Light source heat sink device
By employing a combined structure of a semiconductor cooler, heat dissipation components, and an intermediate heat-conducting layer in the light source heat dissipation device, along with a heat insulation layer and a sealed cavity design, the heat dissipation problem of light sources in small electronic devices is solved, achieving a high-efficiency and low-noise heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING ASU TECH CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-16
AI Technical Summary
The heat dissipation pressure of high-power light sources increases, and traditional heat dissipation devices are difficult to meet the heat dissipation requirements of small electronic devices. In addition, when large-size TECs are directly attached to small-size light sources, 'cold leakage' problems are likely to occur, resulting in reduced heat dissipation effect.
It adopts a combined structure of semiconductor cooler, heat dissipation component and intermediate heat conduction layer. The intermediate heat conduction layer completely covers the cold end face. Combined with the design of heat insulation layer and sealed cavity, it reduces the phenomenon of 'cold leakage' and improves the heat dissipation effect.
It achieves efficient heat dissipation for small-sized, high-power light sources, reduces noise, improves the reliability and lifespan of the heat sink, and reduces heat exchange losses.
Smart Images
Figure CN224364810U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device for a light source. Background Technology
[0002] As the brightness of light sources continues to increase, the power of these sources also increases. However, the size of high-power light sources is constantly shrinking, leading to a gradual increase in the heat dissipation pressure on them.
[0003] For example, in small electronic devices, the internal space is relatively small, and traditional heat dissipation devices such as fans are large in size and prone to noise, making it increasingly difficult to meet the heat dissipation requirements of light sources.
[0004] While conventional thermoelectric coolers (TECs) are quiet, under conditions of high heat dissipation requirements, the direct contact between a large TEC and a small light source can easily lead to "cold leakage," resulting in a significant reduction in the TEC's heat dissipation performance. Utility Model Content
[0005] The purpose of this utility model embodiment is to provide a heat dissipation device for a light source to improve the heat dissipation effect of the light source. The specific technical solution is as follows:
[0006] A heat dissipation device for a light source, comprising:
[0007] A semiconductor cooler, comprising a cold end face and a hot end face;
[0008] A heat dissipation component is disposed on the hot end face of the semiconductor cooler;
[0009] The intermediate heat-conducting layer includes a first heat-conducting surface and a second heat-conducting surface disposed opposite to each other, the first heat-conducting surface completely covering the cold end surface, and the second heat-conducting surface including a first region.
[0010] A light source is located in the first area.
[0011] In some embodiments, it also includes:
[0012] Insulation layer;
[0013] The second heat-conducting surface includes a second region surrounding the first region;
[0014] The heat insulation layer is disposed in the second region to isolate the second region from the outside air.
[0015] In some embodiments, a thermal insulation gap exists between the second region and the thermal insulation layer.
[0016] In some embodiments, the heat insulation layer has a first groove facing the second region, the first groove and the second region engaging to form the heat insulation gap; or,
[0017] The second region has a second groove facing the insulation layer, and the second groove and the insulation layer engage to form the insulation gap.
[0018] In some embodiments, the height of the thermal insulation gap is h, where 0.2mm ≤ h ≤ 2mm.
[0019] In some embodiments, the heat insulation layer is an annular body, with a first opening at a first end and a second opening at a second end;
[0020] The first opening is sealed to the intermediate heat-conducting layer, and the second opening is sealed to the heat dissipation component, forming a sealed cavity between the heat insulation layer and the heat dissipation component;
[0021] The semiconductor cooler is disposed within the sealed cavity.
[0022] In some embodiments, the sealed cavity is a negative pressure cavity, or the sealed cavity is filled with a protective gas to remove moisture from the sealed cavity.
[0023] In some embodiments, a telescopic gap is provided between the second opening and the heat dissipation component;
[0024] The expansion gap is sealed with a first elastic sealant.
[0025] In some embodiments, it also includes:
[0026] The flexible connection assembly includes: a connector and a spring;
[0027] The heat dissipation component is provided with a through hole, which connects to the sealed cavity;
[0028] The connector passes through the through hole, and the first end of the connector is connected to the intermediate heat-conducting layer. The spring is located outside the sealed cavity, sleeved on the connector, and compressed between the end cap of the second end of the connector and the heat dissipation component. Under the elastic force of the spring, the connector exerts a tensile force on the intermediate heat-conducting layer.
[0029] There is a movable gap between the through hole and the connector;
[0030] The movable gap is sealed with a second elastic sealant.
