An integrated ultra-thin fingerprint module protection film structure

Abstract

The utility model discloses an integrated ultrathin fingerprint module protection film structure relates to the field of protection film, including the high -transparency membrane, first double -faced adhesive layer, protection film, bubble cotton layer, second double -faced adhesive layer and shading layer that set up from top to bottom in order layer by layer, be equipped with the tear -off handle that extends on protection film, the one surface of protection film adhesion bubble cotton layer is equipped with release adhesive layer, and release adhesive layer and bubble cotton layer are bonded, and the release adhesive layer and bubble cotton layer's release bonding force is less than second double -faced adhesive layer and protection film and shading layer's release bonding force, the utility model discloses a release adhesive layer is set up on the protection film, and tear -off handle is set up on the protection film, and when whole machine assembly, tear -off protection film is convenient, and simultaneously take along first double -faced adhesive layer and high -transparency membrane together with separation, and keep bubble cotton layer, second double -faced adhesive layer and shading layer on optical fingerprint module, and can avoid bubble cotton layer and shading layer separation, guarantee the photosensitive effect of fingerprint identification equipment, and improve user fingerprint identification precision.

Description

Technical Field

[0001] This utility model relates to the field of protective film technology, and in particular to an integrated ultra-thin fingerprint module protective film structure. Background Technology

[0002] The production of ultra-thin optical fingerprint modules requires complex manufacturing processes from components to finished modules. Due to the special structural design of ultra-thin fingerprint sensors, the photosensitive area of ​​the chip is exposed. On the one hand, light-shielding and reflective treatments are needed around the photosensitive area of ​​the chip to prevent external stray light from entering the chip through the chip side plate or reflected light from the vicinity of the chip from affecting the imaging effect and thus the user's fingerprint recognition experience. On the other hand, the production process involves multiple workstations, and external dust can easily fall onto the photosensitive area, causing contamination of the chip's photosensitive area.

[0003] Patent application CN202220560149.5 discloses a light-shielding high-transparency protective film and an optical fingerprint module. The light-shielding high-transparency protective film includes a protective film body, comprising a light-shielding paper with a first opening, foam disposed on top of the light-shielding paper with a second opening, a PET protective film disposed on the foam with only a third opening, and a high-transparency film disposed on top of the PET protective film. The light-shielding paper, foam, PET protective film, and high-transparency film are stacked sequentially to align the first, second, and third openings. The protective film body is an integrally stacked structure, facilitating assembly and use. This protective film structure is attached to the optical fingerprint module to cover the photosensitive chip for protection. However, during the assembly of the optical fingerprint module, the high-transparency film covers the photosensitive chip. After assembly, a transparent substrate is needed to cover the photosensitive chip for protection. The high-transparency film affects the photosensitivity, thus requiring the high-transparency film and the protective film to be peeled off. In existing light-shielding high-transparency protective films, peeling off the high-transparency film is inconvenient. Therefore, this utility model discloses an integrated ultra-thin fingerprint module protective film structure to solve the above problems. Utility Model Content

[0004] Based on this, it is necessary to provide an integrated ultra-thin fingerprint module protective film structure to address the aforementioned technical problems. By setting a release adhesive layer on the protective film and setting a tear-off handle on the protective film, the protective film can be easily torn off during the assembly of the whole device. At the same time, the first double-sided adhesive layer and the high-transparency film are separated together, while the foam layer, the second double-sided adhesive layer and the light-shielding layer are retained on the optical fingerprint module. This also avoids the separation of the foam layer and the light-shielding layer, ensuring the light-sensing effect of the fingerprint recognition device and improving the fingerprint recognition accuracy of the user.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] An integrated ultra-thin fingerprint module protective film structure includes a high-transparency film, a first double-sided adhesive layer, a protective film, a foam layer, a second double-sided adhesive layer, and a light-shielding layer stacked sequentially from top to bottom. The protective film has an extended tear-off handle. A release adhesive layer is provided on the surface of the protective film that adheres to the foam layer. The release adhesive layer is bonded to the foam layer, and the release adhesive force between the release adhesive layer and the foam layer is less than the release adhesive force between the second double-sided adhesive layer and the protective film and the light-shielding layer.

[0007] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the protective film is provided with a first through hole, and the planar dimensions of the first double-sided adhesive layer are matched with those of the protective film.

[0008] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the light-shielding layer is provided with a second through hole, the foam layer is provided with a third through hole, and the second double-sided adhesive layer is provided with a fourth through hole, and the second through hole and the third through hole are both located inside the fourth through hole.

