Miniature computer host with moisture-proof function

Abstract

The utility model relates to computer technical field discloses a mini computer host with moistureproof function, including support leg, the top fixedly connected with the machine case of support leg, the inner wall sliding connection of machine case has the sliding board, the top of machine case is provided with heat dissipation mechanism, the inner wall of machine case is provided with the line arrangement mechanism. The utility model discloses dustproof net and drying net board fixedly connected in the inner wall of magnetic attraction frame, prevent the damp air to wrap up sand and dust and enter the inside of machine case, prevent sand and dust from affecting the normal work of air inlet fan simultaneously, the heat of dry air takes away the mainboard and other structure and blows from the moistureproof net, and part of air enters the power supply box through the air inlet grille, blows from the air outlet net board, and the moistureproof net is opened on the surface of machine case, increases the contact area with air through uneven surface, improves the heat dissipation efficiency, prevents the moisture of ground from entering the inside of machine case when not using, guarantees the normal use of device, improves the practicality of device.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a microcomputer host with moisture-proof function. Background Technology

[0002] A microcomputer host is a small, high-performance computer device, typically designed in a compact chassis, suitable for scenarios requiring space saving and a certain level of performance. With advancements in hardware technology, microcomputer hosts have found widespread application in many fields, particularly in home entertainment, office work, industrial control, and digital signage.

[0003] Publication No. CN220305754U discloses a microcomputer host with a moisture-proof function, including: a host main shell, a moisture-proof net movably connected to one side of the host main shell, an installation block fixedly installed on one side of the moisture-proof net, a drying block movably connected inside the moisture-proof net, and a reinforcing block movably connected to one side of the drying block; a side shell movably connected to one side of the host main shell, a moisture-proof telescopic plate movably connected to one side of the side shell, and a sliding plate fixedly installed on one side of the moisture-proof telescopic plate.

[0004] Although this device works by installing a moisture-proof mesh on one side of the microcomputer host casing, enabling the internal drying and reinforcing blocks to work together to achieve a drying and dehumidifying effect, thus increasing the moisture resistance of the microcomputer host and preventing a reduction in the lifespan of internal components, the small size and limited internal space of the microcomputer host make wiring extremely difficult. Improper hardware wiring not only affects aesthetics but may also lead to poor air circulation, affecting heat dissipation performance. Messy wiring may also increase the risk of hardware damage. At the same time, the heat dissipation capacity of small power supplies is also limited. When running high-load tasks for a long time, it may cause the power supply to overheat or reduce efficiency, affecting the normal use of the device. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a microcomputer host with moisture-proof function.

[0006] This utility model is achieved using the following technical solution: a micro computer host with moisture-proof function, including a support leg, a chassis fixedly connected to the top of the support leg, a sliding plate slidably connected to the inner wall of the chassis, a heat dissipation mechanism provided on the top of the chassis, a cable routing mechanism provided on the inner wall of the chassis, a sliding groove provided on the inner wall of the chassis, and a slider fixedly connected to the surface of the sliding plate.

[0007] The heat dissipation mechanism includes a magnetic frame, with a dustproof mesh fixedly connected to the inner wall of the magnetic frame. A drying mesh plate is fixedly connected to the bottom of the dustproof mesh. An intake fan is fixedly connected to the inner wall of the chassis. A power supply box is fixedly connected to the inner wall of the chassis. An air intake grille is fixedly connected to the top of the power supply box. An exhaust mesh plate is fixedly connected to the surface of the sliding plate. The surface of the chassis is open.

[0008] As a further improvement to the above solution, the bottom of the magnetic frame is fixedly connected to the top of the chassis.

[0009] As a further improvement to the above solution, the number of intake fans is set to two, which are evenly arranged on the inner wall of the top of the chassis.

