A static contact silver dot structure
The stationary contact silver dot structure manufactured by integrated stamping process utilizes a ring array of protruding nails and grooves design and the synergistic effect of multi-layer materials to solve the problem of easy detachment of the stationary contact silver dot structure under frequent switching and current impact, achieving higher adhesion and more stable current transmission.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 吴江市东风电工器材有限公司
- Filing Date
- 2025-06-25
- Publication Date
- 2026-06-16
AI Technical Summary
The existing static contact silver point structure is prone to silver layer peeling and falling off under frequent switching and current surges, resulting in poor contact and equipment failure, and shortening service life.
The static contact silver dot structure, manufactured using an integrated stamping process, utilizes a ring array of protruding pins and grooves, combined with chamfers and retaining rings at specific demolding angles, to form a mechanical locking structure. This enhances the adhesion between the silver and copper layers and reduces current transmission loss and contact resistance fluctuations through the synergistic effect of multiple materials.
It effectively improves the adhesion between the silver and copper layers, reduces current transmission loss and contact resistance fluctuations, extends the service life of the static contact, and reduces the risk of equipment failure and maintenance costs.
Smart Images

Figure CN224366697U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrical accessories technology, and in particular to a static contact silver dot structure. Background Technology
[0002] The stationary contact silver dot structure is a silver contact structure embedded on the stationary contact piece. It utilizes the excellent conductivity and wear resistance of silver to ensure stable circuit connection. It is fixed in a designated position on the stationary contact piece through a special process, forming a key node for current conduction. It is widely used in electronic components such as relays and switches to ensure reliable switching of equipment.
[0003] The stationary contact silver point structure allows current to flow smoothly between the moving and stationary contacts through the high conductivity of the silver points. The wear resistance of silver maintains long-term contact reliability. When the circuit is connected, the silver points and the moving contact form a conductive path in close contact. When disconnected, the current is cut off. The structure of the silver points and the stationary contact is fixed, and the contact position remains stable during repeated switching, ensuring the stable realization of the circuit switching function.
[0004] In existing technologies, some silver dot structures for stationary contacts are typically fabricated by plating silver or soldering silver dots onto the surface of a copper stationary contact to meet conductivity and wear resistance requirements. However, in actual use, due to the difference in material properties between the silver and copper layers, the adhesion between them is limited. When the stationary contact operates under conditions such as frequent circuit switching and current surges, the silver layer is prone to peeling and detachment. This not only affects the conductivity of the stationary contact but also leads to poor contact, equipment failure, and other problems, greatly shortening the service life of the stationary contact and the reliability of the equipment. Therefore, a new silver dot structure for stationary contacts is proposed to solve the above problems. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a static contact silver dot structure, which aims to improve the problems of poor contact and equipment failure in the prior art.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A static contact silver dot structure includes a carrier, a large end fixedly connected to the front side of the carrier, a plurality of protruding nails fixedly connected to the front side of the large end, a plurality of grooves opened inside the large end, a fixing ring fixedly connected to the outside of the large end, a chamfer one provided at the outer top of the large end, a chamfer two provided at the outer top of the large end, the carrier and the large end are integral, and a reinforcing module is provided inside the carrier;
[0008] As a further description of the above technical solution:
[0009] The reinforcing module includes a conductive base layer, an auxiliary conductive layer is disposed inside the carrier, and a protective conductive layer is disposed outside the carrier.
[0010] As a further description of the above technical solution:
[0011] The plurality of protruding studs are arranged in a ring array, and the plurality of grooves are arranged in a ring array;
[0012] As a further description of the above technical solution:
[0013] The carrier is cylindrical in shape, and the large end is also cylindrical in shape.
[0014] As a further description of the above technical solution:
[0015] The demolding angle of the first chamfer is 15-20 degrees, and the demolding angle of the second chamfer is 30-35 degrees;
[0016] As a further description of the above technical solution:
[0017] The conductive base layer is made of silver, and the auxiliary conductive layer is made of copper.
[0018] As a further description of the above technical solution:
[0019] The protective conductive layer is made of nickel, and the conductive base layer and the auxiliary conductive layer are formed by stamping.
[0020] As a further description of the above technical solution:
[0021] The outer surface of the conductive base layer is in contact with the inner wall of the auxiliary conductive layer, and the outer surface of the auxiliary conductive layer is in contact with the inner wall of the protective conductive layer.
[0022] This utility model has the following beneficial effects:
[0023] 1. In this utility model, the carrier and the large end adopt an integrated stamping process, avoiding problems such as interface resistance and poor connection caused by traditional welding or riveting. The annular array of protruding nails and grooves on the large end, combined with chamfer one and chamfer two with specific demolding angles, and the large angle design of chamfer two reduces the frictional resistance during pressing. The fixing ring is embedded in the annular groove inside the copper during stamping and pressing, thereby realizing the effective reduction of stamping resistance and forming stress through the annular protruding nails, double-angle chamfers and fixing ring locking structure, eliminating welding interface defects, and greatly improving the adhesion of the silver layer and copper layer by using mechanical interlocking and precise positioning mechanism.
