A computer apparatus for experimental instrument development

Abstract

This utility model relates to the field of computer device technology and discloses a computer device for the research and development of experimental instruments. It includes a chassis with several air inlets on the top and several air outlets on the back. A heat-conducting support plate is fixedly installed inside the chassis, and a heat dissipation mechanism is provided on one side of the support plate. A first and a second panel are detachably installed on both sides of the chassis. The heat dissipation mechanism includes a water tank located at the bottom of the chassis in front of the heat-conducting support plate. A micro pump connected to the top of the water tank is located on the back of the support plate. A cooling pipe is located on the back of the support plate, with one end connected to the output end of the micro pump. The other end of the micro pump is connected to a heat sink in front of the support plate, and two cooling fans are located on one side of the heat sink. This utility model achieves a combination of air and water cooling through the heat dissipation mechanism to improve heat dissipation efficiency. The chassis design facilitates quick and easy inspection and maintenance, and the magnetic filter facilitates disassembly and cleaning. The overall structure is practical and easy to operate.

Description

Technical Field

[0001] This utility model relates to the field of computer device technology, and in particular to a computer device for the research and development of experimental instruments. Background Technology

[0002] In the field of experimental instrument research and development, computer devices are key supporting equipment, typically consisting of a chassis, high-performance processor, data acquisition module, storage device, and various functional interfaces. Among these, the chassis not only provides physical support and protection for the internal precision components, but also needs to ensure the stable operation of the device in complex and ever-changing experimental environments, making its importance self-evident.

[0003] However, with the continuous expansion and upgrading of the functions of experimental instruments, the computing performance requirements of computer devices have increased dramatically, and the heat dissipation problem of the chassis has become increasingly difficult. Although traditional chassis are equipped with heat dissipation measures, the effect is not satisfactory. These heat dissipation methods are mostly air cooling that relies solely on fans, or only use basic water cooling systems. When the equipment is running at high performance for a long time, the heat dissipation effect will significantly weaken as the usage time increases: air cooling is prone to heat accumulation inside the chassis, which leads to a decrease in heat dissipation efficiency, while water cooling will cause the temperature to rise due to the continuous absorption of heat by the cooling water. In the end, the overall heat dissipation and cooling effect will continue to decline, making it difficult to meet the needs of stable operation of computer devices for a long time. Utility Model Content

[0004] In view of the fact that the heat dissipation measures of the existing traditional chassis (simple air cooling or basic water cooling) will significantly decrease over time due to heat accumulation inside the chassis or the temperature rise of the cooling water when the equipment is running at high performance, and cannot meet the requirements of long-term stable operation, this utility model is proposed.

[0005] To solve the above technical problems, the present invention provides the following technical solution: a computer device for the research and development of experimental instruments, including a chassis, a plurality of air inlets are opened on the top of the chassis, a plurality of air outlets are opened on the back of the chassis, a heat-conducting support plate is fixedly installed inside the chassis, a heat dissipation mechanism is provided on one side of the heat-conducting support plate, and a first panel and a second panel are detachably installed on both sides of the chassis respectively.

[0006] The heat dissipation mechanism includes a water tank, which is located at the bottom of the chassis in front of the heat-conducting support plate. A micro pump connected to the top of the water tank is provided. A cooling pipe is provided on the back of the heat-conducting support plate, and one end of the cooling pipe is connected to the output end of the micro pump. The other end of the micro pump is connected to a heat sink in front of the heat-conducting support plate. Two cooling fans are provided on one side of the heat sink.

[0007] As a preferred embodiment, the heat dissipation mechanism further includes a heat-conducting plate, and the heat dissipation base has a flow-guiding cavity that communicates with the cooling pipe. The bottom of the heat dissipation base is connected to a water tank through a conduit that communicates with the flow-guiding cavity. The heat-conducting plate is fixedly embedded on the front of the heat dissipation base. A semiconductor cooling chip is connected to the front of the heat-conducting plate. The front of the semiconductor cooling chip is provided with heat dissipation fins. The air outlet corresponds to the heat dissipation base.

[0008] As a preferred embodiment, the cooling pipes are arranged in a meandering curve, and the flow guiding cavity is also in a meandering curve shape.

