Optical module
By setting first and second support components in the optical module, the impact force is evenly distributed by elastic elements, which solves the problem of displacement and breakage of the circuit board under vibration or impact, and improves the stability of the optical module and the signal transmission quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INNOLIGHT TECHNOLOGY (SUZHOU) LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-16
AI Technical Summary
When optical modules are subjected to mechanical vibration or impact, the circuit board cannot be effectively supported and buffered, which can easily lead to displacement, deformation or even breakage, affecting signal transmission quality and service life.
The first and second support components, including a first boss, a second boss, and an elastic element, are respectively disposed between the two sides of the circuit board and the housing. The elastic element evenly disperses the impact force, increases the number of support points, and reduces the impact on the circuit board and electronic components.
It effectively reduces the risk of loosening and damage to the circuit board due to vibration, ensures the stable and reliable operation of the optical module in complex environments, and improves its service life and signal transmission quality.
Smart Images
Figure CN224366230U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical communication technology, specifically to an optical module. Background Technology
[0002] In the current era of rapid development in optical communication technology, optical modules, as the core component for photoelectric signal conversion, directly impact the operational quality of the entire communication system. An optical module consists of a housing and a circuit board and electronic components housed within it. Supports on the housing abut against the circuit board to secure it. To meet performance requirements, the internal circuit board area of optical modules is continuously increasing, and more and more irregularly shaped circuit boards are being used. When an optical module is subjected to mechanical vibration or impact, the circuit board cannot receive effective support and cushioning, easily leading to displacement, deformation, or even breakage. This results in unstable circuit connections, damage to electronic components, and severely affects the signal transmission quality and lifespan of the optical module. Utility Model Content
[0003] This application provides an optical module that can more evenly distribute the impact force on the circuit board, improve the optical module's ability to resist mechanical vibration and impact, and improve the stability and reliability of the optical module.
[0004] This application provides an optical module, including:
[0005] The housing includes a first housing and a second housing, the first housing and the second housing surrounding a receiving cavity;
[0006] A circuit board is disposed in the receiving cavity, the circuit board having a first side and a second side facing each other, the first side of the circuit board facing the first housing, and the second side of the circuit board facing the second housing;
[0007] The cavity contains a first support assembly, which includes a first boss, a second boss, a first elastic member, and a second elastic member. The first boss is disposed on the first housing, the second boss is disposed on the second housing, the first elastic member is disposed between the first boss and the first surface of the circuit board, and the second elastic member is disposed between the second boss and the second surface of the circuit board.
[0008] In some embodiments, the receiving cavity is further provided with a second support assembly, the second support assembly including a third boss and a fourth boss and a third elastic member, the third boss being disposed on the first housing and spaced apart from the first boss, and the fourth boss being disposed on the second housing and spaced apart from the second boss;
[0009] The third elastic element is disposed between the first surface of the circuit board and the third boss; or,
[0010] The third elastic element is disposed between the second surface of the circuit board and the fourth boss.
[0011] In some embodiments, the elastic modulus of the first elastic element and the elastic modulus of the second elastic element are both less than the elastic modulus of the third elastic element.
[0012] In some embodiments, the circuit board further has four sides connected between the first side and the second side, and the intersection of two adjacent sides is a corner;
[0013] The number of the second support components is four, and each second support component is respectively located near the four corners of the circuit board;
[0014] The first support component is positioned near the middle of the two pairs of circuit boards; or, the first support component is positioned between two adjacent pairs of the second support components.
[0015] In some embodiments, the circuit board has a notch near the center, and the first support component is disposed around the notch.
[0016] In some embodiments, both the first elastic member and the second elastic member are thermally conductive adhesives, with the first elastic member bonded to the end of the first boss facing the circuit board, and the second elastic member bonded to the end of the second boss facing the circuit board; and / or,
[0017] The first boss and the first housing are integrally formed; and / or,
[0018] The second boss and the second housing are integrally formed.
[0019] In some embodiments, a heat dissipation part is further provided in the receiving cavity. The heat dissipation part extends from the housing toward the circuit board. A thermally conductive adhesive layer is provided between the heat dissipation part and the circuit board. When the heat dissipation part is provided in the first housing, the height of the heat dissipation part is the same as the height of the first boss. When the heat dissipation part is provided in the second housing, the height of the heat dissipation part is the same as the height of the second boss.