[0010] The above technical solution, by setting a magnetic frame on the top of the chassis, with a dustproof mesh and a drying mesh plate fixedly connected to the inner wall of the magnetic frame, prevents humid air carrying sand and dust from entering the chassis and also prevents sand and dust from affecting the normal operation of the intake fan. Dry air carries away the heat from the motherboard and other structures and is blown out through the moisture-proof mesh. At the same time, some air enters the power supply box through the air intake grille and is blown out through the air exhaust plate, cooling the power supply separately and preventing the heat inside the chassis from affecting the power supply. The moisture-proof mesh on the surface of the chassis increases the contact area with air through its uneven surface, improving heat dissipation efficiency. When not in use, the moisture-proof mesh prevents ground moisture from entering the chassis, ensuring normal operation of the device, extending the device's service life, and improving the device's practicality.

[0011] As a further improvement to the above solution, the cable management mechanism includes a cable tie plate, an installation positioning block is fixedly connected to the inner wall of the chassis, and a cable management groove is provided on the inner wall of the chassis.

[0012] As a further improvement to the above solution, the cable tie is fixedly connected to the inner wall of the chassis, and a number of mounting and positioning blocks are provided, arranged in the corners of the inner wall of the chassis.

[0013] The above technical solution uses cable ties to fix the internal cables to the surface of the cable tie plate, preventing the cables from tangling and affecting the stability of the device structure. The area division of the installation positioning blocks facilitates the installation personnel to arrange the internal structure and speeds up the installation efficiency. The cable management channels on the inner wall of the chassis isolate the cables to the inner wall of the chassis, preventing the cables from blocking the moisture-proof mesh, hindering the internal air circulation, and affecting the heat dissipation effect.

[0014] As a further improvement to the above solution, the mounting positioning block and the heat dissipation slot are installed on the same side of the chassis, on the inner and outer sides.

[0015] As a further improvement to the above solution, the inner wall of the groove is slidably connected to the surface of the slider.

[0016] The above technical solution uses a slider that slides along the inner wall of the slide groove to limit the sliding plate as it slides along the inner wall of the chassis, ensuring that the sliding plate will not shift or come out when sealing and locking the chassis.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] This invention utilizes a heat dissipation mechanism, specifically a magnetic frame fixed to the top of the chassis. A dustproof mesh and a drying mesh plate are fixedly connected to the inner wall of the magnetic frame. This prevents humid air carrying dust into the chassis and also prevents dust from interfering with the normal operation of the intake fan. Dry air carries away heat from the motherboard and other components and is blown out through the moisture-proof mesh. Simultaneously, some air enters the power supply box through the intake grille and is blown out through the exhaust mesh plate, providing separate cooling for the power supply and preventing internal chassis heat from affecting it. The moisture-proof mesh on the chassis surface increases the contact area with air through its uneven surface, improving heat dissipation efficiency. When not in use, the moisture-proof mesh prevents ground moisture from entering the chassis, ensuring normal operation, extending the device's lifespan, and enhancing its practicality.

[0019] This utility model incorporates a cable management mechanism, specifically by securing internal cables to the surface of a cable ties plate with cable ties to prevent cables from tangling and affecting the stability of the device structure. The area division of the mounting positioning blocks facilitates the arrangement of the internal structure by installers, accelerating installation efficiency. The cable management channels on the inner wall of the chassis isolate the cables to the perimeter of the chassis, preventing them from blocking the moisture-proof mesh, hindering internal airflow, and affecting heat dissipation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic cross-sectional view of the present invention.

[0022] Figure 3 This is a schematic cross-sectional view of the present invention.

[0023] Figure 4 This is a schematic cross-sectional view of the present invention.

[0024] Figure 5 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 6 This utility model Figure 3 Schematic diagram of the structure at point A in the middle;

[0026] Figure 7 This utility model Figure 5 Schematic diagram of the structure at point B.