[0031] In some embodiments, the intermediate thermally conductive layer is a copper plate, a vacuum chamber heat exchanger, or a graphene plate;
[0032] The insulation layer is made of a non-metallic material, and / or the insulation layer has a porous structure.
[0033] The light source heat dissipation device provided in this embodiment includes a semiconductor cooler, a heat dissipation component, an intermediate heat-conducting layer, and a light source. The semiconductor cooler includes opposing cold and hot ends; the heat dissipation component is disposed on the hot end of the semiconductor cooler; the intermediate heat-conducting layer includes opposing first and second heat-conducting surfaces, the first heat-conducting surface completely covering the cold end, and the second heat-conducting surface including a first region; the light source is disposed in the first region. In this application, when the light source generates heat during operation, the heat emitted by the light source is transferred to the semiconductor cooler through the intermediate heat-conducting layer. Since the first heat-conducting surface of the intermediate heat-conducting layer completely covers the cold end of the semiconductor cooler, a large-size semiconductor cooler can be used to dissipate heat from a small-size, high-power heat source, reducing the problem of "cooling leakage" and thus improving the heat dissipation effect on the light source.
[0034] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0036] Figure 1 This is a cross-sectional structural diagram of a heat dissipation device for a light source provided in an embodiment of this application;
[0037] Figure 2 This is a cross-sectional structural diagram of a specific light source heat dissipation device provided in an embodiment of this application.
[0038] The attached figures are labeled as follows:
[0039] Semiconductor cooler 10, cold end face 11, hot end face 12, heat dissipation component 20, through hole 21, intermediate heat-conducting layer 30, first heat-conducting surface 31, second heat-conducting surface 32, first region 321, second region 322, light source 40, heat insulation layer 50, first groove 51, first elastic sealant 60, elastic connection component 70, connector 71, end cap 711, spring 72, second elastic sealant 80;
[0040] Thermal insulation gap A1, sealing cavity A2, expansion gap A3. Detailed Implementation
[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.
[0042] Large-size TECs have a larger cold end area. When they are attached to the heat-generating side of small-size light sources, the unattached part of the cold end of the TEC is prone to "cooling leakage", which greatly reduces the heat dissipation effect of the TEC.
[0043] Figure 1 This is a cross-sectional structural diagram of a heat dissipation device for a light source provided in an embodiment of this application, as shown below. Figure 1 As shown, to solve the above problems, this application provides a light source heat dissipation device, including: a semiconductor cooler 10, a heat dissipation component 20, an intermediate heat-conducting layer 30, and a light source 40. The semiconductor cooler 10 includes a cold end face 11 and a hot end face 12 facing each other; the heat dissipation component 20 is disposed on the hot end face 12 of the semiconductor cooler 10; the intermediate heat-conducting layer 30 includes a first heat-conducting surface 31 and a second heat-conducting surface 32 facing each other, the first heat-conducting surface 31 completely covers the cold end face 11, and the second heat-conducting surface 32 includes a first region 321; the light source 40 is disposed in the first region 321.
[0044] A thermoelectric cooler 10 is a device that generates cooling power using the thermoelectric effect of semiconductors; it is also known as a thermoelectric cooler. When two different metals are connected by a conductor and a direct current is applied, the temperature decreases at the cold end face 11 and increases at the hot end face 12. The thermoelectric cooler 10 can be a single-layer thermoelectric cooler, a multi-layer thermoelectric cooler, or a combination of multiple thermoelectric coolers. When the thermoelectric cooler 10 is a multi-layer thermoelectric cooler (stacked thermoelectric cooler), the multiple layers of thermoelectric coolers form opposing cold end faces 11 and hot end faces 12. When the thermoelectric cooler 10 is a combination of multiple thermoelectric coolers, the combination of multiple thermoelectric coolers forms opposing cold end faces 11 and hot end faces 12.
[0045] The semiconductor cooler 10 is noiseless, which makes the light source heat dissipation device operate with low noise.
[0046] The heat dissipation component 20 completely covers the hot end face 12 of the thermoelectric cooler 10. The heat dissipation component 20 can be a metal plate connected to the water-cooling structure, such as a copper plate or an aluminum plate. Alternatively, the heat dissipation component 20 can be a heat-conducting structure connected to other active or passive heat sinks via heat pipes.