[0024] 2. In this utility model, the conductive base layer uses silver to significantly reduce current transmission loss, the auxiliary conductive layer uses copper to provide the main conductive path, and the annular array of protruding nails on the front side of the large end pierces the oxide film on the contact surface when the contact is closed, forming multi-point contact. The protruding nails disperse the arc energy, and the outer protective conductive layer uses nickel, thereby achieving a significant reduction in current transmission loss and contact resistance fluctuation. The annular protruding nail structure effectively disperses the arc energy, improving conductivity stability. The nickel in the protective conductive layer extends the service life of the static contact under complex working conditions, effectively reducing equipment maintenance costs and failure risks. Attached Figure Description
[0025] Figure 1 This is a three-dimensional schematic diagram of a static contact silver dot structure proposed in this utility model;
[0026] Figure 2 This is a schematic diagram of the protruding nail of the static contact silver dot structure proposed in this utility model;
[0027] Figure 3 This is a schematic diagram of the chamfer of the silver dot structure of the static contact sheet proposed in this utility model;
[0028] Figure 4 This is a schematic diagram of the fixing ring of the static contact silver dot structure proposed in this utility model.
[0029] Legend:
[0030] 1. Carrier; 2. Large end; 3. Protruding nail; 4. Groove; 5. Fixing ring; 6. Chamfer 1; 7. Chamfer 2; 8. Conductive base layer; 9. Auxiliary conductive layer; 10. Protective conductive layer. Detailed Implementation
[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0032] Reference Figures 1 to 3This utility model provides an embodiment of a static contact silver dot structure, including a carrier 1, which provides installation space and support for the upper components. A large end 2 is fixedly connected to the front side of the carrier 1. The large end 2 is the key connection part between the silver dot and the external circuit. It is stamped and shaped with the carrier 1. Multiple protruding nails 3 are fixedly connected to the front side of the large end 2. The protruding nails 3 can pierce the oxide film on the contact surface when the contact is closed, forming multi-point contact and reducing contact resistance fluctuation. At the same time, during the breaking process, the protruding nails 3 help to disperse the arc energy, reduce local ablation, and improve the anti-welding performance of the contact. Multiple grooves 4 are opened inside the large end 2. The grooves 4 are hemispherical grooves 4, which enhance the bonding force between the silver dot and the large end 2 and prevent the silver dot from falling off under long-term vibration, thermal expansion and contraction or arc impact. The grooves 4 can also serve as stress relief structures to reduce internal stress concentration caused by the difference in the coefficient of material expansion.
[0033] The external fixed connection of the large end 2 is a fixing ring 5. The fixing ring 5 can be embedded in the corresponding annular groove inside the copper to form an annular mechanical locking structure, which can effectively prevent the silver alloy layer from sliding radially. The outer top of the large end 2 is provided with a chamfer 6. The chamfer 6 ensures that the 3 protruding nails are pressed into the corresponding groove on the outside first to form an initial fixation. The outer top of the large end 2 is provided with a chamfer 7. The large angle of the chamfer 7 reduces the frictional resistance during pressing and avoids edge cracking due to uneven pressure. The carrier 1 and the large end 2 are integrated. The carrier 1 and the large end 2 are formed by stamping to avoid problems such as interface resistance and loose connection caused by traditional welding or riveting. The carrier 1 is provided with a reinforcing module inside.
[0034] Reference Figures 1 to 4 The strengthening module includes a conductive base layer 8, which serves as the core path for current transmission. An auxiliary conductive layer 9 is provided inside the carrier 1, which provides the main conductive path, making the current distribution more uniform and reducing the skin effect. A protective conductive layer 10 is provided on the outside of the carrier 1, which can protect the internal conductive base layer 8 and reduce the corrosion effect.
[0035] Reference Figures 2 to 4Multiple protruding pins 3 are arranged in a ring array. The ring array distribution ensures that the contact pressure can be evenly distributed when the contact piece is closed, avoiding local stress concentration. Multiple grooves 4 are arranged in a ring array. The grooves 4 are used for stamping and can adapt to the external copper to form a mechanical engagement, which greatly improves the bonding force between the copper and the large end 2. The carrier 1 is cylindrical in shape. The cylindrical shape facilitates the matching of external components such as contact seats and insulating sleeves. The large end 2 is cylindrical in shape. The current distribution of the cylindrical structure is more uniform. Compared with the irregular structure, it can reduce eddy current loss by 10% to 15%. The demolding angle of chamfer 1 6 is 15-20 degrees, which ensures that the 3 protruding pins are pressed into the corresponding grooves of the outside first to form initial fixation. The demolding angle of chamfer 2 7 is 30-35 degrees. The large angle of 30-35 degrees reduces the frictional resistance during pressing and avoids edge cracking due to uneven pressure.