[0009] In a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the thickness of the first double-sided adhesive layer is 0.01mm and the thickness of the second double-sided adhesive layer is 0.03mm.

[0010] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the protective film is a PET film, and the adhesive surface resistance of the release liner in the protective film is 10. 5 Ω-10 10 Ω, the peeling voltage of the protective film is ±100V.

[0011] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the high-transparency film has a visible light transmittance of more than 90% and a thickness of 0.1mm.

[0012] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the light-shielding layer is a black light-shielding Mylar sheet with adhesive on one side and a thickness of 0.02mm. The adhesive side of the black light-shielding Mylar sheet is located on a surface opposite to the second double-sided adhesive layer.

[0013] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the protective film structure has symmetrically distributed slots on its side.

[0014] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, an identification piece is attached to the peel-off handle.

[0015] As a preferred embodiment of the integrated ultra-thin fingerprint module protective film structure provided by this utility model, the tear-off handle has an adhesive surface and the adhesive surface of the tear-off handle is bonded to a surface of the tear-off handle that is away from the first double-sided adhesive layer.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The integrated ultra-thin fingerprint module protective film structure provided by the present invention can protect the fingerprint module chip from external stray light interference, while also preventing dust and avoiding contamination of the chip's photosensitive area, thus ensuring the photosensitive effect of the fingerprint module. By setting a release adhesive layer on the protective film and setting a tear-off handle on the protective film, the protective film can be easily peeled off during the assembly of the whole device. At the same time, the first double-sided adhesive layer and the high-transparency film are separated together, retaining the foam layer, the second double-sided adhesive layer and the light-shielding layer on the optical fingerprint module, and avoiding the separation of the foam layer and the light-shielding layer, thus ensuring the photosensitive effect of the fingerprint recognition device and improving the fingerprint recognition accuracy of the user. Attached Figure Description

[0017] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A three-dimensional schematic diagram of the overall structure of the integrated ultra-thin fingerprint module protective film structure provided by this utility model;

[0019] Figure 2 A schematic diagram of the overall structure of the integrated ultra-thin fingerprint module protective film provided by this utility model;

[0020] Figure 3 A three-dimensional disassembled schematic diagram of the overall structure of the integrated ultra-thin fingerprint module protective film structure provided by this utility model;

[0021] Figure 4 A schematic diagram of the roll structure in the integrated ultra-thin fingerprint module protective film structure provided by this utility model.

[0022] The markings in the diagram are explained as follows:

[0023] 100. Protective film structure; 1. High-transparency film; 2. First double-sided adhesive layer; 3. Protective film; 4. Foam layer; 5. Second double-sided adhesive layer; 6. Light-blocking layer; 7. Tear-off handle; 8. Release adhesive layer; 9. First through hole; 10. Second through hole; 11. Third through hole; 12. Fourth through hole; 13. Groove; 14. Identification plate; 15. Roll structure; 16. Material strip; 17. Blank area. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] As described in the background section, ultra-thin optical fingerprint modules require complex manufacturing processes from components to finished modules. Due to the special structural design of ultra-thin fingerprint sensors, the photosensitive area of ​​the chip is exposed. On the one hand, light-shielding and reflective treatments are needed around the photosensitive area to prevent stray light from entering the chip through the chip sideplate or reflected light from the vicinity of the chip from affecting the imaging effect, thus impacting the user's fingerprint recognition experience. On the other hand, the production process involves multiple workstations, and dust particles can easily fall onto the photosensitive area, contaminating it. However, in existing protective film structures, a high-transparency film covers the photosensitive chip during the assembly of the optical fingerprint module. After assembly, a transparent substrate is needed to cover the photosensitive chip for protection. The high-transparency film affects the photosensitivity, so it is necessary to peel off the high-transparency film and the protective film. However, the high-transparency film in existing light-shielding high-transparency protective films is inconvenient to peel off.

[0026] To solve this technical problem, this utility model provides an integrated ultra-thin fingerprint module protective film structure, which is applied in the field of protective films.

[0027] For details, please refer to Figure 1-3 The integrated ultra-thin fingerprint module protective film structure 100 includes a high-transparency film 1, a first double-sided adhesive layer 2, a protective film 3, a foam layer 4, a second double-sided adhesive layer 5, and a light-shielding layer 6 stacked sequentially from top to bottom. The protective film 3 is provided with an extended tear-off handle 7. The protective film 3 has a release adhesive layer 8 on one surface that adheres to the foam layer 4. The release adhesive layer 8 is bonded to the foam layer 4, and the release adhesive force between the release adhesive layer 8 and the foam layer 4 is less than the release adhesive force between the second double-sided adhesive layer 5 and the protective film 3 and the light-shielding layer 6.