[0020] In some embodiments, the elastic modulus of the thermally conductive adhesive layer is the same as that of the first elastic element.
[0021] In some embodiments, the area of the end face of the first boss facing the circuit board is S1, satisfying: 1mm 2 ≤S1≤3mm 2 ;
[0022] The area of the end face of the second boss facing the circuit board is S2, which satisfies: 1mm. 2 ≤S2≤3mm 2 ;
[0023] In the thickness direction of the optical module, the center lines of the first boss, the second boss, the first elastic member, and the second elastic member are collinear.
[0024] In some embodiments, the gap between the first boss and the first surface of the circuit board is G1, which satisfies: 0.2mm≤G1≤0.5mm;
[0025] The gap between the second boss and the second surface of the circuit board is G2, which satisfies: 0.2mm≤G2≤0.5mm;
[0026] Before the first housing, the circuit board, and the second housing are assembled, the thickness of the first elastic member is greater than the gap G1 between the first boss and the circuit board, and the thickness of the second elastic member is greater than the gap G2 between the second boss and the circuit board.
[0027] Beneficial Effects: Compared with the prior art, the optical module provided in this application, by respectively setting the first elastic element between the first protrusion and the first surface of the circuit board and between the second protrusion and the second surface of the circuit board, not only increases the support points of the circuit board, but also allows the first elastic element to distribute the impact force on the circuit board more evenly. This arrangement effectively reduces the impact force on the circuit board and the electronic components on the circuit board, reduces the risk of loosening and damage to electronic components due to vibration, and also avoids displacement, deformation, or even breakage of the circuit board, ensuring the stable and reliable operation of the optical module in complex working environments, and improving the service life and signal transmission quality of the optical module. Compared with not setting the first elastic element, i.e., the first and second protrusions are in direct contact with the circuit board, the optical module of this application with the first elastic element greatly improves the support effect of the first support component, thereby reducing the number of the first support components and saving circuit board space. Attached Figure Description
[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0029] Figure 1 This is a schematic diagram of the planar structure of an embodiment of the optical module of this application;
[0030] Figure 2 It is along Figure 1 Schematic diagram of the cross section of line AA in the middle;
[0031] Figure 3 yes Figure 2 A magnified schematic diagram of the partial structure at point A in the middle;
[0032] Figure 4 yes Figure 2 A magnified schematic diagram of the local structure at point B;
[0033] Figure 5 This is a three-dimensional structural schematic diagram of one embodiment of the optical module of this application;
[0034] Figure 6 yes Figure 5 The diagram shows the exploded structure of the optical module.
[0035] Figure 7 This is a three-dimensional structural schematic diagram of another embodiment of the optical module of this application;
[0036] Figure 8 yes Figure 7 The diagram shows the exploded structure of the optical module.
[0037] Explanation of reference numerals in the attached figures:
[0038] 100. Optical module; 1. Housing; 11. First housing; 111. First side wall; 112. First bottom wall; 113. First mounting hole; 12. Second housing; 121. Second side wall; 122. Second bottom wall; 123. Second mounting hole; 124. Positioning post; 13. Receiving cavity; 14. First support assembly; 141. First boss; 142. Second boss; 143. First elastic element; 144. Second elastic element; 15. Second support assembly; 151. Third boss; 152. Fourth boss; 153. Third elastic element; 16. Heat dissipation part; 17. Thermally conductive adhesive layer; 2. Circuit board; 21. First surface; 22. Second surface; 23. Positioning port; 24. Notch; 25. Side; 26. Corner. Detailed Implementation
[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.
[0040] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0041] This application provides an optical module, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0042] Reference Figure 1 and Figure 2 One embodiment of this application provides an optical module 100, which includes a housing 1, a circuit board 2, and electronic components (not shown). The electronic components may be, for example, a DSP chip (digital signal processing chip), a laser driver, a TIA (transimpedance amplifier), etc. The circuit board 2 and the electronic components are mounted inside the housing 1, and the electronic components are electrically connected to the circuit board 2.
[0043] Specifically, refer to Figure 2 The housing 1 may include a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 may be made of metal, or other materials. The first housing 11 and the second housing 12 enclose a receiving cavity 13. The circuit board 2 and electronic devices are mounted within the receiving cavity 13. The circuit board 2 has a first surface 21 and a second surface 22 disposed opposite to each other, with the first surface 21 facing the first housing 11 and the second surface 22 facing the second housing 12. Electronic devices may be disposed on the first surface 21 and / or the second surface 22 of the circuit board 2.
