Controller and starting power generation integrated machine of embedded power module

Abstract

The utility model discloses a controller and starting power module of integrated generator of embedded power module. The controller includes power module interphase copper bar, power module integrated patch component, power module PCBA, controller PCBA, cover plate and heat dissipation casing, power module interphase copper bar is welded in the first surface of power module PCBA, power module integrated patch component is welded in the second surface of power module PCBA, and the first surface and the second surface are oppositely arranged, the cover plate is matched with heat dissipation casing and fixedly connected, and power module PCBA and controller PCBA are located in the cavity formed by cover plate and heat dissipation casing, and power module PCBA and controller PCBA are electrically connected, power module PCBA is fixed on heat dissipation casing, controller PCBA is fixed on the cover plate, and the cover plate is fixedly connected with heat dissipation casing. The utility model realizes structure optimization, simplifies assembly process, improves controller overall integration, improves product reliability and economy.

Description

Technical Field

[0001] This utility model relates to the field of power module layout technology, and in particular to an embedded power module controller and an integrated starter-generator. Background Technology

[0002] The 48VIBSG is a belt-driven starter-generator. The power module in the controller primarily functions as an inverter, converting direct current (DC) into alternating current (AC). The power module converts the DC power supplied by the 48V battery into three-phase AC power via MOSFETs, providing corresponding control for the motor.

[0003] The existing controller design consists of three independent power module packages. Each power module is mounted on a heatsink, and the power modules are pre-positioned with the heatsink using thermal adhesive. Then, laser welding is used to solder the three copper busbars of the power module to the copper busbars of the capacitor bracket. After welding, the power module is finally encapsulated through potting resin and curing processes. The control output pins of the power module are selectively wave soldered to the upper PCBA control board. The power module and the PCBA housing are sealed with sealant. The entire installation process involves multiple potting and curing steps to ensure heat dissipation and sealing, increasing production cycle time and reducing production efficiency. The existing controller suffers from complex structure, low mechanical integration, complex manufacturing processes, and high material and process costs. Utility Model Content

[0004] This utility model provides an embedded power module controller and an integrated starter-generator to achieve structural optimization, simplify the assembly process, improve the overall integration of the controller, and enhance product reliability and economy.

[0005] According to one aspect of the present invention, an embedded power module controller is provided, the embedded power module controller comprising: a power module phase-to-phase copper busbar, a power module integrated surface mount assembly, a power module PCBA, a controller PCBA, a cover plate, and a heat dissipation housing;

[0006] The power module phase-to-phase copper busbars are soldered to the first surface of the power module PCBA, and the power module integrated surface mount assembly is soldered to the second surface of the power module PCBA. The first surface and the second surface are arranged facing each other.

[0007] The cover plate is matched and fixedly connected to the heat dissipation housing. The power module PCBA and the controller PCBA are located in the cavity formed by the cover plate and the heat dissipation housing. The power module PCBA and the controller PCBA are electrically connected. The power module PCBA is fixed on the heat dissipation housing, and the controller PCBA is fixed on the cover plate. The cover plate is fixedly connected to the heat dissipation housing.

[0008] Optionally, the controller of the embedded power module also includes: a connection connector;

[0009] The power module PCBA and the controller PCBA are soldered together via the connector.

[0010] Optionally, the power module integrated surface mount assembly includes: at least two MOSFET chips, a current sensor, and bonding leads;

[0011] The power module PCBA also includes a magnetic ring and at least three position sensors.

[0012] Optionally, the power module integrates a surface-mount component for converting DC power to AC power and controlling the switching state of the MOSFET chip.

[0013] Optionally, the surface of the heat sink housing has a plurality of first support pillars, and the power module PCBA is fixedly connected to the first support pillars by screws.

[0014] Optionally, the surface of the cover plate has a plurality of second support columns, and the controller PCBA is fixedly connected to the second support columns by screws.

[0015] Optionally, the phase-to-phase copper busbar of the power module is used to transmit AC current to the phase current copper busbar of the motor.

[0016] Optionally, the controller PCBA is an inverter control circuit.

[0017] Optionally, the controller of the embedded power module also includes: an injection-molded part;

[0018] The injection molded part is used for the fixed connection between the power module integrated surface mount assembly and the power module PCBA.

[0019] According to another aspect of the present invention, a starter-generator integrated machine is provided, which includes a controller for the embedded power module described in any one of the preceding aspects.

[0020] The technical solution of this utility model embodiment embeds the power module into the PCBA, and then connects the power module PCBA and the controller PCBA through connectors, encapsulating them in the controller's heat dissipation housing and cover plate. Through the embedded power module design, the originally separate power modules can be integrated into a single control circuit board, eliminating the need for the original power module support housing, potting adhesive, heat dissipation adhesive, laser welding, and other processes and structural designs. This achieves optimized structure, simplified assembly process, improved overall controller integration, and enhanced product reliability and economy. In summary, this mainly solves the problems of complex power module structure, low mechanical integration, complex processes, and high material and process costs in existing controllers.