[0028] The integrated ultra-thin fingerprint module protective film structure 100 provided by this utility model can protect the fingerprint module chip from external stray light interference, and at the same time prevent dust and avoid contamination of the chip's photosensitive area, thus ensuring the photosensitive effect of the fingerprint module. By setting a release adhesive layer 8 on the protective film 3 and setting a tear-off handle 7 on the protective film 3, it is easy to tear off the protective film 3 during the assembly of the whole machine. At the same time, the first double-sided adhesive layer 2 and the high-transparency film 1 are separated together, while the foam layer 4, the second double-sided adhesive layer 5 and the light-shielding layer 6 are retained on the optical fingerprint module, and the separation of the foam layer 4 and the light-shielding layer 6 is avoided, thus ensuring the photosensitive effect of the fingerprint recognition device and improving the fingerprint recognition accuracy of the user.

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0030] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] Example 1

[0033] Please refer to Figure 1-3 This invention provides an integrated ultra-thin fingerprint module protective film structure. The protective film structure 100 includes a high-transparency film 1, a first double-sided adhesive layer 2, a protective film 3, a foam layer 4, a second double-sided adhesive layer 5, and a light-shielding layer 6, which are stacked sequentially from top to bottom. The high-transparency film 1 is bonded and fixed to the protective film 3 by the first double-sided adhesive layer 2, and the foam layer 4 is bonded and fixed to the light-shielding layer 6 by the second double-sided adhesive layer 5. The protective film 3 has an extended tear-off handle 7. The high-transparency film 1 and the first double-sided adhesive layer 2 have the same outer contour dimensions as the protective film 3, and therefore the high-transparency film 1 and the first double-sided adhesive layer 2 also extend correspondingly at the position of the tear-off handle 7 of the protective film 3. A release adhesive layer 8 is provided on one surface of the foam layer 4. The release adhesive layer 8 is bonded to the foam layer 4, and the release adhesive force between the release adhesive layer 8 and the foam layer 4 is less than the release adhesive force between the second double-sided adhesive layer 5 and the protective film 3 and the light-shielding layer 6. The protective film structure 100 is bonded to the fingerprint module in the fingerprint module manufacturing plant. Before the whole machine is assembled, the protective film 3, the first double-sided adhesive layer 2 and the high-transparency film 1 are torn off by the tear handle 7, while the foam layer 4, the second double-sided adhesive layer 5 and the light-shielding layer 6 are retained. When the protective film 3 is torn off, the foam layer 4 and the light-shielding layer 6 will not be pulled up, thus ensuring the adhesion stability of the foam layer 4 and the light-shielding layer 6 to the fingerprint module.

[0034] Furthermore, the protective film 3 has a first through-hole 9, the planar dimensions of the first double-sided adhesive layer 2 are matched with those of the protective film 3, the light-shielding layer has a second through-hole 10, the foam layer 4 has a third through-hole 11, and the second double-sided adhesive layer 5 has a fourth through-hole 12. The second through-hole 10 and the third through-hole 11 are both located inside the fourth through-hole 12. The second through-hole 10 is used to avoid the chip and components on the PCB board. The third through-hole 11, the fourth through-hole 12, and the first through-hole 9 are all used to avoid the chip, ensuring that the photosensitive chip can pass through the high-transparency film 1 for photosensitive processing. Specifically, the thickness of the first double-sided adhesive layer 2 is 0.01 mm, the thickness of the second double-sided adhesive layer 5 is 0.03 mm, the protective film 3 is a PET film, and the adhesive surface resistance of the release adhesive layer 8 in the protective film 3 is 10 ohms. 5 Ω-10 10 The protective film 3 has a tear-off voltage of ±100V, and the total weight of the protective film 3 and the release adhesive layer 8 is controlled between 12 and 20g. The high-transparency film 1 has a thickness of 0.1mm and a visible light transmittance of greater than 90%.

[0035] The light-shielding layer 6 is a single-sided adhesive black light-shielding Mylar sheet with a thickness of 0.02mm. The adhesive side of the black light-shielding Mylar sheet is located on a surface opposite to the second double-sided adhesive layer 5. The adhesive side of the light-shielding layer 6 is bonded and fixed to the periphery of the photosensitive chip on the fingerprint module.