[0044] Among them, reference Figure 2 and Figure 3 A first support assembly 14 is disposed within the accommodating cavity 13. The first support assembly 14 includes a first boss 141, a second boss 142, a first elastic element 143, and a second elastic element 144. In the thickness direction of the optical module 100, the center lines of the first boss 141, the second boss 142, the first elastic element 143, and the second elastic element 144 are collinear to improve the stability of the support provided by the first support assembly 14. The first boss 141 is disposed on the first housing 11, with its end facing the circuit board 2 spaced apart from the first surface 21 of the circuit board 2. The first boss 141 and the first housing 11 are integrally formed. The second boss 142 is disposed on the second housing 12, with its end facing the circuit board 2 spaced apart from the second surface 22 of the circuit board 2. The second boss 142 and the second housing 12 are integrally formed. (Refer to...) Figure 3 The first elastic member 143 is disposed between the first boss 141 and the first surface 21 of the circuit board 2, and the second elastic member 144 is disposed between the second boss 142 and the second surface 22 of the circuit board 2.
[0045] The first elastic element 143 and the second elastic element 144 can be respectively disposed on the first surface 21 and the second surface 22 of the circuit board 2. Alternatively, the first elastic element 143 and the second elastic element 144 can be respectively disposed on one end of the first boss 141 facing the circuit board 2 and the other end of the second boss 142 facing the circuit board 2. Both the first elastic element 143 and the second elastic element 144 are made of elastic material. In this embodiment, both the first elastic element 143 and the second elastic element 144 are thermally conductive adhesives. The first elastic element 143 is bonded to the end of the first boss 141 facing the circuit board 2, and the second elastic element 144 is bonded to the end of the second boss 142 facing the circuit board 2. The thermally conductive adhesive can be applied to the first boss 141 and the second boss 142 by dispensing, which is not only simple to operate but also highly efficient, thereby reducing production costs and improving production efficiency.
[0046] After the optical module 100 is assembled, the first elastic element 143 and the second elastic element 144 are compressed and deformed. This not only absorbs assembly tolerances, but the elastic deformation of the first elastic element 143 and the second elastic element 144 also generates elastic force to restrict the movement of the circuit board 2, ensuring the stability of the circuit board 2's position. At the same time, the first elastic element 143 and the second elastic element 144 can more evenly distribute the impact force on the circuit board 2, effectively reducing the impact force on the circuit board 2 and the electronic components on the circuit board 2, reducing the risk of loosening and damage to electronic components due to vibration, and also preventing the circuit board 2 from displacement, deformation, or even breakage. This ensures the stable and reliable operation of the optical module 100 in complex working environments, and improves the service life and signal transmission quality of the optical module 100.
[0047] To minimize the area occupied on circuit board 2 used for laying out electronic components, while still providing effective support for circuit board 2, the dimensions of the first boss 141 and the second boss 142 need to be controlled. For example, refer to... Figure 6 The area of the end face of the first protrusion 141 facing the circuit board 2 is S1, which satisfies: 1mm 2 ≤S1≤3mm 2 For example, the end face area S1 of the first boss 141 can be 1.0 mm², 1.2 mm², or 1.4 mm². 2 1.6mm 2 1.8mm 2 2.0mm 2 2.2mm 2 2.4mm 2 2.6mm 2 2.8mm 2 3.0mm 2 Any value in the range, or any value in between. (See reference...) Figure 8 The area of the end face of the second protrusion 142 facing the circuit board 2 is S2, which satisfies: 1mm 2 ≤S2≤3mm 2 For example, the end face area S2 of the second boss 142 can be 1.0 mm. 2 1.2mm 2 1.4mm 2 1.6mm 2 1.8mm 2 2.0mm 2 2.2mm 2 2.4mm 2 2.6mm 2 2.8mm 2 3.0mm 2 Any value in the range, or any value between the two.