[0027] Explanation of key symbols:

[0028] 1. Support legs; 2. Chassis; 3. Sliding plate; 4. Heat dissipation mechanism; 401. Magnetic frame; 402. Dustproof mesh; 403. Drying mesh plate; 404. Intake fan; 405. Power supply box; 406. Air intake grille; 407. Air exhaust mesh plate; 408. Heat dissipation slot; 409. Moisture-proof mesh; 5. Cable management mechanism; 501. Cable tie plate; 502. Mounting positioning block; 503. Cable management channel; 6. Slide groove; 7. Slider. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] Example:

[0031] Please combine Figure 1-5 This embodiment of a micro computer host with moisture-proof function includes a support leg 1, a chassis 2 fixedly connected to the top of the support leg 1, a sliding plate 3 slidably connected to the inner wall of the chassis 2, a heat dissipation mechanism 4 provided on the top of the chassis 2, a cable management mechanism 5 provided on the inner wall of the chassis 2, a sliding groove 6 opened on the inner wall of the chassis 2, and a slider 7 fixedly connected to the surface of the sliding plate 3.

[0032] The heat dissipation mechanism 4 includes a magnetic frame 401, with a dustproof mesh 402 fixedly connected to the inner wall of the magnetic frame 401. A drying mesh plate 403 is fixedly connected to the bottom of the dustproof mesh 402. An intake fan 404 is fixedly connected to the inner wall of the chassis 2. By setting the magnetic frame 401 on the top of the chassis 2, and with the dustproof mesh 402 and drying mesh plate 403 fixedly connected to the inner wall of the magnetic frame 401, humid air carrying dust is prevented from entering the interior of the chassis 2, and dust is also prevented from affecting the normal operation of the intake fan 404. A power supply box 405 is fixedly connected to the inner wall of the chassis 2, with an air intake grille 406 fixedly connected to the top of the power supply box 405. An exhaust mesh plate 407 is fixedly connected to the surface of the sliding plate 3. Meanwhile, some air enters the power supply box 405 through the air intake grille 406 and is blown out from the exhaust grille 407, cooling the power supply separately and preventing the heat inside the chassis 2 from affecting the power supply. The surface of the chassis 2 is provided with heat dissipation grooves 408. Through the heat dissipation grooves 408 on the surface of the chassis 2, the uneven surface increases the contact area with air and improves the heat dissipation efficiency. The inner wall of the chassis 2 is fixedly connected with a moisture-proof net 409. Dry air carries away the heat from the motherboard and other structures and is blown out from the moisture-proof net 409. When not in use, the moisture-proof net 409 prevents moisture from the ground from entering the interior of the chassis 2, ensuring normal use of the device, extending the service life of the device, and improving the practicality of the device.

[0033] The bottom of the magnetic frame 401 is fixedly connected to the top of the chassis 2.

[0034] There are two intake fans 404, which are evenly distributed on the inner wall of the top of the chassis 2.

[0035] The cable management mechanism 5 includes a cable tie plate 501. An installation positioning block 502 is fixedly connected to the inner wall of the chassis 2. A cable management groove 503 is provided on the inner wall of the chassis 2. The cable management groove 503 on the inner wall of the chassis 2 isolates the cables to the perimeter of the inner wall of the chassis 2, preventing the cables from blocking the moisture-proof mesh 409, hindering internal air circulation, and affecting the heat dissipation effect.

[0036] The cable tie plate 501 is fixedly connected to the inner wall of the chassis 2. By fixing the internal cables to the surface of the cable tie plate 501 with cable ties, the cables are prevented from tangling and affecting the stability of the device structure. A number of mounting positioning blocks 502 are set and arranged in the corners of the inner wall of the chassis 2. The area division of the mounting positioning blocks 502 facilitates the installation personnel to arrange the internal structure and speeds up the installation efficiency.

[0037] The mounting positioning block 502 and the heat sink 408 are installed on the same side of the chassis 2, on the inside and outside.

[0038] The inner wall of the slide groove 6 is slidably connected to the surface of the slider 7. The slider 7 is slidably connected to the inner wall of the slide groove 6, which limits the sliding plate 3 when it slides on the inner wall of the chassis 2, ensuring that the sliding plate 3 will not shift or fall out when sealing and locking the chassis 2.

