Computer mainboard with layered heat dissipation air ducts

Abstract

The utility model relates to the field of computer mainboard heat dissipation discloses a computer mainboard with layered heat dissipation air duct, including mainboard body, the upper surface of mainboard body is provided with heat dissipation subassembly, the below of mainboard body is provided with mounting panel, the inside of mounting panel is provided with lifting assembly, the lifting assembly includes hand wheel, the rear surface fixed connection of hand wheel has double -end screw rod, double -end screw rod penetrates and rotates the front surface of mounting panel and is connected, the inner wall slide connection of mounting panel bottom end has the sliding block. In the utility model, through setting heat dissipation subassembly and lifting assembly realize layered heat dissipation, and heat dissipation fan cooperation fin is to the mainboard upper portion heat dissipation, and lifting assembly can adjust the mainboard and mounting panel spacing, and the expansion board and the heat dissipation plate enhance the mainboard lower portion heat conduction, and the heat of conduction will be blown away by the host computer internal fan, realize layered heat dissipation, solved the problem that the traditional mainboard uses when the lower portion heat accumulation, and the heat dissipation efficiency is promoted.

Description

Technical Field

[0001] This utility model relates to the field of computer motherboard heat dissipation, and in particular to a computer motherboard with a layered heat dissipation airflow. Background Technology

[0002] As computer hardware performance continues to improve, the number of integrated electronic components such as chips and capacitors on the motherboard, as a core component, continues to increase, resulting in a significant increase in the heat generated during operation. Heat dissipation is the key to ensuring stable operation of the motherboard and extending its service life. Especially in scenarios such as high-performance computing and long-term continuous operation, heat dissipation efficiency directly affects the overall performance of the device.

[0003] There are two common traditional heat dissipation methods: air cooling and water cooling. Air cooling is widely used because of its advantages such as simple installation, low hardware cost, and strong compatibility.

[0004] However, traditional air cooling methods have some shortcomings in use. Traditional air cooling relies on a single fan and heatsink, which are usually fixed to the upper part of the computer motherboard, making it difficult to achieve layered heat dissipation. In addition, during installation, the lower part of the computer motherboard is often in contact with the inner wall of the case, which means that the heat generated at the bottom of the computer motherboard cannot be dissipated in time, resulting in poor heat dissipation efficiency.

[0005] To address this issue, a computer motherboard with a layered heat dissipation channel is proposed. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a computer motherboard with a layered heat dissipation channel, which aims to improve the problems of difficulty in layered heat dissipation, inability to dissipate heat from the bottom of the motherboard in a timely manner, and poor heat dissipation efficiency in the prior art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a computer motherboard with a layered heat dissipation channel, including a motherboard body, a heat dissipation component is provided on the upper surface of the motherboard body, a mounting plate is provided below the motherboard body, and a lifting component is provided inside the mounting plate.

[0008] The lifting assembly includes a handwheel, a double-ended screw fixedly connected to the rear surface of the handwheel, the double-ended screw penetrating and rotatably connected to the front surface of the mounting plate, a slider slidably connected to the inner wall of the bottom end of the mounting plate, connecting rods fixedly connected to both ends of the slider, a connecting block fixedly connected to the end of the connecting rod away from the slider, a hinge seat one mounted on the upper surface of the connecting block, a connecting plate hinged to the inner surface of the hinge seat one, an extension plate fixedly connected to the lower surface of the main body, a heat sink plate penetrating and slidably connected to the lower surface of the extension plate, a rubber ring fixedly connected to the rear surface of the handwheel, and an annular groove formed on the front surface of the mounting plate.

[0009] As a further description of the above technical solution:

[0010] The heat dissipation assembly includes a cooling fan, which is mounted on the upper surface of the motherboard. Mounting holes are provided at both ends of the upper and lower surfaces of the cooling fan. A rotating shaft is inserted into the inner wall of the mounting hole. A fixing rod is fixedly connected to the rear surface of the rotating shaft. An installation rod is fixedly connected to the rear surface of the fixing rod. A heat dissipation fin is provided at the rear end of the cooling fan. A slot is provided at both ends of the heat dissipation fin.

