A box structure for a high-power power supply
By using anti-radiation and insulating spacers to cover the circuit board in high-power power supplies, combined with limiting protrusions for fixation, efficient shielding and heat dissipation of electromagnetic waves and radio frequency radiation are achieved, solving the radiation hazards and heat dissipation problems of high-power power supplies.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIAN IGOR ELECTRIC CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-06-16
AI Technical Summary
The electromagnetic waves and radio frequency radiation from high-power power supplies are harmful to the human body, and existing plastic power supply boxes cannot effectively shield them, causing user panic.
The circuit board is covered with radiation shielding and insulating partitions. The radiation shielding partitions are made of aluminum or copper, and the insulating partitions are made of insulating film material. They are encapsulated with plastic sealant and fixed with limiting protrusions to form a multi-layer structure to shield radiation and dissipate heat.
It effectively reduces radiation intensity by more than 90%, eliminates radiation hazards, ensures circuit board safety and good heat dissipation, and avoids short circuits on the circuit board.
Smart Images
Figure CN224368102U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power supply box technology, and in particular to a box structure for a high-power power supply. Background Technology
[0002] High-power power supplies (such as switching power supplies of 160W and above) cause huge changes in voltage and current in a very short time due to high-frequency switching operations. This can cause dramatic changes in the magnetic field and increase the different radiation energy generated by different components on the circuit board. As a result, the circuit board emits more electromagnetic waves, radio frequency radiation and high-energy particle radiation through the power supply box than before. Since the power supply box is usually made of plastic, it cannot reduce radiation. Therefore, the use of high-power power supplies is more harmful to the human body and can easily cause panic among users. Utility Model Content
[0003] To address the aforementioned shortcomings, the purpose of this invention is to propose a box structure for high-power power supplies, thereby resolving the safety hazard of power supply boxes failing to shield radiation.
[0004] To achieve this objective, the present invention adopts the following technical solution:
[0005] A housing structure for a high-power power supply includes a housing, a radiation shield, an insulating shield, and a cover; a circuit board is installed in a slot in the housing, the insulating shield covers the circuit board, the radiation shield covers the insulating shield, the cover is fixedly connected to the slot of the housing, and the cover seals the slot of the housing.
[0006] Furthermore, the radiation shielding component is also used for heat dissipation, the insulating component is made of an insulating film material, and the circuit board is encapsulated with a plastic sealant.
[0007] Furthermore, both the radiation shielding partition and the insulating partition are concave partitions formed along the groove of the box body;
[0008] The radiation shielding partition is attached and stacked in the groove of the box body, the insulating partition is attached and stacked in the groove of the radiation shielding partition, and the circuit board is placed in the groove of the insulating partition.
[0009] The inner sidewall of the box body is provided with multiple limiting protrusions; the multiple limiting protrusions press against the anti-radiation partition and the insulating partition, and cooperate to limit the circuit board.
[0010] Furthermore, the side of the circuit board with discrete components faces the slot of the insulating spacer.
[0011] Furthermore, the radiation shielding partition and the insulating partition respectively have a first limiting opening and a second limiting opening corresponding to the limiting protrusion; the plurality of limiting protrusions all pass through the first limiting opening and the second limiting opening, and cooperate to limit the circuit board.
[0012] Furthermore, the first limiting opening is larger than the second limiting opening.
[0013] Furthermore, the radiation shielding component has a split notch.
[0014] Furthermore, the radiation shielding element is made of aluminum or copper.
[0015] Furthermore, the insulating film material is a polyester film, a polytetrafluoroethylene film, or a polyimide film.
[0016] Furthermore, the encapsulating adhesive is 916 two-component thermally conductive potting silicone.
[0017] The technical solution provided by this utility model can include the following beneficial effects: the circuit board equipped with a high-power power supply circuit is mainly covered by a radiation-proof partition to prevent the circuit board from emitting radiation signals to the outside of the box, thereby reducing the radiation intensity by more than % and solving the radiation hazard.
[0018] Meanwhile, since radiation shielding components are usually made of metals or alloys such as lead, iron, and copper to shield radiation, they are prone to conduction and can cause short circuits in the circuit board. Therefore, an additional insulating layer is needed between the radiation shielding component and the circuit board for electrical isolation. Attached Figure Description
[0019] Figure 1 This is an assembly drawing of a housing structure for a high-power power supply, which is one embodiment of this utility model.
[0020] The components include: box body 1, radiation shielding partition 2, insulating partition 3, circuit board 4, box cover 5, limiting protrusion 11, first limiting opening 21, second limiting opening 31, and splitting notch 22. Detailed Implementation
[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0022] In the description of this utility model, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of these features, used to distinguish and describe features, without any order or emphasis.