[0009] As a preferred embodiment, magnetic groove one and magnetic groove two are respectively provided on the top and back of the chassis at the air inlet and air outlet, and magnetic filter one and magnetic filter two are magnetically connected in magnetic groove one and magnetic filter two, respectively.

[0010] As a preferred embodiment, the chassis has symmetrical grooves on both sides, with guide rails slidably installed in the grooves. The guide rails on both sides of the chassis are fixedly connected to the first and second panels, respectively. The chassis has symmetrical mounting seats at the end away from the air outlet, with inserts slidably installed in the mounting seats. One end of the insert is fixedly connected to the inner wall of the mounting seat by symmetrically arranged springs. Each side of the first and second panels has a slot corresponding to the insert.

[0011] As a preferred embodiment, the guide rail has an isosceles trapezoidal cross section, the insert has a right trapezoidal cross section, and both the first and second box plates have symmetrically arranged grooves that fit the insert at the ends away from the air outlet.

[0012] Compared with the prior art, the present invention has at least the following beneficial effects:

[0013] 1. This utility model, through its heat dissipation mechanism, uses a micro pump to draw cooling water from the water tank and deliver it through the cooling pipes, thereby achieving water-cooled heat dissipation inside the chassis. The water that flows through the cooling pipes and absorbs heat will flow back through the guide cavity in the heat sink base, where it will be conducted heat through the heat conduction plate and cooled by the semiconductor cooling chip. At the same time, the heat sink fins and cooling fan will provide air cooling for the semiconductor cooling chip and the inside of the chassis, accelerating airflow and improving the heat dissipation effect and efficiency. The water that has been cooled by flowing through the heat sink base will flow back to the water tank for recycling. The combination of air cooling and water cooling improves the heat dissipation effect inside the chassis, making it convenient to use and more practical.

[0014] 2. This utility model allows for convenient and quick disassembly of either box panel one or box panel two, along with a mounting base, insert, and spring, to facilitate internal inspection and maintenance of the chassis.

[0015] 3. The magnetically attached filter screen one and magnetically attached filter screen two of this utility model can be easily disassembled for cleaning or replacement. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0018] Figure 3 For the present utility model Figure 2 A magnified structural diagram of A in the middle;

[0019] Figure 4 This is a schematic diagram of the internal structure of the chassis of this utility model;

[0020] Figure 5 This is a schematic diagram of the structure between the cooling pipe and the chassis of this utility model;

[0021] Figure 6 This is a schematic diagram of the structure between the heat sink and the cooling pipe of this utility model;

[0022] Figure 7 This is a cross-sectional structural diagram of the mounting base and the housing plate of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Chassis; 2. Air inlet; 3. Air outlet; 4. Heat-conducting support plate; 5. Magnetic filter one; 6. Magnetic filter two; 7. Box panel one; 8. Box panel two; 9. Water tank; 10. Micro pump; 11. Cooling pipe; 12. Heat sink base; 13. Airflow guide cavity; 14. Heat-conducting plate; 15. Heat sink fins; 16. Cooling fan; 17. Guide rail; 18. Rail groove; 19. Mounting base; 20. Insert block; 21. Spring; 22. Slot; 23. Extrusion groove; 24. Semiconductor cooling chip. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] Reference Figure 1 - Figure 7 As shown, a computer device for the research and development of experimental instruments is provided, including a chassis 1. The top of the chassis 1 has several air inlets 2, and the back of the chassis 1 has several air outlets 3. A heat-conducting support plate 4 is fixedly installed inside the chassis 1. A heat dissipation mechanism is provided on one side of the heat-conducting support plate 4. A first panel 7 and a second panel 8 are detachably installed on both sides of the chassis 1. The air inlets 2 and the air outlets 3 form an air convection channel, which, together with the heat dissipation mechanism, improves the heat dissipation efficiency. The detachable panel design facilitates the maintenance of internal components and is highly practical.

