A blister packaging tray for circuit boards
By optimizing the structure of the circuit board blister packaging tray, the bottom wall of the cavity is sunken to form an empty space, and a gripping position with a larger depth is set on both sides, which solves the problem of low packaging box utilization in traditional designs and achieves higher packaging box loading capacity and reduced cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- EXCELLENCE OPTOELECTRONICS DONG GUAN LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-06-16
AI Technical Summary
Traditional circuit board packaging tray designs result in low utilization of the packaging box interior, failing to effectively increase the loading capacity of the packaging box.
The structure of the circuit board blister packaging tray is optimized by creating a clearance space by sinking the bottom wall of the acupoint and setting a deeper gripping position on both sides of the acupoint. At the same time, the depth of the pressing position is reduced. In the design, a second pressing position is set on the bottom wall of the gripping position to reduce the total thickness of the packaging tray stack.
It improves the internal utilization rate of packaging boxes, increases the number of packaging pallets that can be loaded into the packaging boxes, and reduces packaging costs.
Smart Images
Figure CN224361565U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board packaging technology, and in particular to a circuit board blister packaging tray. Background Technology
[0002] After circuit boards are manufactured, they are usually placed in packaging trays or pallets. Multiple layers of packaging trays are stacked together, and then the trays are put into packaging boxes. By stacking multiple layers of packaging trays, a large number of circuit boards can be packed into the packaging box, thus saving costs.
[0003] Packaging trays often have gripping, clearance, and pressing positions on their acupoints. The gripping and clearance positions facilitate workers' handling of circuit boards; the pressing positions hold down the underlying circuit boards, limiting their movement and preventing vibration, thus protecting them. Please refer to [reference needed]. Figure 1-4 As shown, the traditional design has the same depth between the clearance position and the gripping position, while the pressing position remains unchanged. This design leads to an increase in the thickness of the stacked packaging trays. However, the size of the packaging box is fixed, so the number of packaging trays loaded in a packaging box of the same size is small, resulting in a low internal utilization rate of the packaging box. Utility Model Content
[0004] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a circuit board blister packaging tray that optimizes the gripping position, thereby reducing the total thickness of the trays after stacking, allowing the packaging box to hold more trays, improving the internal utilization rate of the packaging box, and thus overcoming the shortcomings of the existing technology.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] This application provides a circuit board blister packaging tray, including a blister tray body; the blister tray body is provided with acupoints and grasping positions; the grasping positions are located on both sides of the acupoints and are in communication with the acupoints;
[0007] The bottom wall of the acupoint sinks up and down to form an empty space and a first pressure point;
[0008] The depth of the grab position is greater than the depth of the avoidance position.
[0009] Preferably, the depth d1 of the acupoint is between 7.0-8.0 mm; the depth d2 of the acupoint is between 8.0-9.0 mm; and the depth d3 of the first pressure point is between 13.5-14.5 mm.
[0010] Preferably, a second pressing position is provided on the bottom wall of a portion of the gripping position; the depth d4 of the gripping position is between 12-13 mm; and the depth d5 of the second pressing position is between 13.5-14.5 mm.
[0011] Preferably, the thickness of the blister tray body is between 0.3 and 0.6 mm.
[0012] Preferably, the sidewall of the acupoint protrudes to form a limiting part; the limiting part is embedded in a notch on the circuit board.
[0013] Preferably, the blister tray bodies can be stacked together, and positioning openings are provided at the corners of the blister tray bodies.
[0014] Preferably, the edge of the blister tray body is recessed to form a frame; the frame and the blister tray body form an overlapping part; the upper and lower overlapping parts can be stacked together.
[0015] Preferably, the blister tray body is provided with several rows of acupoints, and adjacent acupoints in the same row are connected by a gripping position.
[0016] Preferably, the blister tray body is a component made of one of the following materials: polyethylene terephthalate, polycarbonate, and acrylate.
[0017] Preferably, the edge of the blister tray body is embossed with a code.
[0018] Compared with existing technologies, this invention has significant advantages and beneficial effects. Specifically, as shown in the above technical solution, the bottom wall of the acupoint is partially sunken to form a clearance space, and a first pressure point is set on the bottom wall of the acupoint corresponding to the clearance space. Grasping points with a depth greater than the clearance space are set on both sides of the acupoint, and a second pressure point is set on the bottom wall of the grasping points. This design allows the grasping points to be made deeper, while the first and second pressure points can be made shallower, thereby reducing the total thickness of the stacked packaging trays. Packaging boxes of the same size can hold more layers of packaging trays, improving the utilization rate of the packaging box and reducing packaging costs. Attached Figure Description
[0019] Figure 1 This is a top view diagram of the circuit board after it has been placed in a traditional design.
[0020] Figure 2 This is a schematic diagram of the traditional packaging tray stacking design.
[0021] Figure 3 This is a schematic diagram of the packaging tray dimensions under traditional design.
[0022] Figure 4 This is a schematic diagram of a single acupoint under the traditional design.