[0048] Before the first housing 11, circuit board 2, and second housing 12 are assembled, the thickness of the first elastic member 143 is greater than the gap G1 between the first boss 141 and the circuit board 2, and the thickness of the second elastic member 144 is greater than the gap G2 between the second boss 142 and the circuit board 2, to ensure stable contact between the first elastic member 143 and the second elastic member 144 and the circuit board 2. For example, refer to... Figure 3The gap between the first protrusion 141 and the first surface 21 of the circuit board 2 is G1, which satisfies the condition: 0.2mm ≤ G1 ≤ 0.5mm. For example, the gap G1 between the first protrusion 141 and the first surface 21 of the circuit board 2 can be any value among 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, or any value between any two. The gap between the second protrusion 142 and the second surface 22 of the circuit board 2 is G2, which satisfies the condition: 0.2mm ≤ G2 ≤ 0.5mm. For example, the gap G2 between the second protrusion 142 and the second surface 22 of the circuit board 2 can be any value among 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, or any value between any two.
[0049] Reference Figures 5 to 8 The first housing 11 may include a first sidewall 111 and a first bottom wall 112 facing the receiving cavity 13. A first boss 141 and a third boss 151 are integrally formed with the first bottom wall 112. The second housing 12 may include a second sidewall 121 and a second bottom wall 122 facing the receiving cavity 13. A second boss 142 and a fourth boss 152 are integrally formed with the second bottom wall 122. When the first housing 11 and the second housing 12 are connected, the first sidewall 111 and the second sidewall 121 can contact each other and together with the first bottom wall 112 and the second bottom wall 122 form the receiving cavity 13.
[0050] The first housing 11 and the second housing 12 are detachably connected, for example, by means of snap-fit or screw locking. (See reference...) Figure 6 and Figure 8 The first housing 11 is provided with a first mounting hole 113, and the second housing 12 is provided with a corresponding second mounting hole 123. Screws (not shown) can be used to mount the first housing 11 to the first mounting hole 113 and the second mounting hole 123 to securely connect the two housings. The first mounting hole 113 can be a non-through hole, located on the inner surface of the first housing 11 to ensure the aesthetic appearance of the outer surface of the first housing 11. The second mounting hole 123 can be a through hole, allowing one end of a screw to pass through the second mounting hole 123 and be fixed to the first mounting hole 113.
[0051] Reference Figure 8 The first housing 11 and / or the second housing 12 are provided with positioning posts 124. The circuit board 2 is correspondingly provided with a positioning opening 23. The positioning posts 124 and the positioning opening 23 cooperate with each other to restrict the movement of the circuit board 2. For example, the cooperation of the positioning posts 124 and the positioning opening 23 can restrict the movement of the circuit board 2 in the horizontal direction. As an example, refer to... Figure 8The positioning post 124 is disposed on the second housing 12. When the circuit board 2 is mounted on the second housing 12, the positioning post 124 and the positioning hole 23 not only restrict the horizontal movement of the circuit board 2, but also have a guiding function to ensure the accuracy of the mounting position of the circuit board 2. The positioning post 124 can be coaxially arranged with the second mounting hole 123, which can reduce the area occupied by the positioning post 124 and the second mounting hole 123 while ensuring performance, thereby improving the space utilization efficiency of the housing 1.
[0052] In one specific implementation, refer to Figure 3 The cavity 13 also houses a second support assembly 15, which includes a third protrusion 151 and a fourth protrusion 152 disposed opposite to each other, and a third elastic member 153. In the thickness direction of the optical module 100, the center lines of the third protrusion 151, the fourth protrusion 152, and the third elastic member 153 are collinear to improve the stability of the second support assembly 15. The third protrusion 151 is disposed on the first housing 11 and spaced apart from the first protrusion 141; the third protrusion 151 and the first housing 11 are integrally formed. The fourth protrusion 152 is disposed on the second housing 12 and spaced apart from the second protrusion 142; the fourth protrusion 152 and the second housing 12 are integrally formed.
[0053] Among them, reference Figure 4 The third elastic element 153 can be disposed between the first surface 21 of the circuit board 2 and the third boss 151; and / or, the third elastic element 153 can be disposed between the second surface 22 of the circuit board 2 and the fourth boss 152. The third elastic element 153 can not only absorb assembly tolerances through compression deformation, but also the elastic force generated by the elastic deformation of the third elastic element 153 can restrict the movement of the circuit board 2, ensuring the stability of the position of the circuit board 2.