[0023] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0024] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model according to the specific circumstances.
[0025] The following is combined Figure 1 This describes a housing structure for a high-power power supply according to an embodiment of the present invention.
[0026] A housing structure for a high-power power supply includes a housing 1, a radiation shielding partition 2, an insulating partition 3, and a housing cover 5; a circuit board 4 is installed in a groove in the housing 1, the insulating partition 3 covers the circuit board 4, the radiation shielding partition 2 covers the insulating partition 3, and the housing cover 5 is fixedly connected to the groove of the housing 1, with the housing cover 5 sealing the groove of the housing 1.
[0027] This utility model proposes a preferred embodiment of a housing structure for a high-power power supply, such as... Figure 1 As shown, the circuit board 4, which is equipped with a high-power power supply circuit, is mainly covered by the anti-radiation partition 2 to prevent the circuit board 4 from emitting radiation signals outside the box, thereby reducing the radiation intensity by more than 90% and solving the radiation hazard.
[0028] Meanwhile, since the radiation shielding partition 2 is usually made of metals or alloys such as lead, iron, and copper to shield radiation, it is easy to conduct electricity, causing the circuit board 4 to short circuit. Therefore, an additional insulating partition 3 is needed between the radiation shielding partition 2 and the circuit board 4 for electrical isolation.
[0029] Furthermore, the radiation shielding partition 2 is also used for heat dissipation, the insulating partition 3 is made of insulating film material, and the circuit board 4 is encapsulated with plastic sealant.
[0030] In this embodiment, since the circuit board 4 is covered by two layers of radiation shielding spacer 2 and insulating spacer 3, heat dissipation will be greatly affected. Therefore, after the circuit board 4 is encapsulated with plastic sealant, it is then covered by insulating spacer 3 made of insulating film material. The circuit board 4 is in full contact with the insulating spacer 3 through the plastic sealant, so that heat is evenly conducted through the film to the radiation shielding spacer 2 and heat is dissipated by the radiation shielding spacer 2, while avoiding the film from melting at high temperature. At the same time, the plastic sealant can also be used to bond and fix the circuit board 4 and the insulating spacer 3, preventing the circuit board 4 from shifting.
[0031] Furthermore, both the radiation shielding partition 2 and the insulating partition 3 are concave partitions formed along the groove of the box body 1;
[0032] The radiation shielding partition 2 is attached and stacked in the groove of the box 1, the insulating partition 3 is attached and stacked in the groove of the radiation shielding partition 2, and the circuit board 4 is placed in the groove of the insulating partition 3.
[0033] The inner sidewall of the groove of the box 1 is provided with multiple limiting protrusions 11; the multiple limiting protrusions 11 press against the radiation shielding partition 2 and the insulating partition 3, and cooperate with the limiting circuit board 4.
[0034] In this embodiment, in order to facilitate the limiting and fixing of the anti-radiation partition 2, the insulating partition 3 and the circuit board 4, and to enable the anti-radiation partition 2 and the insulating partition 3 to achieve a covering effect, it is preferable that the anti-radiation partition 2 and the insulating partition 3 are both concave partitions formed along the groove of the box body 1, which fit against the groove wall of the box body 1 and are pressed by multiple limiting protrusions 11 to limit the circuit board 4, thereby achieving a relative fixed relationship among the three, and the anti-radiation partition 2 and the insulating partition 3 can cover the circuit board 4.
[0035] Furthermore, the side of the circuit board 4 with discrete components faces the slot of the insulating spacer 3.
[0036] In this embodiment, since the anti-radiation spacer 2 and the insulating spacer 3 form a concave spacer covering the circuit board 4, the slot area is not covered; therefore, it is preferable to place the side of the circuit board 4 with discrete components facing the slot of the insulating spacer 3, so that the other side is placed in close contact with the slot of the insulating spacer 3, that is, the PCB board part is close to the bottom of the slot of the insulating spacer 3. This part is the source of radiation signal emission, and being at the bottom of the slot can be shielded by the anti-radiation spacer 2 as much as possible.
[0037] Furthermore, the radiation shielding partition 2 and the insulating partition 3 respectively open a first limiting opening 21 and a second limiting opening 31 corresponding to the limiting protrusion 11; multiple limiting protrusions 11 pass through the first limiting opening 21 and the second limiting opening 31, and cooperate with the limiting circuit board 4.
[0038] In this embodiment, in order to facilitate the direct positioning of the circuit board 4 by the limiting protrusion 11, a first limiting opening 21 and a second limiting opening 31 are provided for the limiting protrusion 11 to pass through; at the same time, the limiting protrusion 11 can also limit the radiation shielding partition 2 and the insulating partition 3 through the first limiting opening 21 and the second limiting opening 31 respectively.
