An immersion liquid cooling device and electronic equipment

Abstract

The utility model provides a kind of immersion liquid cooling device and electronic equipment.The immersion liquid cooling device includes: multiple front split radiators, and each front split radiator is thermally connected to the first surface of a single heating device;Wherein, the multiple front split radiators include a first front split radiator, and at least one second front split radiator, the heat dissipation area of the second front split radiator is greater than the heat dissipation area of the first front split radiator, and the first front split radiator and the second front split radiator are suitable for heat exchange with immersion liquid in turn according to the flow direction of immersion liquid.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to an immersion liquid cooling device and electronic equipment. Background Technology

[0002] With the development of semiconductor technology, high-density and high-power devices have become the mainstream applications. In the fields of artificial intelligence and big data integrated computing, a common approach is to assemble multiple processing chips into a series structure to build a computing board, and then assemble multiple computing boards into a high-performance computing device. This chip arrangement can greatly improve the computing power of the device. However, at the same time, this high-power-density layout also generates a lot of heat during operation, to the point that conventional air cooling and water cooling modes are insufficient to effectively dissipate and cool the localized areas of the chips. Therefore, a more efficient liquid cooling method is used to dissipate heat for the entire device.

[0003] In related technologies, the chip in a liquid cooling device is typically connected to the heat sink or heat plate using thermally conductive gel or thermally conductive grease, and then secured with screws. This increases the thermal resistance between the chip and the heat sink, leading to equipment problems such as chip overheating and component damage due to insufficient heat dissipation.

[0004] Furthermore, one liquid cooling device uses a monolithic heatsink, connected to the chip via a thermally conductive interface material. However, this method suffers from uneven contact between the heatsink and the chip in certain locations, a problem exacerbated by the dissolution of the aforementioned thermally conductive interface material.

[0005] Therefore, a new immersion liquid cooling device is needed that can overcome the shortcomings of existing technologies and efficiently dissipate heat from the chip when it is immersed in the immersion liquid. Utility Model Content

[0006] In view of this, the present invention provides an immersion liquid cooling device and electronic device in an attempt to solve or at least alleviate at least one of the above-mentioned problems.

[0007] According to one aspect of the present invention, an immersion liquid cooling device is provided, comprising: a plurality of front-side split heat sinks, each front-side split heat sink being thermally connected to a first side of a single heat-generating device; wherein the plurality of front-side split heat sinks include a first front-side split heat sink and at least one second front-side split heat sink, the heat dissipation area of ​​the second front-side split heat sink being larger than the heat dissipation area of ​​the first front-side split heat sink, and the first and second front-side split heat sinks being adapted to exchange heat with the immersion liquid sequentially according to the flow direction of the immersion liquid.

[0008] Optionally, in the device according to this invention, the thermally conductive connection includes welding.

[0009] Optionally, in the device according to the present invention, the device further includes a main unit chassis, the main unit chassis including a first immersion liquid inlet orifice plate disposed at a first end, and a second immersion liquid outlet orifice plate disposed at a second end opposite to the first end; wherein, the first front split heat sink is disposed inside the main unit chassis at a preset range from the first immersion liquid inlet orifice plate.

[0010] Optionally, in the device according to the present invention, the preset range is determined based on the position of the heating device, the heat dissipation area of ​​the second front split heat sink and the first front split heat sink, and the target temperature reached by the heating device after heat dissipation.

[0011] Optionally, in the device according to the present invention, the second length of the second front split radiator along the immersion liquid flow direction is greater than the first length of the first front split radiator along the immersion liquid flow direction.

[0012] Optionally, in the device according to the present invention, the end of the front split heat sink is provided with transverse fins for positioning the front split heat sink when it is installed on the heat-generating device.

[0013] Optionally, the device according to the present invention further includes: a plurality of rear split heat sinks, each rear split heat sink being thermally connected to the second side of the heat-generating device opposite to the first side.

[0014] Optionally, in the device according to the present invention, the plurality of rear split heat sinks include a first rear split heat sink and a second rear split heat sink, wherein the heat dissipation area of ​​the second rear split heat sink is larger than that of the first rear split heat sink, and the first rear split heat sink and the second rear split heat sink are used to exchange heat with the immersion liquid sequentially.