[0036] If a single module uses a manual protective film application structure (100), it requires a large amount of manpower, significantly increasing processing costs. To address this, the sheet material can be designed as a roll material structure, utilizing the application principle of automated production equipment (15). Figure 4 As shown, in this example, the protective film structure 100 is attached to the inner side of the winding of the material strip 16 of the roll structure 15. The adjacent protective film structures 100 are spaced 18.4mm apart. Of course, a blank area 17 is also provided at the front end of the material strip 16, which can be automatically attached. On the one hand, it improves the production efficiency and saves labor costs, and on the other hand, it improves the accuracy and stability of the film application to meet the requirements of mass production.

[0037] Example 2

[0038] The integrated ultra-thin fingerprint module protective film structure provided in Embodiment 1 is further optimized, specifically, as follows: Figure 1-2 As shown, the protective film structure 100 has symmetrically distributed slots 13 on its side. The slots 13 are designed to match the fingerprint module and to prevent misalignment during installation.

[0039] Example 3

[0040] The integrated ultra-thin fingerprint module protective film structure provided in Embodiment 2 is further optimized, specifically, as follows: Figure 2 , 3As shown, a label 14 is attached to the tear-off handle 7. The tear-off handle 7 has an adhesive surface, and the adhesive surface of the tear-off handle 7 is bonded to the surface of the tear-off handle 7 that is away from the first double-sided adhesive layer 2. Since the protective film 3 is made of transparent material, it is not easy to identify when tearing off. The label 14 is set on the tear-off handle 7 to facilitate identification of the position of the tear-off handle 7. The tear-off handle 7 is screen-printed with bright colors for easy identification. In this example, the tear-off handle 7 is screen-printed with a yellow coating.

[0041] The working principle of the integrated ultra-thin fingerprint module protective film structure provided by this utility model is as follows: The protective film structure 100 can protect the chip of the fingerprint module from external stray light interference, and at the same time prevent dust and avoid contamination of the chip's photosensitive area, thus ensuring the photosensitive effect of the fingerprint module. By setting a release adhesive layer 8 on the protective film 3 and setting a tear-off handle 7 on the protective film 3, it is convenient to tear off the protective film 3 during the assembly of the whole machine. At the same time, the first double-sided adhesive layer 2 and the high-transparency film 1 are separated together, while the foam layer 4, the second double-sided adhesive layer 5 and the light-shielding layer 6 are retained on the optical fingerprint module, and the separation of the foam layer 4 and the light-shielding layer 6 is avoided, thus ensuring the photosensitive effect of the fingerprint recognition device and improving the fingerprint recognition accuracy of the user.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. An integrated ultra-thin fingerprint module protective film structure, the protective film structure comprising, from top to bottom, a high-transparency film, a first double-sided adhesive layer, a protective film, a foam layer, a second double-sided adhesive layer, and a light-shielding layer, characterized in that, The protective film has an extended tear-off handle, and a release adhesive layer is provided on one surface of the protective film that is attached to the foam layer. The release adhesive layer is bonded to the foam layer, and the release adhesive force between the release adhesive layer and the foam layer is less than the release adhesive force between the second double-sided adhesive layer and the protective film and the light-blocking layer.

2. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The protective film has a first through hole, and the planar dimensions of the first double-sided adhesive layer are matched with those of the protective film.

3. The integrated ultra-thin fingerprint module protective film structure according to claim 2, characterized in that, The light-shielding layer has a second through hole, the foam layer has a third through hole, and the second double-sided adhesive layer has a fourth through hole, with the second and third through holes located inside the fourth through hole.

4. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The thickness of the first double-sided adhesive layer is 0.01 mm, and the thickness of the second double-sided adhesive layer is 0.03 mm.

5. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The protective film is a PET film, and the adhesive surface resistance of the release layer in the protective film is 10. 5 Ω-10 10 Ω, the peeling voltage of the protective film is ±100V.

6. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The high-transmittance film has a visible light transmittance of more than 90% and a thickness of 0.1 mm.

7. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The light-shielding layer is a single-sided adhesive black light-shielding Mylar sheet with a thickness of 0.02 mm. The adhesive side of the black light-shielding Mylar sheet is located on a surface opposite to the second double-sided adhesive layer.

8. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, The protective membrane structure has symmetrically distributed slots on its sides.

9. The integrated ultra-thin fingerprint module protective film structure according to claim 1, characterized in that, A label is attached to the tear-off handle.

10. The integrated ultra-thin fingerprint module protective film structure according to claim 9, characterized in that, The tear-off handle has an adhesive surface, and the adhesive surface of the tear-off handle is bonded to a surface of the tear-off handle that is opposite to the first double-sided adhesive layer.

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