[0039] Furthermore, the first limiting opening 21 is larger than the second limiting opening 31.
[0040] In this embodiment, since the radiation shielding partition 2 and the insulating partition 3 are stacked, and the insulating partition 3 is a thin film, the two are tightly bonded after being stacked and are not easy to separate; therefore, it is preferable to make the first limiting opening 21 larger, so that the first limiting opening 21 and the second limiting opening 31 are misaligned, so as to facilitate the separation of the radiation shielding partition 2 and the insulating partition 3 from the edge, and meet the needs of later replacement and separation.
[0041] Furthermore, the radiation shielding component 2 has a split notch 22.
[0042] In this embodiment, based on the first limiting opening 21 being larger than the second limiting opening 31, a splitting notch 22 is added to the radiation shielding partition 2 as the starting point for splitting the radiation shielding partition 2 and the insulating partition 3. Then, it is pulled apart along the edge, resulting in higher separation efficiency and less damage to the insulating partition 3 (film), so that the insulating partition 3 can be reused.
[0043] Furthermore, the radiation shield 2 is made of aluminum or copper.
[0044] In this embodiment, the radiation shielding component 2 is preferably made of aluminum and copper, whose metallic properties combine radiation shielding and heat dissipation capabilities.
[0045] Furthermore, the insulating film material is a polyester film, a polytetrafluoroethylene film, or a polyimide film.
[0046] In this embodiment, the polyester film (PET), polytetrafluoroethylene (PTFE) film, and polyimide (PI) film have insulation capabilities. PET has a temperature resistance of 105°C, PTFE has a temperature resistance of 260°C, and PI has a temperature resistance of 400°C, so they will not melt due to the heat conduction of the circuit board 4 to the radiation shielding partition 2. However, considering cost issues and the fact that the maximum temperature of the product generally does not exceed 85°C, the insulating partition 3 can be made of polyester film (PET) to meet the requirements.
[0047] Furthermore, the encapsulating adhesive is 916 two-component thermally conductive potting silicone.
[0048] In this embodiment, the 916 two-component thermally conductive potting silicone does not react chemically with polyester film (PET), polytetrafluoroethylene (PTFE) film and polyimide (PI) film, thus avoiding the phenomenon that the adhesive cannot solidify.
[0049] Other configurations and operations of the housing structure for a high-power power supply according to the embodiments of the present invention are known to those skilled in the art and will not be described in detail here.
[0050] In this specification, the terms "embodiment," "example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0051] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A housing structure for a high-power power supply, characterized in that: It includes a box body, a radiation shielding partition, an insulating partition, and a box cover; the circuit board is installed in the groove of the box body, the insulating partition covers the circuit board, the radiation shielding partition covers the insulating partition, the box cover is fixedly connected to the groove of the box body, and the box cover seals the groove of the box body.
2. The housing structure for a high-power power supply according to claim 1, characterized in that: The radiation shielding component is also used for heat dissipation. The insulating component is made of insulating film material, and the circuit board is encapsulated with plastic sealant.
3. The housing structure for a high-power power supply according to claim 1, characterized in that: Both the radiation shielding partition and the insulating partition are concave partitions formed along the groove of the box body; The radiation shielding partition is attached and stacked in the groove of the box body, the insulating partition is attached and stacked in the groove of the radiation shielding partition, and the circuit board is placed in the groove of the insulating partition. The inner sidewall of the box body is provided with multiple limiting protrusions; the multiple limiting protrusions press against the anti-radiation partition and the insulating partition, and cooperate to limit the circuit board.
4. The housing structure for a high-power power supply according to claim 3, characterized in that: The side of the circuit board with discrete components faces the slot of the insulating spacer.
5. A housing structure for a high-power power supply according to claim 3, characterized in that: The radiation shielding partition and the insulating partition respectively have a first limiting opening and a second limiting opening corresponding to the limiting protrusion; the plurality of limiting protrusions all pass through the first limiting opening and the second limiting opening, and cooperate to limit the circuit board.
6. A housing structure for a high-power power supply according to claim 5, characterized in that: The first limiting opening is larger than the second limiting opening.
7. A housing structure for a high-power power supply according to claim 1, characterized in that: The radiation shielding component has a splitting notch.
8. A housing structure for a high-power power supply according to claim 1, characterized in that: The radiation shielding element is made of aluminum or copper.
9. A housing structure for a high-power power supply according to claim 2, characterized in that: The insulating film material is a polyester film, a polytetrafluoroethylene film, or a polyimide film.
10. A housing structure for a high-power power supply according to claim 2, characterized in that: The encapsulating adhesive is 916 two-component thermally conductive potting silicone.