[0015] Optionally, in the device according to the present invention, the fourth length of the second rear split radiator along the immersion liquid flow direction is greater than the third length of the first rear split radiator along the immersion liquid flow direction.

[0016] Optionally, the device according to the present invention further includes a power supply chassis electrically connected to the main unit chassis. The power supply chassis has a second immersion liquid inlet orifice plate at the first end and a second immersion liquid outlet orifice plate at the second end opposite to the first end.

[0017] According to a second aspect of the present invention, an electronic device is provided, including at least one computing board; and an immersion liquid cooling device, the immersion liquid cooling device including a plurality of front split heat sinks, each front split heat sink being thermally connected to a heat-generating device disposed on the computing board.

[0018] In the immersion liquid cooling device of this invention, each heat-generating device is connected to a separate front-side split heat sink, which can reduce the extended thermal resistance when the heat generated by the heat-generating device is conducted to the heat sink. Furthermore, the connection stability is better and the contact surface is tighter when the heat-generating device is connected to the separate front-side split heat sink, thus improving the heat dissipation effect of the heat sink on the heat-generating device.

[0019] Furthermore, the temperature rises after the immersion liquid exchanges heat with several radiators. Therefore, a first front-facing split radiator is installed within a preset range from the first immersion liquid inlet orifice plate, and the heat dissipation area of ​​the second front-facing split radiator is larger than that of the first front-facing split radiator. By increasing the heat dissipation area, the heat dissipation effect of the heating devices that are far from the first immersion liquid inlet orifice plate can be improved; the temperature difference between heating devices at different locations is reduced, avoiding excessively high temperatures in some areas of the heating devices and ensuring long-term stable operation of the heating devices.

[0020] Furthermore, the front-mounted split heat sink is connected to the heat-generating device by welding. When the immersion liquid cooling device works in the immersion liquid for a long time, the welded parts will not dissolve, thus preventing gaps from forming between the heat sink and the heat-generating device and allowing the immersion liquid to flow in. Attached Figure Description

[0021] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 A schematic diagram of an immersion liquid cooling device according to an embodiment of the present invention is shown;

[0023] Figure 2 A schematic diagram of an immersion liquid cooling device according to another embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram showing a heat sink being thermally connected to a heat-generating device according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic diagram showing a computing board disposed in a host chassis according to an embodiment of the present invention is shown;

[0026] Figure 5 A schematic diagram showing the connection between the front split heat sink and the rear split heat sink and the heat-generating device according to an embodiment of the present invention is shown.

[0027] Figure 6 A schematic diagram of an electronic device according to an embodiment of the present invention is shown. Detailed Implementation

[0028] The embodiments of the present invention will now be described with reference to the accompanying drawings. Various details of the embodiments of the present invention are included to aid understanding and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0029] In liquid cooling systems, the chip and heat sink or fin are typically connected using thermally conductive gel or thermally conductive grease, further secured with screws. The thermal conductivity of these interface materials is approximately 3–8 W / (m·K). In common air-cooling systems, these materials effectively fill the gap between the chip and the heat sink, ensuring efficient heat dissipation. However, in immersion liquid cooling systems, after a period of operation, the thermally conductive interface material may dissolve in the immersion liquid. This can cause the immersion liquid to seep between the chip and the heat sink, filling the gap. The thermal conductivity of conventional immersion liquids is approximately 0.13–0.15 W / (m·K), significantly lower than that of commonly used thermally conductive interface materials.

[0030] Figure 1 A schematic diagram of an immersion liquid cooling device according to an embodiment of the present invention is shown. Figure 1 As shown, the immersion liquid cooling device 100 includes a main unit chassis 61 and a power supply chassis 62. The main unit chassis 61 and the power supply chassis 62 are connected. This invention does not limit the specific connection method between the main unit chassis 61 and the power supply chassis 62. According to one embodiment of this invention, one side of the main unit chassis 61 and one side of the power supply chassis 62 can be tightly attached together and fixed by means of clips, riveting, etc. The main unit chassis 61 is also electrically connected to the power supply chassis 62.