[0054] The third elastic element 153 is, for example, a soft pad that can be adhered to the circuit board 2. The difference between the third elastic element 153 and the first elastic element 143 is that the elastic modulus of the first elastic element 143 is lower than that of the third elastic element 153. The first elastic element 143 deforms more easily than the third elastic element 153, thus it is more effective at dispersing the impact force on the circuit board 2. For example, the first elastic element 143 has a modulus of 0.5 MPa to 5 MPa, while the third elastic element 153 has a modulus of 2 GPa to 10 GPa, creating a stiffness gradient. The third elastic element 153 is used to absorb assembly tolerances while ensuring the assembly accuracy of the circuit board 2. In practical applications, the second support assembly 15 needs to be positioned close to the first mounting hole 113 and the second mounting hole 123 and secured with screws to prevent deformation of the housing 1. The first support assembly 14, however, does not require screws and can be used in optical modules 100 with limited space.
[0055] Reference Figure 6 and Figure 8 The circuit board 2 also has four side surfaces 25 connecting the first surface 21 and the second surface 22, with corners 26 where adjacent side surfaces 25 meet. The overall structure of the circuit board 2 is roughly in the shape of a cuboid, and the corners 26 should be understood as the four corner positions of this cuboid. The number of second support components 15 can be four. The four second support components 15 are respectively located near the four corners of the circuit board 2.
[0056] The first support component 14 can be positioned close to the middle of the circuit board 2 to disperse the impact force on the circuit board 2 to the greatest extent, thereby reducing the impact force on the circuit board 2 and the electronic components on the circuit board 2, reducing the risk of loosening and damage to the electronic components due to vibration, and also preventing the circuit board 2 from being displaced, deformed or even broken.
[0057] In some embodiments, refer to Figure 6 and Figure 8 When the circuit board 2 is irregularly shaped, the first support component 14 can be positioned near a location where the structural strength of the circuit board 2 is weak. As an example, the circuit board 2 has a notch 24 near the center, and the first support component 14 is positioned around the notch 24.
[0058] In other embodiments, the first support component 14 may also be disposed between two adjacent pairs of second support components 15. The first support component 14 may be disposed close to the edge of the circuit board 2. The number of first support components 14 may be one or more, depending on the actual situation.
[0059] Reference Figure 6 and Figure 8 The cavity 13 may also be equipped with a heat dissipation section 16, which extends from the housing 1 toward the circuit board 2. A thermally conductive adhesive layer 17 is provided between the heat dissipation section 16 and the circuit board 2. When the electronic components on the circuit board 2 are in operation, they generate heat. This heat can be conducted to the housing 1 through the thermally conductive adhesive layer 17 and the heat dissipation section 16, and then dissipated into the air through the housing 1. This effectively dissipates the heat generated by the circuit board 2, reduces the operating temperature of the circuit board 2, improves the performance and stability of the optical module 100, and extends its service life.
[0060] When the heat dissipation part 16 is disposed on the first housing 11, the height of the heat dissipation part 16 can be the same as the height of the first boss 141. When the heat dissipation part 16 is disposed on the second housing 12, the height of the heat dissipation part 16 can be the same as the height of the second boss 142. That is to say, the heat dissipation part 16 and the first boss 141 or the second boss 142 can adopt the same or similar structure, which facilitates manufacturing.
[0061] The elastic modulus of the thermally conductive adhesive layer 17 is the same as that of the first elastic element 143. In this way, the thermally conductive adhesive layer 17 not only has heat dissipation performance, but also disperses the impact force on the circuit board 2, further ensuring the stable and reliable operation of the optical module 100 in complex working environments.
[0062] More preferably, the first elastic element 143 can be made of the same material as the thermally conductive adhesive layer 17. In this way, the first elastic element 143 can not only disperse the impact force on the circuit board 2, but also has heat dissipation performance, further improving the heat dissipation effect of the optical module 100. When the first elastic element 143 and the thermally conductive adhesive layer 17 are made of the same material, and the heat dissipation part 16 and the first boss 141 or the second boss 142 adopt the same or similar structure, the first elastic element 143 and the thermally conductive adhesive layer 17 can both be formed by dispensing, thereby further reducing production costs and improving production efficiency.