[0011] As a further description of the above technical solution:

[0012] The double-ended screw passes through and is threadedly connected to the inner surface of the slider, and the connecting block passes through and is slidably connected to the upper surface of the mounting plate.

[0013] As a further description of the above technical solution:

[0014] A hinge base two is installed on the lower surface of the motherboard body, and the top of the connecting plate is hinged to the inner surface of the hinge base two.

[0015] As a further description of the above technical solution:

[0016] The heat sink is fixedly connected to the upper surface of the mounting plate, and the rubber ring is inserted into the inner wall of the annular groove, with the outer surface of the rubber ring and the inner surface of the annular groove in contact.

[0017] As a further description of the above technical solution:

[0018] The rear end of the mounting hole is set to be semi-circular, and the rear surface of the rotating shaft and the rear end of the inner surface of the mounting hole are in contact.

[0019] As a further description of the above technical solution:

[0020] The rotating shaft, fixing rod, and mounting rod are provided in two sets. The two sets of rotating shaft, fixing rod, and mounting rod are symmetrically distributed on the left and right sides with respect to the center line of the cooling fan. Each set of rotating shaft and fixing rod has two members, and the two sets of rotating shaft and fixing rod are located on the upper and lower sides of each set of mounting rods, respectively.

[0021] As a further description of the above technical solution:

[0022] The mounting rod is engaged with the inner wall of the slot.

[0023] This utility model has the following beneficial effects:

[0024] 1. In this utility model, layered heat dissipation is achieved by setting heat dissipation components and lifting components. The heat dissipation fan, together with heat dissipation fins, dissipates heat from the upper part of the motherboard. The lifting component can adjust the distance between the motherboard and the mounting plate. The expansion board and heat dissipation plate enhance the heat conduction at the lower part of the motherboard, and the conducted heat is blown away by the internal fan of the host, thus achieving layered heat dissipation. This solves the problem of heat accumulation at the lower part of the motherboard during traditional use and improves heat dissipation efficiency.

[0025] 2. In this utility model, the mounting hole, rotating shaft, fixing rod, mounting rod and slot are combined to enable flexible assembly and disassembly of the mounting rod, heat dissipation fins and heat dissipation fan, which improves the convenience of the device. It also allows for the individual replacement of the deformed mounting rod, which improves the practicality of the device. Attached Figure Description

[0026] Figure 1 This is a front view of the three-dimensional structure of the overall device in this utility model;

[0027] Figure 2 This is a three-dimensional structural disassembly diagram of the heat dissipation component in this utility model;

[0028] Figure 3 This is a three-dimensional structural breakdown diagram of the motherboard body, mounting plate, and connecting plate in this utility model;

[0029] Figure 4 This is a three-dimensional cross-sectional diagram showing the installation plate, double-headed screw, and connecting plate in this utility model.

[0030] Figure 5 This is a partial three-dimensional structural diagram of the mounting plate and handwheel in this utility model;

[0031] Figure 6 This is a three-dimensional cross-sectional view of the expansion plate in this utility model.

[0032] Legend:

[0033] 1. Mainboard body; 2. Heat dissipation assembly; 21. Cooling fan; 22. Heat dissipation fins; 23. Mounting hole; 24. Shaft; 25. Fixing rod; 26. Mounting rod; 27. Slot; 3. Lifting assembly; 31. Handwheel; 32. Double-ended screw; 33. Slider; 34. Connecting rod; 35. Connecting block; 36. Connecting plate; 37. Heat sink; 38. Expansion plate; 39. Rubber ring; 310. Annular groove; 4. Mounting plate. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Reference Figure 1 - Figure 3 The present invention provides an embodiment of a computer motherboard with a layered heat dissipation channel, comprising a motherboard body 1, which is a computer motherboard, a prior art technology, and can be implemented by those skilled in the art. The upper surface of the motherboard body 1 is provided with a heat dissipation component 2 for dissipating heat from the upper part of the motherboard body 1, and the lower part of the motherboard body 1 is provided with a mounting plate 4 for fixing the motherboard body 1 in a chassis. The mounting plate 4 is provided with a lifting component 3 for dissipating heat from the lower part of the motherboard body 1. Under the action of the heat dissipation component 2 and the lifting component 3, layered heat dissipation can be achieved.