[0031] According to one embodiment of this utility model, the immersion liquid cooling device can specifically be implemented as a single-phase immersion liquid cooling device, that is, the immersion liquid flows in from one side of the immersion liquid cooling device and flows out from the other side. The immersion liquid, or coolant, is the liquid used to cool the immersion liquid cooling device.

[0032] like Figure 1 As shown, the main unit chassis 61 includes a first immersion liquid outlet orifice plate 63 disposed at its second end. The power supply chassis 62 includes a second immersion liquid outlet orifice plate 64 disposed at its second end.

[0033] Figure 2 A schematic diagram of an immersion liquid cooling device according to another embodiment of the present invention is shown. Figure 1 and Figure 2 These are views of an immersion liquid cooling system from different perspectives. Figure 2 As shown, the main unit chassis 61 also includes a first immersion liquid inlet orifice plate 66 disposed at a first end opposite to the second end. The first end and the second end of the main unit chassis are two opposite end sides of the main unit chassis.

[0034] The power supply chassis 62 also includes a second immersion liquid inlet orifice plate 65 disposed at a first end opposite to the second end. The first end and the second end of the power supply chassis are two opposite end sides of the power supply chassis.

[0035] The immersion liquid cooling system is suitable for placement within an immersion liquid cabinet. The cabinet is filled with immersion liquid. As the immersion liquid flows through the main unit chassis 61, it enters through the first immersion liquid inlet orifice plate 66 and exits through the first immersion liquid outlet orifice plate 63, exchanging heat with the heat-generating components in the main unit chassis 61 to dissipate heat. Similarly, as the immersion liquid flows through the power supply chassis 62, it enters through the second immersion liquid inlet orifice plate 65 and exits through the second immersion liquid outlet orifice plate 64, exchanging heat with the components in the power supply chassis 62 to dissipate heat.

[0036] The host chassis 61 is equipped with a handle. For example... Figure 1 As shown, a handle 7 can be provided on the first immersion liquid outlet orifice plate 63 so that the immersion liquid cooling device can be placed into or removed from the immersion liquid cabinet through the handle 7.

[0037] According to one embodiment of this utility model, a power cord interface 8 is provided on the second immersion liquid outlet orifice plate 64 so that the immersion liquid cooling device can be connected to the power distribution unit (PDU) through the power cord interface 8 to supply power to the immersion liquid cooling device 100. After the power distribution unit supplies power to the power supply chassis 62 through the power cord interface 8, the power supply chassis 62 then supplies power to the heat-generating devices in the main chassis 61 through an electrical connection with the main chassis 61.

[0038] According to one embodiment of this utility model, one or more computing boards can be arranged inside the host chassis 62, and one or more heat-generating devices can be arranged on each computing board. The heat-generating devices can specifically be implemented as chips, performing functions such as computation. When setting heat-generating devices on the computing board, multiple heat-generating devices can be arranged on its first surface. This utility model does not limit the position and number of heat-generating devices (such as chips) on the computing board.

[0039] Figure 3 A schematic diagram showing a heat sink thermally connected to a heat-generating device according to an embodiment of the present invention is shown. Figure 3As shown, the computing board 2 includes a positive terminal and a negative terminal to supply power to the computing board 2. The positive terminal of the computing board 2 can be implemented as a positive copper strip disposed on the computing board 2, specifically including multiple segmented positive copper strips, such as positive copper strip 51, positive copper strip 52, and positive copper strip 53. The negative terminal of the computing board 2 can be implemented as a negative copper strip, such as negative copper strip 54. Multiple positive and negative copper strips can be installed on the first side of the computing board 2 by soldering to supply power to the heat-generating devices (such as chips) installed on the computing board 2. This utility model does not limit the specific connection method between the positive and negative copper strips and the computing board 2.

[0040] Existing immersion liquid cooling devices use integral heat sinks, which are easy to install and remove, and can cover all the chips on the computing board at once. However, due to the flatness of the computing board itself, there is still a problem of uneven contact between the heat sink and some chips, and the dissolution of the thermal interface material in the immersion liquid may exacerbate this problem. Therefore, this invention provides a front-side split heat sink and a rear-side split heat sink for each heat-generating device on the first side and the second side opposite to the first side of the computing board 2.