[0063] The above provides a detailed description of an optical module provided by this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. An optical module characterized by comprising: include: The housing (1) includes a first housing (11) and a second housing (12), the first housing (11) and the second housing (12) forming a receiving cavity (13); Circuit board (2), the circuit board (2) is disposed in the receiving cavity (13), the circuit board (2) has a first side (21) and a second side (22) facing each other, the first side (21) of the circuit board (2) is disposed facing the first housing (11), and the second side (22) of the circuit board (2) is disposed facing the second housing (12); The cavity (13) contains a first support assembly (14), which includes a first boss (141), a second boss (142), a first elastic member (143), and a second elastic member (144). The first boss (141) is disposed on the first housing (11), the second boss (142) is disposed on the second housing (12), the first elastic member (143) is disposed between the first boss (141) and the first surface (21) of the circuit board (2), and the second elastic member (144) is disposed between the second boss (142) and the second surface (22) of the circuit board (2).
2. The optical module according to claim 1, characterized by The receiving cavity (13) is further provided with a second support assembly (15), the second support assembly (15) includes a third boss (151) and a fourth boss (152) and a third elastic member (153). The third boss (151) is disposed in the first housing (11) and spaced apart from the first boss (141). The fourth boss (152) is disposed in the second housing (12) and spaced apart from the second boss (142). The third elastic element (153) is disposed between the first surface (21) of the circuit board (2) and the third boss (151); or, The third elastic member (153) is disposed between the second surface (22) of the circuit board (2) and the fourth boss (152).
3. The optical module according to claim 2, characterized by The elastic modulus of the first elastic element (143) and the elastic modulus of the second elastic element (144) are both less than the elastic modulus of the third elastic element (153).
4. The optical module according to claim 2, characterized in that, The circuit board (2) also has four side surfaces (25) connected between the first surface (21) and the second surface (22), and the intersection of two adjacent side surfaces (25) is a corner (26); The number of the second support components (15) is four, and each of the second support components (15) is respectively located near the four corners of the circuit board (2); The first support component (14) is located near the middle of the circuit board (2); or the first support component (14) is located between two adjacent pairs of second support components (15).
5. The optical module of claim 1, wherein, The circuit board (2) has a notch (24) near the center, and the first support component (14) is disposed around the notch (24).
6. The optical module of claim 1, wherein, Both the first elastic element (143) and the second elastic element (144) are made of thermally conductive adhesive. The first elastic element (143) is bonded to the end of the first boss (141) facing the circuit board (2), and the second elastic element (144) is bonded to the end of the second boss (142) facing the circuit board (2); and / or, The first boss (141) and the first housing (11) are integrally formed; and / or, The second boss (142) and the second housing (12) are integrally formed.
7. The optical module of claim 1, wherein, The cavity (13) is further provided with a heat dissipation part (16), which extends from the housing (1) toward the circuit board (2). A thermally conductive adhesive layer (17) is provided between the heat dissipation part (16) and the circuit board (2). When the heat dissipation part (16) is provided in the first housing (11), the height of the heat dissipation part (16) is the same as the height of the first boss (141). When the heat dissipation part (16) is provided in the second housing (12), the height of the heat dissipation part (16) is the same as the height of the second boss (142).
8. The optical module according to claim 7, characterized in that, The elastic modulus of the thermally conductive adhesive layer (17) is the same as that of the first elastic element (143).
9. The optical module according to claim 1, characterized in that, The first boss (141) has an end surface area S1 facing the circuit board (2), satisfying: 1mm 2 ≤ S1 ≤ 3mm 2 ; The second boss (142) has an end surface area S2 facing the circuit board (2), satisfying: 1mm 2 ≤ S2 ≤ 3mm 2 ; In the thickness direction of the optical module (100), the center lines of the first boss (141), the second boss (142), the first elastic member (143), and the second elastic member (144) are collinear.
10. The optical module according to claim 1, characterized in that, The gap between the first boss (141) and the first surface (21) of the circuit board (2) is G1, which satisfies: 0.2mm≤G1≤0.5mm; The gap between the second boss (142) and the second surface (22) of the circuit board (2) is G2, which satisfies: 0.2mm≤G2≤0.5mm; Before the first housing (11), the circuit board (2) and the second housing (12) are assembled, the thickness of the first elastic member (143) is greater than the gap G1 between the first boss (141) and the circuit board (2), and the thickness of the second elastic member (144) is greater than the gap G2 between the second boss (142) and the circuit board (2).