[0039] The implementation principle of a moisture-proof microcomputer host in this application embodiment is as follows: During use, the internal structure is first installed according to the area division of the installation positioning block 502 to speed up the installation process. Then, the internal cables are fixed to the surface of the cable tie plate 501 with cable ties to prevent the cables from tangling and affecting the stability of the device structure. The bottom cables are placed in the cable management groove 503 to prevent them from blocking the moisture-proof mesh 409, hindering internal airflow, and affecting heat dissipation. Simultaneously, the power supply is installed in the power supply box 405, and the exhaust mesh plate 407 is fixed to the surface of the chassis 2. Then, the sliding plate 3 is installed on the inner wall of the chassis 2 by the limiting of the sliding groove 6 and the slider 7. During use, the intake fan 404 is turned on, and the dustproof mesh... 402 and the drying mesh 403 prevent humid air carrying sand and dust from entering the interior of the chassis 2, while also preventing sand and dust from affecting the normal operation of the intake fan 404. Dry air carries away the heat from the motherboard and other structures and is blown out from the moisture-proof mesh 409. At the same time, some air enters the power supply box 405 through the air intake grille 406 and is blown out from the exhaust mesh 407, cooling the power supply separately and preventing the heat inside the chassis 2 from affecting the power supply. The heat dissipation grooves 408 on the surface of the chassis 2 increase the contact area with air through the uneven surface, improving heat dissipation efficiency. When not in use, the moisture-proof mesh 409 prevents ground moisture from entering the interior of the chassis 2, ensuring normal operation of the device, extending the service life of the device, and improving the practicality of the device.

[0040] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A microcomputer host with moisture-proof function, characterized in that, Includes a support leg (1), the top of which is fixedly connected to a chassis (2), a sliding plate (3) is slidably connected to the inner wall of the chassis (2), a heat dissipation mechanism (4) is provided on the top of the chassis (2), a cable routing mechanism (5) is provided on the inner wall of the chassis (2), a sliding groove (6) is provided on the inner wall of the chassis (2), and a slider (7) is fixedly connected to the surface of the sliding plate (3); The heat dissipation mechanism (4) includes a magnetic frame (401), a dustproof net (402) is fixedly connected to the inner wall of the magnetic frame (401), a drying mesh plate (403) is fixedly connected to the bottom of the dustproof net (402), an intake fan (404) is fixedly connected to the inner wall of the chassis (2), a power supply box (405) is fixedly connected to the inner wall of the chassis (2), an air intake grille (406) is fixedly connected to the top of the power supply box (405), an exhaust mesh plate (407) is fixedly connected to the surface of the sliding plate (3), a heat dissipation groove (408) is opened on the surface of the chassis (2), and a moisture-proof net (409) is fixedly connected to the inner wall of the chassis (2).

2. A microcomputer host with moisture-proof function as described in claim 1, characterized in that: The bottom of the magnetic frame (401) is fixedly connected to the top of the chassis (2).

3. A microcomputer host with moisture-proof function as described in claim 1, characterized in that: The number of intake fans (404) is set to two, which are evenly arranged on the inner wall of the top of the chassis (2).

4. A microcomputer host with moisture-proof function as described in claim 1, characterized in that: The cable management mechanism (5) includes a cable tie plate (501), and the inner wall of the chassis (2) is fixedly connected with a mounting positioning block (502). The inner wall of the chassis (2) is provided with a cable management groove (503).

5. A microcomputer host with moisture-proof function as described in claim 4, characterized in that: The cable tie plate (501) is fixedly connected to the inner wall of the chassis (2), and the number of the mounting positioning blocks (502) is set to a certain extent, which are arranged in the corners of the inner wall of the chassis (2).

6. A microcomputer host with moisture-proof function as described in claim 4, characterized in that: The mounting positioning block (502) and the heat dissipation slot (408) are installed on the inner and outer sides of the same side of the chassis (2).

7. A microcomputer host with moisture-proof function as described in claim 1, characterized in that: The inner wall of the groove (6) is slidably connected to the surface of the slider (7).

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