[0041] Figure 4 A schematic diagram showing a computing board disposed in a host chassis according to an embodiment of the present invention is provided. Figure 4 As shown, multiple immersion liquid cooling units can be placed in the immersion liquid cabinet 400. The multiple immersion liquid cooling units include immersion liquid cooling unit 100 and other immersion liquid cooling units 200. This invention does not limit the specific number of immersion liquid cooling units placed in the immersion liquid cabinet 400.

[0042] The immersion cabinet 400 is filled with immersion liquid 410, i.e. Figure 4 The shaded area in the image. Immersion fluid 410 can flow within immersion fluid cabinet 400. Figure 4 The diagram illustrates an exemplary flow direction of the immersion fluid. Arrow 421 indicates that the immersion fluid 410 flows unidirectionally around the immersion liquid cooling device 100; arrow cluster 422 indicates that the immersion fluid 410 flows in from the first immersion fluid inlet orifice plate 66 as it flows through the immersion liquid cooling device 100; arrow cluster 423 indicates that the immersion fluid 410 flows out from the first immersion fluid outlet orifice plate 63.

[0043] According to one embodiment of this utility model, the immersion liquid cooling device 100 is provided with a computing board 2 and other computing boards 5. This utility model does not limit the number of computing boards installed inside the host chassis.

[0044] When the computing board 2 is installed in the host chassis, the computing board 2 is placed at a certain angle to the first immersion liquid inlet orifice plate 66, such as 90 degrees; and at a certain angle to the first immersion liquid outlet orifice plate 65, such as 90 degrees. That is, when the immersion liquid 410 flows in from the first immersion liquid inlet orifice plate 66, the flow direction is parallel to the surface of the computing board 2, and it is in full contact with the first and second surfaces of the computing board 2 to exchange heat and remove the heat generated by the heating device on the computing board 2 when it is powered on.

[0045] The heat-generating components (including chips) are arranged in a matrix on the computing board. (Back) Figure 3 Based on the aforementioned placement of the computing board in the host chassis, each front-facing split heatsink is thermally connected to the first side of a single heat-generating device. The heat-generating devices on the computing board can be divided into a first heat-generating device and a second heat-generating device. The front-facing split heatsink connected to the first heat-generating device is designated as the first front-facing split heatsink 32; the front-facing split heatsink connected to the second heat-generating device is designated as the second front-facing split heatsink 33. Thermal connection includes soldering. The soldering material used includes high-temperature solder paste. High-temperature solder paste is characterized by high temperature resistance and high reliability.

[0046] By using high-temperature solder paste to connect heat-generating components to the heat sink, the problem of thermal interface materials dissolving in the immersion liquid, which is common with conventional thermal interface materials (such as thermal gel or thermal grease), can be avoided. Furthermore, using high-temperature solder paste can reduce the vertical thermal resistance of heat transfer from the chip to the heat sink, improving the heat sink's heat dissipation capacity. Vertical thermal resistance refers to the efficiency of heat conduction along the vertical direction. The thermal conductivity of high-temperature solder paste, at 20~30 W / (m·K), is much higher than that of other thermal interface materials. Therefore, using high-temperature solder paste can significantly reduce vertical thermal resistance and improve overall heat dissipation capacity.

[0047] The heat dissipation area of ​​the second front-mounted split radiator 33 is larger than that of the first front-mounted split radiator 32. The heat dissipation area of ​​the radiator is the contact area or heat exchange area between the radiator and the immersion liquid when the immersion liquid cooling device 100 is placed in an immersion liquid cabinet filled with immersion liquid. The first and second front-mounted split radiators are adapted to exchange heat with the immersion liquid sequentially according to the flow direction of the immersion liquid.