[0047] After thermal interface materials are provided between the heat dissipation component 20 and the hot end face 12 of the semiconductor cooler 10, between the first thermally conductive surface 31 of the intermediate thermally conductive layer 30 and the cold end face 11 of the semiconductor cooler 10, and between the light source 40 and the first region 321 of the second thermally conductive surface 32 of the intermediate thermally conductive layer 30, they are pressed and fixed or fixed by soldering. The thermal interface material can be thermally conductive silicone, thermally conductive pad or phase change thermally conductive material.
[0048] In the technical solution of this application, when the light source 40 is working and generating heat, the heat emitted by the light source 40 is transferred to the semiconductor cooler 10 through the intermediate heat-conducting layer 30. The first heat-conducting surface 31 of the intermediate heat-conducting layer 30 completely covers the cold end surface 11 of the semiconductor cooler 10, reducing the problem of "cooling leakage". Thus, a large-size semiconductor cooler 10 can be used to dissipate heat from the small-size high-power heat source light source 40, thereby improving the heat dissipation effect of the light source 40.
[0049] Figure 2 A cross-sectional view of a specific light source heat dissipation device provided in this application embodiment is shown below. Figure 2 As shown, the heat dissipation device for the light source also includes: a heat insulation layer 50; the second heat-conducting surface 32 includes a second region 322 surrounding the first region 321; the heat insulation layer 50 is disposed in the second region 322, blocking the second region 322 from the outside air.
[0050] The heat insulation layer 50 can be made of non-metallic materials with poor thermal conductivity, such as plastics, glass, ceramics, etc. The heat insulation layer 50 is used to reduce the heat exchange between the intermediate heat-conducting layer 30 and the environment, thereby reducing the waste of cooling capacity of the cold end face 11 of the semiconductor cooler 10 and further improving the cooling capacity of the semiconductor cooler 10 for the light source 40.
[0051] In some embodiments, the intermediate heat-conducting layer 30 further includes a side surface, which is connected to the first heat-conducting surface 31 and the second heat-conducting surface 32. The heat insulation layer 50 is also disposed on the side surface of the intermediate heat-conducting layer 30, thereby further reducing the heat exchange between the cold end face 11 of the thermoelectric cooler 10 and the environment, and improving the cooling capacity of the thermoelectric cooler 10 for the light source 40.
[0052] A heat insulation gap A1 is provided between the second region 322 and the heat insulation layer 50. The height of the heat insulation gap A1 is h, which is 0.2 mm ≤ h ≤ 2 mm. For example, h can be between 0.5 mm and 1 mm. The height direction of the heat insulation gap A1 is the same as the height direction of the thermoelectric cooler 10, which is the direction from the hot end face 12 to the cold end face 11. The heat insulation gap A1 is used to reduce heat exchange between the intermediate heat-conducting layer 30 and the environment, further improving the cooling capacity of the thermoelectric cooler 10 for the light source 40.
[0053] In a specific implementation, the heat insulation layer 50 has a first groove 51 facing the second region 322, and the first groove 51 and the second region 322 engage to form the heat insulation gap A1. The first groove 51 can be a first annular groove, projected in the height direction of the semiconductor cooler 10, and the first annular groove surrounds the light source 40.
[0054] Alternatively, the second region 322 has a second groove (not shown) facing the heat insulation layer 50, which engages with the heat insulation layer 50 to form the heat insulation gap A1. The second groove may be a second annular groove, projected in the height direction of the thermoelectric cooler 10, and the second annular groove surrounds the light source 40.
[0055] The heat insulation layer 50 is annular, with a first opening at one end and a second opening at the other end. The first opening is sealed to the intermediate heat-conducting layer 30, and the second opening is sealed to the heat dissipation component 20, forming a sealed cavity A2 between the heat insulation layer 50 and the heat dissipation component 20. The thermoelectric cooler 10 is disposed within the sealed cavity A2. This further reduces heat exchange between the cold end face 11 of the thermoelectric cooler 10 and the environment, improving the cooling capacity of the thermoelectric cooler 10 for the light source 40. Simultaneously, the sealed cavity A2 isolates external water vapor, reducing the possibility of condensation forming at the thermoelectric cooler 10 and improving the reliability and lifespan of the thermoelectric cooler 10.
[0056] Specifically, the sealed cavity A2 can be evacuated to create a negative pressure cavity, or the humidity inside the sealed cavity A2 can be controlled, for example, by filling it with a protective gas to remove moisture from the sealed cavity A2. This further reduces the possibility of condensation forming at the thermoelectric cooler 10, improving the reliability and lifespan of the thermoelectric cooler 10. Furthermore, evacuating the sealed cavity A2 can further reduce heat exchange between the intermediate heat-conducting layer 30 and the environment, improving the cooling capacity of the thermoelectric cooler 10 for the light source 40.