[0021] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is an exploded view of a controller for an embedded power module according to an embodiment of the present utility model;

[0024] Figure 2 This is a schematic diagram of the structure of a power module integrated patch assembly according to an embodiment of the present utility model;

[0025] Figure 3 This is a structural schematic diagram of a power module PCBA provided according to an embodiment of the present utility model;

[0026] Figure 4 This is a structural schematic diagram of a power module phase-to-phase copper busbar and a power module PCBA provided according to an embodiment of the present utility model. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0029] Figure 1 This is an exploded view of a controller for an embedded power module according to an embodiment of the present invention, with reference to... Figure 1 The present invention provides an embedded power module controller, which includes: a power module phase-to-phase copper busbar 1, a power module integrated surface mount assembly 2, a power module PCBA 3, a controller PCBA 5, a cover plate 6, and a heat dissipation housing 7.

[0030] The power module phase-to-phase copper busbar 1 is soldered to the first surface of the power module PCBA3, and the power module integrated surface mount assembly 2 is soldered to the second surface of the power module PCBA3. The first and second surfaces are arranged facing each other.

[0031] The cover plate 6 is matched and fixedly connected to the heat sink 7. The power module PCBA3 and the controller PCBA5 are located in the cavity formed by the cover plate 6 and the heat sink 7. The power module PCBA3 and the controller PCBA5 are electrically connected. The power module PCBA3 is fixed on the heat sink 7, and the controller PCBA5 is fixed on the cover plate 6. The cover plate 6 and the heat sink 7 are fixedly connected.

[0032] Specifically, the power module phase-to-phase copper busbar 1 is soldered to the lower surface of the power module PCBA3, the power module integrated surface mount assembly 2 is reflow soldered to the upper surface of the power module PCBA3, the power module PCBA3 is positioned on the heat sink housing 7 by screws, the controller PCBA5 is positioned on the cover plate 6 by screws, and the controller PCBA5 is soldered to the power module PCBA3.

[0033] The power module phase-to-phase copper busbar 1 is electrically connected to the power module PCBA3 and the external motor phase current copper busbar. The power module phase-to-phase copper busbar 1 is used to transfer AC current to the motor phase current copper busbar. The power module integrated surface mount assembly 2 realizes DC-to-AC conversion and MOSFET switching. The power module PCBA3 functions to solder the components on the power module integrated surface mount assembly 2 onto the same PCB board. The controller PCBA5 functions as the inverter control circuit. The cover plate 6 functions to support and protect the controller PCBA5, and also provides heat dissipation. The heat sink 7 functions to support the power module PCBA3, protect the internal structure of the inverter, and also provides heat dissipation.

[0034] The embedded power module design integrates the power module onto the PCB board and connects the power module PCBA3 to the controller PCBA5, achieving mechanical integration. This design offers greater structural complexity and space efficiency compared to independently packaged power modules, while also providing more flexibility and space for maneuvering in the overall controller size and positioning.

[0035] In the assembly process, multiple steps of the original independent power module are eliminated, reducing potting adhesive and curing processes, laser welding of copper busbars and capacitor support copper busbars, wave soldering of multiple power control PINs, and sealing and curing processes for the original heat sink housing and PCBA housing. This significantly simplifies the process and improves production efficiency. In terms of cost, the elimination of multiple potting, dispensing, and welding processes saves on material and production time costs. Regarding reliability, the simple structure, simplified process, and high integration improve upon the original potting adhesive leakage, poor sealing, and cold solder joints, thus enhancing product reliability.

[0036] The technical solution of this utility model embodiment embeds the power module into the PCBA, and then connects the power module PCBA and the controller PCBA through connectors, encapsulating them in the controller's heat dissipation housing and cover plate. Through the embedded power module design, the originally separate power modules can be integrated into a single control circuit board, eliminating the need for the original power module support housing, potting adhesive, heat dissipation adhesive, laser welding, and other processes and structural designs. This achieves optimized structure, simplified assembly process, improved overall controller integration, and enhanced product reliability and economy. In summary, this mainly solves the problems of complex power module structure, low mechanical integration, complex processes, and high material and process costs in existing controllers.

[0037] Continue to refer to Figure 2 Optionally, the controller of the embedded power module also includes: connector 4;

[0038] The power module PCBA3 and the controller PCBA5 are soldered together via connector 4.

[0039] Figure 2 This is a structural schematic diagram of a power module integrated surface mount assembly according to an embodiment of the present invention, with reference to... Figure 2 Optionally, the power module integrated surface mount assembly 2 includes: at least two MOSFET chips 21, a current sensor 22, and bonding leads 23;

[0040] Figure 3 This is a structural schematic diagram of a power module PCBA according to an embodiment of the present utility model, with reference to... Figure 3 The power module PCBA3 also includes a magnetic ring 31 and at least three position sensors 32.