[0048] The first front-mounted split heat sink is positioned inside the main unit chassis at a predetermined distance from the first immersion liquid inlet orifice plate. According to one embodiment, the predetermined range is determined based on the location of the heat-generating device, the heat dissipation area of ​​the second and first front-mounted split heat sinks, and the target temperature reached by the heat-generating device after heat dissipation. In determining the predetermined range, this invention constructs a heat dissipation model to simulate the heat dissipation process of the immersion liquid cooling device on the heat-generating device, sets the location of each heat-generating device, initializes the predetermined range, and places the first front-mounted split heat sink on the heat-generating devices within the predetermined range, while placing the second front-mounted split heat sink on the other heat-generating devices.

[0049] Input the heat dissipation areas of the first and second front-side split heat sinks into the model to determine whether the temperature of the heat-generating device can reach the target temperature after the front-side split heat sink dissipates heat from the heat-generating device when the immersion liquid is flowing, and whether the temperature of each heat-generating device is uniform.

[0050] Then, based on the initial preset range, the settings are continuously adjusted to obtain multiple candidate preset ranges. For each candidate preset range, it is determined whether the temperature of the heating element can reach the target temperature under the settings determined by the candidate preset range, and whether the temperature of each heating element is uniform.

[0051] The process continued until a suitable setting was determined: under this setting, after the front-mounted split heatsink dissipates heat from the heat-generating components, the temperature of the heat-generating components reaches the target temperature, and the temperature is minimized, resulting in the best heat dissipation effect and the lowest temperature difference between the various heat-generating components. Finally, the candidate preset range corresponding to this setting was used as the final preset range to configure the front-mounted split heatsink in the computer case.

[0052] According to one embodiment, the predetermined range is defined as the midpoint between one end of the computing board near the first immersion liquid inlet orifice plate and the long side of the computing board. A first front-facing split heat sink is provided on the heat-generating devices within the predetermined range, and a second front-facing split heat sink is provided on the other heat-generating devices.

[0053] According to one embodiment, the immersion liquid cooling device further includes multiple rear-mounted heat sinks, each of which is thermally connected to a second surface of a heat-generating device opposite to the first surface. Since the second surface of the heat-generating device is soldered to the first surface of the computing board, when the rear-mounted heat sinks are thermally connected to the second surface of the heat-generating device, they are thermally connected to the location of each heat-generating device on the second surface of the computing board.

[0054] The multiple rear-mounted split radiators include a first rear-mounted split radiator and a second rear-mounted split radiator. The heat dissipation area of ​​the second rear-mounted split radiator is larger than that of the first rear-mounted split radiator. The first and second rear-mounted split radiators are used to exchange heat with the immersion liquid sequentially.

[0055] According to one embodiment, for a first heat-generating device that is provided with a first front split heat sink, a first rear split heat sink is provided at a corresponding position on the second side of the computing board; for a second heat-generating device that is provided with a second front split heat sink, a second rear split heat sink is provided at a corresponding position on the second side of the computing board.

[0056] Figure 5 This diagram illustrates the connection between a front-mounted split heat sink and a rear-mounted split heat sink according to an embodiment of the present invention and a heat-generating device. The heat-generating device can specifically be a chip or similar device. Figure 5 A cross-section of the chip and heat sink is shown, perpendicular to the flow direction of the immersion liquid. Figure 5 As shown, the second side of chip 1 is soldered to the computing board 2 via solder paste 13. This invention does not limit the specific type of solder paste 13. According to one embodiment of this invention, the solder paste 13 can be a conventional solder paste, which has good wetting properties and can improve the stability of the connection between chip 1 and computing board 2.

[0057] The first surface of chip 1 can be coated with a copper-nickel alloy 11. The specific coating method can be electrophoretic coating, physical vapor deposition, etc., and this invention does not limit the specific coating method used. The thickness of the copper-nickel alloy 11 is in the micrometer range. The copper-nickel alloy 11 is soldered to the front-side split heat sink 3 using solder paste 12. The solder paste 12 can specifically be a high-temperature solder paste.

[0058] The front-side split heatsink 3 includes a first front-side split heatsink 32 or a second front-side split heatsink 33. The front-side split heatsink 3 includes multiple parallel layer structures to increase the contact area with the immersion liquid. At the end of the front-side split heatsink 3, i.e., at the end of the parallel layer structures, transverse fins 31 are provided to facilitate positioning of the front-side split heatsink 3 when it is placed on the chip, ensuring that each front-side split heatsink 3 can be accurately installed on the chip at the corresponding location.