[0036] Reference Figure 1 , Figure 3 , Figure 4 The lifting component 3 includes a handwheel 31. The outer wall of the handwheel 31 has anti-slip texture for easy gripping. A double-ended screw 32 is fixedly connected to the rear surface of the handwheel 31. The outer wall of the double-ended screw 32 has two sections of threads facing opposite directions. The thread helix angle of the threaded sections is less than ten degrees. When the double-ended screw 32 stops rotating, the threaded parts at the threaded sections of its outer wall are fixed. The double-ended screw 32 passes through and is rotatably connected to the front surface of the mounting plate 4. The mounting plate 4 provides support for the double-ended screw 32. A slider 33 is slidably connected to the inner wall of the bottom end of the mounting plate 4. Two sets of sliders 33 are provided, symmetrically arranged front and back, and evenly distributed at the two sections of threads facing opposite directions on the outer wall of the double-ended screw 32. Both ends of the slider 33 are fixedly connected to connecting rods 34 for connecting connecting blocks 35. The end of the connecting rod 34 away from the slider 33 is fixedly connected to a connecting block 35 for pushing the connecting plate 36. A hinge seat is installed on the upper surface of the connecting block 35, and the connecting plate 36 is hinged to the inner surface of the hinge seat.

[0037] Reference Figure 3 , Figure 5 , Figure 6An expansion plate 38 is fixedly connected to the lower surface of the motherboard body 1. A heat sink 37 is slidably connected through the lower surface of the expansion plate 38. Both the expansion plate 38 and the heat sink 37 are made of metal and have strong thermal conductivity. Multiple sets of heat sinks are provided and are equidistantly distributed in the left and right directions. A rubber ring 39 is fixedly connected to the rear surface of the handwheel 31. An annular groove 310 is provided on the front surface of the mounting plate 4. The rubber ring 39 and the annular groove 310 fit together. Threaded holes are provided at the four corners of the upper surface of the mounting plate 4 for installation in the chassis.

[0038] Reference Figure 1 , Figure 3 , Figure 4 The double-ended screw 32 passes through and is threadedly connected to the inner surface of the slider 33. The connecting block 35 passes through and is slidably connected to the upper surface of the mounting plate 4. The lower surface of the main body 1 is equipped with a hinge seat 2. Both hinge seat 1 and hinge seat 2 are existing technologies and can be implemented by those skilled in the art. The top of the connecting plate 36 is hinged to the inner surface of the hinge seat 2. The connecting plate 36 will swing as the connecting block 35 moves, thereby changing the distance between the mounting plate 4 and the main body 1. The openings of hinge seat 1 and hinge seat 2 are both front-to-back oriented, so the connecting plate 36 cannot swing left-to-right.

[0039] Reference Figure 3 , Figure 5 , Figure 6 The heat sink 37 is fixedly connected to the upper surface of the mounting plate 4, and the rubber ring 39 is inserted into the inner wall of the annular groove 310. The outer surface of the rubber ring 39 and the inner surface of the annular groove 310 are in contact, which can provide friction and prevent the handwheel 31 from being accidentally rotated due to external force.