[0057] The intermediate thermally conductive layer 30 has a high thermal conductivity structure, such as a copper plate, a vacuum chamber (VC) heat spreader, or a graphene plate. For example, when the intermediate thermally conductive layer 30 is a copper plate, the coefficient of thermal expansion of copper is 17 × 10⁻⁶. -6 / ℃, the surface of the semiconductor cooler 10 is generally made of alumina ceramic or aluminum nitride ceramic, and the coefficients of thermal expansion of alumina ceramic and aluminum nitride ceramic are 7×10. -6 / ℃, 5×10 -6The difference in thermal expansion coefficients between the intermediate heat-conducting layer 30 and the semiconductor cooler 10 is relatively large at / ℃. Therefore, during the operation of the light source heat dissipation device, due to the different thermal expansion coefficients of the different materials, additional forces will be generated when the ambient temperature changes significantly. This can easily cause the semiconductor cooler 10 to be subjected to additional pressure, resulting in a decrease in its performance or even damage.
[0058] In this embodiment of the solution, there is a telescopic gap A3 between the second opening and the heat dissipation component 20; the telescopic gap A3 is sealed with a first elastic sealant 60.
[0059] The first elastic sealant 60 can be 704 silicone rubber, which is a rubber-type sealant, or it can be polyurethane rubber, neoprene rubber, butyl rubber, etc. The first elastic sealant 60 connects the second opening and the heat dissipation component 20. The Young's modulus of the first elastic sealant 60 can generally be lower than 3 MPa. Because the first elastic sealant 60 is elastic, when the semiconductor cooler 10 and the intermediate heat-conducting layer 30 have different coefficients of thermal expansion due to different materials, additional forces are generated when the ambient temperature changes significantly. The second opening and the heat dissipation component 20 can move relative to each other, causing the expansion gap A3 to change, thereby reducing the additional pressure on the semiconductor cooler 10 and reducing the risk of its performance degradation or even damage.
[0060] In practice, the expansion gap A3 between the second opening and the heat dissipation component 20 can also be sealed by an elastic sealing ring, such as a rubber sealing ring. For example, the rubber sealing ring can wrap around the outer wall of the second opening and the heat dissipation component, but is not limited thereto.
[0061] In some embodiments, the light source heat dissipation device further includes: an elastic connection assembly 70, which includes: a connector 71 and a spring 72; the heat dissipation component 20 is provided with a through hole 21, which communicates with the sealed cavity A2; the connector 71 passes through the through hole 21, and the first end of the connector 71 is connected to the intermediate heat-conducting layer 30; the spring 72 is located outside the sealed cavity A2, sleeved on the connector 71, and compressed between the end cap 711 of the second end of the connector 71 and the heat dissipation component 20; under the elastic force of the spring 72, the connector 71 exerts a pulling force on the intermediate heat-conducting layer 30; there is a movable gap between the through hole 21 and the connector 71; the movable gap is sealed with a second elastic sealant 80. The spring 72 is configured to maintain the semiconductor cooler 10 at its appropriate pressure.
[0062] The second elastic sealant 80 can be 704 silicone rubber, which is a rubber-type sealant, or it can be polyurethane rubber, neoprene rubber, butyl rubber, etc. The second elastic sealant 80 connects the through hole 21 and the connector 71. The Young's modulus of the second elastic sealant 80 can generally be lower than 3 MPa.
[0063] During assembly, the connector 71 and spring 72 are assembled first, and then 704 silicone rubber is used to seal the movement gap to form a second elastic sealant 80.
[0064] The connector 71 can be either a screw or a bolt.
[0065] Because the second elastic sealant 80 is elastic, when the semiconductor cooler 10 and the intermediate heat-conducting layer 30 generate additional forces due to the different thermal expansion coefficients of the different materials, the connector 71 can move up and down within the through hole 21, thereby reducing the additional pressure on the semiconductor cooler 10 and reducing the problem of its performance degradation or even damage.
[0066] In addition, compared with the thermoelectric cooler 10, the heat dissipation component 20 and the intermediate heat-conducting layer 30 have a higher coefficient of thermal expansion. At low temperatures, the heat dissipation component 20 and the intermediate heat-conducting layer 30 shrink more. Under the action of the spring, the heat dissipation component 20 and the intermediate heat-conducting layer 30 "clamp" the thermoelectric cooler 10, so that the heat dissipation component 20 and the intermediate heat-conducting layer 30 form good contact pressure with the thermoelectric cooler 10, and avoid the TIM (thermal interface material, such as thermal pad, thermal grease, phase change plate, etc.) from reducing its thermal conductivity due to insufficient pressure.