[0059] On the second side of the computing board 2, a rear-mounted heatsink 4 is soldered to the corresponding position of each chip using solder paste 14. The rear-mounted heatsink 4 includes either a first rear-mounted heatsink 41 or a second rear-mounted heatsink 42. The solder paste 14 can specifically be a high-temperature solder paste, which can reduce the vertical thermal resistance when heat is transferred from the chip to the rear-mounted heatsink 4. The rear-mounted heatsink 4 is also provided on the second side of the computing board 2, increasing the heat transfer path and the heat exchange area between the immersion liquid and the chip. The rear-mounted heatsink 4 also includes multiple parallel layer structures to increase the contact area with the immersion liquid and improve heat exchange efficiency.

[0060] This invention integrates separate heat sinks welded to both the first and second sides of the computing board, with each heat sink positioned in a one-to-one correspondence with a heat-generating device. This reduces the extended thermal resistance between the heat-generating device and the heat sink, improving heat exchange efficiency. Extended thermal resistance refers to the additional thermal resistance caused by limited lateral thermal conduction when heat diffuses from a smaller heat source area to a larger heat dissipation area. When using a single heat sink to dissipate heat from each individual heat-generating device, the area of ​​the heat sink is larger than the area of ​​a single heat-generating device, resulting in higher extended thermal resistance. This invention uses separate heat sinks to dissipate heat from each heat-generating device individually, significantly reducing the ratio of the contact area of ​​the separate heat sink to the area of ​​a single heat-generating device, thus reducing extended thermal resistance and improving heat exchange efficiency.

[0061] like Figure 3 As shown, the heat dissipation area of ​​the second front split radiator 33 is larger than that of the first front split radiator 32, and the heat dissipation area of ​​the second rear split radiator 42 is larger than that of the first rear split radiator 41. According to one embodiment, the cross-sections of the second front split radiator 33 and the first front split radiator 32 perpendicular to the flow direction of the immersion liquid are the same. In the second front split radiator 33 and the second front split radiator 32, the lengths of the sides parallel to the flow direction of the immersion liquid are a second length and a first length, respectively. The second length is greater than the first length.

[0062] According to one embodiment, the first length can be set to 3cm, and the second length can be set to 5cm or 7cm.

[0063] The second rear-mounted split radiator 42 and the first rear-mounted split radiator 41 have the same cross-section perpendicular to the direction of immersion liquid flow. In both the second rear-mounted split radiator 42 and the second rear-mounted split radiator 41, the lengths of the sides parallel to the direction of immersion liquid flow are the fourth length and the third length, respectively. The fourth length is greater than the third length.

[0064] According to one embodiment, the third length can be set to 3cm, and the fourth length can be set to 5cm or 7cm.

[0065] Because the immersion fluid is at a low temperature when it first flows into the first immersion fluid inlet plate 66, its temperature rises after passing through several heat sinks and exchanging heat with them. To ensure good heat dissipation for other heat-generating devices even after the immersion fluid temperature rises, the heat dissipation area of ​​the heat sink on the second heat-generating device is increased. Specifically, this invention lengthens the second length of the second front-facing split heat sink 33 connected to the second heat-generating device and the fourth length of the second rear-facing split heat sink 42, improving the heat dissipation effect on the heat-generating devices when the immersion fluid temperature rises and also improving the temperature consistency of heat-generating devices at different locations on the computing board. Based on the arrangement of the heat-generating device matrix, this invention has made a special design in the length direction of the heat sink connected to the second heat-generating device, optimizing the parameters with a "shorter front and longer back" configuration along the immersion fluid flow direction, ensuring heat dissipation efficiency while further improving the temperature consistency of all heat-generating devices on the computing board.

[0066] According to one embodiment, the present invention can also provide two or more lengths for the front split heat sink and the rear split heat sink, so that the length of the heat sink of various different specifications gradually increases along the direction of the immersion liquid flow, thereby gradually increasing the heat dissipation area of ​​the heat sink, improving the flexibility of the heat sink setting and the heat dissipation effect on the heat-generating device.