[0041] Specifically, in addition to the integrated power module surface mount assembly 2, the power module PCBA3 has three position sensors 32 on its front side and a magnetic ring 31 and other components on its back side.

[0042] Continue to refer to Figure 2 Optionally, the power module integrates a surface-mount component 2 to convert DC power to AC power and control the switching state of the MOSFET chip 21.

[0043] Continue to refer to Figure 1 Optionally, the surface of the heat sink 7 has multiple first support pillars, and the power module PCBA3 is fixedly connected to the first support pillars by screws.

[0044] Specifically, the function of the heat sink 7 is to support the power module PCBA3, protect the internal structure of the inverter, and dissipate heat. The power module PCBA3 is fixedly connected to multiple first support posts on the surface of the heat sink 7 by screws. The first support posts are used to support the power module PCBA3, so that the power module PCBA3 is subjected to more even force and avoids stress concentration that could damage the power module PCBA3.

[0045] Continue to refer to Figure 1 Optionally, the surface of the cover plate 6 has multiple second support pillars, and the controller PCBA5 is fixedly connected to the second support pillars by screws.

[0046] Specifically, the cover plate 6 functions to support and protect the controller PCBA5, and also provides heat dissipation. The controller PCBA5 is fixedly connected to multiple second support columns on the surface of the cover plate 6 by screws. The second support columns are all used to support the controller PCBA5, so that the controller PCBA5 is subjected to more even force and avoids stress concentration that could damage the controller PCBA5.

[0047] Optionally, the phase busbars of the power module are used as phase current busbars to transmit AC current to the motor.

[0048] Optionally, the controller PCBA is an inverter control circuit.

[0049] Figure 4 This is a structural schematic diagram of a power module phase-to-phase copper busbar and a power module PCBA according to an embodiment of the present invention, with reference to... Figure 4 Optionally, the controller of the embedded power module also includes: injection molded part 11; injection molded part 11 is used for the fixed connection of the power module integrated surface mount assembly 2 and the power module PCBA3.

[0050] Specifically, the power module phase-to-phase copper busbar 1 is connected to the power module PCBA3 and the external motor phase current copper busbar via the injection-molded part 11. The power module phase-to-phase copper busbar 1 is used to transmit AC current to the motor phase current copper busbar. The injection-molded part 11 mainly serves the functions of insulation, protection, and fixation. The presence of the injection-molded part 11 increases the electrical isolation between the phase-to-phase copper busbars.

[0051] An embodiment of this utility model also provides a starter-generator integrated machine, which includes the controller of the embedded power module in any embodiment of this utility model.

[0052] Since the integrated starter-generator includes the controller of the embedded power module provided in any embodiment of this utility model, the beneficial effects of the integrated starter-generator and the controller of the embedded power module are the same, and will not be repeated here.

[0053] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A controller for an embedded power module, characterized in that, include: Power module phase-to-phase copper busbars, power module integrated surface mount components, power module PCBA, controller PCBA, cover plate, and heat dissipation housing; The power module phase-to-phase copper busbars are soldered to the first surface of the power module PCBA, and the power module integrated surface mount assembly is soldered to the second surface of the power module PCBA. The first surface and the second surface are arranged facing each other. The cover plate is matched and fixedly connected to the heat dissipation housing. The power module PCBA and the controller PCBA are located in the cavity formed by the cover plate and the heat dissipation housing. The power module PCBA and the controller PCBA are electrically connected. The power module PCBA is fixed on the heat dissipation housing, and the controller PCBA is fixed on the cover plate. The cover plate is fixedly connected to the heat dissipation housing.

2. The controller for the embedded power module according to claim 1, characterized in that, Also includes: Connector plugs; The power module PCBA and the controller PCBA are soldered together via the connector.

3. The controller for the embedded power module according to claim 1, characterized in that, The power module integrated surface mount assembly includes: at least two MOSFET chips, a current sensor, and bonding leads; The power module PCBA also includes a magnetic ring and at least three position sensors.

4. The controller for the embedded power module according to claim 3, characterized in that, The power module integrates a surface-mount component to convert DC power to AC power and control the switching state of the MOSFET chip.

5. The controller for the embedded power module according to claim 1, characterized in that, The surface of the heat sink housing has multiple first support pillars, and the power module PCBA is fixedly connected to the first support pillars by screws.

6. The controller for the embedded power module according to claim 1, characterized in that, The surface of the cover plate has multiple second support columns, and the controller PCBA is fixedly connected to the second support columns by screws.

7. The controller for the embedded power module according to claim 1, characterized in that, The phase busbars of the power module are used to transmit alternating current to the phase current busbars of the motor.

8. The controller for the embedded power module according to claim 1, characterized in that, The controller PCBA is an inverter control circuit.

9. The controller for the embedded power module according to claim 1, characterized in that, Also includes: Injection molded parts; The injection molded part is used for the fixed connection between the power module integrated surface mount assembly and the power module PCBA.

10. A starter-generator integrated unit, characterized in that, The controller includes the embedded power module as described in any one of claims 1-9.

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