[0040] Reference Figure 1 - Figure 2 The heat dissipation assembly 2 includes a cooling fan 21 for heat dissipation. The cooling fan 21 is existing technology and can be implemented by those skilled in the art. After the cooling fan 21 is installed, it has wires that are electrically connected to the motherboard body 1. The cooling fan 21 is installed on the upper surface of the motherboard body 1. Mounting holes 23 are provided at both the left and right ends of the upper and lower surfaces of the cooling fan 21. The mounting holes 23 penetrate the front surface of the cooling fan 21. A rotating shaft 24 is inserted into the inner wall of the mounting hole 23. The rotating shaft 24 is inserted from front to back and can be removed for easy disassembly and assembly. Compared with the traditional rotating shaft 24, which cannot be disassembled and replaced, it has greater flexibility. A fixing rod 25 is fixedly connected to the rear surface of the rotating shaft 24, and a mounting rod 26 is fixedly connected to the rear surface of the fixing rod 25. A heat dissipation fin 22 is provided at the rear end of the cooling fan 21. A slot 27 is provided at both the left and right ends of the heat dissipation fin 22. The mounting rod 26 and the slot 27 fit together.

[0041] Reference Figure 1 - Figure 2The rear end of the mounting hole 23 is set to be semi-circular. The rear surface of the rotating shaft 24 is in contact with the rear end of the inner surface of the mounting hole 23. The rotating shaft 24 can rotate around the rear end of the mounting hole 23. There are two sets of rotating shaft 24, fixing rod 25, and mounting rod 26. The two sets of rotating shaft 24, fixing rod 25, and mounting rod 26 are symmetrically distributed on the left and right sides with the center line of the cooling fan 21. There are two rotating shafts 24 and fixing rods 25 in each set. The two sets of rotating shafts 24 and fixing rods 25 are located on the upper and lower sides of each set of mounting rods 26. Driving the mounting rod 26 can drive the two rotating shafts 24 and fixing rods 25 to move at the same time. The mounting rod 26 is snapped into the inner wall of the slot 27. The adjacent surfaces of the two rotating shafts 24 in each set are in contact with the mounting hole 23.

[0042] Working principle: When installing the motherboard body 1, the distance between the motherboard body 1 and the mounting plate 4 can be adjusted according to the size of the space inside the chassis. During adjustment, the handwheel 31 is turned to drive the double-ended screw 32 to rotate synchronously, which in turn drives the two sets of sliders 33 to slide in opposite directions along the inner wall of the mounting plate 4. The sliders 33 drive the connecting block 35 to move through the connecting rod 34, causing the hinged connecting plate 36 to swing, thereby changing the distance between the motherboard body 1 and the mounting plate 4. After the distance between the motherboard body 1 and the mounting plate 4 is adjusted, the rotation is stopped. Since the rubber ring 39 is in contact with the annular groove 310, it can provide friction, thus preventing the handwheel 31 from being accidentally turned and causing the double-ended screw 32 to rotate, ensuring the distance is stable. Then, the mounting plate 4 is installed in the chassis using screws.

[0043] When the distance between the motherboard body 1 and the mounting plate 4 changes, the expansion plate 38 and the heat sink 37 will also expand or retract. When the fan inside the motherboard blows, it can blow away the heat transferred from the motherboard body 1 to the expansion plate 38 and the heat sink 37, thereby achieving heat dissipation for the lower part of the motherboard body 1.

[0044] When the cooling fan 21 on the upper surface of the motherboard body 1 is running, the airflow generated can blow away the heat transferred to the heat sink fins 22, thereby achieving heat dissipation of the upper part of the motherboard body 1 and realizing layered heat dissipation.

[0045] Furthermore, the cooling fan 21 and the heat dissipation fins 22 can be flexibly disassembled and assembled. By bending the mounting rod 26, it can be inserted into or removed from the slot 27 to achieve the disassembly and assembly of the cooling fan 21 and the heat dissipation fins 22. The mounting rod 26 can also be flexibly replaced. When the mounting rod 26 and the slot 27 are disassembled, the rotating shaft 24 can be moved forward and separated from the mounting hole 23 to achieve the disassembly of the mounting rod 26. This facilitates the replacement of deformed or damaged mounting rods 26 (the mounting rod 26 is made of metal, and during installation, including the initial installation, it is easy to deform due to bending, which will affect the stability of subsequent fixation. The flexibility of replacement improves practicality and convenience).