[0067] In this invention, a large number of separate heat sinks are provided on the computing board and connected to each heat-generating device by welding. For a single-phase immersion liquid cooling device, under the same operating conditions of the heat-generating devices (i.e., with the same power consumption), compared with the common solution of using a whole-board heat sink, the maximum temperature of the heat-generating devices on the computing board can be reduced by 4-5℃ and the average temperature can be reduced by 3-4℃.

[0068] Figure 6 A schematic diagram of an electronic device according to an embodiment of the present invention is shown. For example... Figure 6 As shown, the electronic device includes a computing board 2 and an immersion liquid cooling device 100. The immersion liquid cooling device 100 includes a front-mounted split heat sink 621, which is thermally connected to the heat-generating devices 611 disposed on the computing board 2. The immersion liquid cooling device 100 also includes a rear-mounted split heat sink, which is connected to the second side of the heat-generating devices, specifically thermally connected to the location of each heat-generating device on the second side of the computing board.

[0069] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this utility model can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this utility model. In particular, the features described in the various embodiments and / or claims of this utility model can be combined and / or combined in various ways without departing from the spirit and teachings of this utility model. All such combinations and / or combinations fall within the scope of this utility model.

[0070] The embodiments of the present invention have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of the present invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present invention, and all such substitutions and modifications should fall within the scope of the present invention.

Claims

1. An immersion liquid cooling device, characterized by, The device comprises: a plurality of front split heat sinks, each front split heat sink being thermally connected to a first face of a single heat-generating component; wherein the plurality of front split heat sinks comprises a first front split heat sink and at least one second front split heat sink, the second front split heat sink having a larger heat dissipation area than the first front split heat sink, the first front split heat sink and the second front split heat sink being adapted to exchange heat with the immersion liquid in sequence according to the flow direction of the immersion liquid.

2. The apparatus of claim 1, wherein, The thermal connection comprises welding.

3. The apparatus of claim 1, wherein, The device further comprises a mainframe cabinet, the mainframe cabinet comprising a first immersion liquid inlet aperture plate arranged at a first end, and a second immersion liquid outlet aperture plate arranged at a second end opposite to the first end; wherein the first front split heat sink is arranged inside the mainframe cabinet at a preset range from the first immersion liquid inlet aperture plate.

4. The apparatus of claim 3, wherein, The preset range is determined according to the position of the heat-generating component, the heat dissipation areas of the second front split heat sink and the first front split heat sink, and the target temperature reached by the heat-generating component after heat dissipation.

5. The apparatus of any one of claims 1-4, wherein, The second length of the second front split heat sink along the flow direction of the immersion liquid is greater than the first length of the first front split heat sink along the flow direction of the immersion liquid.

6. The apparatus of any one of claims 1-4, wherein, The end of the front split heat sink is provided with a transverse fin for positioning the front split heat sink when the front split heat sink is mounted to the heat-generating component.

7. The apparatus of claim 1, wherein, Further comprising: a plurality of back split heat sinks, each back split heat sink being thermally connected to a second face of the heat-generating component opposite to the first face.

8. The apparatus of claim 7, wherein, The plurality of back split heat sinks comprises a first back split heat sink and a second back split heat sink, the second back split heat sink having a larger heat dissipation area than the first back split heat sink, the first back split heat sink and the second back split heat sink being adapted to exchange heat with the immersion liquid in sequence.

9. The apparatus of claim 8, wherein, The fourth length of the second back split heat sink along the flow direction of the immersion liquid is greater than the third length of the first back split heat sink along the flow direction of the immersion liquid.

10. The apparatus of claim 4, wherein, Further comprising a power supply cabinet electrically connected to the mainframe cabinet, the power supply cabinet being provided with a second immersion liquid inlet aperture plate at a first end and a second immersion liquid outlet aperture plate at a second end opposite to the first end.

11. An electronic device, comprising: comprising at least one operation board; and The immersion liquid cooling device according to any one of claims 1-10, the immersion liquid cooling device comprising a plurality of front split heat sinks, each front split heat sink being thermally connected to a heat-generating component arranged on the operation board.

Images