technology

[0002] Silicon wafers are thin sheets made from high-purity monocrystalline silicon and are the core material for semiconductor manufacturing. A silicon wafer dicing machine is a special device used to cut monocrystalline silicon rods into thin silicon wafers. Its core function is to achieve high-precision, low-loss cutting. When dicing silicon wafers, a coolant is required for auxiliary cutting.

[0003] The aforementioned device lacks a structure for extracting and separating impurities from the cutting coolant during use. As a result, when the coolant in the existing silicon wafer cutting machine is used for cutting, most of the impurities in the coolant are filtered and separated by gravity, which is not very effective. Moreover, after a period of use, the filter element becomes slightly clogged, and the filtration speed drops significantly. Based on the shortcomings of the existing technology, this utility model designs a coolant separation and collection device for silicon wafer cutting. Utility Model Content

[0004] To address the aforementioned problems in the existing technology, this utility model provides a coolant separation and collection device for silicon wafer cutting, which features the function of suction and separation of impurities in the cutting coolant.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a coolant separation and collection device for silicon wafer cutting, comprising a coolant cylinder, a cylinder cover being provided on the top of the coolant cylinder, and a filter mechanism being provided inside the coolant cylinder;

[0006] A filtration mechanism includes an inner cylinder, a connecting sleeve, a filter plate, a liquid extraction pipe, and a liquid extraction pump. The inner cylinder is disposed inside a coolant cylinder. The connecting sleeve is fixedly connected to the lower surface of the inner cylinder. The filter plate is disposed inside the connecting sleeve. The liquid extraction pipe is disposed inside the inner cylinder. A liquid extraction pump is disposed on one side of the liquid extraction pipe.

[0007] As a preferred technical solution of the coolant separation and collection device for silicon wafer cutting according to this utility model, the bottom of the coolant cylinder is provided with a support foot, and the inside of the coolant cylinder is provided with an inlet pipe.

[0008] As a preferred technical solution of the coolant separation and collection device for silicon wafer cutting according to this utility model, an air pump is provided on the top of the cylinder cover, and a one-way valve is provided on the top of the cylinder cover.

[0009] As a preferred technical solution of the coolant separation and collection device for silicon wafer cutting according to this utility model, the inner cylinder is fixedly connected to the lower surface of the cylinder cover, and the connecting sleeve is disposed inside the coolant cylinder.

[0010] As a preferred embodiment of the coolant separation and collection device for silicon wafer cutting according to this utility model, the filter plate is set at the bottom of the inner cylinder, and the liquid extraction pipe is fixedly connected to one side of the coolant cylinder.

[0011] As a preferred technical solution of the cooling liquid separation and collection device for silicon wafer cutting according to this utility model, the liquid extraction pipe is set on the top of the filter plate, and the liquid extraction pump is set on one side of the cooling liquid cylinder.

[0012] As a preferred technical solution of the cooling liquid separation and collection device for silicon wafer cutting according to this utility model, the liquid inlet pipe is located at the bottom of the cylinder cover and on one side of the inner cylinder.

[0013] As a preferred technical solution of the cooling liquid separation and collection device for silicon wafer cutting according to this utility model, the air pump is located at the top of the inner cylinder, and the one-way valve is located at the top of the inner cylinder.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. In use, this utility model, by setting an inner cylinder, when it is necessary to filter and separate coolant, firstly, the coolant used for cutting silicon wafers is transported to the inside of the coolant cylinder through the liquid inlet pipe. At this time, the coolant is filtered through the filter plate, so that the filtered coolant enters the inside of the inner cylinder. Then, the liquid pump drives the liquid extraction pipe to extract the filtered coolant inside the inner cylinder and transport it to the outside of the coolant cylinder for collection. This device facilitates the filtration and separation of coolant. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the coolant cylinder structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the cylindrical cover structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the filter mechanism structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the liquid inlet pipe structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the one-way valve structure of this utility model.

[0022] In the diagram: 1. Coolant cylinder; 101. Support leg; 102. Inlet pipe; 2. Cylinder cover; 201. Air pump; 202. Check valve; 3. Filtering mechanism; 301. Inner cylinder; 302. Connecting sleeve; 303. Filter plate; 304. Suction pipe; 305. Suction pump. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] Please see Figure 1-5 The present invention provides the following technical solution: a coolant separation and collection device for silicon wafer cutting, comprising a coolant cylinder 1, a cylinder cover 2 provided on the top of the coolant cylinder 1, and a filter mechanism 3 provided inside the coolant cylinder 1;

[0026] The bottom of the coolant cylinder 1 is provided with a support foot 101, and the inside of the coolant cylinder 1 is provided with a liquid inlet pipe 102.

[0027] The liquid inlet pipe 102 is located at the bottom of the cylinder cover 2 and on one side of the inner cylinder 301.

[0028] An air pump 201 is installed on the top of the cylinder cover 2, and a one-way valve 202 is installed on the top of the cylinder cover 2.

[0029] The air pump 201 is located at the top of the inner cylinder 301, and the one-way valve 202 is located at the top of the inner cylinder 301.

[0030] Further explanation is needed: A liquid inlet pipe 102 is provided on one side of the coolant cylinder 1, and the liquid inlet pipe 102 extends into the interior of the coolant cylinder 1, so as to facilitate the delivery of the coolant used for silicon wafer cutting after external use into the interior of the coolant cylinder 1. A cylinder cover 2 is provided on the top of the coolant cylinder 1, and the cylinder cover 2 is connected to the filter mechanism 3. An air pump 201 and a one-way valve 202 are provided on the top of the cylinder cover 2. When the filter plate 303 has a large filtration resistance, the air pump 201 draws air from the interior of the inner cylinder 301, which promotes the efficiency of the coolant in the coolant cylinder 1 being filtered through the filter plate 303 into the interior of the inner cylinder 301, and facilitates the output of the filtered and separated coolant.