[0067] Specifically, in some other embodiments, the heat insulation layer 50 may have a porous structure, such as being made of foam. The porous structure further enhances the heat insulation capability of the heat insulation layer 50, thereby reducing heat exchange between the intermediate heat-conducting layer 30 and the environment, and improving the cooling capacity of the semiconductor cooler 10 for the light source 40. When applied to the aforementioned negative pressure cavity, the porous structure can be a closed-cell structure.
[0068] In other embodiments, the insulation layer 50 can be a polymer, such as rubber, PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), PA (polyamide, also known as nylon), etc. When applied to the above-mentioned negative pressure cavity, the polymer can be PC, ABS, PA, etc.
[0069] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.
Claims
1. A heat dissipation device for a light source, characterized in that, include: A semiconductor cooler (10) includes a cold end face (11) and a hot end face (12) opposite each other; A heat dissipation component (20) is disposed on the hot end face (12) of the semiconductor cooler (10); The intermediate heat-conducting layer (30) includes a first heat-conducting surface (31) and a second heat-conducting surface (32) disposed opposite to each other. The first heat-conducting surface (31) completely covers the cold end surface (11), and the second heat-conducting surface (32) includes a first region (321). A light source (40) is disposed in the first region (321).
2. The heat dissipation device for the light source according to claim 1, characterized in that, Also includes: Insulation layer (50); The second heat-conducting surface (32) includes a second region (322) surrounding the first region (321); The heat insulation layer (50) is disposed in the second region (322) to block the second region (322) from the outside air.
3. The light source heat dissipation device according to claim 2, characterized in that, There is a thermal insulation gap (A1) between the second region (322) and the thermal insulation layer (50).
4. The light source heat dissipation device according to claim 3, characterized in that, The heat insulation layer (50) has a first groove (51) facing the second region (322), the first groove (51) and the second region (322) engaging to form the heat insulation gap (A1); or, The second region (322) has a second groove facing the heat insulation layer (50), and the second groove and the heat insulation layer (50) engage to form the heat insulation gap (A1).
5. The light source heat dissipation device according to claim 4, characterized in that, The height of the insulation gap (A1) is h, where 0.2mm ≤ h ≤ 2mm.
6. The light source heat dissipation device according to any one of claims 2 to 5, characterized in that, The heat insulation layer (50) is an annular body, with a first opening at the first end and a second opening at the second end; The first opening is sealed to the intermediate heat-conducting layer (30), and the second opening is sealed to the heat dissipation component (20), forming a sealed cavity (A2) between the heat insulation layer (50) and the heat dissipation component (20); The semiconductor cooler (10) is disposed inside the sealed cavity (A2).
7. The light source heat dissipation device according to claim 6, characterized in that, The sealed cavity (A2) is a negative pressure cavity, or the sealed cavity (A2) is filled with a protective gas to remove water vapor from the sealed cavity (A2).
8. The light source heat dissipation device according to claim 6, characterized in that, There is a telescopic gap (A3) between the second opening and the heat dissipation component (20); The expansion gap (A3) is sealed with a first elastic sealant (60) or an elastic sealing ring.
9. The light source heat dissipation device according to claim 8, characterized in that, Also includes: The resilient connection assembly (70) includes: a connector (71) and a spring (72); The heat dissipation component (20) is provided with a through hole (21), which connects to the sealed cavity (A2); The connector (71) passes through the through hole (21), and the first end of the connector (71) is connected to the intermediate heat-conducting layer (30). The spring (72) is located outside the sealed cavity (A2), sleeved on the connector (71), and compressed between the end cap (711) of the second end of the connector (71) and the heat dissipation component (20). Under the elastic force of the spring (72), the connector (71) forms a tension on the intermediate heat-conducting layer (30). There is a movable gap between the through hole (21) and the connector (71); The movable gap is sealed with a second elastic sealant (80).
10. The light source heat dissipation device according to claim 2, characterized in that, The intermediate heat-conducting layer (30) is a copper plate, a vacuum cavity heat exchange plate, or a graphene plate; The heat insulation layer (50) is made of a non-metallic material, and / or the heat insulation layer (50) has a porous structure.