[0027] The heat dissipation mechanism includes a water tank 9, which is located at the bottom of the chassis 1 in front of the heat-conducting support plate 4. A micro pump 10 connected to the top of the water tank 9 is provided. A cooling pipe 11 is provided on the back of the heat-conducting support plate 4, and one end of the cooling pipe 11 is connected to the output end of the micro pump 10. The other end of the micro pump 10 is connected to a heat sink 12 in front of the heat-conducting support plate 4. Two cooling fans 16 are provided on one side of the heat sink 12. The cooling water is circulated by the micro pump 10, the cooling pipe 11 directly dissipates heat from the components on the heat-conducting support plate 4, and the cooling fans 16 accelerate the heat dissipation, thus initially forming a water-cooling and air-cooling synergistic heat dissipation system to improve the heat dissipation effect.

[0028] In this example, the heat dissipation mechanism also includes a heat-conducting plate 14. The heat sink 12 has a flow-guiding cavity 13 that communicates with the cooling pipe 11. The bottom of the heat sink 12 is connected to the water tank 9 through a conduit that communicates with the flow-guiding cavity 13. The heat-conducting plate 14 is fixedly embedded on the front of the heat sink 12. A semiconductor cooling chip 24 is connected to the front of the heat-conducting plate 14. The semiconductor cooling chip 24 has heat dissipation fins 15 on its front. The air outlet 3 corresponds to the heat sink 12. The flow-guiding cavity 13 extends the cooling water heat dissipation path. The semiconductor cooling chip 24 and the heat dissipation fins 15 enhance the cooling effect of the cooling water. The air outlet 3 is precisely matched to accelerate heat dissipation, ensure the cooling water circulation temperature is stable, and further improve the heat dissipation efficiency.

[0029] In this example, the cooling pipes 11 are arranged in a meandering curve, and the flow guide cavity 13 is also in a meandering curve shape. The meandering curve design increases the contact area between the cooling pipes 11 and the heat-conducting support plate 4, and between the flow guide cavity 13 and the cooling water, thereby improving the heat exchange efficiency and enhancing the heat dissipation effect.

[0030] In this example, magnetic slot one and magnetic slot two are respectively provided on the top and back of the chassis 1 at the air inlet 2 and air outlet 3. Magnetic filter one 5 and magnetic filter two 6 are magnetically connected in magnetic slot one and magnetic slot two, respectively. The magnetic filters are easy to disassemble, clean or replace quickly, effectively preventing dust from entering the chassis 1 through the air inlet 2 and air outlet 3, ensuring a clean operating environment for the components.

[0031] In this example, the chassis 1 has symmetrical rail grooves 18 on both sides, and guide rails 17 are slidably installed in the rail grooves 18. The guide rails 17 on both sides of the chassis 1 are fixedly connected to the first panel 7 and the second panel 8, respectively. The chassis 1 has symmetrical mounting bases 19 on the side away from the air outlet 3. The mounting base 19 has a sliding plug 20. One end of the plug 20 is fixedly connected to the inner wall of the mounting base 19 by symmetrically arranged springs 21. The first panel 7 and the second panel 8 have slots 22 on one side corresponding to the plug 20. The rail grooves 18 and guide rails 17 cooperate to realize the smooth sliding of the panel. The plug 20 and the slot 22 are elastically engaged by the springs 21, which makes the panel easy to disassemble and assemble and the connection stable, which is convenient for internal inspection and maintenance.

[0032] In this example, the cross-section of the guide rail 17 is an isosceles trapezoid, and the cross-section of the insert 20 is a right trapezoid. The box panel 1 7 and the box panel 2 8 are symmetrically provided with extrusion grooves 23 that are adapted to the insert 20 at the ends away from the air outlet 3. The isosceles trapezoidal guide rail 17 improves the sliding stability of the box panel, and the right trapezoidal insert 20, in conjunction with the extrusion grooves 23, facilitates the automatic squeezing of the insert 20 to complete the engagement during the installation of the box panel, making the disassembly and assembly operations more convenient and labor-saving.

[0033] The working principle of this invention is as follows: In the development of experimental instruments, this device achieves stable operation through the coordinated operation of its various components:

[0034] When the device is running, cold air is introduced through the air inlet 2, and the heat dissipation mechanism is started simultaneously. The micro pump 10 sends the cooling water in the water tank 9 into the meandering cooling pipes 11. The cooling pipes 11 come into contact with the heat-conducting support plate 4, quickly absorbing the heat from the core components during the development of the experimental instrument, thus achieving preliminary water cooling.