[0031] Example 2

[0032] Please see Figure 3-5 The present invention provides the following technical solution:

[0033] The filter mechanism 3 includes an inner cylinder 301, a connecting sleeve 302, a filter plate 303, a liquid extraction pipe 304, and a liquid extraction pump 305. The inner cylinder 301 is disposed inside the coolant cylinder 1. The connecting sleeve 302 is fixedly connected to the lower surface of the inner cylinder 301. The filter plate 303 is disposed inside the connecting sleeve 302. The liquid extraction pipe 304 is disposed inside the inner cylinder 301. The liquid extraction pump 305 is disposed on one side of the liquid extraction pipe 304.

[0034] The inner cylinder 301 is fixedly connected to the lower surface of the cylinder cover 2, and the connecting sleeve 302 is located inside the coolant cylinder 1.

[0035] The filter plate 303 is located at the bottom of the inner cylinder 301, and the liquid extraction pipe 304 is fixedly connected to one side of the coolant cylinder 1.

[0036] The liquid extraction pipe 304 is located on the top of the filter plate 303, and the liquid extraction pump 305 is located on one side of the coolant cylinder 1.

[0037] Further explanation is needed: the used silicon wafer cutting coolant is transported to the inside of the coolant cylinder 1 through the inlet pipe 102. At this time, the coolant is filtered through the filter plate 303, so that the filtered coolant enters the inside of the inner cylinder 301. Then, the pump 305 drives the pump pipe 304 to draw out the filtered coolant inside the inner cylinder 301 and transport it to the outside of the coolant cylinder 1 for collection.

[0038] Working principle: When a silicon wafer cutting coolant separation and collection device is used, an inlet pipe 102 is first set on one side of the coolant cylinder 1, and the inlet pipe 102 extends into the interior of the coolant cylinder 1, so as to facilitate the delivery of the silicon wafer cutting coolant after external use into the interior of the coolant cylinder 1. A cylinder cover 2 is set on the top of the coolant cylinder 1, and the cylinder cover 2 is connected to the filter mechanism 3. An air pump 201 and a one-way valve 202 are set on the top of the cylinder cover 2. When the filter plate 303 has a large filtration resistance, the air pump 201 draws out the air inside the inner cylinder 301, which promotes the efficiency of the coolant inside the coolant cylinder 1 being filtered through the filter plate 303 into the inner cylinder 301, and facilitates the output of the filtered and separated coolant.

[0039] When it is necessary to filter and separate the coolant, the used silicon wafer cutting coolant is first transported into the coolant cylinder 1 through the inlet pipe 102. At this time, the coolant is filtered through the filter plate 303, so that the filtered coolant enters the inner cylinder 301. Then, the pump 305 drives the pump pipe 304 to draw out the filtered coolant from the inner cylinder 301 and transport it to the outside of the coolant cylinder 1 for collection. This device facilitates the filtration and separation of coolant.

[0040] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cooling liquid separation and collection device for silicon wafer dicing, comprising a cooling liquid cylinder (1), characterized in that: The top of the coolant cylinder (1) is provided with a cylinder cover (2), and the inside of the coolant cylinder (1) is provided with a filter mechanism (3). The filtration mechanism (3) includes an inner cylinder (301), a connecting sleeve (302), a filter plate (303), a liquid extraction pipe (304), and a liquid extraction pump (305). The inner cylinder (301) is located inside the coolant cylinder (1). The connecting sleeve (302) is fixedly connected to the lower surface of the inner cylinder (301). The filter plate (303) is located inside the connecting sleeve (302). The liquid extraction pipe (304) is located inside the inner cylinder (301). The liquid extraction pump (305) is located on one side of the liquid extraction pipe (304).

2. The cooling fluid separation and collection device for silicon wafer cutting according to claim 1, characterized in that: The bottom of the coolant cylinder (1) is provided with a support foot (101), and the inside of the coolant cylinder (1) is provided with a liquid inlet pipe (102).

3. The cooling fluid separation and collection device for silicon wafer cutting according to claim 1, characterized in that: The top of the cylinder cover (2) is provided with an air pump (201) and a one-way valve (202).

4. The cooling fluid separation and collection device for silicon wafer cutting according to claim 1, characterized in that: The inner cylinder (301) is fixedly connected to the lower surface of the cylinder cover (2), and the connecting sleeve (302) is disposed inside the coolant cylinder (1).

5. The cooling fluid separation and collection device for silicon wafer cutting according to claim 1, characterized in that: The filter plate (303) is located at the bottom of the inner cylinder (301), and the liquid extraction pipe (304) is fixedly connected to one side of the coolant cylinder (1).

6. The cooling fluid separation and collection device for silicon wafer cutting according to claim 1, characterized in that: The liquid extraction pipe (304) is located on the top of the filter plate (303), and the liquid extraction pump (305) is located on one side of the coolant cylinder (1).

7. The cooling fluid separation and collection device for silicon wafer cutting according to claim 2, characterized in that: The liquid inlet pipe (102) is located at the bottom of the cylinder cover (2) and on one side of the inner cylinder (301).

8. The cooling fluid separation and collection device for silicon wafer cutting according to claim 3, characterized in that: The air pump (201) is located at the top of the inner cylinder (301), and the one-way valve (202) is located at the top of the inner cylinder (301).

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