[0023] Figure 5 This is a top view of an embodiment of the present invention after the circuit board has been placed.
[0024] Figure 6This is a side view of a packaging tray according to an embodiment of the present invention.
[0025] Figure 7 This is a cross-sectional schematic diagram of a portion of the packaging trays in a stacked state according to an embodiment of this utility model.
[0026] Figure 8 This is a schematic diagram of the packaging tray dimensions according to an embodiment of the present utility model.
[0027] Figure 9 This is a schematic diagram of a single acupoint according to an embodiment of the present invention.
[0028] Explanation of reference numerals in the attached diagram:
[0029] 10. Blister tray body; 11. Acupoint; 12. Limiting part; 13. Grasping position; 14. Clearance position; 15. First pressing position; 16. Overlapping part; 17. Encoding; 18. Circuit board; 19. Notch; 20. Second pressing position; 21. Positioning port; 22. Frame. Detailed Implementation
[0030] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.
[0031] Please refer to Figures 4 to 9 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which is a circuit board 18 blister packaging tray.
[0032] In this design, the bottom wall of acupoint 11 is partially sunken to form a clearance space 14, and a first pressure point 15 is set on the bottom wall of acupoint 11 corresponding to the clearance space 14. Grasping points 13, with a depth greater than the clearance space 14, are set on both sides of acupoint 11, and a second pressure point 20 is set on the bottom wall of the grasping point 13. This allows the grasping points to be made slightly deeper, while the first pressure point 15 and the second pressure point 20 can be made shallower. The overall thickness of the stacked packaging trays is reduced, thus reducing the total thickness of the stacked packaging trays. Packaging boxes of the same size can hold more layers of packaging trays, improving the utilization rate of the packaging boxes and reducing packaging costs.
[0033] This application provides a blister packaging tray for circuit boards 18, including a blister tray body 10. The blister tray body 10 is provided with acupoints 11 and grasping positions 13. The grasping positions 13 are located on both sides of the acupoints 11 and communicate with them. The bottom wall of the acupoints 11 is recessed to form clearance positions 14 and first pressure positions 15. The depth of the grasping positions 13 is greater than the depth of the clearance positions 14. The blister tray body 10 can be manufactured using blow molding or injection molding processes. This packaging tray can be used to place ordinary circuit boards 18, LED circuit boards, single-sided circuit boards, double-sided circuit boards, etc. The acupoints 11 are used to place the circuit boards 18, and a certain gap is left between the side wall of the acupoints 11 and the circuit boards 18 to facilitate the removal or placement of the circuit boards 18. The depth of the grasping positions 13 is greater than the depth of the clearance positions 14, providing sufficient space for fingers to pick up and remove the circuit boards 18. The acupoints 11 and grasping positions 13 are preferably groove-shaped. After the packaging trays are stacked, the first pressing position 15 can press down on the top of the circuit board 18, so that the circuit board 18 can be pressed into the cavity 11 and will not move. Since the clearance position 14 is formed by sinking down from the bottom wall of the cavity 11, and the first pressing position 15 is formed by sinking down from the bottom wall of the clearance position 14, this design can greatly reduce the overall thickness of the packaging trays after stacking, and more packaging trays can be packed into the same size packaging box. The bottom of the first pressing position and the second pressing position can be columnar.
[0034] Preferably, the depth d1 of the acupoint 11 is between 7.0-8.0 mm; the depth d2 of the clearance position 14 is between 8.0-9.0 mm; and the depth d3 of the first pressure position 15 is between 13.5-14.5 mm. A second pressure position 20 is provided on the bottom wall of some of the grasping positions 13; the depth d4 of the grasping position 13 is between 12-13 mm; and the depth d5 of the second pressure position 20 is between 13.5-14.5 mm. The thickness of the blister pack body 10 is between 0.3-0.6 mm. In this embodiment, the thickness of the blister pack body 10 can be any thickness among 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm.
[0035] Specifically, in this embodiment, the thickness of the blister tray body 10 is 0.5mm; the depth d1 of the acupoint 11 is 7.5mm; the depth d2 of the clearance position 14 is 8.5mm; the depth d3 of the first pressing position 15 is 14.00mm; the depth d4 of the grasping position 13 is 12.5mm; and the depth d5 of the second pressing position 20 is 14.00mm. In contrast, the original acupoint depth d6 in the traditional design was 7.5mm; the original clearance position depth d7 was 12.5mm; the original first pressing position depth d8 was 19mm; the original grasping position depth d9 was 12.5mm; and the original second pressing position depth d10 was 19mm. It is evident that after structural improvement, the depths of the first pressing position 15 and the second pressing position 20 are reduced. This design reduces the overall thickness of the packaging tray, allowing more trays to be placed in the same packaging box, thus improving the internal utilization rate of the packaging box. More specifically: Before the optimization design of the finger gripping area, the original packaging tray had a blister pack height of 19mm, allowing for only 14 layers of blister packs. After utilizing the pressure space for the finger gripping area design, the blister pack height was reduced to 14mm, the number of blister pack layers increased to 23, and the packaging volume ratio increased by 64%, greatly improving the utilization rate of the internal space of the packaging box. Both solutions use a 545*330*225mm cardboard box, and the total height of the blister pack layers needs to be controlled within 200mm.