[0035] After absorbing heat, the cooling water enters the meandering flow cavity 13 of the heat sink 12. The heat conduction plate 14 conducts the heat to the semiconductor cooling chip 24. With the help of the heat dissipation fins 15 and the cooling fan 16, the heat dissipation is accelerated. The cooled water flows back to the water tank 9 for recycling, ensuring that stable heat dissipation is continuously provided for the research and development of experimental instruments.

[0036] In addition, the first panel 7 and the second panel 8 can be easily disassembled and assembled via the guide rail 17, the rail groove 18, the plug 20, and the spring 21. When disassembling, by pushing the plug 20 out of the slot 22, the plug 20 will squeeze the push spring 21, which will release the plug 20 from the restriction of the first panel 7 or the second panel 8. Then, the first panel 7 can be slid to the left to separate it from the chassis 1 for internal inspection and maintenance of the chassis 1.

[0037] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A computer device for the research and development of experimental instruments, comprising a chassis (1), characterized in that: The top of the chassis (1) has several air inlets (2), the back of the chassis (1) has several air outlets (3), a heat-conducting support plate (4) is fixedly installed inside the chassis (1), a heat dissipation mechanism is provided on one side of the heat-conducting support plate (4), and a first box plate (7) and a second box plate (8) are detachably installed on both sides of the chassis (1). The heat dissipation mechanism includes a water tank (9), which is located at the bottom of the chassis (1) in front of the heat-conducting support plate (4). A micro pump (10) connected to the water tank (9) is provided on the top of the water tank (9). A cooling pipe (11) is provided on the back of the heat-conducting support plate (4), and one end of the cooling pipe (11) is connected to the output end of the micro pump (10). The other end of the micro pump (10) is connected to a heat sink (12) in front of the heat-conducting support plate (4). Two cooling fans (16) are provided on one side of the heat sink (12).

2. The computer device for the research and development of experimental instruments according to claim 1, characterized in that: The heat dissipation mechanism also includes a heat-conducting plate (14). The heat sink (12) has a flow-guiding cavity (13) that communicates with the cooling pipe (11). The bottom of the heat sink (12) is connected to the water tank (9) through a conduit that communicates with the flow-guiding cavity (13). The heat-conducting plate (14) is fixedly embedded on the front of the heat sink (12). A semiconductor cooling chip (24) is connected to the front of the heat-conducting plate (14). The semiconductor cooling chip (24) has heat dissipation fins (15) on the front. The air outlet (3) corresponds to the heat sink (12).

3. The computer device for the research and development of experimental instruments according to claim 2, characterized in that: The cooling pipes (11) are arranged in a meandering curve, and the flow guide cavity (13) is also in a meandering curve shape.

4. The computer device for the research and development of experimental instruments according to claim 3, characterized in that: The top and back of the chassis (1) are respectively provided with magnetic suction slot one and magnetic suction slot two at the air inlet (2) and air outlet (3) respectively. Magnetic suction slot one and magnetic suction slot two are respectively magnetically connected in magnetic suction slot one and magnetic suction slot two.

5. A computer device for the research and development of experimental instruments according to claim 2, characterized in that: The chassis (1) has symmetrical rail grooves (18) on both sides, and guide rails (17) are slidably installed in the rail grooves (18). The guide rails (17) on both sides of the chassis (1) are fixedly connected to the first box plate (7) and the second box plate (8) respectively. The chassis (1) has symmetrical mounting bases (19) on one side away from the air outlet (3). The mounting base (19) has a plug (20) slidably installed in the mounting base (19). One end of the plug (20) is fixedly connected to the inner wall of the mounting base (19) by symmetrically arranged springs (21). The first box plate (7) and the second box plate (8) have slots (22) on one side corresponding to the plug (20) that are adapted to the plug (20).

6. A computer device for the research and development of experimental instruments according to claim 5, characterized in that: The guide rail (17) has an isosceles trapezoidal cross section, the insert (20) has a right trapezoidal cross section, and the box plate one (7) and box plate two (8) are symmetrically provided with extrusion grooves (23) that are compatible with the insert (20) at the ends away from the air outlet (3).

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