[0046] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A computer motherboard with a layered heat dissipation channel, comprising a motherboard body (1), characterized in that: A heat dissipation component (2) is provided on the upper surface of the motherboard body (1), and a mounting plate (4) is provided below the motherboard body (1). A lifting component (3) is provided inside the mounting plate (4). The lifting assembly (3) includes a handwheel (31), a double-headed screw (32) is fixedly connected to the rear surface of the handwheel (31), the double-headed screw (32) passes through and is rotatably connected to the front surface of the mounting plate (4), a slider (33) is slidably connected to the inner wall of the bottom end of the mounting plate (4), a connecting rod (34) is fixedly connected to both the left and right ends of the slider (33), a connecting block (35) is fixedly connected to the end of the connecting rod (34) away from the slider (33), a hinge seat is installed on the upper surface of the connecting block (35), a connecting plate (36) is hinged to the inner surface of the hinge seat, an extension plate (38) is fixedly connected to the lower surface of the main body (1), a heat sink (37) is slidably connected to the lower surface of the extension plate (38), a rubber ring (39) is fixedly connected to the rear surface of the handwheel (31), and an annular groove (310) is opened on the front surface of the mounting plate (4).

2. The computer motherboard with layered heat dissipation channels according to claim 1, characterized in that: The heat dissipation assembly (2) includes a cooling fan (21), which is mounted on the upper surface of the motherboard body (1). The cooling fan (21) has mounting holes (23) at both ends of its upper and lower surfaces. A rotating shaft (24) is inserted into the inner wall of the mounting hole (23). A fixing rod (25) is fixedly connected to the rear surface of the rotating shaft (24). An installation rod (26) is fixedly connected to the rear surface of the fixing rod (25). A heat dissipation fin (22) is provided at the rear end of the cooling fan (21). A slot (27) is provided at both ends of the heat dissipation fin (22).

3. The computer motherboard with layered heat dissipation channels according to claim 1, characterized in that: The double-ended screw (32) passes through and is threadedly connected to the inner surface of the slider (33), and the connecting block (35) passes through and is slidably connected to the upper surface of the mounting plate (4).

4. The computer motherboard with layered heat dissipation channels according to claim 1, characterized in that: The lower surface of the main body (1) is equipped with a hinge seat 2, and the top end of the connecting plate (36) is hinged to the inner surface of the hinge seat 2.

5. The computer motherboard with layered heat dissipation channels according to claim 1, characterized in that: The heat sink (37) is fixedly connected to the upper surface of the mounting plate (4), and the rubber ring (39) is inserted into the inner wall of the annular groove (310). The outer surface of the rubber ring (39) and the inner surface of the annular groove (310) are in contact.

6. The computer motherboard with layered heat dissipation channels according to claim 2, characterized in that: The rear end of the mounting hole (23) is set to be semi-circular, and the rear surface of the rotating shaft (24) and the rear end of the inner surface of the mounting hole (23) are in contact.

7. The computer motherboard with layered heat dissipation channels according to claim 2, characterized in that: The rotating shaft (24), fixing rod (25), and mounting rod (26) are provided in two sets. The two sets of rotating shafts (24), fixing rods (25), and mounting rods (26) are symmetrically distributed on the left and right sides with respect to the center line of the cooling fan (21). Each set of rotating shafts (24) and fixing rods (25) has two members. The two sets of rotating shafts (24) and fixing rods (25) are located on the upper and lower sides of each set of mounting rods (26).

8. The computer motherboard with layered heat dissipation channels according to claim 2, characterized in that: The mounting rod (26) is engaged with the inner wall of the slot (27).

Images