[0036] The conductive base layer 8 is made of silver, the metal with the best conductivity. Its low resistivity significantly reduces current transmission loss. The auxiliary conductive layer 9 is made of copper, providing the main conductive path. The inner layer is an aluminum core, which is bonded together through a cladding welding process, ensuring conductivity while reducing weight. The protective conductive layer 10 is made of nickel, which combines excellent conductivity with strong corrosion resistance. Its amorphous structure has no grain boundary defects, effectively preventing the penetration of corrosive media. The conductive base layer 8 and the auxiliary conductive layer 9 are formed by stamping. Stamping reduces material deformation and mold wear, reduces the unsightly appearance caused by traditional soldering, and improves the yield rate of stamped parts. The outer surface of the conductive base layer 8 is in contact with the inner wall of the auxiliary conductive layer 9, which assists the conductive base layer 8 in conducting electricity. The outer surface of the auxiliary conductive layer 9 is in contact with the inner wall of the protective conductive layer 10, which provides protection for the interior and reduces corrosion.
[0037] Working principle: In the production process of the silver dot structure of the static contact piece, the carrier 1 and the large end 2 adopt an integrated stamping process, avoiding problems such as interface resistance and loose connection caused by traditional welding or riveting. The design of the annular array of protruding nails 3 and grooves 4 on the large end 2, combined with the specific demolding angles of chamfer one 6 (15-20) degrees and chamfer two 7 (30-35) degrees, can significantly reduce the stamping resistance. During stamping, the protruding nails 3 are preferentially embedded into the corresponding external grooves to form initial fixation. The large angle design of chamfer two 7 reduces the frictional resistance during pressing and avoids edge cracking due to uneven pressure. At the same time, the fixing ring 5 is embedded into the annular groove inside the copper during stamping and pressing to form a mechanical locking structure, ensuring accurate positioning of the parts. This enables efficient and high-precision production, greatly improving the yield of stamped parts.
[0038] This static contact silver dot structure utilizes the synergistic effect of multiple materials. The conductive base layer 8 significantly reduces current transmission loss through silver, while the auxiliary conductive layer 9 uses copper to provide the main conductive path. The copper layer surface undergoes micro-arc oxidation treatment to form a nanoscale porous structure, enhancing the bonding force with the conductive base layer 8, resulting in a more uniform current distribution and reducing the skin effect. During contact, the annular array of protruding studs 3 on the front side of the large end 2 pierces the oxide film on the contact surface when the contact is closed, forming multi-point contact and effectively reducing contact resistance fluctuations. During the breaking process, the protruding studs 3 disperse the arc energy, reducing local ablation and further ensuring conductive stability. The external protective conductive layer 10 uses nickel, which effectively prevents the penetration of corrosive media, providing protection for the internal conductive structure and avoiding a decrease in conductivity due to corrosion. The combined effect of multiple structures and materials ensures that the silver dot possesses strong conductivity and long-term reliability.
[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A static contact silver dot structure, comprising a carrier (1), characterized in that: The front side of the carrier (1) is fixedly connected to a large end (2), and the front side of the large end (2) is fixedly connected to multiple protruding nails (3). Multiple grooves (4) are opened inside the large end (2). A fixing ring (5) is fixedly connected to the outside of the large end (2). A chamfer one (6) is provided at the top of the outer end of the large end (2). A chamfer two (7) is provided at the top of the outer end of the large end (2). The carrier (1) and the large end (2) are integrated. A reinforcing module is provided inside the carrier (1).
2. The static contact silver dot structure according to claim 1, characterized in that: The reinforcing module includes a conductive base layer (8), an auxiliary conductive layer (9) is provided inside the carrier (1), and a protective conductive layer (10) is provided outside the carrier (1).
3. The static contact silver dot structure according to claim 1, characterized in that: The plurality of protruding nails (3) are arranged in a ring array, and the plurality of grooves (4) are arranged in a ring array.
4. The static contact silver dot structure according to claim 1, characterized in that: The carrier (1) is cylindrical in shape, and the large end (2) is cylindrical in shape.
5. The static contact silver dot structure according to claim 1, characterized in that: The demolding angle of chamfer one (6) is 15-20 degrees, and the demolding angle of chamfer two (7) is 30-35 degrees.
6. The static contact silver dot structure according to claim 2, characterized in that: The conductive base layer (8) is made of silver, and the auxiliary conductive layer (9) is made of copper.
7. The static contact silver dot structure according to claim 2, characterized in that: The protective conductive layer (10) is made of nickel, and the conductive base layer (8) and the auxiliary conductive layer (9) are formed by stamping.
8. The silver dot structure of a static contact sheet according to claim 2, characterized in that: The outer surface of the conductive base layer (8) is in contact with the inner wall of the auxiliary conductive layer (9), and the outer surface of the auxiliary conductive layer (9) is in contact with the inner wall of the protective conductive layer (10).