[0036] Preferably, the sidewall of the acupoint 11 protrudes to form a limiting part 12; the limiting part 12 is embedded in a notch on the circuit board 18. When the circuit board 18 is placed into the acupoint 11, the limiting part 12 is embedded in the notch on the circuit board 18. This design can control the placement direction of the circuit board 18 and prevent the circuit board 18 from shifting.
[0037] Preferably, the blister tray bodies 10 can be stacked together, and positioning openings 21 are provided at the corners of the blister tray bodies 10. The packaging trays can be stacked together, and when the blister tray bodies 10 are stacked together, the positioning openings 21 can provide positioning for the upper and lower packaging trays, making the stacking smoother.
[0038] Preferably, the edge of the blister tray body 10 is recessed to form a frame 22; an overlapping portion 16 is formed between the frame 22 and the blister tray body 10; the upper and lower overlapping portions 16 can be stacked together. The frame 22 is curved downwards and has a certain curvature. This design can improve the structure of the blister tray body 10, not only improving its resistance to deformation but also preventing cuts. When the packaging trays are stacked, the upper and lower overlapping portions 16 can be stacked together, improving the tightness of the stacking between the packaging trays.
[0039] Preferably, the blister tray body 10 has several rows of acupoints 11, with adjacent acupoints 11 in the same row connected by a gripping position 13. The blister tray body 10 has several rows of acupoints 11, allowing for the placement of a large number of circuit boards 18. The connection between adjacent acupoints 11 via gripping positions 13 allows for more acupoints 11 to be provided on the blister tray body, thus improving the loading capacity of the packaging tray.
[0040] Preferably, the blister tray body 10 is a component made of one of the following materials: polyethylene terephthalate, polycarbonate, and acrylate. The blister tray body 10 is made of polyethylene terephthalate (PET), a mature and stable material with low cost.
[0041] Preferably, a code 17 is pressed onto the edge of the blister pack body 10. The code 17 is pressed into the mold of the blister pack body 10, which facilitates subsequent computer scanning and recording, and helps with material control.
[0042] In summary, the key design feature of this utility model is that the bottom wall of the acupoint 11 is partially sunken to form an empty space 14 and a first pressure space 15; a grasping space 13 with a depth greater than the empty space 14 is set on both sides of the acupoint 11; with this design, the grasping space can be made deeper, while the first pressure space 15 and the second pressure space 20 are set shallower, thereby reducing the total thickness of the packaging trays after stacking. The same size packaging box can hold more layers of packaging trays, improving the utilization rate of the packaging box and reducing packaging costs.
[0043] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A blister packaging tray for circuit boards, characterized in that: It includes a blister tray body; the blister tray body is provided with acupoints and grasping positions; the grasping positions are located on both sides of the acupoints and are connected to the acupoints; The bottom wall of the acupoint is subsided to form an empty space and a first pressure point; wherein, the depth of the grasping point is greater than the depth of the empty space.
2. The circuit board blister packaging tray according to claim 1, characterized in that: The depth d1 of the acupoint is between 7.0-8.0 mm; the depth d2 of the acupoint is between 8.0-9.0 mm; and the depth d3 of the first pressure point is between 13.5-14.5 mm.
3. A circuit board blister packaging tray according to claim 1 or 2, characterized in that: A second pressing position is provided on the bottom wall of the gripping position; the depth d4 of the gripping position is between 12-13 mm; the depth d5 of the second pressing position is between 13.5-14.5 mm.
4. The circuit board blister packaging tray according to claim 3, characterized in that: The thickness of the blister tray body is between 0.3-0.6mm.
5. The circuit board blister packaging tray according to claim 1, characterized in that: The sidewall of the acupoint protrudes to form a limiting part; the limiting part is embedded in the notch on the circuit board.
6. The circuit board blister packaging tray according to claim 1, characterized in that: The blister tray bodies can be stacked together, and positioning openings are provided at the corners of the blister tray bodies.
7. A circuit board blister packaging tray according to claim 1 or 6, characterized in that: The edge of the blister tray body is recessed to form a frame; the frame and the blister tray body form an overlapping part; the upper and lower overlapping parts can be stacked together.
8. The circuit board blister packaging tray according to claim 1, characterized in that: The blister pack body has several rows of acupoints, and adjacent acupoints in the same row are connected by a gripping position.
9. A circuit board blister packaging tray according to claim 1, characterized in that: The main body of the blister tray is a component made of one of the following materials: polyethylene terephthalate, polycarbonate, or acrylate.
10. A circuit board blister packaging tray according to claim 1 or 9, characterized in that: The edges of the blister tray body are embossed with codes.